A heat dissipation optimized 5G communication module shell structure

Abstract

This utility model relates to the field of communication technology and discloses a heat dissipation optimized 5G communication module housing structure, including a mounting bracket, an upper housing on the inner wall of the mounting bracket, a first heat dissipation mesh fixedly connected to the top of the upper housing, two mounting rods fixedly connected to the inner wall of the upper housing, a small fan at the bottom of the mounting rods, and a fixing bolt threaded to the inner wall of each of the four corners of the bottom of the small fan. A lower housing is snapped onto the bottom of the upper housing, and an integrated motherboard is connected to the inner wall of the lower housing via a mounting assembly. A second mounting bracket is provided on the outer wall of the lower housing. In this utility model, the small fan can directly blow heat onto the surface of the integrated motherboard, while the mounting plate can conduct heat generated at the bottom of the integrated motherboard. The airflow generated by the small fan then cools the bottom of the mounting plate, directly reducing the heat generated at both ends of the integrated motherboard and significantly optimizing the heat dissipation performance of the housing.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and in particular to a heat dissipation optimized housing structure for a 5G communication module. Background Technology

[0002] A 5G communication module is a device that integrates hardware such as a 5G communication chip and a radio frequency (RF) module. It is a core component for realizing 5G network connectivity. The housing of the 5G communication module is an important part of the 5G communication module, and its main functions are to provide physical protection, heat dissipation support, and signal transmission stability for the module.

[0003] Existing 5G communication module housings mainly dissipate heat from the motherboard, which integrates communication chips, radio frequency modules, and other hardware, by directly opening large-area heat dissipation holes on the housing. However, relying solely on natural air circulation results in low heat dissipation performance, making it difficult to support the long-term high-intensity operation of the communication module. In response to this technical problem, this application proposes a heat dissipation-optimized 5G communication module housing structure. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heat-optimized 5G communication module housing structure. A small fan can directly blow heat onto the surface of the integrated motherboard, while the mounting plate can conduct heat generated at the bottom of the integrated motherboard. The airflow generated by the small fan then cools the bottom of the mounting plate, directly reducing the heat generated at both the top and bottom of the integrated motherboard and significantly optimizing the heat dissipation performance of the housing.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A heat-dissipating optimized 5G communication module housing structure includes a mounting bracket, an upper housing on the inner wall of the mounting bracket, a first heat dissipation mesh fixedly connected to the top of the upper housing, two mounting rods fixedly connected to the inner wall of the upper housing, a small fan at the bottom of the mounting rods, and a fixing bolt threaded to the inner wall of each of the four corners of the bottom of the small fan. A lower housing is snapped onto the bottom of the upper housing, an integrated motherboard is connected to the inner wall of the lower housing via a mounting assembly, a second mounting bracket is provided on the outer wall of the lower housing, and a second heat dissipation mesh is fixedly connected to the bottom of the lower housing.

[0007] Furthermore, the fixing bracket and the front end of the upper housing are provided with through holes for wiring, and the upper side of the outer wall of the fixing bolt is threaded to the inner wall of the mounting rod.

[0008] Furthermore, the mounting assembly includes fixed posts located at the four corners of the inner wall of the lower housing, each fixed post having a mounting plate at its top, and a mounting frame snapped onto the top of the mounting plate.

[0009] Furthermore, each of the four corners of the top of the mounting plate is threaded with a fixing bolt, and the lower outer side of the fixing bolt is threaded to the inner wall of the fixing column.

[0010] Furthermore, the bottom of the integrated motherboard is disposed at the top of the mounting plate, and the top of the integrated motherboard is disposed on the inner wall of the mounting frame.

[0011] Furthermore, each of the four corners of the top of the second fixing frame is provided with a positioning groove, and each of the four corners of the bottom of the first fixing frame is fixedly connected with a positioning block, and a limit block is slidably connected to the inner wall of the front end of the first fixing frame.

[0012] Furthermore, the positioning groove is adapted to the size of the positioning block, and the front end of the second fixing frame is provided with a sliding groove for the limiting block to slide.

[0013] This utility model has the following beneficial effects:

[0014] 1. In this utility model, the small fan can blow directly onto the surface of the integrated motherboard, blowing the hot air generated by the integrated motherboard to the second heat dissipation mesh for exhaust, and allowing the low-temperature outside air to enter from the first heat dissipation mesh to form a circulation for heat dissipation. The mounting plate can conduct the heat generated at the bottom of the integrated motherboard, and then the wind force generated by the small fan can cool the bottom of the mounting plate. The heat generated at both the top and bottom of the integrated motherboard is directly reduced, greatly optimizing the heat dissipation performance of the casing.

[0015] 2. In this utility model, the small fan can be connected to the reserved port on the integrated motherboard by a wire, and the integrated motherboard can supply power to it. When damaged, the four corner fixing bolts can be removed by tools and the wire can be unplugged from the port on the integrated motherboard, so that the small fan can be replaced separately, which facilitates the overall maintenance of the device. Attached Figure Description

[0016] Figure 1 This is a perspective view of a heat dissipation optimized 5G communication module housing structure proposed in this utility model;

[0017] Figure 2 An exploded view of a heat-dissipating optimized housing structure for a 5G communication module proposed in this utility model;

[0018] Figure 3 This is an exploded view of the upper shell of a 5G communication module housing structure with optimized heat dissipation proposed in this utility model.

[0019] Figure 4 This is an exploded view of the lower shell of a 5G communication module housing structure with optimized heat dissipation proposed in this utility model.

[0020] Legend:

[0021] 1. Fixing bracket one; 2. Fixing bracket two; 3. Limiting block; 4. Upper shell; 5. First heat dissipation mesh; 6. Positioning block; 7. Lower shell; 8. Positioning groove; 9. Mounting rod; 10. Small fan; 11. Fixing bolt one; 12. Second heat dissipation mesh; 13. Fixing column; 14. Mounting plate; 15. Integrated main board; 16. Fixing bolt two; 17. Mounting frame. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Reference Figure 1-4 The present invention provides an embodiment of a heat dissipation optimized 5G communication module housing structure, including a fixing frame 1, an upper housing 4 provided on the inner wall of the fixing frame 1, through holes for cable routing at the front ends of the fixing frame 1 and the upper housing 4, a first heat dissipation mesh 5 fixedly connected to the top of the upper housing 4, two mounting rods 9 fixedly connected to the inner wall of the upper housing 4, a small fan 10 provided at the bottom of the mounting rods 9, and fixing bolts 11 threadedly connected to the inner walls of the four corners of the bottom of the small fan 10, and the upper side of the outer wall of the fixing bolts 11 threadedly connected to the inner wall of the mounting rods 9;

[0024] Specifically, the small fan 10 is mounted on the mounting rod 9 by fixing bolts 11. When started, it can accelerate the airflow inside the housing and blow directly onto the integrated motherboard 15, carrying the hot air out through the second heat dissipation mesh 12. Outside air enters through the first heat dissipation mesh 5, forming a circulation flow and improving the heat dissipation effect of the device. At the same time, it can be connected to the reserved port on the integrated motherboard 15 by wires, and the integrated motherboard 15 can supply it with power. When damaged, the four corner fixing bolts 11 can be removed by tools and the wires can be unplugged from the port on the integrated motherboard 15, so that the small fan 10 can be replaced separately, which facilitates the overall maintenance of the device.

[0025] The lower housing 7 is snapped onto the bottom of the upper housing 4. An integrated motherboard 15 is connected to the inner wall of the lower housing 7 via an installation assembly. The installation assembly includes a fixing post 13 fixedly connected to the four corners of the inner wall of the lower housing 7. An installation plate 14 is provided at the top of the fixing post 13. An installation frame 17 is snapped onto the top of the installation plate 14. Fixing bolts 16 are threaded to the four corners of the top of the installation plate 14. The lower side of the outer wall of the fixing bolts 16 is threaded to the inner wall of the fixing post 13. The bottom of the integrated motherboard 15 is located at the top of the installation plate 14. The top of the integrated motherboard 15 is located on the inner wall of the installation frame 17. A second fixing bracket 2 is provided on the outer wall of the lower housing 7. A second heat dissipation mesh 12 is fixedly connected to the bottom of the lower housing 7. Positioning grooves 8 are provided at the four corners of the top of the second fixing bracket 2. Positioning blocks 6 are fixedly connected to the four corners of the bottom of the first fixing bracket 1. A limit block 3 is slidably connected to the inner wall of the front end of the first fixing bracket 1. The positioning grooves 8 and the positioning blocks 6 are matched in size. A sliding groove is provided at the front end of the second fixing bracket 2 for the limit block 3 to slide.

[0026] Specifically, the mounting plate 14 is placed on multiple fixing posts 13 and installed using fixing bolts 16, allowing the mounting plate 14 to be suspended inside the lower housing 7. This provides space between the second heat dissipation mesh 12 and the integrated motherboard 15 for heat dissipation. The mounting plate 14 is made of copper, which conducts heat generated at the bottom of the integrated motherboard 15 to the bottom of the mounting plate 14, where it is cooled by the airflow generated by a small fan. The integrated motherboard 15 is mounted on the mounting plate 14 via the mounting frame 17, making it easy to install and remove, facilitating routine disassembly and maintenance. External wires connected to the integrated motherboard 15 can pass through a comb... After processing, the upper shell 4 and the pre-drilled holes on the fixing frame 1 connect to the outside. The fixing frame 1 and the fixing frame 2 can protect the device and reduce the possibility of direct damage after impact. During installation, the positioning block 6 on the fixing frame 1 cooperates with the positioning groove 8 on the fixing frame 2 to provide positioning, making it easy to assemble the fixing frame 1 onto the fixing frame 2. When the limiting block 3 slides to the right side of the inner wall of the front groove of the fixing frame 2, the locking block on the inner wall of the front of the fixing frame 1 and the fixing frame 2 will limit the limiting block 3, so that the fixing frame 1 and the fixing frame 2 lock each other, improving the convenience of installation between the fixing frame 1 and the fixing frame 2.

[0027] Working principle: During use, the small fan 10 installed on the mounting rod 9, together with the first heat dissipation mesh 5 and the second heat dissipation mesh 12 set on the upper housing 4 and the lower housing 7, can accelerate the air circulation rate inside the housing, exhaust the heat generated by the integrated motherboard 15 to the outside, improve the heat dissipation capacity of the module, and push the limiting block 3 to slide inside the slide groove on the second fixing bracket 2, which can release the limiting of the first fixing bracket 1, so that the first fixing bracket 1 and the second fixing bracket 2 can be separated, making it easy for the user to take out the upper housing 4 and the lower housing 7 for disassembly. The integrated motherboard 15 is installed on the mounting plate 14 through the mounting frame 17. The mounting frame 17 can restrict the integrated motherboard 15 to prevent it from moving inside the housing. At the same time, when disassembling, simply press the mounting frame 17 so that its bottom end clip can be disassembled from the hole on the mounting plate 14, which is very convenient and conducive to the daily maintenance of the module.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation optimized 5G communication module housing structure, comprising a mounting bracket (1), characterized in that: The inner wall of the first fixing frame (1) is provided with an upper shell (4). The top of the upper shell (4) is fixedly connected with a first heat dissipation mesh (5). The inner wall of the upper shell (4) is fixedly connected with two mounting rods (9). The bottom of the mounting rods (9) is provided with a small fan (10). The inner walls of the four corners of the bottom of the small fan (10) are threaded with fixing bolts (11). The bottom of the upper shell (4) is snapped with a lower shell (7). The inner wall of the lower shell (7) is connected with an integrated motherboard (15) through a mounting component. The outer wall of the lower shell (7) is provided with a second fixing frame (2). The bottom of the lower shell (7) is fixedly connected with a second heat dissipation mesh (12).

2. The heat dissipation optimized 5G communication module housing structure according to claim 1, characterized in that: The fixing bracket (1) and the upper housing (4) have through holes for wiring. The upper side of the outer wall of the fixing bolt (11) is threaded to the inner wall of the mounting rod (9).

3. The heat dissipation optimized 5G communication module housing structure according to claim 1, characterized in that: The mounting assembly includes fixed posts (13) fixedly connected to the four corners of the inner wall of the lower housing (7), and a mounting plate (14) is provided at the top of the fixed post (13), and a mounting frame (17) is snapped onto the top of the mounting plate (14).

4. The heat dissipation optimized 5G communication module housing structure according to claim 3, characterized in that: The mounting plate (14) has four screw-connected fixing bolts (16) at the top corners, and the lower outer side of the fixing bolts (16) is screw-connected to the inner wall of the fixing column (13).

5. The heat dissipation optimized 5G communication module housing structure according to claim 1, characterized in that: The bottom of the integrated motherboard (15) is located at the top of the mounting plate (14), and the top of the integrated motherboard (15) is located on the inner wall of the mounting frame (17).

6. The heat dissipation optimized 5G communication module housing structure according to claim 1, characterized in that: The top four corners of the second fixing frame (2) are provided with positioning grooves (8), the bottom four corners of the first fixing frame (1) are fixedly connected with positioning blocks (6), and the inner wall of the front end of the first fixing frame (1) is slidably connected with a limit block (3).

7. The heat-dissipating optimized 5G communication module housing structure according to claim 6, characterized in that: The positioning groove (8) is adapted to the size of the positioning block (6), and the front end of the fixing frame (2) is provided with a sliding groove for the limiting block (3) to slide.

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