Electronic component taping device

Abstract

The utility model relates to patching machine technical field, and disclose electronic component patching device, including patching machine frame, the symmetry of two clamping blocks for clamping electronic components is established to patching machine frame, two clamping blocks are all J character structure of horizontal placement, the inside of patching machine frame is connected with bidirectional screw rod through bearing, one end of bidirectional screw rod extends to the outside of patching machine frame and penetrates patching machine frame inside. In the utility model, through setting up bidirectional screw rod and the linkage mechanism (including connecting rod, linkage block, movable hole and screw hole) that cooperates with it, reached the effect that can fast, convenient and stably to different size electronic components are clamped fixed, greatly improved the applicability and work efficiency of equipment, reduced the operation difficulty and cost, the handle design of manual rotation makes the control of clamping intensity and position more accurate and flexible under some fine operation scene, help to improve the patching quality.

Description

Technical Field

[0001] This utility model relates to the field of chip mounter technology, specifically to a chip mounter device for electronic components. Background Technology

[0002] In the field of electronics manufacturing, pick-and-place machines are key equipment for accurately mounting electronic components onto circuit boards, and their performance directly affects the production efficiency and quality of electronic products.

[0003] A search of Chinese Patent Publication No. CN216391569U reveals a pick-and-place machine for an electronic component assembly system, relating to the field of electronic component placement technology. This invention includes a pick-and-place machine frame with grooves on both side walls. A rotating rod is rotatably connected between the inner walls of the frame, with one end extending out of the frame and fixedly connected to a handle. A drive gear is fixedly fitted onto the outer surface of the rotating rod. A threaded rod is rotatably connected between the upper and lower inner walls of the frame, with a driven gear fixedly fitted onto its outer surface. The drive gear and driven gear mesh with each other. A pressure plate is threaded onto the outer surface of the threaded rod, with one end extending out of the grooves. A limit rod is fixedly connected between the upper and lower inner walls of the frame. This invention solves the problem that existing pick-and-place machines often struggle to clamp and fix the electronic components during placement, leading to component movement and affecting placement quality.

[0004] As electronic products continue to develop, they are moving towards miniaturization and diversification, which makes the size and shape of electronic components increasingly diverse. However, the fixing method in this solution is not flexible enough, which leads to certain limitations in the design of clamping mechanisms for electronic components.

[0005] When faced with an increasing number of non-standard sized or different-specification electronic components on the market, it becomes difficult to clamp them quickly and accurately. This leads to a significant time commitment during actual production to adjust the clamping device or replace different fixtures to accommodate components of varying sizes, greatly reducing production efficiency, increasing production costs and timelines, and failing to meet the demands of modern electronic manufacturing for rapid, efficient, and flexible production. Furthermore, existing surface mount technology (SMT) machines often fail to adequately protect the edges of components during clamping. Due to the lack of an effective buffering mechanism, the clamping components directly apply significant rigid impact force to the electronic components during clamping, making their edges highly susceptible to damage. This increases the component failure rate, further raising production costs, reducing product yield, and severely impacting the company's economic benefits and market competitiveness. Therefore, we propose an electronic component SMT device. Utility Model Content

[0006] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an electronic component mounting device, thereby solving the above-mentioned problems.

[0007] The technical solution adopted by this utility model to solve the above-mentioned technical problems is: an electronic component placement device, including a placement machine frame, on which two clamping blocks for holding electronic components are symmetrically arranged. Both clamping blocks are horizontally placed J-shaped structures. A bidirectional lead screw is connected to the inside of the placement machine frame through a bearing. One end of the bidirectional lead screw extends through the inside of the placement machine frame to the outside of the placement machine frame. A handle is fixedly connected to the end of the bidirectional lead screw located on the outside of the placement machine frame. A linkage mechanism for driving the two clamping blocks to move and clamp the electronic components is provided on the bidirectional lead screw. Both clamping blocks are provided with a buffer mechanism for protection when clamping the electronic components.

[0008] Preferably, the linkage mechanism includes a connecting rod, a linkage block, a movable hole, and a threaded hole. Two linkage blocks are disposed inside the placement machine frame corresponding to the positions of the two clamping blocks. Threaded holes are provided on both linkage blocks corresponding to the positions of the bidirectional lead screw. The two linkage blocks are threadedly connected to the two threaded surfaces of the bidirectional lead screw through the threaded holes. Two movable holes are symmetrically provided on the upper wall of the placement machine frame. Two connecting rods are fixedly connected to the upper wall of the linkage blocks corresponding to the positions of the two movable holes. The upper ends of both connecting rods extend upwards, penetrating the interior of the movable holes and being fixedly connected to the lower wall of the clamping blocks.

[0009] Preferably, two support columns are symmetrically installed inside the pick-and-place machine frame. The two support columns are located on both sides of the bidirectional lead screw. Two connection holes are opened on the linkage block corresponding to the positions of the two support columns. The two support columns pass through the interior of the corresponding connection holes on the linkage block, and the linkage block is movably connected to the two support columns.

[0010] Preferably, the buffer mechanism includes a buffer block, a slot, and an auxiliary top block. The two clamping blocks have buffer blocks inside them. Several slots are formed on one side wall of the buffer block near the inside of the clamping block. An auxiliary top block is fixedly connected to the inner wall of the clamping block at a position corresponding to the slot on the buffer block. The number of auxiliary top blocks is the same as the number of slots. Each auxiliary top block consists of two symmetrically arranged semi-circular ring structures. The auxiliary top block is elastic, and the diameter of the outer wall of the upper semi-circular ring structure of the auxiliary top block gradually decreases towards one side of the buffer block. The maximum diameter of the outer wall of the upper semi-circular ring structure of the auxiliary top block is greater than the maximum diameter of the inner wall of the slot. The end of the auxiliary top block near the buffer block is located inside the corresponding slot.

[0011] Preferably, the upper and lower side walls of the buffer block are fixedly connected with sliders, and the inside of the clamping block has two grooves corresponding to the positions of the two sliders, and the sliders are movably engaged in the inside of the corresponding grooves.

[0012] Preferably, anti-slip pads are fixedly connected to the side walls of the two buffer blocks that are close to each other.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. By setting a bidirectional lead screw and its cooperating linkage mechanism (including connecting rod, linkage block, movable hole and threaded hole), the device can quickly, conveniently and stably clamp and fix electronic components of different sizes, which greatly improves the applicability and work efficiency of the equipment, reduces the difficulty of operation and cost. At the same time, the manually rotating handle design makes the control of clamping force and position more precise and flexible in some delicate operation scenarios, which helps to improve the placement quality.

[0015] 2. By setting up a buffer mechanism (including buffer block, slot, auxiliary top block, slider, and slide groove), the edge parts of electronic components are effectively buffered and protected when clamping them, avoiding damage to electronic components caused by clamping impact, thereby reducing production costs. At the same time, the slider and slide groove of the buffer block are designed to quickly and accurately reset, which is convenient for the next clamping operation. It is also easy to install and replace, reducing maintenance costs and difficulty.

[0016] 3. By setting anti-slip pads on the buffer block, the frictional resistance between the buffer block and the electronic components is increased, which improves the stability of the equipment during clamping, further ensures the smooth progress of the placement operation, reduces the possibility of component displacement during the placement process, and improves the placement accuracy and success rate.

[0017] 4. By adopting a horizontally placed J-shaped clamping block, the device better adapts to the shape of electronic components and provides a more stable clamping effect. Compared with a simple block clamping structure, it has better component wrapping, reduces the possibility of component displacement during the placement process, and further improves placement accuracy and success rate. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0019] Figure 2 This is a half-sectional schematic diagram of the present invention;

[0020] Figure 3 This is a partial cross-sectional view of the frame of the chip mounter of this utility model;

[0021] Figure 4This is a schematic diagram of the linkage block of this utility model;

[0022] Figure 5 This utility model Figure 2 Enlarged view of point A in the middle.

[0023] In the diagram: 1. Pick and place machine frame; 2. Clamping block; 3. Connecting rod; 4. Two-way lead screw; 5. Handle; 6. Linkage block; 7. Movable hole; 8. Buffer block; 9. Anti-slip pad; 10. Slot; 11. Auxiliary top block; 12. Slide groove; 13. Slider; 14. Threaded hole; 15. Connecting hole; 16. Support column. Detailed Implementation

[0024] The present invention will be further described below with reference to specific embodiments. However, those skilled in the art should understand that the detailed description given here with reference to the accompanying drawings is for better explanation. The structure of the present invention may exceed the limited embodiments described herein. Some equivalent alternatives or common means will not be described in detail here, but they still fall within the protection scope of this application.

[0025] Figures 1-5 This is the preferred embodiment of the present invention, which is described below in conjunction with the appendix. Figure 1 ~Appendix Figure 5 The present invention will be further described below.

[0026] The electronic component placement device includes a placement machine frame 1. Two clamping blocks 2 for holding electronic components are symmetrically arranged on the placement machine frame 1. Both clamping blocks 2 are horizontally placed in a J-shape. A bidirectional lead screw 4 is connected to the inside of the placement machine frame 1 through a bearing. One end of the bidirectional lead screw 4 extends through the inside of the placement machine frame 1 to the outside of the placement machine frame 1. A handle 5 is fixedly connected to the end of the bidirectional lead screw 4 located on the outside of the placement machine frame 1. The handle 5 allows the operator to easily rotate the bidirectional lead screw 4. The bidirectional lead screw 4 is equipped with a linkage mechanism for moving the two clamping blocks 2 to hold electronic components. Both clamping blocks 2 are equipped with a buffer mechanism for protection when holding electronic components.

[0027] During use, the operator rotates the bidirectional lead screw 4 via the handle 5. Through the linkage mechanism on the bidirectional lead screw 4, the two clamping blocks 2 are used to clamp and fix electronic components of different sizes. After fixing the electronic components, they can be surface-mounted. The operation is simple and can quickly fix the electronic components, thereby improving work efficiency. At the same time, the buffer mechanism set on the clamping block 2 can also buffer and protect the edges of the electronic components when the two clamping blocks 2 clamp the electronic components, avoiding damage to the electronic components due to fixing, thereby reducing production costs.

[0028] The linkage mechanism includes a connecting rod 3, a linkage block 6, a movable hole 7, and a threaded hole 14. Inside the pick-and-place machine frame 1, there are two linkage blocks 6 corresponding to the positions of the two clamping blocks 2. Threaded holes 14 are opened on the two linkage blocks 6 corresponding to the positions of the bidirectional lead screw 4. The two linkage blocks 6 are threadedly connected to the two threaded surfaces of the bidirectional lead screw 4 through the threaded holes 14. Two movable holes 7 are symmetrically opened on the upper wall of the pick-and-place machine frame 1. Two connecting rods 3 are fixedly connected to the upper wall of the linkage blocks 6 corresponding to the positions of the two movable holes 7. The upper ends of the two connecting rods 3 extend upward and penetrate the interior of the movable holes 7 to be fixedly connected to the lower wall of the clamping blocks 2.

[0029] Since the two-way lead screw 4 has two opposite threaded surfaces, the operator can control the two linkage blocks 6 to move toward one side away from or toward the other by rotating in different directions. Since the linkage block 6 is fixedly connected to the clamping block 2 through two connecting rods 3, the corresponding clamping block 2 will move synchronously under its drive when the linkage block 6 moves.

[0030] During use, the operator can rotate the bidirectional lead screw 4 to control the two linkage blocks 6 to move the two clamping blocks 2 toward each other, thereby completing the clamping operation of electrical components. Since the position of the two clamping blocks 2 can be flexibly adjusted under the action of the two linkage blocks 6, it can clamp electronic components of various sizes, thus greatly improving the applicability and utilization rate of the equipment.

[0031] The pick and place machine frame 1 has two symmetrically installed support columns 16 inside. The two support columns 16 are located on both sides of the bidirectional lead screw 4. The linkage block 6 has two connection holes 15 corresponding to the positions of the two support columns 16. The two support columns 16 pass through the interior of the corresponding connection holes 15 on the linkage block 6, and the linkage block 6 is movably connected to the two support columns 16.

[0032] By installing two support columns 16 inside the pick and place machine frame 1, the movement state of the linkage block 6 can be limited, so that it can only move in the length direction of the support column 16, ensuring that it will not flip over with the rotation of the bidirectional lead screw 4, thereby ensuring the stability of the linkage block 6 when it moves.

[0033] The buffer mechanism includes a buffer block 8, a slot 10, and an auxiliary top block 11. The buffer block 8 is disposed inside the two clamping blocks 2. Several slots 10 are formed on the side wall of the buffer block 8 near the inside of the clamping block 2. The auxiliary top block 11 is fixedly connected to the inner wall of the clamping block 2 at the position corresponding to the slots 10 on the buffer block 8. The number of auxiliary top blocks 11 is the same as the number of slots 10. The auxiliary top block 11 is composed of two symmetrically arranged semi-circular ring structures. The auxiliary top block 11 is elastic, and the diameter of the outer wall of the upper semi-circular ring structure of the auxiliary top block 11 gradually decreases towards the side of the buffer block 8. The maximum diameter of the outer wall of the upper semi-circular ring structure of the auxiliary top block 11 is greater than the maximum diameter of the inner wall of the slot 10. The end of the auxiliary top block 11 near the buffer block 8 is located inside the corresponding slot 10.

[0034] Since the maximum diameter of the outer wall of the semi-circular structure of the auxiliary top block 11 is greater than the maximum diameter of the inner wall of the slot 10, and the end of the auxiliary top block 11 near the buffer block 8 is located inside the corresponding slot 10, when the buffer block 8 moves toward the inside of the clamping block 2, the buffer block 8 will squeeze the auxiliary top block 11 to deform it.

[0035] The upper and lower side walls of the buffer block 8 are fixedly connected with sliders 13. The inside of the clamping block 2 is provided with two grooves 12 corresponding to the positions of the two sliders 13. The sliders 13 are movably engaged in the inside of the corresponding grooves 12. Through the cooperation of the sliders 13 and the grooves 12, the buffer block 8 can be stably displaced inside the clamping block 2.

[0036] When the two clamping blocks 2 are clamping electronic components, as they approach each other, the buffer block 8 on the clamping block 2 will first contact the edge of the electronic component. As the clamping blocks 2 continue to approach, the buffer block 8 moves inward under the pressure of the electronic component, thereby squeezing the auxiliary top block 11 and causing it to deform. The force generated by the deformation of the auxiliary top block 11 can gradually reduce the impact force generated when the two clamping blocks 2 approach each other to clamp the electronic component, thereby achieving a buffering effect and avoiding damage to the edge of the electronic component when clamping it, thus reducing production costs.

[0037] Anti-slip pads 9 are fixedly connected to the side walls of the two buffer blocks 8 that are close to each other. The side wall of the anti-slip pads 9 away from the buffer blocks 8 is a rough surface.

[0038] By installing anti-slip pads 9 on the buffer block 8, the frictional resistance between the buffer block 8 and the electronic components can be greatly increased, thereby improving the stability of the device when clamped.

[0039] Working principle:

[0040] During use, the operator rotates the bidirectional lead screw 4 via the handle 5. Through the linkage mechanism on the bidirectional lead screw 4, the two clamping blocks 2 are used to clamp and fix electronic components of different sizes. After fixing the electronic components, they can be surface-mounted. The operation is simple and can quickly fix the electronic components, thereby improving work efficiency. At the same time, the buffer mechanism set on the clamping block 2 can also buffer and protect the edges of the electronic components when the two clamping blocks 2 clamp the electronic components, avoiding damage to the electronic components due to fixing, thereby reducing production costs.

[0041] During use, the operator can rotate the bidirectional lead screw 4 to control the two linkage blocks 6 to move the two clamping blocks 2 toward each other, thereby completing the clamping operation of electrical components. Since the position of the two clamping blocks 2 can be flexibly adjusted under the action of the two linkage blocks 6, it can clamp electronic components of various sizes, thus greatly improving the applicability and utilization rate of the equipment.

[0042] When the two clamping blocks 2 are clamping electronic components, as they approach each other, the buffer block 8 on the clamping block 2 will first contact the edge of the electronic component. As the clamping blocks 2 continue to approach, the buffer block 8 moves inward under the pressure of the electronic component, thereby squeezing the auxiliary top block 11 and causing it to deform. The force generated by the deformation of the auxiliary top block 11 can gradually reduce the impact force generated when the two clamping blocks 2 approach each other to clamp the electronic component, thereby achieving a buffering effect and avoiding damage to the edge of the electronic component when clamping it, thus reducing production costs.

[0043] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. An electronic component placement apparatus, comprising a placement machine frame (1), characterized in that: Two clamping blocks (2) for clamping electronic components are symmetrically arranged on the pick-and-place machine frame (1). Both clamping blocks (2) are horizontally placed in a J-shape. A bidirectional lead screw (4) is connected to the inside of the pick-and-place machine frame (1) through a bearing. One end of the bidirectional lead screw (4) extends through the inside of the pick-and-place machine frame (1) to the outside of the pick-and-place machine frame (1). A handle (5) is fixedly connected to the end of the bidirectional lead screw (4) located on the outside of the pick-and-place machine frame (1). A linkage mechanism for driving the two clamping blocks (2) to move and clamp the electronic components is provided on the bidirectional lead screw (4). Both clamping blocks (2) are provided with a buffer mechanism for protection when clamping the electronic components.

2. The electronic component surface mount device according to claim 1, characterized in that: The linkage mechanism includes a connecting rod (3), a linkage block (6), a movable hole (7), and a threaded hole (14). Inside the pick and place machine frame (1), there are two linkage blocks (6) corresponding to the positions of the two clamping blocks (2). Threaded holes (14) are opened on the two linkage blocks (6) corresponding to the positions of the bidirectional lead screw (4). The two linkage blocks (6) are threadedly connected to the two threaded surfaces on the bidirectional lead screw (4) through the threaded holes (14). The upper wall of the pick and place machine frame (1) is symmetrically provided with two movable holes (7). Two connecting rods (3) are fixedly connected to the upper wall of the linkage block (6) corresponding to the positions of the two movable holes (7). The upper ends of the two connecting rods (3) extend upward and penetrate the interior of the movable holes (7) to be fixedly connected to the lower wall of the clamping block (2).

3. The electronic component placement apparatus according to claim 2, characterized in that: The pick and place machine frame (1) has two symmetrically installed support columns (16) inside. The two support columns (16) are located on both sides of the bidirectional lead screw (4). The linkage block (6) has two connecting holes (15) at the positions corresponding to the two support columns (16). The two support columns (16) pass through the interior of the corresponding connecting holes (15) on the linkage block (6). The linkage block (6) is movably connected to the two support columns (16).

4. The electronic component surface mount device according to claim 1, characterized in that: The buffer mechanism includes a buffer block (8), a slot (10), and an auxiliary top block (11). The two clamping blocks (2) are equipped with buffer blocks (8). The buffer block (8) has several slots (10) on one side wall near the inside of the clamping block (2). The inner wall of the clamping block (2) is fixedly connected to the slots (10) on the buffer block (8). The number of auxiliary top blocks (11) is the same as the number of slots (10). The auxiliary top block (11) is composed of two symmetrically arranged semi-circular ring structures. The auxiliary top block (11) is elastic. The diameter of the outer wall of the upper semi-circular ring structure of the auxiliary top block (11) gradually decreases towards the side of the buffer block (8). The maximum diameter of the outer wall of the upper semi-circular ring structure of the auxiliary top block (11) is greater than the maximum diameter of the inner wall of the slot (10). The end of the auxiliary top block (11) near the buffer block (8) is located inside the corresponding slot (10).

5. The electronic component placement apparatus according to claim 4, characterized in that: The upper and lower side walls of the buffer block (8) are fixedly connected with sliders (13). The clamping block (2) has two grooves (12) corresponding to the positions of the two sliders (13). The sliders (13) are movably engaged in the interior of the corresponding grooves (12).

6. The electronic component placement apparatus according to claim 4, characterized in that: Anti-slip pads (9) are fixedly connected to the side walls of the two buffer blocks (8) that are close to each other.

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