Chip transfer EPP cushion protection box

Abstract

The utility model discloses a kind of EPP buffering protection box for chip transfer, including EPP box and the transfer frame of movable clamping in EPP box interior;Metal frame is provided in EPP box interior, EPP box top end is provided with the handle connected with metal frame, EPP box front end swing hinged has box door;Transfer frame is provided with several, each transfer frame is horizontally arranged in metal frame interior, and the both ends of each transfer frame are slidably connected with the sliding clamping groove fixedly connected with metal frame;Several grooves are equally distributed on the both sides of each transfer frame, and chip bin is rotatably connected in each groove interior;The utility model structure design is reasonable, to EPP material as main box, and metal frame is arranged in EPP box interior, EPP box can form protection to chip in chip transfer process, avoid chip to be damaged by external force impact, and the setting of metal frame further strengthens the structural strength of EPP box.

Description

Technical Field

[0001] This utility model relates to the field of chip processing equipment technology, specifically to an EPP buffer protection box for chip transfer. Background Technology

[0002] A chip is the carrier of an integrated circuit. It is an electronic device that integrates semiconductors, resistors, capacitors, and other components, along with their connecting wires, onto a small silicon wafer through semiconductor manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminum evaporation. The chip is then soldered and packaged in a casing. Chips enable data processing, storage, and transmission, and are a core component of modern electronic devices, widely used in computers, mobile phones, home appliances, medical equipment, automobiles, and many other fields. During the chip manufacturing process, electronic chips need to be transported from one process step to another, requiring transfer devices for this process.

[0003] In the existing technology, the transfer device for chip processing does not have a protective structure. Because the electronic chips are exposed on the outer surface during transportation, dust will adhere to them, affecting subsequent processing. Moreover, the existing transfer device has poor shock absorption and cannot effectively alleviate the vibration generated during transportation, resulting in damage to the chips during the transfer process. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a chip transfer EPP buffer protection box.

[0005] The technical solution of this utility model is: a chip transfer EPP buffer protection box, including an EPP box body and a transfer frame that is movably snapped into the inside of the EPP box body; a metal frame is provided inside the EPP box body, a handle connected to the metal frame is provided at the top of the EPP box body, and a box door is movably hinged at the front end of the EPP box body.

[0006] Several transfer racks are provided, each horizontally arranged inside the metal frame, and each transfer rack has sliding slots at both ends that are fixedly connected to the metal frame; each transfer rack has several grooves evenly distributed on both sides, and each groove has a chip compartment that is rotatably engaged inside.

[0007] Furthermore, it also includes a flipping assembly set inside the transfer frame and connected to each chip compartment simultaneously; the flipping assembly includes a sliding column that is slidably engaged inside the transfer frame, a flipping push rod that is movably hinged to both sides of the sliding column and movably hinged to the outer wall of the chip compartment at the corresponding position, and an adjustment lever that is threaded to the lower end of the outer wall of the sliding column and passes through the transfer frame; a return spring that abuts against the sliding column is provided at the bottom of the transfer frame.

[0008] Instructions: When in use, pull the sliding column downward inside the transfer frame by adjusting the lever. At this time, the flip push rod pushes the corresponding chip compartment to rotate along its hinge point with the transfer frame, which makes it easy to put the chip into the chip compartment. When the adjusting lever is released, the sliding column is reset by the action of the return spring, and each chip compartment can rotate into the corresponding groove.

[0009] Furthermore, several partitions are evenly distributed inside the chip compartment, and placement notches are provided on the side walls of the chip compartment and on both sides of the partitions.

[0010] Description: By setting a partition inside the chip compartment, it is easy to classify and store chips of different models, and also to store chips individually; by setting a placement notch on the side wall of the chip compartment, it is easy to clamp and pick up the chips, which improves the ease of use of this utility model.

[0011] Furthermore, a heat dissipation groove is provided inside the metal frame and between two adjacent transfer racks; the heat dissipation groove is hollow inside, one end of the heat dissipation groove penetrates through the rear end of the EPP box, and heat dissipation holes are provided through the side wall of the heat dissipation groove; ventilation holes are provided through the side wall of the chip compartment.

[0012] Note: During chip transport, outside air enters the heat sink through the rear end of the EPP enclosure and is blown onto the chip through the heat dissipation holes on the heat sink, thus preventing the chip from being damaged by being in a sealed, high-temperature environment for a long time.

[0013] Furthermore, there are limiting baffles inside the metal frame and located at both ends of the transfer frame, which are connected by buffer springs;

[0014] Note: During the movement of the EPP box, buffer springs and limit baffles are used to buffer and limit the swing stroke of the transfer frame inside the sliding slot to avoid chip collision damage.

[0015] The method of using this utility model is as follows:

[0016] First, pull the transfer frame out from inside the metal frame along the sliding slot. Adjust the lever to move the sliding column downwards inside the transfer frame. At this time, the flip push rod pushes the corresponding chip compartment to rotate along its hinge point with the transfer frame. Then, place the chips (commercially available products) into their respective chip compartments. After the chips are placed, the sliding column returns to its original position under the action of the return spring. At this point, each chip compartment can rotate into its corresponding groove. Finally, push the transfer frame into the EPP enclosure along the sliding slot and close the enclosure door. During the EPP enclosure transfer process, outside air enters the heat dissipation tank through the rear end of the EPP enclosure and is blown onto the chips through the heat dissipation holes on the heat dissipation sleeve to cool them.

[0017] Compared with the prior art, the beneficial effects of this utility model are reflected in the following aspects:

[0018] First, the structure of this utility model is reasonable. It uses EPP material as the main box and sets a metal frame inside the EPP box. The EPP box can protect the chip during the chip transportation process and prevent the chip from being damaged by external impact. The setting of the metal frame further strengthens the structural strength of the EPP box.

[0019] Secondly, by setting multiple transfer racks inside the EPP box, and each transfer rack is equipped with multiple chip compartments, this utility model can not only classify and store chips of different models, but also store chips individually, avoiding collisions between chips and thus improving the reliability of this utility model.

[0020] Third, by setting up a flipping component, the sliding column is moved downward inside the transfer frame by adjusting the lever. At this time, the flipping push rod pushes the corresponding chip compartment to rotate along its hinge point with the transfer frame, which makes it easy to put the chip into the chip compartment. After releasing the adjusting lever, the chip compartment can rotate into the corresponding groove, which improves the ease of use of this utility model. Attached Figure Description

[0021] Figure 1 This is a longitudinal sectional view of the present invention.

[0022] Figure 2 This is the front view of this utility model;

[0023] Figure 3 This is a schematic diagram showing the connection between the chip compartment and the transfer rack of this utility model;

[0024] Figure 4 This is a schematic diagram showing the connection between the flip-up component and the chip compartment of this utility model;

[0025] Figure 5 This is a schematic diagram showing the connection between the flipping component and the transfer frame of this utility model;

[0026] Figure 6 This is a schematic diagram of the internal structure of this utility model;

[0027] Among them, 1-EPP box body, 10-metal frame, 11-handle, 12-box door, 2-transfer rack, 20-sliding slot, 21-groove, 22-chip compartment, 220-partition, 221-placement notch, 222-ventilation hole, 3-flip assembly, 30-sliding column, 31-flip push rod, 32-adjustment lever, 33-reset spring, 4-heat dissipation slot, 5-limiting baffle, 50-buffer spring. Detailed Implementation

[0028] Example 1

[0029] like Figure 1 , 2 The chip transfer using an EPP buffer protection box includes an EPP box body 1 and a transfer frame 2 that is movably snapped into the inside of the EPP box body 1; a metal frame 10 is provided inside the EPP box body, a handle 11 connected to the metal frame 10 is provided at the top of the EPP box body 1, and a box door 12 is movably hinged at the front end of the EPP box body 1; in this embodiment, the metal frame 10 is made of aluminum alloy.

[0030] like Figure 1 , 4 As shown, there are 3 transfer frames 2, each of which is arranged horizontally side by side inside the metal frame 10. Each of the two ends of each transfer frame 2 is slidably engaged with a sliding slot 20 that is fixedly connected to the metal frame 10. Each of the two sides of each transfer frame 2 has 6 grooves 21 evenly distributed, and each groove 21 is rotatably engaged with a chip compartment 22.

[0031] Example 2

[0032] The difference between this embodiment and Embodiment 1 is that:

[0033] like Figure 1 , 4 As shown in Figure 5, the system also includes a flipping assembly 3 disposed inside the transfer frame 2 and connected to each chip compartment 22. The flipping assembly 3 includes a sliding column 30 that is slidably engaged inside the transfer frame 2, a flipping push rod 31 that is movably hinged to both sides of the sliding column 30 and respectively hinged to the outer wall of the chip compartment 22 at the corresponding position, and an adjusting lever 32 that is threaded to the lower end of the outer wall of the sliding column 30 and passes through the transfer frame 2. A return spring 33 that abuts against the sliding column 30 is provided at the bottom of the transfer frame 2. By adjusting the lever 32, the sliding column 30 is pulled downward inside the transfer frame 2. At this time, the flipping push rod 31 pushes the corresponding chip compartment 22 to rotate along its hinge point with the transfer frame 2. After the adjusting lever 32 is released, the sliding column 30 is reset under the action of the return spring 33. At this time, each chip compartment 22 can rotate into the corresponding groove 21.

[0034] Example 3

[0035] The difference between this embodiment and Embodiment 2 is that:

[0036] like Figure 3 , 5As shown, there are two partitions 220 evenly distributed inside the chip compartment 22. Placement notches 221 are provided on the side wall of the chip compartment 22 on both sides of the partitions 220. By setting the partitions 220 inside the chip compartment 22, it is convenient to classify and store chips of different models, and also to store chips individually. By setting the placement notches 221 on the side wall of the chip compartment 22, it is convenient to clamp and pick up the chips.

[0037] Example 4

[0038] The difference between this embodiment and Embodiment 3 is that:

[0039] like Figure 3 , 6 As shown, a heat dissipation groove 4 is provided inside the metal frame 10 and between two adjacent transfer racks 2; the heat dissipation groove 4 is hollow inside, one end of the heat dissipation groove 4 penetrates through the rear end of the EPP box 1, and heat dissipation holes are provided through the side wall of the heat dissipation groove 4; ventilation holes 222 are provided through the side wall of the chip compartment 22; during the chip transfer process, outside air enters the heat dissipation groove 4 through the rear end of the EPP box 1 and is blown towards the chip through the heat dissipation holes on the heat dissipation groove 4, thereby preventing the chip from being damaged by being in a sealed, high-temperature environment for a long time.

[0040] Example 5

[0041] The difference between this embodiment and embodiment 4 is that:

[0042] like Figure 6 As shown, the metal frame 10 is connected to the limiting baffles 5 at both ends of the transfer frame 2 by buffer springs 50; during the movement of the EPP box 1, the buffer springs 50 and the limiting baffles 5 are used to buffer and limit the swing stroke of the transfer frame 2 inside the sliding slot 20.

Claims

1. An EPP cushioned shipping case for chip transfer, characterized by, It includes an EPP box (1) and a transfer frame (2) that is movably attached inside the EPP box (1); a metal frame (10) is provided inside the EPP box, a handle (11) connected to the metal frame (10) is provided at the top of the EPP box (1), and a door (12) is movably hinged at the front end of the EPP box (1). Several transfer racks (2) are provided, and each transfer rack (2) is arranged horizontally side by side inside the metal frame (10). Each transfer rack (2) has a sliding slot (20) that is fixedly connected to the metal frame (10) at both ends. Each transfer rack (2) has several grooves (21) evenly distributed on both sides, and each groove (21) has a chip compartment (22) that is rotatably engaged inside.

2. The chip transfer EPP buffer protection box according to claim 1, characterized in that, It also includes a flipping assembly (3) disposed inside the transfer frame (2) and connected to each of the chip compartments (22); the flipping assembly (3) includes a sliding column (30) slidably engaged inside the transfer frame (2), a flipping push rod (31) movably hinged to both sides of the sliding column (30) and movably hinged to the outer wall of the chip compartment (22) at the corresponding position, and an adjusting lever (32) threadedly connected to the lower end of the outer wall of the sliding column (30) and penetrating the transfer frame (2); a return spring (33) abutting against the sliding column (30) is provided at the bottom of the transfer frame (2).

3. The chip transfer EPP buffer protection box according to claim 1, characterized in that, The chip compartment (22) has several partitions (220) evenly distributed inside, and placement notches (221) are provided on the side wall of the chip compartment (22) and on both sides of the partitions (220).

4. The chip transfer EPP buffer protection box according to claim 1, characterized in that, A heat dissipation groove (4) is provided inside the metal frame (10) and between two adjacent transfer racks (2); the heat dissipation groove (4) is hollow inside, one end of the heat dissipation groove (4) penetrates the rear end of the EPP box (1), and a heat dissipation hole is provided through the side wall of the heat dissipation groove (4); a ventilation hole (222) is provided through the side wall of the chip compartment (22).

5. A chip transfer EPP buffer protection box according to claim 1, characterized in that, The limiting baffle (5) is located inside the metal frame (10) and at both ends of the transfer frame (2) is connected by a buffer spring (50).

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