Intelligent micro power module and device
By integrating a power module, which is equivalent to an intelligent micro power module on a wafer, the problems of large size, high power consumption and low reliability of existing power modules are solved, and a power module with high consistency and reliability is realized, which is suitable for a variety of motors and inverter power supply equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU XINGAN TECH CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-06-23
AI Technical Summary
Existing power modules are large in size, consume a lot of power, have poor overcurrent capability, and cannot detect overcurrent, overvoltage and overtemperature of the load, resulting in low reliability.
Design an intelligent micro power module that integrates a power supply module, a back EMF detection module, a status detection module, a central control module, a PWM drive module, and a fault indication module on the same wafer. Adopt a modular design to increase the chip's thermal balance capability, connect them in parallel on the same DBC, and integrate reverse connection protection circuit and multiple detection functions.
It improves product consistency and reliability, solves packaging limitations, enhances overcurrent capability, reduces production costs, and reduces the probability of failure.
Smart Images

Figure CN224401379U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of power modules, and specifically relates to an intelligent micro power module and device. Background Technology
[0002] An IPM module is an intelligent power module that integrates power switching devices, drive circuits, and protection circuits. It is widely used in AC motor frequency conversion speed regulation and DC motor chopper speed regulation, such as motor drives in household appliances like air conditioners, washing machines, and refrigerators, as well as motor control systems in industrial fields. It is also widely used in various inverter power supplies, such as UPS uninterruptible power supplies, solar photovoltaic inverters, and wind power inverters.
[0003] Existing power modules typically consist of multiple independent transistors (such as BJTs and MOSFETs), diodes, etc. Each device has its own package, requiring separate layout, routing, and connection on the circuit board, resulting in a large size and high power consumption. As the power density per unit area of chips continues to increase, existing packages limit the maximum output current of the chip, preventing it from operating safely and reliably within its SOA (Service-Oriented Area) operating region. Existing power modules generally suffer from poor overcurrent capability, exhibiting inconsistent performance when used in parallel, leading to low reliability. Furthermore, existing products lack the ability to detect overcurrent, overvoltage, and overtemperature loads, further complicating their reliability.
[0004] Therefore, a power module is needed that can solve the above problems. Summary of the Invention
[0005] To address the shortcomings of the prior art, this application provides an intelligent micro power module and device integrated onto the same wafer, which improves product consistency, facilitates installation, and enhances reliability.
[0006] The technical effect to be achieved in this application is accomplished through the following solution:
[0007] According to a first aspect of this application, a smart micro power module is provided, comprising an integrated power module, a back EMF detection module, a status detection module, a central control module, a PWM drive module, and a fault indication module, wherein:
[0008] The power module is used to identify the voltage type, ensure circuit safety, and provide power to the entire module;
[0009] The back EMF detection module is connected to the power supply module and the central control module, and is used to detect the back EMF of the motor.
[0010] The status detection module is connected to the central control module and is used to detect the operating status of the system.
[0011] The central control module is used to receive signals from the back EMF detection module and the status detection module in order to control the PWM drive module.
[0012] The PWM drive module includes several modules connected in parallel to the same DBC and connected to the central control module for driving the motor to rotate;
[0013] The fault indication module is connected to the central control module and is used to issue corresponding indications when a fault occurs.
[0014] Preferably, the power module includes an analog-to-digital converter module for dividing the battery voltage and outputting stable 15V and 5V power supplies.
[0015] Preferably, the power module is provided with a reverse connection protection circuit, which includes a diode for reverse connection interception.
[0016] Preferably, the status detection module includes a voltage detection module, a current detection module, and a temperature detection module. The voltage detection module is used to monitor the bus voltage; the current detection module is used to monitor the bus current; and the temperature detection module is used to monitor the temperature of the aluminum substrate. When undervoltage, overcurrent, overvoltage, overtemperature, or short circuit is detected, the corresponding load circuit is disconnected.
[0017] Preferably, the central control module is a microcontroller, which is used to output a PWM wave according to a set position state, so as to turn on the MOSFET through the PWM drive module.
[0018] Preferably, after the PWM drive module controls the load motor to increase its speed at a constant speed, the back EMF detection module continuously detects the position signal of the load motor in the circuit. The microcontroller drives the load motor to reach the set speed through the position signal, thus completing the start-up.
[0019] Preferably, the control section is separate from the power section, and the power section adopts a modular approach.
[0020] According to a second aspect of this application, a device is provided that employs the aforementioned intelligent micro power module.
[0021] According to one embodiment of this application, the beneficial effects of this intelligent micro power module are as follows:
[0022] This power module effectively improves product consistency by picking up chips on the same wafer, ensuring more stable and uniform product performance. Moreover, the integrated design makes installation more convenient.
[0023] After integration, this power module can be used with copper brackets to form specific module products, successfully solving the defects of product limited by packaging and avoiding performance bottlenecks caused by packaging limitations; by connecting multiple chips in parallel on the same DBC, the chip thermal balance capability is increased, the chip output current capability is greatly improved, and the overcurrent capability of the product is greatly increased, which can better meet the high current requirements of such as electric vehicle controllers.
[0024] This power module can monitor and protect the operation process, which can significantly improve product reliability and reduce the probability of failure.
[0025] While improving product performance and reliability, it also reduces production costs, resulting in better economic benefits. Attached Figure Description
[0026] To more clearly illustrate the embodiments of this application or the existing technical solutions, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a circuit structure block diagram of an intelligent micro power module according to an embodiment of this application;
[0028] Figure 2 for Figure 1 Circuit diagram of the intelligent micro power module. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0030] like Figure 1 As shown, an intelligent micro power module according to one embodiment of this application includes an integrated power supply module, a back EMF detection module, a status detection module, a central control module, a PWM drive module, and a fault indication module, wherein:
[0031] The power module is used to identify the voltage type, ensure circuit safety, and provide power to the entire module.
[0032] This power module is compatible with 48V / 60V batteries. After voltage sampling and analysis by the voltage detection module, it can automatically identify the voltage type of the connected battery and effectively adapt to different voltage sources.
[0033] Equipped with reverse connection protection, it prevents damage to the circuit caused by reverse battery connection, ensuring circuit safety. Specifically, a diode is connected in series in the circuit, utilizing the diode's unidirectional conductivity to prevent reverse power connection. When the power supply is connected in the correct direction, the diode is in the forward conducting state, allowing current to flow smoothly through the diode and thus powering the subsequent circuit. At this time, the forward voltage drop of the diode is generally around 0.7V (for silicon diodes), which has little impact on the normal operation of the circuit in most cases.
[0034] When the power supply is reversed, the diode is in the reverse cutoff state, and almost no current flows through the circuit, thus protecting the downstream circuit components from damage by reverse current.
[0035] The DC-DC module converts battery power and outputs stable 15V and 5V power to provide suitable operating voltage for subsequent circuits; specifically, this power module includes an analog-to-digital converter (ADC) module.
[0036] First, the battery voltage is divided into appropriate proportions using a voltage divider circuit to make its voltage range suitable for the ADC's input range. For example, if the battery voltage is in the tens of volts, a voltage divider resistor is needed to reduce the battery voltage to a range acceptable to the ADC, such as 0-5V.
[0037] When the divided battery voltage signal is input to the ADC, the ADC converts the analog voltage signal into a digital signal, establishing a quantization relationship between the digital signal and the battery voltage. For example, a 10-bit ADC has an output digital value range of 0-1023, allowing the ADC's output voltage to be set.
[0038] The back EMF detection module connects to the power supply module and the central control module and is used to detect the back EMF of the motor.
[0039] The status detection module, connected to the central control module, is used to detect the operating status of the system. The status detection module includes a voltage detection module, a current detection module, and a temperature detection module. The voltage detection module monitors the bus voltage; the current detection module monitors the bus current; and the temperature detection module monitors the temperature of the aluminum substrate. When undervoltage, overcurrent, overvoltage, overtemperature, or short circuit is detected, i.e., when the temperature change exceeds the threshold, the system immediately enters the corresponding protection state, such as power cut-off or alarm activation, to prevent the fault from escalating and ensure the stable operation of the motor and circuit.
[0040] For example, in a voltage detection module: a comparator is set up, with one input connected to the divided power supply voltage and the other input connected to a fixed reference voltage, which corresponds to the undervoltage protection threshold. When the power supply voltage is normal, the divided power supply voltage is higher than the reference voltage, and the comparator outputs a high level, indicating that the voltage is normal.
[0041] The power supply voltage is 12V. Through a voltage divider circuit consisting of two resistors (assuming a division ratio of 1 / 10), the voltage after division is 1.2V. If the reference voltage corresponding to the undervoltage protection threshold is set to 1V, the comparator outputs a high level. When the power supply voltage drops below 10V, the voltage after division is below 1V, the comparator outputs a low level, triggering the undervoltage protection action, such as by controlling a relay or a MOSFET to disconnect the load circuit.
[0042] The central control module is the core control unit of the entire system. It receives signals from the back EMF detection module and the status detection module to control the PWM drive module. The central control module is a microcontroller. The microcontroller outputs a PWM wave according to the set position status to turn on the MOSFET through the PWM drive module.
[0043] The PWM drive module consists of several modules connected in parallel to the same DBC, which are connected to the central control module to drive the motor rotation; for example... Figure 2 As shown, QA1, QA2, QA3, QA4, QA6, QA7, QA8, and QA9 are parallel PWM drive modules. Connecting them in parallel on the same DBC increases the chip's thermal balance capability, and the chip's outflow capability is greatly improved.
[0044] The fault indication module is connected to the central control module and is used to issue corresponding indications when a fault occurs. For example, it can issue an alarm by means of sound and light, or connect to a display screen to display the current cause of the fault or display the fault code.
[0045] This power module uses a three-stage starting method to start the load motor:
[0046] The first segment: The microcontroller outputs a PWM wave based on the set false position state. The PWM drive module turns on the MOSFET, allowing current to flow through the phase line of the permanent magnet motor. This operation is repeated two or more times to accurately locate the initial position of the motor rotor.
[0047] The second stage: Based on the preset false position signal, a PWM wave is output to make the permanent magnet motor speed increase at a specific slope until the back EMF detection module can correctly detect the position signal.
[0048] The third stage: Based on the position signal output by the back EMF detection module, the permanent magnet motor is driven to reach the set speed, completing the start-up process.
[0049] This power module adopts a design architecture that separates the control and power sections, which improves system maintainability and stability. The power section uses a modular approach to enhance heat dissipation, reduce the risk of failure due to overheating, and improve the overall reliability and durability of the controller.
[0050] This intelligent micro power module is suitable for use in various motor drive scenarios, such as motor drives for home appliances like air conditioners, washing machines, and refrigerators. It can also be used in motor control systems in the industrial field, as well as in various inverter power supplies, such as UPS uninterruptible power supplies, solar photovoltaic inverters, and wind power inverters.
[0051] This intelligent micro power module effectively improves product consistency by selecting chips with highly consistent electrical performance from the same wafer, thus ensuring more stable and uniform product performance. It solves the problem of complex manufacturing processes and poor product consistency caused by the single-tube mounting method used in traditional discrete device drives for DC brushless controllers.
[0052] Traditional packaging requires a chip to be mounted on a heatsink and then soldered onto the PCB. This module's layout design optimizes the installation process, eliminating the difficulty of power module installation; users simply need to fix it in place according to the designated mounting points.
[0053] Traditional discrete devices are limited by package types such as TO-220, TO-247, and TO-263. Due to pin overcurrent limitations, the chip's maximum current cannot be fully utilized, which can easily lead to product failure. This intelligent micro power module uses a copper support as the busbar, which improves heat dissipation and successfully solves the defects caused by the product's package limitations, avoiding the performance bottleneck caused by package constraints.
[0054] By screening multiple chips and connecting them in parallel on the same DBC, the thermal balance capability of the chips is increased, and the current output capability of the chips is greatly improved. This solves the problem that traditional discrete devices are limited in overcurrent capability, which affects the performance of products in high-current application scenarios, thus better meeting the high-current requirements of electric vehicle controllers and other applications.
[0055] This power module has been optimized in terms of startup, operation monitoring and protection, and overall structure. Compared with traditional discrete components, its overall reliability has been greatly improved, reducing the probability of failure. Moreover, due to its integrated modular structure, the cost of production, use and maintenance is lower, resulting in better economic benefits.
[0056] It should be noted that the above detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0057] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0058] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.
[0059] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.
[0060] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, such as rotated 90 degrees or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.
[0061] In the detailed description above, reference has been made to the accompanying drawings, which form part of this document. In the drawings, similar symbols typically identify similar parts unless the context otherwise indicates otherwise. The illustrated embodiments described in the detailed specification, drawings, and claims are not intended to be limiting. Other embodiments may be used and other changes may be made without departing from the spirit or scope of the subject matter presented herein.
[0062] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. An intelligent micro power module, characterized by, The intelligent micro power module comprises a power module, a back electromotive force detection module, a state detection module, a central control module, a PWM drive module and a fault indication module integrated together, wherein: The power module is used for identifying voltage types, ensuring circuit safety and providing power for the whole module. The back electromotive force detection module is connected with the power module and the central control module and is used for detecting the back electromotive force of the motor. The state detection module is connected with the central control module and is used for detecting the running state of the system. The central control module is used for receiving signals of the back electromotive force detection module and the state detection module to control the PWM drive module. The PWM drive module comprises a plurality of parallel DBCs connected with the central control module and is used for driving the motor to rotate. The fault indication module is connected with the central control module and is used for giving corresponding indication when a fault occurs.
2. The smart micro power module of claim 1, wherein, An analog-digital conversion module is arranged in the power module and is used for outputting stable 15V and 5V power after dividing the voltage of the battery.
3. The smart micro power module of claim 1, wherein, A reverse connection prevention circuit is arranged in the power module and comprises a diode for preventing reverse connection.
4. The smart micro power module of claim 1, wherein, A voltage detection module, a current detection module and a temperature detection module are arranged in the state detection module, the voltage detection module is used for monitoring the bus voltage, the current detection module is used for monitoring the bus current and the temperature detection module is used for monitoring the temperature of the aluminum substrate, and when under-voltage, over-current, over-voltage, over-temperature and short circuit are detected, the corresponding load circuit is cut off.
5. The intelligent power module according to claim 1, wherein The central control module is a single-chip microcomputer, which is used for outputting PWM waves according to a set position state to make the MOS tube conductive through the PWM drive module.
6. An apparatus, comprising: The intelligent micro power module is adopted. The intelligent micro power module is adopted.