A motor home power supply mainboard heat dissipation device with a defined air duct structure
By introducing a defined air duct structure into the heat dissipation device of the RV power supply motherboard, and using the cover plate and control board to form a semi-enclosed air duct, the problem of scattered airflow from the fan is solved, achieving efficient cooling and easy maintenance of core components, and adapting to the modification needs of RV power supplies.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGZHOU HARDIN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-06-19
AI Technical Summary
In the existing heat dissipation devices of RV power motherboards, the airflow generated by the fan lacks effective guidance, resulting in the accumulation of hot air, which affects the working stability and lifespan of core components. At the same time, the existing devices are complex in structure and expensive, making them difficult to adapt to retrofit requirements.
Design a heat dissipation device with a defined airflow structure. By setting a cover plate on the top of the radiator and a control plate to form a semi-enclosed airflow, the airflow is guided to flow in a specific direction, and the power tube and transformer are cooled in a concentrated manner. The cover plate is made of metal to enhance the structural stability and heat conduction, and to achieve easy disassembly and maintenance.
It improves heat dissipation efficiency, avoids hot air accumulation, ensures stable operation of core components in low-temperature environments, reduces device complexity and modification costs, and is suitable for the modification needs of both new and old power supply motherboards.
Smart Images

Figure CN224385989U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of RV power equipment technology, and in particular to a heat dissipation device for RV power mainboard with a defined air duct structure. Background Technology
[0002] Existing RV power supply motherboards often integrate power conversion modules. The power transistors, transformers, and other components on these modules generate a significant amount of heat during operation. Cooling is typically achieved using a combination of radiators and fans. However, the airflow generated by the fans lacks effective structural guidance, easily spreading outwards and even forming eddies, causing hot air to accumulate locally and fail to dissipate promptly. This not only reduces the overall cooling effect of the system but may also affect the operational stability and lifespan of core components due to prolonged exposure to high temperatures. Therefore, there is an urgent need for a simple cooling device that can effectively enhance airflow guidance.
[0003] To address this, we propose a heat dissipation device for the power supply motherboard of a motorhome with a defined air duct structure. Utility Model Content
[0004] The main purpose of this utility model is to provide a heat dissipation device for a motorhome power supply motherboard with a defined air duct structure. In order to prevent the airflow generated by the fan from spreading outwards and forming eddies due to lack of effective guidance, resulting in the accumulation of hot air in local areas that cannot be discharged in time, the overall cooling effect of the heat dissipation system is improved. This avoids the core components (power transistors, transformers, etc.) from being affected by long-term high-temperature environments, thus affecting their working stability and service life. At the same time, the device is simplified and reduced in cost through structural optimization to meet the needs of motorhome power supply modification and new product applications. This can effectively solve the problems in the background technology.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A motorhome power supply mainboard heat dissipation device with a defined air duct structure includes a fan, a transformer, a power transistor, a mainboard, a control board, and a heat sink. The top of the heat sink is provided with a cover plate, which cooperates with the control board to form a semi-enclosed air duct.
[0007] By adopting the above technical solution, the airflow generated after the fan starts enters from the side of the heat sink. Constrained by the semi-enclosed air duct formed by the cover plate and control board, it avoids spreading to the surroundings or forming eddies. The airflow flows directionally along the air duct and concentrates on the surface of the heat sink, fully carrying away the heat transferred to the heat sink by the power tube. Then it flows through the transformer and carries away the heat generated by its operation, and finally is discharged from the air duct outlet, achieving efficient and synchronous cooling of the core heat-generating components.
[0008] Furthermore, the power transistor is soldered to the motherboard via pins, and the power transistor is mounted on the surface of the heat sink.
[0009] By adopting the above technical solution, the power transistor forms a stable electrical connection with the motherboard through its pins, ensuring normal circuit conduction. At the same time, its bottom surface is in close contact with the heat sink surface, and thermal conductive silicone can be applied to enhance the heat conduction efficiency. The large amount of heat generated during operation is quickly transferred to the heat sink through the contact surface, and then the airflow flowing through the heat sink surface carries away the heat, avoiding performance degradation or damage to the power transistor due to local overheating.
[0010] Furthermore, the transformer's pins are soldered and fixed to the motherboard, and the transformer is located next to the heat sink and in the fan's exhaust path.
[0011] By adopting the above technical solution, the transformer maintains a stable electrical connection with the motherboard through its pins, ensuring the stable operation of the voltage conversion function. Since it is located in the air outlet path of the fan, the airflow after heat exchange by the heat sink will flow directly through the transformer, and the residual heat of the airflow will further absorb the heat generated by the iron loss and copper loss during the operation of the transformer, thereby achieving targeted cooling of the transformer and preventing its insulation performance or service life from being affected by high temperature.
[0012] Furthermore, the cover plate is detachably and fixedly connected to the radiator by screws.
[0013] By adopting the above technical solution, the screws firmly fix the cover plate to the top of the radiator, ensuring that the air duct structure remains stable under vibrations such as bumps during RV travel, and preventing the air duct from deforming due to loosening of the cover plate; if it is necessary to clean, maintain or replace the radiator or cover plate, the screws can be unscrewed to quickly remove the cover plate, which is easy to operate and adapts to the later maintenance needs of the RV power supply.
[0014] Furthermore, the cover plate is made of metal.
[0015] By adopting the above technical solution, the cover plate made of metal (aluminum or aluminum alloy) not only has sufficient structural strength to maintain the shape of the air duct, but also absorbs some of the radiant heat from the radiator and the surrounding environment through its own thermal conductivity. Then, it transfers the heat to the airflow through contact with the airflow in the air duct and discharges it. At the same time, the metal surface has a high degree of smoothness, which can reduce the resistance when the airflow passes through, ensure the smooth airflow in the air duct, and indirectly improve the heat dissipation efficiency.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] (1) The present invention provides a heat dissipation device for a motorhome power supply main board with a limited air duct structure. By setting a cover plate on the top of the radiator and forming a semi-enclosed air duct with the control board, the airflow generated by the fan can be effectively constrained and guided, avoiding airflow dispersion or eddy current generation, so that the airflow flows directionally through the radiator surface and the transformer, significantly improving the synchronous cooling efficiency of the power tube and the transformer, and solving the problem of hot air accumulation in the existing heat dissipation method.
[0018] (2) The present invention provides a heat dissipation device for a motorhome power supply motherboard with a limited air duct structure. It is achieved by adding a cover plate and screws, without the need for complex additional parts, and the manufacturing cost is low. The cover plate adopts a detachable connection design, which is convenient for installation, maintenance and replacement. It is suitable for newly produced motorhome power supply motherboards and can also easily adapt to the modification needs of existing motorhome power supplies. It has strong practicality and economy. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of a RV power supply motherboard heat dissipation device with a defined air duct structure according to the present invention.
[0020] Figure 2 This is a side view of a RV power supply mainboard heat dissipation device with a defined air duct structure according to the present invention.
[0021] In the diagram: 1. Fan; 2. Cover plate; 3. Transformer; 4. Power transistor; 5. Mainboard; 6. Control board; 7. Heatsink; 8. Screws. Detailed Implementation
[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0023] To prevent the airflow generated by the fan from spreading outwards and forming eddies due to a lack of effective guidance, thus avoiding the problem of hot air accumulating locally and failing to be discharged in time, and thereby improving the overall cooling effect of the heat dissipation system, this design avoids affecting the operational stability and lifespan of core components (power transistors, transformers, etc.) due to prolonged exposure to high-temperature environments. Simultaneously, structural optimization simplifies the device and reduces costs, making it suitable for the retrofitting and new application needs of RV power supplies. Figure 1 , Figure 2 As shown, a RV power mainboard heat dissipation device with a defined air duct structure includes a fan 1, a transformer 3, a power transistor 4, a mainboard 5, a control board 6, and a radiator 7. The top of the radiator 7 is provided with a cover plate 2, and the cover plate 2 cooperates with the control board 6 to form a semi-enclosed air duct.
[0024] When in use, the airflow generated by the fan 1 enters from the side of the heat sink 7 after the fan 1 is started. It is constrained by the semi-enclosed air duct formed by the cover plate 2 and the control plate 6, which prevents it from spreading to the surroundings or forming vortices. The airflow flows directionally along the air duct and sweeps across the surface of the heat sink 7, which fully carries away the heat transferred to the heat sink 7 by the power tube 4. Then it flows through the transformer 3 and carries away the heat generated by its operation. Finally, it is discharged from the air duct outlet, achieving efficient and synchronous cooling of the core heat-generating components.
[0025] For example, such as Figure 2 As shown, the present invention also includes the power transistor 4 being soldered to the motherboard 5 via pins, and the power transistor 4 being mounted on the surface of the heat sink 7.
[0026] During use, the power transistor 4 forms a stable electrical connection with the motherboard 5 through its pins to ensure normal circuit conduction. At the same time, its bottom surface is in close contact with the surface of the heat sink 7, and thermal conductive silicone can be applied to enhance the heat conduction efficiency. The large amount of heat generated during operation is quickly transferred to the heat sink 7 through the contact surface, and then the airflow flowing through the surface of the heat sink 7 carries away the heat, preventing the power transistor 4 from being degraded or damaged due to local overheating.
[0027] For example, such as Figure 2 As shown, the present invention also includes that the pins of the transformer 3 are welded and fixed to the motherboard 5, and the transformer 3 is located next to the heat sink 7 and in the air outlet path of the fan 1.
[0028] During use, transformer 3 maintains a stable electrical connection with motherboard 5 through pins to ensure stable operation of voltage conversion function; since it is located in the air outlet path of fan 1, the airflow after heat exchange by heat sink 7 will flow directly through transformer 3, and the residual heat of the airflow will further absorb the heat generated by iron loss and copper loss when transformer 3 is working, so as to achieve targeted cooling of transformer 3 and avoid its insulation performance or service life due to high temperature.
[0029] For example, such as Figure 1 , Figure 2 As shown, the present invention also includes a cover plate 2 that is detachably and fixedly connected to the radiator 7 by screws 8.
[0030] When in use, screw 8 firmly fixes cover plate 2 to the top of radiator 7, ensuring that the air duct structure remains stable under vibrations such as bumps during RV travel, and preventing cover plate 2 from loosening and causing air duct deformation. If it is necessary to clean, maintain or replace radiator 7 or cover plate 2, screw 8 can be unscrewed to quickly remove cover plate 2. The operation is simple and suitable for the later maintenance needs of RV power supply.
[0031] For example, such as Figure 1 , Figure 2 As shown, the present invention also includes a cover plate 2 made of metal.
[0032] When in use, the metal cover plate 2 (aluminum or aluminum alloy) not only has sufficient structural strength to maintain the shape of the air duct, but also absorbs some of the radiant heat from the radiator 7 and the surrounding environment through its own thermal conductivity. Then, it transfers the heat to the airflow through contact with the airflow in the air duct and discharges it. At the same time, the metal surface has a high degree of smoothness, which can reduce the resistance when the airflow passes through, ensure the smooth airflow in the air duct, and indirectly improve the heat dissipation efficiency.
[0033] It should be noted that this utility model is a heat dissipation device for a motorhome power supply mainboard with a defined air duct structure. When the device is started, the fan 1 operates first to generate airflow. The airflow enters from the side of the radiator 7 and is constrained by the semi-enclosed air duct formed by the top cover plate 2 of the radiator 7 and the control board 6, preventing it from spreading outwards or forming eddies, and flows directionally along the air duct. At this time, the power transistor 4, which is connected to the mainboard 5 by pin welding, generates a lot of heat due to its operation. Its bottom surface is in close contact with the surface of the radiator 7 (thermal conductive silicone can be applied to enhance heat conduction). The heat is quickly transferred to the radiator 7 through the contact surface, and the directional airflow concentrates and sweeps across the surface of the radiator 7, efficiently carrying away this heat. Subsequently, the airflow continues to flow along the air duct past the transformer 3, which is located in the air outlet path of the fan 1. The transformer 3 is fixed to the mainboard 5 by pin welding. The iron loss and copper loss heat generated during operation are further absorbed by the airflow. Finally, the airflow is discharged from the air duct outlet, achieving synchronous cooling of the power transistor 4 and the transformer 3. During this process, the cover plate 2 is detachably and fixedly connected to the radiator 7 by screws 8, ensuring the stability of the air duct structure when the RV is traveling on bumps. The metal cover plate 2 maintains the shape of the air duct by its own strength, and absorbs the surrounding heat through heat conduction and transfers it to the airflow, reducing airflow resistance to ensure heat dissipation efficiency. If maintenance is required, the cover plate 2 can be removed by unscrewing the screws 8, which is convenient.
[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A recreational vehicle power supply mainboard heat dissipation device with a defined air duct structure, comprising a fan (1), a transformer (3), a power tube (4), a mainboard (5), a control board (6) and a radiator (7), characterized in that, The top of the radiator (7) is provided with a cover plate (2), which, together with the control plate (6), forms a semi-enclosed air duct.
2. The recreational vehicle power supply main board heat sink with defined air channel structure of claim 1, wherein: The power transistor (4) is soldered to the motherboard (5) via pins, and the power transistor (4) is mounted on the surface of the heat sink (7).
3. The RV power supply motherboard heat dissipation device with a defined air duct structure according to claim 1, characterized in that: The pins of the transformer (3) are soldered and fixed to the motherboard (5), and the transformer (3) is located next to the heat sink (7) and in the air outlet path of the fan (1).
4. A heat dissipation device for a motorhome power supply motherboard with a defined air duct structure according to claim 1, characterized in that: The cover plate (2) is detachably and fixedly connected to the radiator (7) by screws (8).
5. A heat dissipation device for a motorhome power supply motherboard with a defined air duct structure according to claim 1, characterized in that: The cover plate (2) is made of metal.