A press-fit platform

Abstract

The application discloses a press-fitting platform, which comprises a press-fitting support, a base plate movably arranged on the press-fitting support, a positioning device arranged on the bottom surface of the base plate and a material taking device. The positioning device comprises a plurality of positioning columns distributed on the bottom surface of the base plate and used for positioning a circuit board; the material taking device is arranged between the positioning columns and used for grabbing the positioned circuit board; and the circuit board and a carrier plate are press-fitted at a press-fitting position in cooperation with the positioning device. The base plate integrates the functions of material taking, positioning and press-fitting, so that the circuit board grabbing, positioning and press-fitting process is simplified, and the assembly efficiency and the press-fitting precision are improved.

Description

Technical Field

[0001] This application relates to the field of electronic assembly technology, and in particular to a press-fit platform applicable to automobiles. Background Technology

[0002] In the current field of electronic assembly, the pressing of circuit boards and carrier boards is usually completed in a multi-station, segmented manner, with steps such as material handling, positioning, and pressing performed by multiple independent devices. This decentralized workflow has the following drawbacks: First, the need for workpiece transfer between devices can easily cause positioning deviations, affecting pressing accuracy; second, it requires a large floor space and has high system complexity, increasing maintenance costs and operational difficulty; third, process interruptions or asynchronous cycles between different devices can easily lead to low assembly efficiency.

[0003] Especially in applications such as automotive electronics, 3C products, and medical devices, where high assembly precision and production cycle time are required, traditional press-fitting systems struggle to meet the demands for rapid response and high stability.

[0004] Therefore, there is an urgent need for a compact, functionally integrated press-fitting platform with automatic alignment capabilities to improve overall assembly efficiency and press-fitting reliability. Utility Model Content

[0005] The purpose of this application is to provide a press-fitting platform that aims to solve the problems of dispersed processes, low assembly efficiency, and poor press-fitting accuracy in the prior art.

[0006] To achieve the above objectives:

[0007] This application discloses a press-fitting platform, including a press-fitting bracket;

[0008] A base plate that is movably mounted on the press-fit bracket;

[0009] Positioning device and material handling device installed on the bottom surface of the substrate;

[0010] The positioning device includes a plurality of positioning posts distributed on the bottom surface of the substrate, used to position the circuit board at the material picking position;

[0011] The material handling device is located between the plurality of positioning columns and is used to grab the circuit board after it has been positioned by the positioning device, and cooperate with the positioning device to press at least a portion of the circuit board and the carrier plate at the pressing position.

[0012] Optionally, at least some of the positioning posts extend beyond the bottom surface of the substrate to a length greater than the length of the picking device extending beyond the bottom surface of the substrate.

[0013] Optionally, the positioning post includes a needle-shaped positioning post and a circular positioning post;

[0014] The needle-shaped positioning post includes a needle-shaped fixed positioning post and a needle-shaped spring positioning post, wherein the extension length of the needle-shaped fixed positioning post on the substrate is greater than the extension length of the material picking device on the substrate.

[0015] The pin-shaped fixing and positioning post is used for the initial positioning of the circuit board;

[0016] The needle-shaped spring positioning post includes a tip for positioning the circuit board disposed at the end of the post body, and a spring component sleeved on the post body. The spring component is used to elastically engage with the non-press-fit area of ​​the circuit board during the press-fit process.

[0017] The circular positioning post includes a circular fixed positioning post and a circular spring positioning post;

[0018] The end platform of the circular fixed positioning post forms a tip, which is used for repositioning the circuit board. The platform is used to cooperate with the material handling device to press at least part of the circuit board and the carrier plate at the pressing position.

[0019] The circular spring positioning post includes a pointed tip for positioning the circuit board at the end of the post body, and a spring component sleeved on the post body. The spring component is used to elastically engage with the non-pressed area of ​​the circuit board during the press-fitting process.

[0020] Optionally, the pressing position is provided with a carrier plate placement platform for supporting the carrier plate;

[0021] The positioning post also includes a square positioning post, the end of which is provided with a groove, which is used to cooperate with the carrier plate placement platform for positioning.

[0022] Optionally, the substrate includes a press-fit region and a non-press-fit region;

[0023] Multiple pin-shaped fixing and positioning posts and multiple circular fixing and positioning posts are distributed in the pressing area of ​​the substrate, and the material picking device is located between the multiple pin-shaped fixing and positioning posts and the circular fixing and positioning posts;

[0024] Multiple needle-shaped spring positioning posts and multiple circular spring positioning posts are distributed in the non-press-fitting area of ​​the substrate.

[0025] Optionally, the substrate edge is provided with a limiting part, the height of which is adapted to the bottom height of the positioning post and the material picking device having a platform structure, for forming a limiting support during the pressing process of at least part of the circuit board and carrier board.

[0026] Optionally, the pressing platform includes a docking assembly, which is movably disposed relative to the pressing bracket;

[0027] The docking assembly includes a lifting unit and a sliding unit;

[0028] The docking assembly includes a sliding unit and a lifting unit;

[0029] The sliding unit is used to drive the lifting unit to move horizontally between the material picking position and the pressing position;

[0030] The substrate is mounted on the lifting unit, which is used to drive the substrate to move up and down in the vertical direction.

[0031] Optionally, the substrate is installed with the lifting unit via a connector, and the lower end of the lifting unit is provided with a connecting seat that mates with the connector. The substrate is detachably connected to the connecting seat via the connector.

[0032] Optionally, a buffer is provided between the plug and the substrate. The buffer deforms during the pressing process to reduce the relative distance between the plug and the substrate after pressing is completed.

[0033] Optionally, the sliding unit and / or the press-fit bracket includes a locking device, which includes a first locking device and a second locking device;

[0034] The first locking device is disposed at one end near the material picking position, and is used to lock the sliding unit at the material picking position when the sliding unit slides to the material picking position;

[0035] The second locking device is disposed at one end near the pressing position, and is used to lock the sliding unit at the pressing position when the sliding unit slides to the pressing position.

[0036] The pressing platform provided in this application integrates a material handling device, a positioning device, and a pressing mechanism into one unit. By setting a movable substrate, it achieves full-process linkage control of the circuit board from material handling and positioning to pressing, simplifying the assembly process and reducing error accumulation caused by intermediate transfer links. The platform has a compact structure and high motion coordination and alignment accuracy. By incorporating a buffer, it effectively absorbs instantaneous impacts during the pressing process, reducing stress on tooling and products and extending equipment lifespan. Simultaneously, through plug-and-play connections and a quick-change structure, it enables rapid assembly and replacement of various substrate components, enhancing the system's adaptability and flexibility. The overall solution is suitable for automated pressing processes of various types of high-precision electronic modules, offering comprehensive advantages such as high assembly efficiency, high positioning accuracy, and strong structural reliability, thereby improving the automation level and application breadth of the assembly system. Attached Figure Description

[0037] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0038] Figure 1 This is a structural diagram of a press-fitting platform in the prior art.

[0039] Figure 2 This is a structural schematic diagram of the pressing platform described in the embodiments of this application from one angle.

[0040] Figure 3 This is a schematic diagram of the docking components of the pressing platform described in the embodiments of this application.

[0041] Figure 4 This is an enlarged structural schematic diagram of the docking component described in the embodiments of this application.

[0042] Figure 5 This is a schematic diagram of the substrate structure described in the embodiments of this application.

[0043] Figure 6 This is a schematic diagram of the structure of the substrate and the docking component as described in the embodiments of this application.

[0044] Figure 7 This is a schematic diagram of the structure of the substrate and the lifting unit as described in the embodiments of this application.

[0045] In the picture:

[0046] 1. Press-fit bracket; 10. Base plate; 101. Positioning device; 1011. Needle-shaped positioning post; 1011a. Needle-shaped fixed positioning post; 1011b. Needle-shaped spring positioning post; 1012. Circular positioning post; 1012a. Circular fixed positioning post; 1012b. Circular spring positioning post; 1013. Square positioning post; 102. Material handling device; 103. Limiting part; 11. Docking assembly; 111. Lifting unit; 112. Sliding unit; 12. Connector; 13. Buffer; 113. Locking device; 1131. First locking device; 1132. Second locking device; 2. Press-fit fixture; 21. Material handling component; 22. Positioning component; 23. Press-fit component; 24. Transmission component; 25. Servo motor.

[0047] The realization of the objectives, functional features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0048] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this invention. Based on the description of this invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention.

[0049] Unless otherwise explicitly specified and limited, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms based on the specific circumstances.

[0050] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0051] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0052] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0053] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0054] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0055] This utility model relates to an automated component pressing technology, which is particularly suitable for integrated assembly scenarios with requirements for limiting, positioning, and pressing. This type of technology has wide applications in pressing operations of electronic manufacturing, automotive electronics, medical devices, and 3C products, mainly for high-precision assembly and combination of components such as circuit boards and carrier boards.

[0056] See Figure 1 , Figure 1 This is a schematic diagram of the structure of a conventional press-fitting fixture 2. The conventional press-fitting fixture 2 typically includes a feeding system, a picking component 21, a positioning component 22, a pressing component 23, a transmission component 24, and a servo motor 25. Its workflow is generally as follows: The circuit board and the carrier board are respectively fed to the assembly area by their respective feeding systems. After picking up the circuit board from the feeding position, the picking component 21 transports the circuit board to the position of the positioning component 22, and completes the placement and positioning operation with the assistance of the positioning component 22. After the circuit board is placed, the picking component 21 returns to its initial picking position. At this time, the positioning component 22, carrying the positioned circuit board and carrier board, moves to the pressing area under the drive of the transmission component 24. Upon reaching the pressing station, the servo motor 25 drives the pressing component 23 to perform the pressing operation, realizing the bonding of the circuit board and the carrier board. After pressing is completed, the pressing component 23 and the positioning component 22 return to their original positions sequentially, completing one complete pressing cycle.

[0057] Although the aforementioned press-fitting platform has achieved basic automatic press-fitting functions, it still has significant shortcomings in terms of structural organization, operating efficiency, and process adaptability.

[0058] First, the multiple handling actions during the material handling and pressing processes can easily cause displacement deviations in the circuit board during transport. Especially when there is no unified positioning reference between gripping, placing and platform transfer, the cumulative error can easily cause misalignment of key positions, thus affecting the final pressing quality.

[0059] Secondly, the multiple mechanisms in the press-fitting platform 2 operate independently, and the collaborative process relies on complex logic control. Each component is located at different positions on the production line, resulting in frequent signal linkages, causing system response delays, and making efficient management through a single control platform difficult, further limiting the improvement of assembly cycle time.

[0060] Furthermore, to avoid spatial interference between the material handling path and the positioning component 22, existing technologies typically employ a clamping method to limit and position the outer edge of the circuit board. While this method is simple in structure, it is prone to deformation or damage to the edge of the circuit board during the clamping process, posing a significant risk, especially for circuit boards with delicate structures or brittle materials, and consequently affecting assembly consistency.

[0061] In summary, the existing press-fitting fixture 2 still has significant shortcomings in terms of handling and positioning accuracy, structural integration, product adaptability, and ease of use and maintenance. There is an urgent need for a new press-fitting platform with a compact structure, strong integrated functions, high positioning reliability, and fast assembly cycle to improve and optimize it.

[0062] See Figures 2 to 6 This embodiment provides a press-fit platform, mainly used in the automated assembly process of circuit board-type structural components, especially suitable for precision press-fitting operations between circuit boards and carrier boards. The circuit board is typically a functional control board, signal processing unit, or communication interface module, and the carrier board is a structural mother board or connecting substrate 10 that carries the circuit board. The two are electrically connected and structurally fixed through press-fitting.

[0063] After pressing, the components form a circuit control module, which can be widely used in vehicle electronic controllers (such as ECUs), intelligent manufacturing equipment, medical testing equipment, and consumer electronic terminals (such as tablet computers and smartwatches). It features a compact structure, reliable connection, and high assembly efficiency.

[0064] The pressing platform includes a pressing bracket 1, a base plate 10 movably mounted on the pressing bracket 1, and a positioning device 101 and a material handling device 102 mounted on the bottom surface of the base plate 10.

[0065] The overall workflow of the press-fit platform is as follows: the circuit board is conveyed by the front-end feeding system to the picking position located on one side of the press-fit bracket 1; the positioning device 101 installed on the bottom surface of the substrate 10 limits and positions the circuit board located at the picking position; after positioning is completed, the picking device 102 on the bottom surface of the substrate 10 adsorbs the circuit board; subsequently, the substrate 10 together with the picking device 102 moves to the pressing position on the other side of the press-fit bracket 1; at the pressing position, the circuit board is aligned with the preset carrier plate, and the pressing mechanism set above the press-fit bracket 1 performs the pressing operation to complete the assembly.

[0066] The pressing bracket 1 is a rigid frame structure with a material picking position and a pressing position at its two ends, respectively, for supporting the substrate 10 and guiding it to move back and forth in the horizontal direction. The substrate 10 is mounted on the pressing bracket 1 via a slide rail assembly, and can move from the material picking position to the pressing position along the slide rail, and return to the initial position after pressing is completed, thus completing the assembly cycle.

[0067] The positioning device 101 includes multiple positioning posts distributed at the bottom of the substrate 10. The positioning posts are used to limit and position the circuit board when the substrate 10 is in the material handling position, ensuring the circuit board is in a stable and controllable posture before being gripped, thus guaranteeing material handling accuracy. Simultaneously, when the substrate 10 moves to the pressing position, the positioning device 101 also forms a positioning engagement with a reference component (such as a carrier positioning platform or tooling fixture) at the pressing position, assisting in the precise positioning of the substrate 10 at the pressing position and improving alignment accuracy and structural stability during the pressing process.

[0068] The material handling device 102 is installed on the bottom surface of the substrate 10 and is located between multiple positioning posts. It is used to perform adsorption and gripping on the positioned circuit board when the substrate 10 is in the material handling position, and to maintain the adsorption state continuously during the movement of the substrate 10 until the pressing is completed.

[0069] In one specific embodiment, the material handling device 102 is a vacuum adsorption mechanism fixedly mounted on the bottom surface of the substrate 10, with its adsorption end facing downwards. After the circuit board is positioned by the positioning post, the vacuum adsorption mechanism activates, adsorbing the circuit board from top to bottom while the substrate 10 remains stationary. The substrate 10 then moves the circuit board to the pressing position. Upon reaching the pressing position, the circuit board, while maintaining its adsorption state, is aligned with the carrier plate by the positioning device 101. The pressing mechanism moves from top to bottom, pressing the circuit board onto the carrier plate to complete the assembly. After pressing, the vacuum adsorption mechanism releases its adsorption state, releasing the circuit board, completing one pressing cycle.

[0070] In another embodiment, the material handling device 102 is an electromagnetic adsorption module disposed on the bottom surface of the substrate 10. The electromagnetic structure generates magnetic force when energized to adsorb circuit boards with metal reinforcement structures, and releases them when power is off. This structure is suitable for assembly requirements where the back of the circuit board has a metal layer or shielding plate; it provides stable adsorption and rapid response, making it particularly suitable for high-frequency assembly lines.

[0071] In another embodiment, the material handling device 102 is a controllable adhesion structure disposed on the bottom surface of the substrate 10, and its adsorption surface is composed of micro-adsorption gel or electrically controlled adhesive material. When the material handling operation begins, the surface of the adsorption pad enhances its adhesion performance under electrical control, forming a temporary adhesion with the circuit board surface; after the handling and pressing are completed, the adhesion is released by adjusting the voltage, temperature, or structural state, thereby releasing the circuit board. This structure is suitable for circuit boards that do not allow indentation, are electrostatically sensitive, or have a relatively precise surface coating.

[0072] It should be noted that, depending on different product structures and process requirements, the pressing operation may only be applied to a portion of the circuit board and the carrier board, such as limiting pressing to the functional connection area or a partial fixing area, or it may cover the entire mating surface of the circuit board and the carrier board. Through these methods, the functional requirement of pressing at least a portion of the circuit board and the carrier board at the pressing position is achieved, balancing structural reliability and process flexibility.

[0073] For further details, please refer to [link / reference]. Figure 5 ,、 Figure 6 or Figure 7 In order to optimize the limiting effect of the circuit board, in the positioning device 101, at least some of the positioning posts have an extension length on the bottom surface of the substrate 10 that is greater than the extension length of the material picking device 102 on the bottom surface of the substrate 10.

[0074] Specifically, the vertical distance between the lower end of some positioning posts and the bottom surface of the substrate 10 is greater than the height of the adsorption end of the picking device 102, so that when the circuit board reaches the picking position, these positioning posts will preferentially make contact with the circuit board, thereby achieving limiting positioning of its edges or positioning holes.

[0075] When the circuit board is conveyed to the picking position via the conveyor mechanism, it is first positioned and limited by an extended positioning post, and then the picking device 102 presses down onto the surface of the circuit board for adsorption. Since this pressing action is itself part of the picking operation, no additional independent positioning step is needed, achieving accurate positioning of the circuit board during the picking process. This not only improves the efficiency of motion coordination but also effectively simplifies the pre-pressing process, helping to shorten pressing time, reduce control complexity, and improve the overall efficiency and stability of the assembly system.

[0076] Furthermore, to ensure precise positioning of the substrate 10 at the pressing position, the pressing platform is equipped with a carrier plate placement platform (not shown in the figure) at the pressing position to support the carrier plate to be pressed. The carrier plate placement platform is fixedly installed, and its upper surface is provided with a reference structure or limiting edge to limit the position and orientation of the carrier plate, ensuring that it is in a stable state before pressing.

[0077] In addition to the pin-shaped positioning post 1011 and the circular positioning post 1012, the positioning post also includes a square positioning post 1013. The square positioning post 1013 is disposed on the bottom surface of the substrate 10, corresponding to the positioning structure arrangement of the carrier plate placement platform. The end of the square positioning post 1013 is provided with a groove structure for cooperating with the limiting protrusion on the carrier plate placement platform to realize the limiting positioning of the substrate 10 in the pressing position.

[0078] Furthermore, the groove structure can be designed differently according to positioning accuracy requirements and platform structure. For example, the groove can be a "V" shaped structure with symmetrical inclined surfaces on both sides, which can cooperate with the conical limiting post set on the carrier plate placement platform to form a self-aligning structure, suitable for occasions requiring rapid positioning and automatic guidance; the groove structure can also be a stepped structure, with stepped parts of different heights inside the groove, which can be used with limiting bosses with multi-level positioning surfaces, in addition to lateral positioning, it can also realize vertical positioning control of the substrate 10.

[0079] This embodiment provides a groove at the end of the square positioning post 1013 and positions it in conjunction with the carrier plate placement platform structure at the pressing position. This enables rapid positioning when the substrate 10 moves to the pressing position, effectively preventing positioning errors and assembly misalignment. It also improves the fault tolerance and positioning stability of the substrate 10 at the pressing station, and helps to improve the overall operational reliability and assembly accuracy of the pressing platform.

[0080] Furthermore, the substrate 10 is divided into a pressing area and a non-pressing area, and the positioning posts are arranged differently according to functional requirements to realize the local pressing operation of the circuit board.

[0081] Specifically, multiple pin-shaped fixing and positioning posts 1011a and multiple circular fixing and positioning posts 1012a are distributed and arranged in the pressing area of ​​the substrate 10, surrounding the material handling device 102, forming a stable support for the circuit board pressing area. The pin-shaped fixing and positioning post 1011a has a slender column with a pointed end for insertion into a limiting hole on the circuit board, achieving precise insertion positioning of the circuit board. The end structure of the circular fixing and positioning post 1012a may include a limiting tip and a stepped platform for pressing and fitting. The tip is used to position the circuit board, and the platform cooperates with the material handling device 102 to press the circuit board and the carrier plate, ensuring support strength and uniform pressure transmission during the pressing process.

[0082] The plurality of pin-shaped spring positioning posts 1011b and the plurality of circular spring positioning posts 1012b are distributed in the non-pressing area of ​​the substrate 10, corresponding to the area of ​​the circuit board that does not participate in press-fitting. The end of the pin-shaped spring positioning post 1011b is provided with a slender positioning tip, which can be inserted into the auxiliary hole or edge limiting groove of the non-pressing area of ​​the circuit board for precise positioning of the circuit board after the substrate 10 moves to the press-fitting position. A compression spring structure is sleeved on its exterior. When the press-fitting mechanism presses down, it can generate axial displacement while maintaining the positioning state, thereby preventing excessive force from being applied to the non-pressing area of ​​the circuit board and avoiding structural damage.

[0083] The circular spring positioning post 1012b has a dome-shaped positioning protrusion at its end, which is used to form surface contact support with the flat area or partial flange of the back of the circuit board. The circular positioning post 1012 also has a spring assembly, which can generate a small deformation during the pressing process to achieve elastic support. This structure is suitable for providing auxiliary support and buffering in the pressing area, further improving the pressing balance and overall deformation control capability.

[0084] This embodiment achieves rigid limiting and pressure support in the circuit board pressing area, as well as elastic avoidance and structural protection in the non-pressing area, ensuring reasonable pressure distribution and controllable force during the pressing process. It is applicable to various circuit board partition pressing scenarios and effectively improves assembly accuracy and structural integrity.

[0085] Furthermore, to prevent damage to components due to excessive pressure during the pressing process, a limiting portion 103 is provided on the edge of the substrate 10 to provide auxiliary support and structural limiting during the pressing process.

[0086] The limiting part 103 is arranged along the edge of the substrate 10 in a strip or dot pattern, and its height is designed to match the top platform surface of the positioning column of the platform structure and the bottom surface of the material picking device 102. When the substrate 10 moves to the pressing position and starts the pressing operation, if the pressing stroke of the pressing device exceeds the predetermined range, the limiting part 103 will form a physical limit with the contact structure of the pressing device above, thereby forming a limiting reference surface with the positioning column platform surface and the bottom surface of the material picking device 102 at the same height, preventing the pressing mechanism from continuing to press down, preventing excessive pressing between the circuit board and the carrier board, effectively protecting the circuit board and the carrier board from overpressure damage, and also improving the overall fault tolerance of the platform structure.

[0087] Furthermore, to improve the operational flexibility and alignment accuracy of the pressing platform between the material handling and pressing stations, the pressing platform is equipped with a docking component 11, which is used to realize the horizontal movement and vertical adjustment of the substrate 10.

[0088] Specifically, the docking assembly 11 is mounted on the pressing bracket 1 and is movably arranged relative to the pressing bracket 1, comprising a sliding unit 112 and a lifting unit 111. The sliding unit 112 is mounted on the pressing bracket 1 and is used to drive the entire docking assembly 11 to reciprocate horizontally between the material picking position and the pressing position. The sliding unit 112 can adopt a linear guide slider structure, a synchronous belt slide mechanism, or a servo electric cylinder module, and its output end is connected to the lifting unit 111, so that the entire lifting system can move horizontally with the sliding unit 112.

[0089] The lifting unit 111 is installed below the movable part of the sliding unit 112 and is used to drive the base plate 10 to move up and down in the vertical direction. The lifting unit 111 may include structures such as a lead screw-motor pair, a cylinder, and a guide rail lifting mechanism. The driving end is connected to the base plate 10, enabling the base plate 10 to be adjusted in a high-precision vertical direction. The lifting stroke can be precisely controlled by a stroke sensor, photoelectric switch, or limit device.

[0090] The substrate 10 is fixedly installed at the output end of the lifting unit 111 and is used to support the positioning device 101 and the material picking device 102. During operation, firstly, the external feeding system transports the circuit board to the picking position below one end of the pressing bracket 1; at this time, the lifting unit 111 drives the substrate 10 to move down, so that the material picking device 102 descends to a working height close to the circuit board, and completes the limiting positioning and adsorption operation of the circuit board under the action of the positioning device 101; after the material picking is completed, the lifting unit 111 drives the substrate 10 to rise to a safe height, and then the sliding unit 112 drives the lifting unit 111 and the substrate 10 it carries to move horizontally to the pressing position.

[0091] After the substrate 10 moves to the pressing position, the lifting unit 111 maintains a constant height, and the pressing mechanism, located above the pressing bracket 1, moves from top to bottom to complete the pressing operation between the circuit board and the carrier board. After pressing is completed, the pressing mechanism rises, and the lifting unit 111 moves down again to complete the board placement or reset action. Then, the sliding unit 112 drives the docking assembly 11 back to the material picking position to enter the next work cycle.

[0092] The docking component 11 decouples the horizontal sliding and vertical lifting functions through the sliding unit 112 and the lifting unit 111. The movements are coordinated and clear, which effectively improves the cycle efficiency, spatial adaptability and alignment accuracy in the assembly process. It is suitable for electronic component press-fitting application scenarios with multiple workstations, complex structures and high cycle requirements.

[0093] Furthermore, to enhance the adaptability and modular configuration capability of the press-fitting platform under different assembly tasks, the base plate 10 and the lifting unit 111 are connected by a plug-in structure to achieve a detachable connection.

[0094] Specifically, the base plate 10 is installed with the lifting unit 111 via a connector 12. The connector 12 can be a post, a guide rail slider, a dovetail block, or other structures. The lower end of the lifting unit 111 is provided with a connecting seat that mates with the connector 12. The connecting seat is provided with a limiting groove, a guide rail, or a socket structure for forming an insertion connection with the connector 12.

[0095] In one embodiment, the plug-in 12 is a vertically upward plug structure, and the connector is a support structure with a plug hole. After the operator inserts the base plate 10 into the connector, the plug is positioned at the bottom of the plug hole to achieve initial mechanical engagement. Subsequently, the plug and the connector are locked by a laterally inserted positioning pin or locking pin to ensure reliable connection.

[0096] In another embodiment, the connector 12 is a transverse sliding guide rail, and the connecting seat is a matching groove structure. The operator slides the base plate 10 along the guide rail to the limit position and finally fixes it by rotating buckle, lateral limit screw or elastic spring structure.

[0097] In this embodiment, various plug-in structures can achieve rapid assembly and disassembly and stable connection between the substrate 10 and the lifting unit 111, and different positioning methods can be selected according to the actual product assembly differences. Through the plug-in structure, the pressing platform can flexibly replace the substrate 10 components to adapt to different pressing tasks, support multi-specification modular switching, and has good scalability and versatility.

[0098] For further details, please refer to [link / reference]. Figure 7 To provide buffer protection for the plug-in connection structure during the press-fitting process and prevent structural damage or stress accumulation caused by instantaneous impact, a buffer 13 is provided between the plug-in component and the substrate 10.

[0099] Specifically, the lower end of the plug-in component is provided with a downwardly extending support post, and the base plate 10 is installed with the plug-in component through the support post to form a basic connection relationship. The buffer 13 is provided on the outer periphery of the support post, preferably a set of compression springs, the upper end of the compression spring abuts against the lower shoulder of the plug-in component, and the lower end abuts against the upper support surface of the base plate 10.

[0100] During the press-fitting process, when the press-fitting mechanism applies downward pressure to the substrate 10, the substrate 10 experiences a slight upward displacement due to the press-fitting reaction force. This causes the spring to undergo axial compression, resulting in elastic deformation. This deformation absorbs part of the impact force, preventing the load from being directly transmitted to the plug-in connection. As the press-fitting pressure continues to be applied, the spring is further compressed, and the relative distance between the plug-in and the substrate 10 decreases, thus achieving a buffering effect structurally and delaying the impact propagation path.

[0101] By providing the buffer 13, an elastic buffering mechanism is introduced to ensure the stable installation of the substrate 10. This effectively reduces the concentration of mechanical stress during the pressing process, extends the service life of the plug-in connection structure, and improves the structural reliability and reusability of the assembly system.

[0102] Furthermore, to ensure that the sliding unit 112 can maintain a stable state when it runs to the material picking position and the pressing position, and to prevent position deviation due to inertia or external force, the sliding unit 112 and / or the pressing bracket 1 are provided with a locking device 113.

[0103] Specifically, the locking device 113 includes a first locking device 1131 and a first locking device 1132. The first locking device 1131 is located at the end of the pressing bracket 1 near the material-picking position, and is used to lock the sliding unit 112 in that position after it moves to the material-picking position, preventing the sliding unit 112 from shifting during the material-picking process. The first locking device 1132 is located at the end of the pressing bracket 1 near the pressing position, and is used to lock the sliding unit 112 in that position after it moves to the pressing position, ensuring the stability of the substrate 10 during the pressing process and preventing inaccurate pressing or slippage due to vibration.

[0104] The locking device 113 can be configured with a mechanical stop block and a pneumatic spring pin. Taking the first locking device 1131 as an example, a fixed locking hole structure can be set on one side of the material picking position. When the sliding unit 112 moves to the preset position, the cylinder-driven locking pin automatically inserts into the locking hole to fix the position. After pressing is completed, the locking pin is retracted by the control system, and the sliding unit 112 can be unlocked and moved to the next position. The structure of the first locking device 1132 is similar to that of the first one, and they are independently arranged at both ends of the sliding path to form a bidirectional limiting and locking mechanism for the sliding unit 112 at two key work positions.

[0105] By setting the above-mentioned locking structure, the sliding unit 112 can maintain a stable state when it stops at both the material picking and pressing positions, avoiding the adverse effects of positional deviation on subsequent adsorption placement and pressing accuracy, and improving the operational reliability and positioning accuracy of the entire platform.

[0106] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0108] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A pressing platform, characterized in that, include, Press-fit bracket; A base plate that is movably mounted on the press-fit bracket; Positioning device and material handling device installed on the bottom surface of the substrate; The positioning device includes a plurality of positioning posts distributed on the bottom surface of the substrate, used to position the circuit board at the material picking position; The material handling device is located between the plurality of positioning columns and is used to grab the circuit board after it has been positioned by the positioning device, and cooperate with the positioning device to press at least a portion of the circuit board and the carrier plate at the pressing position.

2. The pressing platform according to claim 1, characterized in that, At least some of the positioning posts extend beyond the bottom surface of the substrate by a length greater than the length of the material handling device extending beyond the bottom surface of the substrate.

3. The pressing platform according to claim 2, characterized in that, The positioning posts include needle-shaped positioning posts and circular positioning posts; The needle-shaped positioning post includes a needle-shaped fixed positioning post and a needle-shaped spring positioning post, wherein the extension length of the needle-shaped fixed positioning post on the substrate is greater than the extension length of the material picking device on the substrate. The pin-shaped fixing and positioning post is used for the initial positioning of the circuit board; The needle-shaped spring positioning post includes a tip for positioning the circuit board disposed at the end of the post body, and a spring component sleeved on the post body. The spring component is used to elastically engage with the non-press-fit area of ​​the circuit board during the press-fit process. The circular positioning post includes a circular fixed positioning post and a circular spring positioning post; The end platform of the circular fixed positioning post forms a tip, which is used for repositioning the circuit board. The platform is used to cooperate with the material handling device to press at least part of the circuit board and the carrier plate at the pressing position. The circular spring positioning post includes a pointed tip for positioning the circuit board at the end of the post body, and a spring component sleeved on the post body. The spring component is used to elastically engage with the non-pressed area of ​​the circuit board during the press-fitting process.

4. The pressing platform according to claim 3, characterized in that, The pressing position is equipped with a carrier plate placement platform for supporting the carrier plate; The positioning post also includes a square positioning post, the end of which is provided with a groove, which is used to cooperate with the carrier plate placement platform for positioning.

5. The pressing platform according to claim 3, characterized in that, The substrate includes a press-fit region and a non-press-fit region; Multiple pin-shaped fixing and positioning posts and multiple circular fixing and positioning posts are distributed in the pressing area of ​​the substrate, and the material picking device is located between the multiple pin-shaped fixing and positioning posts and the circular fixing and positioning posts; Multiple needle-shaped spring positioning posts and multiple circular spring positioning posts are distributed in the non-press-fitting area of ​​the substrate.

6. The pressing platform according to claim 5, characterized in that, The substrate has a limiting part on its edge, and the height of the limiting part is adapted to the bottom height of the positioning post and the material picking device with the platform structure, so as to form a limiting support during the pressing process of at least part of the circuit board and the carrier board.

7. The pressing platform according to any one of claims 1-6, characterized in that, The pressing platform includes a docking component, which is movably configured relative to the pressing bracket. The docking assembly includes a lifting unit and a sliding unit; The docking assembly includes a sliding unit and a lifting unit; The sliding unit is used to drive the lifting unit to move horizontally between the material picking position and the pressing position; The substrate is mounted on the lifting unit, which is used to drive the substrate to move up and down in the vertical direction.

8. The pressing platform according to claim 7, characterized in that, The base plate is installed to the lifting unit via a connector. The lower end of the lifting unit is provided with a connecting seat that mates with the connector. The base plate is detachably connected to the connecting seat via the connector.

9. The pressing platform according to claim 8, characterized in that, A buffer is provided between the connector and the substrate. The buffer deforms during the pressing process to reduce the relative distance between the connector and the substrate after pressing is completed.

10. The pressing platform according to claim 7, characterized in that, The sliding unit and / or the press-fit bracket includes a locking device, which includes a first locking device and a second locking device. The first locking device is disposed at one end near the material picking position, and is used to lock the sliding unit at the material picking position when the sliding unit slides to the material picking position; The second locking device is disposed at one end near the pressing position, and is used to lock the sliding unit at the pressing position when the sliding unit slides to the pressing position.

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