Wavy compression-resistant hollow plate for cutting silicon wafers

Abstract

The utility model relates to the technical field of silicon wafer cutting plate material, specifically relates to a wave shape compression -resistant structure hollow plate for silicon wafer cutting, including support part, the bottom end bonding of support part has installation part, and support part and installation part constitute hollow cavity after closing, and the inside bonding of hollow cavity has compression -resistant part, and the both ends of compression -resistant part extend to the clamping surface of support part and installation part, and compression -resistant part is wave -like support structure. The utility model through bottom mounting plate and top support plate bonding, formed a hollow structure's plate material, is provided with wave -like compression -resistant plate, through the axial component force principle of triangle unit, will silicon rod vertical load into plate material lateral tensile force, through wave structure dispersion silicon rod weight, reduce the vibration deformation when cutting, through clamping lug and clamping groove one fit, limit step and clamping groove two fit, in the process of cutting, can avoid the breakage, the situation of collapse of wave shape compression -resistant plate in the process of cutting.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cutting material technology, specifically to a corrugated, pressure-resistant hollow material for silicon wafer cutting. Background Technology

[0002] In the process of cutting monocrystalline silicon, the silicon rod needs to be placed on the plate for cutting. The existing plates are mainly solid plates, which may not be able to penetrate the cutting. This means that a safety distance must be reserved when the steel wire cuts into the bottom of the silicon rod, resulting in "additional cutting loss", wasting expensive silicon material and reducing the yield of wafers per unit silicon rod.

[0003] Furthermore, the existing hollow plate structure cannot meet the load-bearing requirements of large-sized silicon rods. It has low bending / compressive strength, is prone to deformation, and cannot support large-sized silicon rods. Ordinary hollow plates have problems such as wire jamming and wafer falling off, causing steel wire breakage and increasing the fragmentation rate.

[0004] Therefore, it is necessary to invent a corrugated, pressure-resistant hollow plate for silicon wafer cutting to solve the above problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a corrugated, pressure-resistant hollow plate for silicon wafer cutting. This solves the problems of existing hollow plate structures being unable to support large-sized silicon rods, having low bending / compressive strength, being prone to deformation, and being unable to support large-sized silicon rods. Ordinary hollow plates also suffer from problems such as wire jamming and wafer falling off, causing steel wire breakage and increasing the breakage rate.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A corrugated, pressure-resistant hollow plate for silicon wafer cutting includes a support portion, an mounting portion bonded to the bottom end of the support portion, and a hollow cavity formed by closing the support portion and the mounting portion. A pressure-resistant portion is bonded to the inside of the hollow cavity, and the two ends of the pressure-resistant portion extend to the clamping surfaces of the support portion and the mounting portion. The pressure-resistant portion is a corrugated support structure.

[0008] As a preferred embodiment of the present invention, the mounting part includes a bottom mounting plate, and the two ends of the bottom mounting plate are provided with limiting steps. The pressure-resistant part includes a corrugated pressure-resistant plate, and the two ends of the corrugated pressure-resistant plate are provided with clamping grooves. The end face of the clamping grooves fits against the limiting steps.

[0009] As a preferred embodiment of the present invention, the support part includes a top support plate, and edge support blocks are provided on both sides of the bottom end of the top support plate. The inner side of the edge support block is provided with an inclined surface that can clamp the corrugated anti-compression plate.

[0010] As a preferred embodiment of this utility model, the bottom end of the edge support block is provided with a clamping protrusion, and the two ends of the wavy anti-pressure plate are provided with a clamping groove, and the bottom end of the clamping protrusion fits into the clamping groove.

[0011] As a preferred embodiment of this utility model, a limiting sealing block is provided at the top of the limiting step, the end face of the limiting sealing block is attached to the end of the corrugated anti-pressure plate, an adhesive surface one is provided at the top of the limiting step, the top of the adhesive surface one is flush with the top of the extension of the corrugated anti-pressure plate, and an adhesive surface two is provided at the bottom of the edge support block that can be attached to the adhesive surface one.

[0012] As a preferred embodiment of this utility model, the top of the top support plate is provided with an adhesive part, which is the adhesive surface of the silicone rod.

[0013] As a preferred embodiment of this utility model, the bottom end of the top support plate is provided with multiple limiting slots II, and the top end of the bottom mounting plate is provided with multiple limiting slots I. Both the limiting slots II and the limiting slots I are used to clamp the wave-shaped anti-pressure plate.

[0014] As a preferred embodiment of this utility model, both ends of the support part and the mounting part are provided with multiple cutting guide grooves, and the cutting guide grooves are trapezoidal grooves.

[0015] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0016] In this invention, a hollow structure plate is formed by bonding the bottom mounting plate and the top support plate. A corrugated anti-compression plate is provided. Through the axial force component principle of the triangular unit, the vertical load of the silicon rod is converted into the lateral tensile force of the plate. The corrugated structure disperses the weight of the silicon rod, reducing vibration and deformation during cutting. By having the clamping protrusions fit into the clamping groove one and the limiting step fit into the clamping groove two, the corrugated anti-compression plate can be prevented from breaking or shattering during the cutting process. Edge support blocks are used to strengthen the edge support, thereby preventing wafer drop and wire jamming. To ensure the support strength of the plate, the material of the corrugated anti-compression plate can be changed as needed, reducing material usage while ensuring the weight-bearing capacity. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0019] Figure 3This is a schematic diagram of the exploded structure of the hollow plate of this utility model;

[0020] Figure 4 This utility model Figure 3 Enlarged structural diagram at point B.

[0021] Explanation of reference numerals in the attached drawings: 1. Mounting part; 101. Bottom mounting plate; 102. Limiting step; 103. Limiting sealing block; 104. Limiting slot one; 105. Adhesive surface one; 2. Compression-resistant part; 201. Corrugated compression-resistant plate; 202. Clamping groove one; 203. Clamping groove two; 3. Adhesive part; 4. Support part; 401. Top support plate; 402. Edge support block; 403. Clamping protrusion; 404. Limiting slot two; 405. Adhesive surface two; 5. Cutting guide groove. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0023] This utility model provides, for example Figure 1-4 The diagram illustrates a corrugated, pressure-resistant hollow plate for silicon wafer cutting, comprising a support portion 4. An mounting portion 1 is bonded to the bottom of the support portion 4. When the support portion 4 and the mounting portion 1 are closed, they form a hollow cavity. A pressure-resistant portion 2 is bonded to the inside of the hollow cavity, with both ends extending to the clamping surfaces of the support portion 4 and the mounting portion 1. The pressure-resistant portion 2 is a corrugated support structure. Through the synergistic effect of the corrugated pressure-resistant plate 201 and the composite interlayer, the problem of central collapse under pressure, common in traditional hollow plates, is effectively avoided. Both the support portion 4 and the mounting portion 1 are made of plastic. The outer surface of the corrugated pressure-resistant plate 201 can be coated or soaked to create a covering layer, thereby improving its pressure-bearing strength.

[0024] The mounting part 1 includes a bottom mounting plate 101, with limiting steps 102 at both ends. The pressure-resistant part 2 includes a corrugated pressure-resistant plate 201, with clamping grooves 203 extending from both ends of the corrugated pressure-resistant plate 201. The end faces of the clamping grooves 203 fit against the limiting steps 102. The clamping grooves 203 effectively prevent the corrugated pressure-resistant plate 201 from spreading to both sides, thereby providing better support.

[0025] The support part 4 includes a top support plate 401, and edge support blocks 402 are provided on both sides of the bottom end of the top support plate 401. The inner side of the edge support blocks 402 is provided with an inclined surface that can clamp the corrugated pressure plate 201. The inclined surface can support the arcuate surface of the corrugated pressure plate 201 and share the load borne by the corrugated pressure plate 201.

[0026] The bottom end of the edge support block 402 is provided with a clamping protrusion 403, and the two ends of the corrugated pressure-resistant plate 201 are provided with clamping grooves 202. The bottom end of the clamping protrusion 403 fits into the clamping groove 202. The combination of the clamping protrusion 403 and the limiting step 102 can fix the corrugated pressure-resistant plate 201, prevent displacement during cutting, and facilitate the guidance and positioning of the corrugated pressure-resistant plate 201, reducing the difficulty of placement during installation.

[0027] The top of the limiting step 102 is provided with a limiting sealing block 103, the end face of which is in contact with the end of the corrugated pressure-resistant plate 201. The top of the limiting step 102 is provided with an adhesive surface 105, the top of which is flush with the top of the extension of the corrugated pressure-resistant plate 201. The bottom of the edge support block 402 is also provided with an adhesive surface 405 that can be in contact with the adhesive surface 105. The adhesive surface 105 and the adhesive surface 405 are in contact, and the setting of the adhesive surfaces can avoid the corrugated pressure-resistant plate 201 from affecting the opening of the cutting guide groove 5.

[0028] The top support plate 401 has an adhesive portion 3 at its top, which is the adhesive surface for the silicon rod. The silicon rod is pressed along its length and, after curing, forms a stable load structure.

[0029] The bottom end of the top support plate 401 is provided with multiple limiting slots 404, and the top end of the bottom mounting plate 101 is provided with multiple limiting slots 104. Both the limiting slots 404 and 104 are used to clamp the corrugated pressure-resistant plate 201. During installation, epoxy resin adhesive needs to be evenly applied to the corrugated surface of the corrugated pressure-resistant plate 201. Both the limiting slots 104 and 404 are used to constrain the placement position of the corrugated pressure-resistant plate 201.

[0030] Both ends of the support part 4 and the mounting part 1 are provided with multiple cutting guide grooves 5, which are trapezoidal grooves. This product is a commonly used consumable in the silicon wafer cutting process. When size adjustment is required, the cutting guide grooves 5 facilitate the positioning of the cutting position. The cutting guide grooves 5 are trapezoidal grooves or triangular grooves, with grooves cut at equal intervals. The plate material cut by the cutting guide grooves 5 will not affect the load-bearing capacity of the corrugated pressure plate 201.

[0031] This invention forms a hollow structure plate by bonding the bottom mounting plate 101 and the top support plate 401. A corrugated anti-compression plate 201 is provided. Through the axial force component principle of the triangular unit, the vertical load of the silicon rod is converted into the lateral tensile force of the plate. The corrugated structure disperses the weight of the silicon rod, reducing vibration and deformation during cutting. The clamping protrusion 403 fits into the clamping groove 1 202, and the limiting step 102 fits into the clamping groove 203. During the cutting process, the corrugated anti-compression plate 201 can be prevented from breaking or shattering. The edge support block 402 strengthens the edge support, thereby preventing wafer drop and wire jamming. To ensure the support strength of the plate, the material of the corrugated anti-compression plate 201 can be changed as needed, reducing material usage while ensuring the weight-bearing capacity.

[0032] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A corrugated, pressure-resistant hollow plate for silicon wafer cutting, characterized in that: It includes a support part (4), and an installation part (1) is bonded to the bottom end of the support part (4). When the support part (4) and the installation part (1) are closed, they form a hollow cavity. An anti-pressure part (2) is bonded to the inside of the hollow cavity. The two ends of the anti-pressure part (2) extend to the clamping surface of the support part (4) and the installation part (1). The anti-pressure part (2) is a wave-shaped support structure.

2. The corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 1, characterized in that: The mounting part (1) includes a bottom mounting plate (101), and the bottom mounting plate (101) has limit steps (102) at both ends. The pressure-resistant part (2) includes a corrugated pressure-resistant plate (201), and the corrugated pressure-resistant plate (201) has clamping grooves (203) at both ends. The end face of the clamping grooves (203) fits against the limit steps (102).

3. The corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 2, characterized in that: The support part (4) includes a top support plate (401), and edge support blocks (402) are provided on both sides of the bottom end of the top support plate (401). The inner side of the edge support block (402) is provided with an inclined surface that can clamp the wave-shaped anti-compression plate (201).

4. A corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 3, characterized in that: The bottom end of the edge support block (402) is provided with a clamping protrusion (403), and the two ends of the wave-shaped pressure plate (201) are provided with a clamping groove (202). The bottom end of the clamping protrusion (403) fits into the clamping groove (202).

5. A corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 4, characterized in that: The top of the limiting step (102) is provided with a limiting sealing block (103), the end face of the limiting sealing block (103) is attached to the end of the corrugated pressure plate (201), the top of the limiting step (102) is provided with an adhesive surface one (105), the top of the adhesive surface one (105) is flush with the top of the extension of the corrugated pressure plate (201), and the bottom of the edge support block (402) is also provided with an adhesive surface two (405) that can be attached to the adhesive surface one (105).

6. A corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 3, characterized in that: The top of the top support plate (401) is provided with an adhesive part (3), which is the adhesive surface of the silicon rod.

7. A corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 3, characterized in that: The bottom end of the top support plate (401) is provided with multiple limiting slots 2 (404), and the top end of the bottom mounting plate (101) is provided with multiple limiting slots 1 (104). Both the limiting slots 2 (404) and the limiting slots 1 (104) are used to clamp the wave-shaped pressure plate (201).

8. A corrugated, compressive-resistant hollow plate for silicon wafer cutting according to claim 1, characterized in that: Both ends of the support part (4) and the mounting part (1) are provided with multiple cutting guide grooves (5), and the cutting guide grooves (5) are trapezoidal grooves.

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