Heat pipe radiator device applied to high-power chip test

Abstract

The utility model discloses a heat pipe type radiator device for high power consumption chip test is applied to, include: first connecting seat board, it is equipped with the connecting portion, second connecting seat board, first connecting seat board with second connecting seat board one side rotation connection, first connecting seat board, second connecting seat board are equipped with respectively detachable connection locking piece, locking piece, second connecting seat board is equipped with the connecting site for with tester connection, radiating module, radiating module with The connecting portion is connected, and the radiating module includes fin group, wind flow driving element, heat pipe heat transfer spare, heat conduction block, air duct enclosure cover, heat pipe heat transfer spare includes bottom plate, a plurality of heat pipe column, bottom plate first end surface and heat conduction block are close to and connect, and a plurality of heat pipe column is equipped with bottom plate second end surface, a plurality of heat pipe column is worn fin group, and wind flow driving element is equipped with one side of fin group, air duct enclosure cover is connected and encloses fin group, wind flow driving element, and enclose total air inlet, total air outlet.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, specifically a heat pipe heat sink device used in high-power chip testing. Background Technology

[0002] With the increasing demand from market applications such as GTP, intelligent computing, servers, and AGI (Artificial Intelligence), the computing power required for chip products is also rising. The computing power of a chip is generally positively correlated with its power consumption and heat generation; that is, the higher the computing power of a chip, the greater its power consumption and heat generation during operation. Large-scale computing operations, such as those performed by CPUs, GPGPUs, and DCUs, generate a significant amount of heat. Overheating of the chip environment can lead to short circuits, failures, or even burnout and fire hazards.

[0003] Traditional duct radiators currently on the market have shortcomings such as insufficient cooling capacity and excessive size that causes interference with EVB circuit boards, thus requiring urgent improvement. Utility Model Content

[0004] This invention addresses the above-mentioned problems by proposing a heat pipe radiator device for testing high-power chips, aiming to solve the technical issues in the background art.

[0005] To achieve the above objectives, this utility model provides a heat pipe heat sink device for high-power chip testing, comprising:

[0006] A first connecting plate, wherein the first connecting plate is provided with a connecting portion;

[0007] The second connecting plate is rotatably connected to the first connecting plate on one side. At the end away from the rotatable connection, the first connecting plate and the second connecting plate are respectively provided with a detachable locking member and a locking member; the second connecting plate is provided with a connection position for connecting with the tester.

[0008] A heat dissipation module is connected to the connecting part. The heat dissipation module includes a fin assembly, an airflow actuator, a heat pipe heat transfer component, a heat-conducting block, and an air duct enclosure. The heat pipe heat transfer component includes a base plate and multiple heat pipe columns. The first end face of the base plate is abutted against the heat-conducting block, and the multiple heat pipe columns are disposed on the second end face of the base plate. The multiple heat pipe columns pass through the fin assembly, and the airflow actuator is disposed on one side of the fin assembly. The air duct enclosure connects and encloses the fin assembly and the airflow actuator, and encloses a main air inlet, a main air outlet, and an air duct connecting the main air inlet and the main air outlet.

[0009] Furthermore, it includes a support plate disposed between the fin assembly and the base plate, the support plate having positioning connection holes corresponding to the plurality of heat pipe columns, and the air duct enclosure being connected to the side of the support plate by screws.

[0010] Furthermore, the heat dissipation module includes a third connecting plate, which is disposed on the first end face of the base plate. The third connecting plate and the base plate are connected to the support plate by a set of screws. The connecting part is a bolt connection hole provided on the side wall of the first connecting plate. The third connecting plate is provided with a threaded hole corresponding to the bolt connection hole. The bolt connection hole and the threaded hole are connected by bolts to fasten the connection between the two.

[0011] Furthermore, an elastic buffer is provided between the base plate and the support plate.

[0012] Furthermore, a pad and a butterfly spring are provided between the base plate and the third connecting seat plate.

[0013] Furthermore, it includes a floating buffer block and an elastic buffer member; the second connecting plate has a receiving groove on its end face relative to the first connecting plate; the floating buffer block is connected to the receiving groove by a limiting screw, and the elastic buffer member is disposed between the floating buffer block and the bottom wall of the receiving groove.

[0014] Furthermore, the airflow initiator consists of two fans arranged side by side; the heat-conducting block is equipped with a temperature sensor and a heater.

[0015] Furthermore, the locking member is rotatably connected to the first connecting seat plate, and the locking member is provided with a hook portion; the locking member includes an operating handle, a locking block, and a support shaft; the operating handle is rotatably connected to the second connecting seat plate, and the operating handle is provided with a protruding pressing portion at the rotatable connection; the second connecting seat plate is provided with a strip-shaped hole, and the support shaft passes through the strip-shaped hole and the locking block; the locking block is provided with a retaining groove that corresponds to and cooperates with the hook portion; when the operating handle is rotated to a predetermined angle, the protruding pressing portion presses the support shaft.

[0016] Furthermore, the second connecting plate is provided with a movable groove, and the locking block is located in the movable groove; an elastic abutment is provided between the locking block and the bottom wall of the movable groove; an elastic abutment is provided between the side of the locking member away from its hook portion and the first connecting plate.

[0017] Furthermore, in the fin assembly, each fin has folded vertical edges on both sides, and the folded vertical edges abut against the bottom wall of the fin connected to the upper end; the fin has a through hole for the heat pipe column to pass through, and the edge of the through hole has an annular edge extending toward the top of the heat pipe column; a solder port is opened on the side of the through hole.

[0018] Compared with the prior art, the heat pipe heat sink device for high power chip testing provided by this utility model can, by setting up an air duct enclosure, ensure that the airflow generated by the airflow initiator located at the main air inlet or main air outlet of the fin assembly can only enter the air duct from the main air inlet and then flow out from the main air outlet, with a clear directionality. This can effectively prevent hot airflow from escaping from around the fin assembly and hot air from re-entering the fin assembly through the airflow initiator, resulting in poor heat dissipation and cooling effect. Attached Figure Description

[0019] Figure 1 The table shows the heat dissipation effect of the heat pipe heat sink device applied to high-power chip testing in this application when testing chips with different power consumption levels.

[0020] Figure 2 The heat pipe heat sink device of this application is used for high power chip testing. The heat dissipation effect is statistically recorded in the curves when testing chips with different power consumption.

[0021] Figure 3 The diagram shows the airflow direction driven by the airflow actuator in the heat pipe heat sink device for high-power chip testing, which is connected to the fin group and the airflow initiator. The fin group and the airflow initiator are connected to form a main air inlet, a main air outlet, and an air duct connecting the main air inlet and the main air outlet.

[0022] Figure 4 This is a heat distribution diagram of the heat pipe radiator device used in high-power chip testing during operation.

[0023] Figure 5 This is a schematic diagram of the structure of the heat pipe heat sink device used in high-power chip testing in this application when the first connecting plate and the second connecting plate are connected and covered.

[0024] Figure 6 This is a schematic diagram of the structure of the heat pipe heat sink device used in high-power chip testing in this application when the first connecting plate and the second connecting plate are relatively open.

[0025] Figure 7 This is a schematic diagram of the structure of the heat pipe heat sink device used in high-power chip testing according to this application, from another perspective, when the first connecting plate and the second connecting plate are relatively open.

[0026] Figure 8 This is an exploded view of the heat pipe radiator device used in high-power chip testing according to this application.

[0027] Figure 9 This is a cross-sectional view of some components of the heat pipe radiator device used in high-power chip testing according to this application.

[0028] Figure 10This is a schematic diagram of a fin structure in the heat pipe heat sink device used for high-power chip testing in this application.

[0029] Figure 11 This is an exploded view of some components of the heat pipe radiator device used in high-power chip testing according to this application.

[0030] Figure 12 This is an exploded view of some components of the heat pipe radiator device used in high-power chip testing according to this application.

[0031] The reference numerals in the figure are as follows: 1. First connecting base plate; 110. Connecting part; 120. Locking element; 121. Hook part; 2. Second connecting base plate; 210. Locking element; 211. Operating handle; 2111. Protruding pressing part; 212. Locking block; 2121. Holding groove; 213. Support shaft; 220. Connecting position; 230. Receiving groove; 240. Strip hole; 250. Movable groove; 3. Heat dissipation module; 310. Fin assembly; 311. Folded vertical edge; 312. Through hole; 313. Ring edge; 314. Solder port; 320. Airflow starter; 330. Heat pipe heat transfer component; 331. Base plate; 332. Heat pipe column; 340. Heat-conducting block; 350. Air duct enclosure; 360. Support plate; 361. Positioning connection hole; 370. Third connecting seat plate; 4. Pad; 5. Butterfly spring; 6. Floating buffer block; 7. Elastic buffer component; 8. Temperature sensor; 9. Heater; 10. Elastic support component; 11. Limit screw. Detailed Implementation

[0032] Please refer to Figure 1 - Figure 12 This embodiment provides a heat pipe radiator device for high-power chip testing, including:

[0033] First connecting plate 1, the first connecting plate 1 is provided with connecting part 110;

[0034] The second connecting plate 2 is rotatably connected to the first connecting plate 1 on one side, away from the rotatable connection point. The first connecting plate 1 and the second connecting plate 2 are respectively provided with a detachable locking member 120 and a locking member 210. The second connecting plate 2 is provided with a connection position 220 for connecting with the tester.

[0035] The heat dissipation module 3 is connected to the connecting part 110. The heat dissipation module 3 includes a fin assembly 310, an airflow actuator 320, a heat pipe heat transfer component 330, a heat-conducting block 340, and an air duct enclosure 350. The heat pipe heat transfer component 330 includes a base plate 331 and multiple heat pipe columns 332. The first end face of the base plate 331 is abutted against the heat-conducting block 340, and the multiple heat pipe columns 332 are disposed on the second end face of the base plate 331. The multiple heat pipe columns 332 pass through the fin assembly 310, and the airflow actuator 320 is disposed on one side of the fin assembly 310. The air duct enclosure 350 connects and encloses the fin assembly 310 and the airflow actuator 320, and encloses a main air inlet, a main air outlet, and an air duct connecting the main air inlet and the main air outlet.

[0036] The heat-conducting block 340 is preferably made of copper, which has good thermal conductivity.

[0037] The heat pipe heat transfer component 330 is manufactured using a 3DVC capillary cooling process. The base plate 331 integrates one end of multiple heat pipe pillars 332 together and is attached to the heatsink block 340. During operation, the other end of the heatsink block 340 is in contact with the chip under test. The heat generated by the chip during operation is transferred through the heatsink block 340, the base plate 331, and the multiple heat pipe pillars 332 to each heatsink fin in the fin assembly 310.

[0038] Because of the enclosed duct cover 350, the airflow generated by the airflow actuator 320 located at the main air inlet or main air outlet of the fin assembly 310 can only enter the airflow duct from the main air inlet and then flow out from the main air outlet. It has a clear directionality, which can effectively prevent hot air from escaping from around the fin assembly 310 and hot air from re-entering the fin assembly 310 through the airflow actuator 320, resulting in poor heat dissipation and cooling effect.

[0039] Compared to existing technologies, such as the chip high-temperature aging test socket with independently controllable temperature disclosed in patent application CN201920152609.9, which stacks and distributes cooling fans in the vertical direction, the heat pipe heat sink device provided in this application has stronger cooling capacity and smaller size. At the same time, it avoids the airflow force acting vertically on the chip under test, causing contact vibration and affecting the actual test results.

[0040] Both the first connecting plate 1 and the second connecting plate 2 have a centrally recessed slot structure, which avoids obstructing the heat-conducting block 340, allowing the heat-conducting block 340 to contact the chip under test when the first connecting plate 1 and the second connecting plate 2 are rotated and closed. In some embodiments, the connection position 220 is a threaded hole and screw assembly located at the edge of the second connecting plate 2.

[0041] The power consumption of chips in commercial desktop computers is generally around 60-110W, while that in laptops is around tens of watts. However, so-called high-power chips, which are individual chips, can consume up to 1000W when the integrated circuit is being tested or working.

[0042] Please refer to Figure 1 The heat sink device has a case temperature Tc of 125℃, an airflow of CFM49.4 provided by the airflow initiator 320, and an ambient wind speed of 5M / S. It can cool down fully loaded chips with power of 800, 700, 600, 500, 400, and 300W respectively, and can control the temperature at the contact point between the chip and the heat-conducting block 340 at 101, 94, 86, 78, 70, and 63℃.

[0043] Please refer to Figure 9 and Figure 11 It includes a support plate 360 ​​disposed between the fin assembly 310 and the base plate 331. The support plate 360 ​​is provided with positioning connection holes 361 corresponding to a plurality of heat pipe columns 332. The air duct enclosure 350 is connected to the side of the support plate 360 ​​by screws.

[0044] Please refer to Figure 7 and Figure 9 , Figure 11 The heat dissipation module 3 includes a third connecting plate 370, which is disposed on the first end face of the base plate 331. The third connecting plate 370 and the base plate 331 are connected to the support plate 360 ​​by a set of screws. The connecting part 110 is a bolt connection hole provided on the side wall of the first connecting plate 1. The third connecting plate 370 is provided with a threaded hole corresponding to the bolt connection hole. The bolt connection hole and the threaded hole are connected by bolts to fasten the connection between the two.

[0045] Since the heat pipe heat transfer component 330 is generally made of copper, a material with good thermal conductivity, and has a hollow internal structure, its overall texture is relatively soft, making it unsuitable for repeated and forceful connection using screws. Therefore, the heat pipe heat transfer component 330 is fixed by clamping it with a support plate 360 ​​and a third connecting plate 370. The base plate 331 only needs to have through holes, and the threaded holes are specifically located in the support plate 360. The bolt nuts abut against the third connecting plate 370, ensuring that the heat pipe heat transfer component 330 is not deformed or damaged by excessive force.

[0046] The positioning connection hole 361 is specifically fitted into the root part of the heat pipe column 332, which can provide support and positioning for the heat pipe column 332 and enhance its structural strength.

[0047] Please refer to Figure 11 An elastic buffer 7 is provided between the base plate 331 and the support plate 360.

[0048] The elastic buffer 7 prevents rigid compression damage to the end face of the base plate 331 facing the support plate 360 ​​when the heat pipe heat transfer component 330 is connected and fixed to the support plate 360 ​​by screws through the third connecting seat plate 370 and the base plate 331.

[0049] Please refer to Figure 9 and Figure 11 A pad 4 and a butterfly spring 5 are provided between the base plate 331 and the third connecting seat plate 370.

[0050] By using pad 4 and butterfly spring 5, rigid compression damage is avoided on the end face of the base plate 331 facing the third connecting plate 370 when the heat pipe heat transfer component 330 is connected and fixed to the support plate 360 ​​by screws through the third connecting seat plate 370 and the base plate 331.

[0051] This allows for adjustment of the height of the heat-conducting block 340, which is attached to the base plate 331, to better avoid excessive pressure on the chip under test or insufficient contact with the chip.

[0052] Please refer to Figure 7 and Figure 12 It includes a floating buffer block 6 and an elastic buffer member 7; the second connecting seat plate 2 has a receiving groove 230 on its end face opposite to the first connecting seat plate 1; the floating buffer block 6 is connected to the receiving groove 230 by a limiting screw 11, and the elastic buffer member 7 is disposed between the floating buffer block 6 and the bottom wall of the receiving groove 230.

[0053] The floating buffer block 6 and the elastic buffer 7 are specifically located on the edge of the through groove of the second connecting plate 2 that avoids the heat conduction block 340. They are set on the end face of the third connecting plate 370 so that when the first connecting plate 1 and the second connecting plate 2 rotate and close, they are buffered, preventing the rigid force of the heat conduction block 340 from pressing on the brittle chip and causing the chip to break. This design is well thought out.

[0054] In some embodiments, the elastic buffer 7 is a cylindrical spring.

[0055] In addition, when the chip test is completed and the first connecting plate 1 and the second connecting plate 2 need to be opened relative to each other, the floating buffer block 6 provides a certain supporting force to the third connecting plate 370, making it easy to open and preventing the heat-conducting block 340 from pressing down against the chip under test, venting air, creating a vacuum state, and making it inconvenient to open.

[0056] Please refer to Figure 6 and Figure 11 The airflow initiator 320 consists of two fans arranged side by side; the heat conduction block 340 is equipped with a temperature sensor 8 and a heater 9.

[0057] Using two fans arranged side by side is more cost-effective than using a single large fan with higher total power, and it also better matches the layout of the main air inlet and outlet ports.

[0058] Heater 9 can actively generate heat, quickly reaching the required test environment and accelerating test efficiency.

[0059] Please refer to Figure 9 and Figure 11 , Figure 12 The locking member 120 is rotatably connected to the first connecting seat plate 1, and the locking member 120 is provided with a hook portion 121; the locking member 210 includes an operating handle 211, a locking block 212, and a support shaft 213; the operating handle 211 is rotatably connected to the second connecting seat plate 2, and the operating handle 211 is provided with a protruding pressing portion 2111 at the rotatable connection; the second connecting seat plate 2 is provided with a strip hole 240, and the support shaft 213 passes through the strip hole 240 and the locking block 212; the locking block 212 is provided with a retaining groove 2121 that corresponds to and cooperates with the hook portion 121; when the operating handle 211 is rotated to a predetermined angle, the protruding pressing portion 2111 presses the support shaft 213.

[0060] The protruding pressing part 2111 forms a cam structure on the operating handle 211. When the operating handle 211 is rotated to the angle where the protruding pressing part 2111 presses against the support shaft 213, the support shaft 213 is pressed and fixed, preventing the support shaft 213 from moving along the slot 240. In this way, the hook part 121 can stably engage the locking groove 2121.

[0061] When the first connecting plate 1 and the second connecting plate 2 need to be opened relative to each other, rotate the operating handle 211 so that the protruding pressing part 2111 can release the pressing part on the support shaft 213. The locking block 212 and the support shaft 213 can move together within the length range of the strip hole 240. The hook part 121 is no longer tightly engaged with the locking groove 2121. The locking part 120 can be flipped over, and then the first connecting plate 1 and the second connecting plate 2 can be opened relative to each other.

[0062] Preferably, the support shaft 213 is provided with E-shaped buckles at both ends to prevent the support shaft 213 from moving axially and dislodging from the strip hole 240.

[0063] Please refer to Figure 9 and Figure 12The second connecting plate 2 is provided with a movable groove 250, and the locking block 212 is located in the movable groove 250; an elastic abutment 10 is provided between the locking block 212 and the bottom wall of the movable groove 250; an elastic abutment 10 is provided between the side of the locking member 120 away from its hook portion 121 and the first connecting plate 1.

[0064] The elastic abutment 10 allows the first connecting plate 1 and the second connecting plate 2 to be in the open state, so that when they are open relative to each other, the elastic abutment 10 abuts against the locking block 212, and the locking block 212 and the support shaft 213 are held in the opposite direction by the protruding pressing part 2111.

[0065] When the first connecting plate 1 and the second connecting plate 2 are in a closed state, the elastic abutment 10 abuts against the locking member 120, keeping the hook part 121 tightly engaged with the retaining groove 2121.

[0066] The elastic support member 10 can be a cylindrical spring.

[0067] Preferably, a torsion spring is provided at the rotatable connection between the first connecting plate 1 and the second connecting plate 2 to keep the first connecting plate 1 tending to open relative to the second connecting plate 2.

[0068] Please refer to Figure 9 and Figure 10 In the fin assembly 310, each fin has a folded vertical edge 311 on both edges, and the folded vertical edge 311 abuts against the bottom wall of the fin connected to the upper end; this can ensure that the air passage does not leak and improve the heat dissipation effect.

[0069] The height of the bottom wall of two adjacent fins is the height of the folded vertical edge 311.

[0070] The fins are provided with through holes 312 through which the heat pipe column 332 passes, and the edge of the through hole 312 is provided with an annular edge 313 extending toward the top end of the heat pipe column 332; a solder port 314 is provided on the side of the through hole 312.

[0071] Preferably, the circumferential edge 313 and the fin body are connected by a rounded transition to prevent the heat pipe column 332 from being scratched when passing through the through hole 312. The solder port 314 is used for the heat pipe column 332 to pass through the through hole 312. After the position is determined, solder is placed in the port, and then the heat pipe column 332 and the fin are welded together as a whole.

[0072] In summary, the heat pipe heat sink device provided in this application for high-power chip testing has multiple levels of buffer between key components to prevent damage to the heat pipe heat transfer component 330 and to effectively prevent damage to the chip. It can be used for stable testing with repeated chip replacements over a long lifespan.

Claims

1. A heat pipe heat sink device for use in testing high power chips, characterized by, include: A first connecting plate, wherein the first connecting plate is provided with a connecting portion; The second connecting plate is rotatably connected to the first connecting plate on one side. At the end away from the rotatable connection, the first connecting plate and the second connecting plate are respectively provided with a detachable locking member and a locking member; the second connecting plate is provided with a connection position for connecting with the tester. A heat dissipation module is connected to the connecting part. The heat dissipation module includes a fin assembly, an airflow actuator, a heat pipe heat transfer component, a heat-conducting block, and an air duct enclosure. The heat pipe heat transfer component includes a base plate and multiple heat pipe columns. The first end face of the base plate is abutted against the heat-conducting block, and the multiple heat pipe columns are disposed on the second end face of the base plate. The multiple heat pipe columns pass through the fin assembly, and the airflow actuator is disposed on one side of the fin assembly. The air duct enclosure connects and encloses the fin assembly and the airflow actuator, and encloses a main air inlet, a main air outlet, and an air duct connecting the main air inlet and the main air outlet.

2. The heat pipe radiator device for high-power chip testing according to claim 1, characterized in that, It includes a support plate disposed between the fin assembly and the base plate, the support plate having positioning connection holes corresponding to the plurality of heat pipe columns, and the air duct enclosure being connected to the side of the support plate by screws.

3. The heat pipe radiator device for high-power chip testing according to claim 2, characterized in that, The heat dissipation module includes a third connecting plate, which is located on the first end face of the base plate. The third connecting plate and the base plate are connected to the support plate by a set of screws. The connecting part is a bolt connection hole located on the side wall of the first connecting plate. The third connecting plate is provided with a threaded hole corresponding to the bolt connection hole. The bolt connection hole and the threaded hole are connected by bolts to fasten the connection between the two.

4. The heat pipe radiator device for high-power chip testing according to claim 2, characterized in that, An elastic buffer is provided between the base plate and the support plate.

5. The heat pipe radiator device for high-power chip testing according to claim 3, characterized in that, A pad and a butterfly spring are provided between the base plate and the third connecting seat plate.

6. The heat pipe radiator device for high-power chip testing according to claim 1, characterized in that, It includes a floating buffer block and an elastic buffer member; the second connecting plate has a receiving groove on its end face opposite to the first connecting plate; the floating buffer block is connected to the receiving groove by a limiting screw, and the elastic buffer member is disposed between the floating buffer block and the bottom wall of the receiving groove.

7. The heat pipe radiator device for high-power chip testing according to claim 1, characterized in that, The airflow initiator consists of two fans arranged side by side; the heat-conducting block contains a temperature sensor and a heater.

8. The heat pipe radiator device for high-power chip testing according to claim 1, characterized in that, The locking member is rotatably connected to the first connecting seat plate, and the locking member is provided with a hook portion; the locking member includes an operating handle, a locking block, and a support shaft; the operating handle is rotatably connected to the second connecting seat plate, and the operating handle is provided with a protruding pressing portion at the rotatable connection; the second connecting seat plate is provided with a strip-shaped hole, and the support shaft passes through the strip-shaped hole and the locking block; the locking block is provided with a retaining groove that corresponds to and cooperates with the hook portion; when the operating handle is rotated to a predetermined angle, the protruding pressing portion presses the support shaft.

9. The heat pipe radiator device for high-power chip testing according to claim 8, characterized in that, The second connecting plate is provided with a movable groove, and the locking block is located in the movable groove; an elastic abutment is provided between the locking block and the bottom wall of the movable groove; an elastic abutment is provided between the side of the locking member away from its hook portion and the first connecting plate.

10. The heat pipe radiator device for high-power chip testing according to claim 1, characterized in that, In the fin assembly, each fin has folded vertical edges on both sides, and the folded vertical edges abut against the bottom wall of the fin at the upper end; the fin has a through hole for the heat pipe column to pass through, and the edge of the through hole has a ring edge extending toward the top of the heat pipe column; a solder port is opened on the side of the through hole.

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