Kilowatt laser processing device

Abstract

The utility model provides a kind of kilowatt laser processing device, it at least includes: laser generator;Galvanometer module, it is set on the output light path of the laser generator and is configured as the laser beam from the laser generator is deflected to form processing track;And laser mirror module, it is attached in the light exit side of the galvanometer module in sealed manner, and it is configured as the laser beam from the galvanometer module is reflected towards predetermined processing direction.According to some embodiments of the utility model, since laser mirror module is attached in the light exit side of galvanometer module in sealed manner, dust etc. generated during processing process cannot fly into optical path and pollute optical lens, and since laser mirror module can reflect the laser beam from galvanometer module towards predetermined processing direction, laser beam can be made to very small angle incident corresponding material of predetermined processing direction, so that the size of laser focusing spot can be guaranteed, and the quality and efficiency of laser processing are improved.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to a kilowatt-level laser processing device, especially a laser processing device that can change the path of the laser beam to optimize the laser processing effect. Background Technology

[0002] In the automotive industry, some laser processing techniques have specific requirements for the incident angle of the laser beam. For example, to optimize the interior layout of electric vehicles, it is desirable to integrate the battery module with the vehicle chassis or tray to effectively utilize the interior space. This integration is typically achieved using adhesive bonding. Battery trays are usually made of aluminum, whose surface roughness is too low for direct adhesive bonding. Therefore, the aluminum tray needs to be laser-treated before bonding to increase the surface roughness. This process requires not only sufficiently high surface roughness values ​​but also high laser processing efficiency to meet the mass production demands of the automotive industry. In actual production, most surfaces of the battery tray require surface roughening treatment to facilitate the subsequent adhesive bonding process. This requires the laser to act on the material at the smallest possible incident angle to achieve higher laser processing efficiency. In the bottom area of ​​the tray, the laser can easily act on the material at a 0° incident angle. However, on the side walls of the tray, especially in narrow areas, the laser can only act on the material at a large incident angle due to the interference of the galvanometer, robotic arm, and tray machinery. The focused laser spot on the material is magnified due to the incident angle, resulting in a decrease in the laser power density acting on the material surface, affecting the quality and efficiency of laser processing. Furthermore, in the automotive industry, the laser power used in this laser texturing or cleaning process is typically in the kilowatt range or above, and it is necessary to prevent dust and other contaminants from entering the optical path and contaminating the optical lenses during processing.

[0003] Therefore, an improved high-power laser processing device is needed to meet the various process requirements mentioned above as much as possible. Utility Model Content

[0004] The purpose of this invention is to provide a kilowatt-level laser processing device to at least partially solve the aforementioned problems existing in the prior art.

[0005] According to a first aspect of the present invention, a kilowatt-level laser processing apparatus is provided, the laser processing apparatus comprising at least:

[0006] Laser generator;

[0007] A galvanometer module, disposed in the output optical path of the laser generator and configured to deflect the laser beam from the laser generator to form a machining trajectory; and

[0008] A laser rotating mirror module is mounted in a sealed manner on the light-emitting side of the galvanometer module and is configured to reflect the laser beam from the galvanometer module in a predetermined processing direction that is transverse to the transmission direction of the laser beam from the galvanometer module.

[0009] According to the laser processing apparatus of the first aspect of this utility model, since the laser rotating mirror module can reflect the laser beam from the galvanometer module in a predetermined processing direction different from the original transmission direction of the laser beam from the galvanometer module, the laser beam can be incident at a very small angle on the corresponding material surface perpendicular to the predetermined processing direction, thereby ensuring a small laser focusing spot size and improving the quality and efficiency of laser processing. Furthermore, for kilowatt-level high-power laser processing apparatuses, since the laser rotating mirror module is sealed and mounted on the light-emitting side of the galvanometer module, dust and other contaminants generated during processing will not fly into the optical path and contaminate the optical lenses.

[0010] According to an optional embodiment of this utility model, the light-emitting side of the galvanometer module faces downwards vertically, and the predetermined processing direction forms an angle within ±15° with the horizontal direction. This embodiment allows for a large-angle change in the transmission direction of the laser beam relative to the light-emitting side of the galvanometer module, reflecting the laser beam in a direction within ±15° with the horizontal direction to perform efficient laser processing.

[0011] According to an optional embodiment of the present invention, the predetermined processing direction is horizontal. This embodiment enables efficient laser processing of the sidewall by vertically incident a laser beam onto it.

[0012] According to an optional embodiment of the present invention, the laser rotating mirror module is detachably mounted to the light-emitting side of the galvanometer module, and includes a sealed cavity and a laser reflector disposed within the sealed cavity. This embodiment allows for improved versatility and expanded applicability of the laser processing apparatus by installing and disassembling the laser rotating mirror module, while maintaining a simple structure.

[0013] According to an optional embodiment of the present invention, the sealed cavity includes a beam inlet and a beam outlet at a predetermined angle to each other, and a beam channel connecting the beam inlet and the beam outlet. The sealed cavity is mounted to the galvanometer module at the beam inlet, and the laser reflector is disposed within the beam channel and configured to reflect the laser beam from the beam inlet to the beam outlet, wherein the predetermined angle depends on the predetermined processing direction. This embodiment enables the laser rotating mirror module to be implemented in a simple manner.

[0014] According to an optional embodiment of the present invention, the sealed cavity has a self-sealing structure formed at the beam inlet. When not connected to the galvanometer module, the self-sealing structure seals the beam inlet, and when connected to the galvanometer module, the self-sealing structure allows the laser beam from the galvanometer module to pass through. This embodiment ensures the sealing performance of the sealed cavity at the beam inlet.

[0015] According to an optional embodiment of the present invention, the sealed cavity has a protective mirror at the beam exit that seals the beam exit while allowing the laser beam to pass through. This embodiment ensures the sealing of the sealed cavity at the beam exit.

[0016] According to an optional embodiment of the present invention, the reflective surface of the laser reflector is covered with a reflective film. This embodiment enables the laser reflector to have a high reflectivity to the laser beam, thereby reducing energy loss of the laser beam.

[0017] According to an optional embodiment of the present invention, the reflective surface of the laser reflector is further coated with a laser resisting film. This embodiment enables the laser resisting film to reduce damage to the reflective film and the laser reflector from the laser beam.

[0018] According to an optional embodiment of the present invention, the wavelength range of the laser emitted by the laser generator is 1030–1064 nm.

[0019] According to an optional embodiment of the present invention, the laser emitted by the laser generator is a continuous laser or a laser with a pulse width in the range of 1 to 1000 ns.

[0020] According to an optional embodiment of the present invention, the maximum scanning width of the emitted laser beam of the laser processing device is less than or equal to 245 mm.

[0021] According to an optional embodiment of the present invention, the laser processing apparatus further includes a focusing lens module, which is installed at the light outlet of the galvanometer module to focus the laser beam from the galvanometer module.

[0022] According to an optional embodiment of the present invention, the laser processing apparatus further includes a jet module configured to spray protective gas toward the processing position on the workpiece.

[0023] According to an optional embodiment of the present invention, the laser processing device is a laser texturing device or a laser cleaning device. Attached Figure Description

[0024] The present invention will now be described in more detail with reference to the accompanying drawings, which will provide a better understanding of its principles, features, and advantages. The drawings include:

[0025] Figure 1 A schematic diagram of a kilowatt-level laser processing apparatus according to an exemplary embodiment of the present invention is shown;

[0026] Figure 2 The laser optical path of a kilowatt-level laser processing apparatus in its operating state, according to an exemplary embodiment of the present invention, is schematically shown; and

[0027] Figure 3 The diagram schematically illustrates a laser rotating mirror module of a kilowatt-level laser processing apparatus according to an exemplary embodiment of the present invention.

[0028] List of reference numerals

[0029] 100 laser processing device

[0030] 1. Laser generator

[0031] 2. Galvanometer Module

[0032] 3 Laser rotating mirror module

[0033] 30 sealed cavities

[0034] 301 beam entrance

[0035] 302 Beam Exit

[0036] 303 Beam Channel

[0037] 304 protective lens

[0038] 31 laser reflectors

[0039] 4. Focusing Lens Module

[0040] L-shaped laser output Detailed Implementation

[0041] To make the technical problem to be solved, the technical solution, and the beneficial technical effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and several exemplary embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the scope of protection of the present utility model.

[0042] Figure 1 A schematic diagram of a kilowatt-level laser processing apparatus 100 according to an exemplary embodiment of the present invention is shown. Figure 2 The laser optical path of a kilowatt-level laser processing apparatus 100 in its operating state, according to an exemplary embodiment of the present invention, is schematically shown; and Figure 3The laser rotating mirror module 3 of a kilowatt-level laser processing apparatus 100 according to an exemplary embodiment of the present invention is schematically shown.

[0043] like Figure 1 As shown, a kilowatt-level laser processing apparatus 100 according to an exemplary embodiment of the present invention includes: a laser generator 1; a galvanometer module 2 disposed on the output optical path of the laser generator 1 and configured to deflect the laser beam from the laser generator 1 to form a processing trajectory; and a laser rotating mirror module 3, which is sealed to the light-emitting side of the galvanometer module 2 and configured to reflect the laser beam from the galvanometer module 2 toward a predetermined processing direction laterally to the transmission direction of the laser beam from the galvanometer module 2. Using the kilowatt-level laser processing apparatus 100 according to an exemplary embodiment of the present invention, since the laser rotating mirror module 3 is installed in a sealed manner on the light-emitting side of the galvanometer module 2, dust and other particles generated during processing will not fly into the optical path and contaminate the optical lenses. Furthermore, since the laser rotating mirror module 3 can reflect the laser beam from the galvanometer module 2 toward a predetermined processing direction, which is different from the original transmission direction of the laser beam from the galvanometer module 2, the original emission direction of the laser beam can be changed so that the laser beam can be incident on the corresponding material in the predetermined processing direction at a very small angle, especially the inclined wall of the workpiece other than the bottom surface, and especially the side wall of the workpiece. This ensures the size of the laser focused spot and improves the quality and efficiency of laser processing.

[0044] According to a preferred exemplary embodiment, the laser rotating mirror module 3 is detachably mounted to the light-emitting side of the galvanometer module 2, and includes a sealed cavity 30 and a laser reflector 31 disposed within the sealed cavity 30. Thus, when the object to be laser-processed is a horizontal surface, the laser rotating mirror module 3 can be detached from the galvanometer module 2 without deflecting the laser beam from the galvanometer module 2, allowing the laser beam to be incident on the horizontal surface at a very small angle to achieve high processing quality and efficiency. Only when the surface to be processed is a vertical surface or a near-vertical surface is the laser rotating mirror module 3 mounted to the light-emitting side of the galvanometer module 2, and the laser reflector 31 disposed within the sealed cavity 30 deflects the laser beam from the galvanometer module 2, similarly allowing the laser beam to be incident on a vertical or near-vertical surface at a very small angle to achieve high processing quality and efficiency.

[0045] According to a preferred exemplary embodiment, the sealed cavity 30 includes a beam inlet 301 and a beam outlet 302 at a predetermined angle to each other, and a beam channel 303 connecting the beam inlet 301 and the beam outlet 302. The sealed cavity 30 is mounted to the galvanometer module 2 at the beam inlet 301, and a laser reflector 31 is disposed within the beam channel 303 and configured to reflect the laser beam from the beam inlet 301 toward the beam outlet 302, particularly as shown in the example. Figure 2As shown, the predetermined angle depends on the predetermined processing direction. This allows for the isolation of the laser beam path from the external environment and its deflection towards the predetermined processing direction with a simple structure.

[0046] According to a preferred exemplary embodiment, the sealed cavity 30 has a self-sealing structure (not shown) formed at the beam inlet 301. When not connected to the galvanometer module 2, the self-sealing structure seals the beam inlet 301, and when connected to the galvanometer module 2, the self-sealing structure allows the laser beam from the galvanometer module 2 to pass through. This self-sealing structure can be any suitable self-sealing structure known to those skilled in the art.

[0047] According to a preferred exemplary embodiment, the sealed cavity 30 has a protective mirror 304 at the beam exit 302 that seals the beam exit 302 while allowing the laser beam to pass through. This enables the sealing of the laser optical path, preventing dust and other contaminants from entering the optical path during laser processing and contaminating the optical lenses or affecting the processing quality.

[0048] According to a preferred exemplary embodiment, the reflective surface of the laser reflector 31 is covered with a reflective film (not shown in the figure), particularly a high-reflectivity film, which can, for example, enable the laser reflector 31 to reflect laser beams at a rate of 99% or higher, thereby reducing the energy loss of the laser beam.

[0049] According to a preferred exemplary embodiment, the reflective surface of the laser reflector 31 is further coated with a laser-resistant film, such as a SiO2 film, to reduce the damage of the laser beam to the reflective film and the laser reflector 31.

[0050] According to a preferred exemplary embodiment, the light-emitting side of the galvanometer module 2 faces downwards vertically, and the angle between the predetermined processing direction and the horizontal direction is within a range of ±15°. This allows the laser processing apparatus 100 to have a wider range of processable angles, thus broadening its applicability.

[0051] According to a preferred exemplary embodiment, the predetermined processing direction is horizontal. Thus, as... Figure 2 As shown, the laser beam from the galvanometer module 2 (indicated by the black arrow in the figure) can be reflected horizontally by the laser reflector 31, so that it can be incident perpendicularly on the vertical sidewall of the workpiece, i.e., the incident angle is basically 0°, thus enabling the laser processing apparatus 100 to be used specifically for high-quality and high-efficiency laser processing of the vertical sidewall of the workpiece.

[0052] According to a preferred exemplary embodiment, the laser emitted by the laser generator 1 has a wavelength range of 1030–1064 nm.

[0053] According to a preferred exemplary embodiment, the laser emitted by the laser generator 1 is a continuous laser or a laser with a pulse width in the range of 1 to 1000 ns.

[0054] According to a preferred exemplary embodiment, particularly as Figure 3 As shown, the maximum scanning width of the emitted laser beam of the laser processing apparatus 100 is less than or equal to 245 mm, meaning the emitted laser L of the laser processing apparatus 100 forms a straight line. In a preferred example, the laser processing apparatus 100 can scan a maximum width of 245 mm, which is greater than the width of the beam exit 302, thereby enabling the processing of a larger area on the corresponding workpiece surface. In another preferred example, the laser processing apparatus 100 can scan a maximum width, for example, 175 mm.

[0055] According to a preferred exemplary embodiment, the laser processing apparatus 100 further includes a focusing lens module 4, which is mounted at the light outlet of the galvanometer module 2 to focus the laser beam from the galvanometer module 2.

[0056] According to a preferred exemplary embodiment, the laser processing apparatus 100 further includes a jetting module configured to jet protective gas toward the processing position on the workpiece.

[0057] According to a preferred exemplary embodiment, the laser processing apparatus 100 is a laser texturing apparatus or a laser cleaning apparatus.

[0058] Although specific embodiments of the present invention are described in detail herein, they are given for illustrative purposes only and should not be construed as limiting the scope of the present invention. Various substitutions, alterations, and modifications may be conceived without departing from the spirit and scope of the present invention.

Claims

1. A kilowatt-level laser processing device, characterized in that, The laser processing apparatus (100) includes at least: Laser generator (1); A galvanometer module (2), disposed in the output optical path of the laser generator (1) and configured to deflect the laser beam from the laser generator (1) to form a processing trajectory; and A laser rotating mirror module (3) is mounted in a sealed manner on the light-emitting side of the galvanometer module (2) and is configured to reflect the laser beam from the galvanometer module (2) in a predetermined processing direction that is transverse to the transmission direction of the laser beam from the galvanometer module (2).

2. The kilowatt-level laser processing device according to claim 1, characterized in that, The light-emitting side of the galvanometer module (2) faces downwards vertically, and the predetermined processing direction forms an angle within the range of ±15° with the horizontal direction.

3. The kilowatt-level laser processing device according to claim 2, characterized in that, The predetermined processing direction is horizontal.

4. The kilowatt-level laser processing apparatus according to any one of claims 1 to 3, characterized in that, The laser rotating mirror module (3) is detachably mounted on the light-emitting side of the galvanometer module (2), and includes a sealed cavity (30) and a laser reflector (31) disposed in the sealed cavity (30).

5. The kilowatt-level laser processing device according to claim 4, characterized in that, The sealed cavity (30) includes a beam inlet (301) and a beam outlet (302) at a predetermined angle to each other, and a beam channel (303) connecting the beam inlet (301) and the beam outlet (302). The sealed cavity (30) is mounted to the galvanometer module (2) at the beam inlet (301), and the laser reflector (31) is disposed within the beam channel (303) and configured to reflect the laser beam from the beam inlet (301) toward the beam outlet (302), wherein the predetermined angle depends on the predetermined processing direction; and / or The reflective surface of the laser reflector (31) is covered with a reflective film.

6. The kilowatt-level laser processing device according to claim 5, characterized in that, The sealed cavity (30) has a self-sealing structure at the beam inlet (301). When not connected to the galvanometer module (2), the self-sealing structure seals the beam inlet (301), and when connected to the galvanometer module (2), the self-sealing structure allows the laser beam from the galvanometer module (2) to pass through; and / or The sealed cavity (30) has a protective mirror (304) at the beam outlet (302) that seals the beam outlet (302) and allows the laser beam to pass through; and / or The reflective surface of the laser reflector (31) is also covered with a laser-resistant film.

7. The kilowatt-level laser processing apparatus according to any one of claims 1 to 3, 5, and 6, characterized in that, The laser emitted by the laser generator (1) has a wavelength range of 1030–1064 nm; and / or The laser emitted by the laser generator (1) is a continuous laser or a laser with a pulse width in the range of 1 to 1000 ns; and / or The maximum scanning width of the laser beam emitted by the laser processing device (100) is less than or equal to 245 mm.

8. The kilowatt-level laser processing apparatus according to any one of claims 1 to 3, 5, and 6, characterized in that, The laser processing apparatus (100) further includes a focusing lens module (4), which is installed at the light outlet of the galvanometer module (2) to focus the laser beam from the galvanometer module (2).

9. The kilowatt-level laser processing apparatus according to any one of claims 1 to 3, 5, and 6, characterized in that, The laser processing apparatus (100) also includes a jet module configured to spray protective gas toward the processing position on the workpiece.

10. The kilowatt-level laser processing apparatus according to any one of claims 1 to 3, 5, and 6, characterized in that, The laser processing device (100) is a laser texturing device or a laser cleaning device.

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