A fixing structure for electronic components and a diode module

Abstract

This utility model proposes a fixing structure for electronic components, including a base and a PCB board. The PCB board has dispensing holes, and the base has lead-out pins that are positioned and soldered to corresponding pads on the PCB board. The PCB board and the base are fixedly connected by filling the dispensing holes with adhesive. Furthermore, a diode module is proposed, including the aforementioned fixing structure for electronic components, with a diode mounted on the PCB board. This application achieves integrated high-strength vibration-resistant fixing and efficient heat dissipation of the PCB and base by setting dispensing holes in the middle of the PCB and injecting thermally conductive adhesive into the base, combined with soldering the lead-out pins to the PCB board, thus meeting the requirements for miniaturization and high reliability of automotive modules.

Description

Technical Field

[0001] This utility model belongs to the technical field of vehicle electronic components, specifically relating to a fixed structure for electronic components and a diode module. Background Technology

[0002] With the widespread application of new energy vehicles and related electronic control systems, automotive electronic components often need to withstand frequent vibrations, shocks, and temperature changes. Existing diode rectifier modules are typically fixed to the PCB board and base via pin soldering or clips, which are prone to solder joint fatigue, poor contact, or component loosening due to vibration. Using screws or metal clips increases structural complexity and overall thickness, affecting the miniaturization of the module layout. Furthermore, traditional fixing methods struggle to balance heat dissipation and vibration resistance, failing to meet the comprehensive requirements of reliability, compactness, and heat dissipation efficiency in the automotive environment. Therefore, there is an urgent need for a miniaturized module fixing solution that simplifies the structure, improves vibration resistance, and also ensures proper heat dissipation. Utility Model Content

[0003] In view of the above-mentioned technical problems existing in the prior art, this utility model proposes a fixing structure for electronic components and a diode module to solve the above-mentioned technical problems.

[0004] This utility model proposes a fixing structure for electronic components, including a base and a PCB board. The PCB board has dispensing holes, and the base has lead-out pins that are positioned and soldered to corresponding pads on the PCB board. The PCB board and base are fixedly connected by filling the space between them with adhesive. This application, by creating dispensing holes in the PCB board and using adhesive to integrally fix the PCB board and base, avoids relying solely on solder joints to bear vibration loads, significantly enhancing the module's vibration and impact resistance, while simplifying the structure and eliminating the need for additional mechanical fasteners.

[0005] In a specific embodiment, the dispensing hole is located in the middle of the PCB board, and at least one dispensing hole is provided. This arrangement makes the fixing effect of the adhesive more concentrated and symmetrical, evenly distributing the working load, and further improving the stability and reliability of the overall connection.

[0006] In a specific embodiment, a filling groove is provided in the area of ​​the base corresponding to the dispensing hole. Pre-setting a filling groove in the area of ​​the base corresponding to the dispensing hole provides a confined space for the adhesive, preventing excessive overflow of the adhesive, and after curing, it engages with the groove, further improving the interlocking force between the adhesive and the base and the overall connection stability.

[0007] In a specific embodiment, the PCB board completely covers the filling groove when mated with the base. This ensures a closed space is formed between the dispensing hole and the groove, preventing adhesive overflow.

[0008] In a specific embodiment, the filling groove includes a multi-level groove structure of varying depths. This configuration, after the colloid cures, forms a multi-level mechanical interlocking structure, further enhancing pull-out and shear strength, and providing better dispersion and resistance to vibration loads.

[0009] In a specific embodiment, the filling adhesive is a thermally conductive adhesive or epoxy resin adhesive. This design not only secures the structure but also facilitates heat conduction, improving the heat dissipation efficiency between the PCB and the base, thus meeting the temperature management requirements of automotive environments.

[0010] According to a second aspect of this utility model, a diode module is proposed, including a fixing structure for the electronic components as described above, with diodes disposed on a PCB board. The aforementioned fixing structure is integrated into the diode module to form an integrated design, simplifying the module assembly process.

[0011] In a specific embodiment, the base is provided with heat dissipation holes. These additional heat dissipation holes, combined with the conductive properties of the thermal adhesive, further accelerate the release of heat from within the module.

[0012] In a specific embodiment, two diodes are included, with their corresponding pairs of leads arranged in a staggered manner. Two circuits, each containing only one diode, are arranged within a small relay housing, resulting in a simple structure and compact size.

[0013] In a specific embodiment, one pair of leads is arranged horizontally, and the other pair is arranged vertically. This arrangement can meet various installation and positioning requirements, provides flexible interface configuration, and the adhesive fixing structure is compatible with mechanical loads in different directions, ensuring a stable connection.

[0014] This utility model discloses a fixing structure for electronic components that fixes the PCB board to the base through dispensing holes, which strengthens the vibration resistance defects of traditional solder joint structures in automotive applications and significantly improves the vibration resistance of the module in the automotive environment. Attached Figure Description

[0015] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the present invention. Other embodiments and many anticipated advantages of the embodiments will be readily recognized as they become better understood through reference to the following detailed description. Elements in the drawings are not necessarily to scale. The same reference numerals refer to corresponding similar parts.

[0016] Figure 1 A schematic diagram of the fixing structure of an electronic component according to an embodiment of the present invention is shown.

[0017] Figure 2 An exploded view of the fixed structure of an electronic component according to a specific embodiment of the present invention is shown.

[0018] The meanings of the numbers in the diagram are as follows: 1. PCB board; 2. Base; 21. Filling groove; 3. Lead pin; 4. Lead pad; 5. Dispensing hole. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant utility model and not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings.

[0020] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] The specific embodiments of this utility model have been described above, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

[0022] Figure 1 A schematic diagram of the fixing structure of an electronic component according to an embodiment of the present invention is shown, as follows: Figure 1 As shown, the fixing structure of this electronic component includes a PCB board 1 and a base 2. The bottom of the base 2 has several lead-out pins 3. The top posts of the lead-out pins 3 are soldered to the corresponding pin pads 4 on the PCB board 1 after positioning and insertion. The soldering method can be reflow or wave soldering to complete the electrical connection and initial positioning and fixing. The PCB board 1 has dispensing holes 5 for injecting adhesive from the top surface of the PCB board 1, so that the PCB board 1 and the base 2 form an integrated connection structure, enhancing the overall vibration resistance.

[0023] In a specific embodiment, at least one dispensing hole 5 is provided, located in the middle of the PCB board 1. The centrally located dispensing hole 5 makes the fixing effect of the adhesive more concentrated and symmetrical, evenly distributing the working load and further improving the stability and reliability of the overall connection. In a preferred embodiment, the dispensing hole 5 is strip-shaped, which increases the adhesive injection area and ensures that the adhesive fully enters the base 2. The filling adhesive is a thermally conductive adhesive or epoxy resin adhesive. This material not only completes the structural fixation but also facilitates heat conduction, improving the heat dissipation efficiency between the PCB board 1 and the base 2, and meeting the temperature management requirements of the automotive environment.

[0024] Figure 2 An exploded view of the fixing structure of an electronic component according to a specific embodiment of the present invention is shown, such as... Figure 2 As shown, the base 2 has a filling groove 21 in the area corresponding to the dispensing hole 5. When the PCB board 1 and the base 2 are in contact, the filling groove 21 is completely covered, ensuring that a closed space is formed between the dispensing hole 5 and the groove, avoiding excessive overflow of the adhesive. After curing, the adhesive engages with the groove, further improving the interlocking force between the adhesive and the base 2 and the overall connection stability.

[0025] In some preferred embodiments, the bottom of the filling groove 21 has a stepped surface to form a multi-level mechanical interlocking to enhance the connection strength after curing. In another preferred embodiment, the filling groove 21 is a continuous annular groove distributed around the periphery of the dispensing hole 5, so that the adhesive forms an integral enclosure structure around the hole, uniformly distributing the adhesive ring pressure and improving the overall interlocking strength and shear resistance of the interface. In another preferred embodiment, the filling groove 21 is a plurality of small rectangular grooves that are separated from each other and are located in different quadrants around each through hole, so as to achieve zoned mechanical interlocking after curing.

[0026] Another aspect of this utility model proposes a diode module with the above-mentioned fixed structure. A diode is provided on the PCB board 1, and the aforementioned fixed structure is integrated into the diode module to form an integrated design scheme, which simplifies the module assembly process.

[0027] In specific embodiments, the sidewalls or bottom surfaces of the base 2 may also be provided with heat dissipation holes, which, together with the thermally conductive colloid, construct a "point-to-surface" heat conduction channel to achieve efficient heat dissipation inside the module. The diode module also includes a housing structure, which is similar to the small housing of a relay, making it more versatile.

[0028] In a specific embodiment, two diodes are included, with their corresponding pairs of leads 3 arranged in a staggered manner. One pair of leads 3 is arranged horizontally, and the other pair is arranged vertically. Two circuits, each containing only one diode, are arranged within a small relay housing, resulting in a simple structure and compact size. In other embodiments, the diode leads can be offset at any angle or arranged in other ways according to the specific requirements of the housing slot or mounting substrate, and the number of diodes can be selected (e.g., more than two). This design offers good versatility and scalability, and can be widely used in various relay housings or diode rectifier modules.

[0029] In a preferred embodiment, to meet the module's operational requirements under high current and high power conditions, the wiring area of ​​PCB board 1 employs a thickened copper foil process, significantly increasing the copper layer thickness and width of the main conductive traces. The increased copper cross-sectional area not only reduces line resistance and significantly improves current carrying capacity, but also more efficiently conducts heat generated by diodes and other heat-generating components along the PCB layers to the base 2 and heat dissipation holes, achieving more uniform and faster heat dissipation. Through this structural and material optimization, the module maintains stable electrical performance under high current surges and effectively suppresses the risk of failure due to excessive temperature rise.

[0030] This invention creates a mechanical-colloidal integrated locking structure by opening a dispensing hole in the middle of the PCB board and correspondingly setting a filling groove in the base, combined with pin positioning soldering and the injection and curing of thermally conductive adhesive / epoxy resin. At the same time, the heat dissipation holes in the base and the PCB wiring with thickened copper foil technology work together to construct a "point-to-surface" heat conduction channel, and adopts a staggered arrangement of dual diode pins to achieve miniaturization, high reliability fixation and efficient heat dissipation of the module in the high vibration and high current environment of vehicle.

[0031] In the description of this utility model, it should be understood that the terms "upper," "lower," "inner," "outer," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The simple fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used for improvement. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A fixing structure for an electronic component, characterized in that, The device includes a base and a PCB board. The PCB board has dispensing holes, and the base has lead-out pins that are positioned and soldered to the corresponding pads on the PCB board. The PCB board and the base are fixedly connected by filling the dispensing holes with adhesive.

2. The fixing structure of the electronic component according to claim 1, characterized in that, The dispensing hole is located in the middle of the PCB board, and there is at least one dispensing hole.

3. The fixing structure of the electronic component according to claim 1 or 2, characterized in that, The base has a filling groove in the area corresponding to the dispensing hole.

4. The fixing structure of the electronic component according to claim 3, characterized in that, When the PCB board is fitted with the base, it completely covers the filling groove.

5. The fixing structure of the electronic component according to claim 3, characterized in that, The filling groove includes a multi-level groove structure with different depths.

6. The fixing structure of the electronic component according to claim 1, characterized in that, The filling colloid is a thermally conductive adhesive or an epoxy resin adhesive.

7. A diode module, characterized in that, The PCB board includes a mounting structure for the electronic components as described in any one of claims 1-6, wherein a diode is disposed on the PCB board.

8. The diode module according to claim 7, characterized in that, The base is provided with heat dissipation holes.

9. The diode module according to claim 8, characterized in that, It includes two diodes, and the two pairs of leads corresponding to the two diodes are arranged in a staggered manner.

10. The diode module according to claim 9, characterized in that, One pair of leads is arranged horizontally, and the other pair of leads is arranged vertically.

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