A semiconductor annealing apparatus

Abstract

The utility model provides a kind of semiconductor annealing equipment, comprising: rack, the support chip's platform and cover plate, platform is assembled in rack, cover plate coaxially movably set in the upper of platform;The diameter of cover plate is greater than the diameter of platform, rack has jacking device, the driving end of jacking device rises or falls to drive the chip supported by platform and cover plate respectively rise or fall;Rack is distributed with not less than three support around platform, the bottom wall of cover plate is attached to the upper surface of several support in unstressed state.This application is used to solve the problem of uneven gas distribution and poor heat dissipation caused by the small distance between the upper cover and the heating bottom plate in the prior art, so as to ensure the electrical properties and yield of the chip.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing equipment, and more specifically to a semiconductor annealing equipment. Background Technology

[0002] Silicon carbide chips are mainly used in LED solid-state lighting and high-frequency devices. They have the characteristics of wide bandgap, high thermal conductivity, high critical breakdown electric field, and high carrier saturation drift, making them suitable for electronic applications that require high temperature and high pressure resistance, as well as extreme environment applications such as aerospace and nuclear energy.

[0003] Annealing is a heat treatment process commonly used in materials science, involving heating a material to a specific temperature in a particular atmosphere, holding it at that temperature for a period of time, and then cooling it at a suitable rate. In the annealing process of silicon carbide, during the heating and holding step, a cover plate is typically placed above the chip to ensure temperature stability, with the heaters positioned on the side of the cover plate facing the chip. Furthermore, in existing technologies, to reduce the oxygen content around the chip, the distance between the cover plate and the heating base is approximately 2mm. Under high-temperature heating, this small distance creates a near-sealed environment, leading to uneven gas distribution and poor heat dissipation, which severely affects the chip's electrical properties and yield.

[0004] In view of this, it is necessary to improve the existing semiconductor annealing equipment to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to disclose a semiconductor annealing apparatus to solve the problem of uneven gas distribution and poor heat dissipation caused by the small distance between the top cover and the heating base in the prior art, so as to ensure the electrical properties and yield of the chip.

[0006] To achieve the above objectives, this utility model provides a semiconductor annealing apparatus, comprising: a frame, a chip support platform, and a cover plate, wherein the platform is assembled at the frame, and the cover plate is coaxially and movably disposed above the platform.

[0007] The diameter of the cover plate is larger than the diameter of the platform, and the frame has a lifting device. The drive end of the lifting device rises or falls to drive the chip supported by the platform and the cover plate to rise or fall respectively.

[0008] The frame has at least three support members evenly distributed around the platform, and the bottom wall of the cover plate is in contact with the upper surface of the support members when it is not under stress.

[0009] As a further improvement of this utility model, the frame has a worktable arranged parallel to the plane where the chip is located and a support platform vertically connected to one side of the worktable. The lifting device includes a drive mechanism and a lifting column. The drive mechanism is connected to the bottom of the worktable. The top end of the lifting column passes through the worktable and the platform to lift the chip supported by the platform.

[0010] The support platform is connected to a support rod on one side along its length. The support rod includes a first rod and a second rod arranged parallel to each other. Two mounting plates are respectively fixed vertically to the first rod and the second rod on their sides close to each other. Each mounting plate is fixed to a support member. The bottom wall of the cover plate is in contact with the top wall of the multiple support members.

[0011] As a further improvement of this utility model, the first rod and the second rod are located below the platform, and a support column is formed on the upper surface of the mounting plates, and a plurality of through holes for the support columns to pass through are evenly distributed near the edge of the platform.

[0012] The drive mechanism is selected as a linear motor. The drive end of the drive mechanism is fixed to the lifting platform. The lifting columns are set as four evenly distributed columns. The bottom ends of the four lifting columns are fixed to the upper surface of the lifting platform. The top ends of the four lifting columns are vertically upward and pass through the worktable.

[0013] The top of the lifting column forms a lifting protrusion, and the lower surface of the platform forms a lifting hole adapted to the lifting protrusion. The driving mechanism drives the lifting column to rise so that the lifting protrusion passes through the lifting hole to raise the chip.

[0014] As a further improvement of this utility model, the lifting column has a mounting rod, the mounting rod is arranged perpendicular to the lifting direction of the lifting column, the lifting protrusion is fixed to the upper surface of the mounting rod, and the upper surface of the mounting rod is also equipped with a lifting column, the height of the lifting column is greater than the height of the lifting protrusion;

[0015] When the lifting column rises, it rises near the edge of the platform to abut against the upper surface of the cover plate and drives the cover plate and the chip to rise together.

[0016] As a further improvement of this utility model, the top surface of the mounting plate is vertically fixed with a positioning post, and a positioning groove adapted to the positioning post is formed at the edge of the cover plate, through which the positioning post passes and slides relative to the positioning post.

[0017] As a further improvement of this utility model, the first rod and the second rod are vertically fixed to the third rod on the side away from the support platform, and the connection between the first rod and the second rod and the third rod is smoothly transitioned.

[0018] The first rod and the second rod are fixedly connected to a connector at the ends away from the third rod. The connector is L-shaped and fits and is fixed to the support platform.

[0019] As a further improvement of this utility model, the top surface of the mounting plate is also provided with a positioning pin, the top end of which abuts against the bottom surface of the platform.

[0020] As a further improvement of this utility model, the support component is selected as a quartz screw with a height in the range of 5 to 9 mm, the bottom surface of the support component is in contact with the upper surface of the platform, and the bottom surface of the cover plate is in contact with the upper surface of the support component when the cover plate and the lifting column are far apart.

[0021] As a further improvement of this utility model, a housing is provided around the periphery of the upper surface of the worktable, and an installation opening is provided on the side wall of the housing. The support platform is assembled into the installation opening and fixed.

[0022] As a further improvement of this utility model, an observation port is provided at the top of the housing, and a sealing groove is provided around the observation port.

[0023] Compared with existing technologies, the beneficial effects of this invention are as follows: The semiconductor annealing equipment consists of a frame, a stage for supporting the chip, and a cover plate. The diameter of the cover plate is larger than the diameter of the stage, and the stage and cover plate are coaxially arranged. The heater is located on the side of the cover plate near the chip, specifically a heating lamp. The chip is placed on the stage. When the chip is placed on the stage, the cover plate is supported by a support member, and the height of the support member is equal to the distance between the cover plate and the chip. In this invention, the height of the support member is set to 5-9 mm, and the diameter of the cover plate is larger than the diameter of the stage. When heating the wafer with the heating lamp, because the size of the cover plate is larger than the size of the stage, the problem of excessively high temperature at the periphery of the chip due to secondary radiation can be effectively avoided during the heating process. Furthermore, the height is increased to a certain extent compared with existing technologies to prevent uneven gas distribution due to a closed environment from affecting the chip's electrical properties and yield. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the overall structure of the semiconductor annealing equipment of this utility model;

[0025] Figure 2 This is a schematic diagram illustrating the structure of the present invention, showing the lifting device driving the chip and the cover plate to rise together.

[0026] Figure 3 for Figure 2 Schematic diagram of cross section along the FF direction;

[0027] Figure 4 for Figure 2 Enlarged view of part A;

[0028] Figure 5 Schematic diagram showing the state where the lifting device does not drive the chip and the cover plate to rise in the present utility model;

[0029] Figure 6 is Figure 5 Enlarged view of part B. Specific embodiments

[0030] The present utility model will be described in detail below in conjunction with the embodiments shown in the drawings. However, it should be noted that these embodiments are not limitations on the present utility model. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present utility model.

[0031] Refer Figures 1 to 6 This is a specific embodiment of a semiconductor annealing device disclosed in the present utility model. Compared with the prior art, the semiconductor annealing device consists of a frame 1, a stage 2 for supporting a chip 5, and a cover plate 3. The diameter of the cover plate 3 is larger than that of the stage 2, and the stage 2 and the cover plate 3 are coaxially arranged. A heater (not shown) is provided on the side of the cover plate close to the chip 5. Specifically, the heater is selected as a heating lamp tube, and the chip 5 is placed on the stage 2. When the chip 5 is placed on the stage 2, the cover plate 3 is in a state supported by a supporting member 1342. At this time, the height of the supporting member 1342 is equal to the distance between the cover plate 3 and the chip 5. In the present utility model, the height of the supporting member 1342 is set to 5 - 9 mm, and the diameter of the cover plate 3 is larger than that of the stage 2. When heating the chip 5 through the heating lamp tube, since the size of the cover plate 3 is larger than that of the stage 2, the problem of excessive temperature at the peripheral edge of the chip 5 caused by secondary radiation can be effectively avoided during the heating process, and the height is increased to a certain extent compared with the distance between the cover plate 3 and the chip 5 in the prior art, avoiding the problem of uneven gas distribution due to the airtight environment affecting the electrical properties and yield of the chip 5.

[0032] Refer Figures 1 to 6 As shown, a semiconductor annealing device designed in this embodiment includes a frame 1, a stage 2 for supporting a chip 5, and a cover plate 3. The stage 2 is assembled to the frame 1, and the cover plate 3 is coaxially and movably arranged above the stage 2; the diameter of the cover plate 3 is larger than that of the stage 2, and the frame 1 has a lifting device 4. The driving end of the lifting device 4 rises or falls to drive the chip 5 supported by the stage 2 and the cover plate 3 to rise or fall respectively. The frame 3 is provided with no less than three supporting members 1342 evenly distributed around the stage 2. When the cover plate 3 is in an unloaded state, the bottom wall thereof fits with the upper surfaces of the several supporting members 1342.

[0033] Refer Figures 1 to 6As shown in the figure, the frame 1 has a workbench 11 arranged parallel to the plane where the chip 5 is located and a support platform 12 vertically connected to one side of the workbench 11. The lifting device 4 includes a driving mechanism 41 and a lifting column 42. The driving mechanism 41 is connected to the lower side of the workbench 11. The top end of the lifting column 42 passes through the workbench 11 and then through the carrier 2 to lift the chip 5 supported by the carrier 2. One side of the support platform 12 in the length direction is connected to a support rod 13. The support rod 13 includes a first rod body 131 and a second rod body 132 arranged in parallel. On the sides of the first rod body 131 and the second rod body 132 close to each other, two mounting plates 134 are respectively and perpendicularly fixed. Each mounting plate 134 is fixedly connected with a supporting member 1342. The bottom wall of the cover plate 3 is fitted with the top walls of multiple supporting members 1342.

[0034] Refer to Fig. 2 to Figure 6 As shown in the figure, the first rod body 131 and the second rod body 132 are located below the carrier 2. On the upper surfaces of several mounting plates 134, a support column 1341 is respectively formed. A number of through holes 21 for the support columns 1341 to pass through are evenly distributed near the edge of the carrier 2. The driving mechanism 41 is selected as a linear motor. The driving end of the driving mechanism 41 is fixedly connected with a lifting platform 43. The lifting columns 42 are arranged in four evenly distributed channels. The bottom ends of the four lifting columns 42 are fixedly connected to the upper surface of the lifting platform 43. The top ends of the four lifting columns 42 are vertically upward and pass through the workbench 11. A lifting protrusion 422 is formed at the top end of the lifting column 42. A lifting hole 22 adapted to the lifting protrusion 422 is opened on the carrier 2. The driving mechanism 41 drives the lifting column 42 to rise so that the lifting protrusion 422 passes through the lifting hole 22 to lift the chip 5. The lifting column 42 has a mounting rod 421. The mounting rod 421 is arranged perpendicular to the lifting direction of the lifting column 42. The lifting protrusion 422 is fixedly connected to the upper surface of the mounting rod 421. A lifting column 423 is also assembled on the upper surface of the mounting rod 421. The height of the lifting column 423 is greater than the height of the lifting protrusion 422. When the lifting column 42 rises, the lifting column 423 rises near the edge of the carrier 2 to abut against the lower surface of the cover plate 3 and drives the cover plate 3 and the chip 5 to rise together.

[0035] Refer to Figure 1 As shown in the figure, a housing 14 is arranged around the periphery of the upper surface of the workbench 11. An installation opening 141 is opened on the side wall of the housing 14. The support platform 12 is assembled in the installation opening 141 and fixed. An observation opening 142 is opened at the top end of the housing 14. A sealing groove 143 is opened around the observation opening 142. Specifically, in the actual annealing process, a cover body (not shown) can be covered at the observation opening 142, and the inner wall of the cover body is abutted by a sealing member (not marked) arranged in the sealing groove 143 to achieve a nearly sealed state inside the housing 14. It should be noted that a feeding port 144 is opened on one side of the housing 14 away from the installation opening 141. When the driving mechanism 41 of the lifting device 4 is in the rising state, the chip 5 is sent into the housing 14 by a manipulator (not shown), and the chip 5 is supported by the lifting protrusion 422 connected to the lifting column 42 (refer to Figure 2 and Figure 3 as shown), and then the driving mechanism 41 drives the jacking column 42 and the chip 5 supported by the jacking protrusion 422 to fall together until the chip 5 is supported by the stage 2. The following specifically describes the steps of supporting, heating, and jacking up the chip 5 after heating is completed.

[0036] When annealing the chip 5 is required, first, the driving end of the driving mechanism 41 is driven to raise the lifting table 43, so that the four jacking columns 42 are synchronously raised until the mounting rods 421 respectively assembled with the four jacking columns 42 synchronously drive the jacking protrusion 422 and the lifting column 423 to rise to the highest position. Specifically refer to Figure 2 and Figure 3 as shown. At this time, the cover plate 3 is raised to a high point under the drive of the lifting column 423. At this time, the chip 5 is sent into the housing 14 through the feeding port 144 opened in the housing 14, so that the four jacking protrusions 422 support the chip 5 at the same time. It should be noted that, refer to Figure 4 and Figure 6 as shown. The positioning column 1343 is vertically fixed to the top surface of the mounting plate 134, and a positioning groove 31 adapted to the positioning column 1343 is formed at the edge of the cover plate 3. The positioning column 1343 passes through the positioning groove 31 and slides relatively. More specifically, the vertical distance between the positioning columns 1343 connected to the two mounting plates 134 of the first rod body 131 and the positioning columns 1343 connected to the two mounting plates 134 of the second rod body 132 is greater than the diameter of the chip 5, and further, the lifting column 423 can freely lift from the position around the stage 2, which shows that the diameter of the circle formed by the four lifting columns 423 is greater than the diameter of the chip 5, so that the chip 5 can be smoothly sent above the stage 2 when the driving end of the driving mechanism 41 is raised. In this embodiment, a jacking hole 22 is opened at the stage 2 so that the jacking protrusion 422 can smoothly pass through the stage 2 to support the chip 5.

[0037] Refer to Figure 5 and Figure 6 as shown. After the chip 5 is carried by the four jacking protrusions 422, the driving end of the driving mechanism 41 is lowered so that the four mounting rods 421 are synchronously lowered until the jacking protrusion 422 is removed from the jacking hole 22. At this time, the chip 5 is supported by a supporting groove (not shown) opened on the surface of the stage 2. At this time, the cover plate 3 that loses the upward lifting force applied by the lifting column 423 falls back to the state supported by the supporting member 1342. It should be noted that in this embodiment, the supporting member 1342 is selected as a quartz screw with a height in the range of 5-9 mm. The bottom surface of the supporting member 1342 is fitted to the upper surface of the stage 2, and the bottom surface of the cover plate 3 is fitted to the upper surface of the supporting member 1342 in the state where the cover plate 3 and the lifting column 423 are away from each other. At this time, the heating lamp (not shown) on the side of the cover plate 3 facing the chip 5 can be started to heat the chip 5. Further, refer to Figure 4 As shown, a positioning pin 1344 is further provided on the top surface of the mounting plate 134. The top end of the positioning pin 1344 abuts against the bottom surface of the carrier 2, so as to cooperate with the supporting member 1342 to position the carrier 2.

[0038] It should be noted that through the design of the supporting member 1342, it can simultaneously play the role of limiting the carrier 2 and supporting the cover plate 3 and controlling the relative distance between the cover plate 3 and the chip 5. In this embodiment, first, by making the diameter of the cover plate 3 larger than the diameter of the carrier 2, it can effectively avoid the problem of excessive temperature at the peripheral edge of the chip 5 caused by secondary radiation during the heating process of the chip 5. Specifically, if the diameters of the carrier 2 and the cover plate 3 are the same, that is, when the surface areas are the same, there will be a problem of affecting the peripheral temperature of the chip 5 due to secondary thermal radiation, resulting in the problem of excessive temperature at the periphery of the chip 5. In this embodiment, by increasing the diameter of the cover plate 3, the above situation is effectively avoided, so that the uniformity of the heating process of the chip 5 rises from 2.78% to 1.25%, and the electrical value at the periphery of the chip 5 rises from 0.7 to 0.25. Further, in this embodiment, a quartz nut is used as the supporting member 1342. First, it plays the role of clamping and positioning the carrier 2. Secondly, the height range of the quartz nut is usually 5-9 mm. When the cover plate 3 falls back to the state supported by the supporting member 1342, the height of the supporting member 1342 is the relative distance between the cover plate 3 and the chip 5. Compared with the uneven gas field distribution when the distance between the chip and the cover plate is 2 mm in the prior art, that is, the oxygen content at the outer edge of the chip is 8%, which is higher than the specified oxygen content of 3% and the heat dissipation effect is poor, the distance of 5-9 mm can take into account controlling the uniformity of the oxygen content and maintaining better heat dissipation effect of the chip 5 during the heating process.

[0039] After the chip 5 is heated, the driving end of the driving mechanism 41 is raised again, so that the jacking protrusion 422 passes through the jacking hole 22 again to raise the chip 5 to leave the carrier 2. At the same time, the lifting column 423 applies an upward driving force to the cover plate 3 to make it rise together with the chip 5. During the rising process of the chip 5, since the distances between it and the carrier 2 and the cover plate 3 both increase, the heated chip 5 can be effectively cooled. It should be noted that by providing a positioning groove 31 at the edge of the cover plate 3, during the lifting and lowering process of the cover plate 3, the positioning groove 31 slides relative to the positioning column 1343 fixed on the upper surface of the mounting plate 134, so as to achieve the effect of restricting the linear displacement of the cover plate 3. It should be noted that the positioning column 1343 is selected as a quartz column body, and selecting a quartz column body has the effect of reducing the friction between the cover plate 3 and the positioning column 1343. After the driving mechanism 41 drives the chip 5 and the cover plate 3 to rise to the highest point, the manipulator (not shown) is made to take out the chip through the feeding port 144 again.

[0040] Refer Figures 2 to 6 As shown, the first rod 131 and the second rod 132 are vertically fixed to the third rod 133 on the side away from the support platform 12. The connection between the first rod 131, the second rod 132 and the third rod 133 is smoothly transitioned. The ends of the first rod 131 and the second rod 132 away from the third rod 133 are fixed to the connecting piece 135, which is L-shaped and fits and is fixed to the support platform 12. Through the above design, the support rods 13 are distributed around the platform 2 in a loop shape, so as to achieve the function of supporting the platform 2 and guiding the cover plate 3 with a more stable structure.

[0041] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

[0042] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor annealing apparatus, characterized in that, include: The chip support platform and cover plate are provided, with the platform being assembled at the frame and the cover plate being coaxially and movably disposed above the platform. The diameter of the cover plate is larger than the diameter of the platform, and the frame has a lifting device. The drive end of the lifting device rises or falls to drive the chip supported by the platform and the cover plate to rise or fall respectively. The frame has at least three support members evenly distributed around the platform, and the bottom wall of the cover plate is in contact with the upper surface of the support members when it is not under stress.

2. The semiconductor annealing equipment according to claim 1, characterized in that, The rack has a worktable parallel to the plane where the chip is located and a support platform vertically connected to one side of the worktable. The lifting device includes a drive mechanism and a lifting column. The drive mechanism is connected to the bottom of the worktable. The top of the lifting column passes through the worktable and the platform to lift the chip supported by the platform. The support platform is connected to a support rod on one side along its length. The support rod includes a first rod and a second rod arranged parallel to each other. Two mounting plates are respectively fixed vertically to the first rod and the second rod on their sides close to each other. Each mounting plate is fixed to a support member. The bottom wall of the cover plate is in contact with the top wall of the multiple support members.

3. The semiconductor annealing equipment according to claim 2, characterized in that, The first rod and the second rod are located below the platform. A support column is formed on the upper surface of each of the mounting plates. A plurality of through holes for the support columns to pass through are evenly distributed near the edge of the platform. The drive mechanism is selected as a linear motor. The drive end of the drive mechanism is fixed to the lifting platform. The lifting columns are set as four evenly distributed columns. The bottom ends of the four lifting columns are fixed to the upper surface of the lifting platform. The top ends of the four lifting columns are vertically upward and pass through the worktable. The top of the lifting column forms a lifting protrusion, and the lower surface of the platform forms a lifting hole adapted to the lifting protrusion. The driving mechanism drives the lifting column to rise so that the lifting protrusion passes through the lifting hole to raise the chip.

4. The semiconductor annealing equipment according to claim 3, characterized in that, The lifting column has a mounting rod, which is arranged perpendicular to the lifting direction of the lifting column. The lifting protrusion is fixed to the upper surface of the mounting rod. The upper surface of the mounting rod is also equipped with a lifting column, the height of which is greater than the height of the lifting protrusion. When the lifting column rises, it rises near the edge of the platform to abut against the upper surface of the cover plate and drives the cover plate and the chip to rise together.

5. The semiconductor annealing equipment according to claim 4, characterized in that, The top surface of the mounting plate is vertically fixed with a positioning post, and a positioning groove adapted to the positioning post is formed at the edge of the cover plate. The positioning post passes through the positioning groove and slides relative to it.

6. The semiconductor annealing equipment according to claim 2, characterized in that, The first rod and the second rod are vertically fixed to the third rod on the side away from the support platform, and the connection between the first rod and the second rod and the third rod is smoothly transitioned. The first rod and the second rod are fixedly connected to a connector at the ends away from the third rod. The connector is L-shaped and fits and is fixed to the support platform.

7. The semiconductor annealing apparatus according to claim 5, characterized in that, The top surface of the mounting plate is also provided with a positioning pin, and the top end of the positioning pin abuts against the bottom surface of the platform.

8. The semiconductor annealing apparatus according to claim 5, characterized in that, The support component is optionally equipped with quartz screws with a height in the range of 5 to 9 mm. The bottom surface of the support component is in contact with the upper surface of the platform. When the cover plate and the lifting column are far apart, the bottom surface is in contact with the upper surface of the support component.

9. The semiconductor annealing equipment according to claim 2, characterized in that, A housing is provided around the periphery of the upper surface of the worktable, and an installation opening is provided on the side wall of the housing. The support platform is assembled into the installation opening and fixed.

10. The semiconductor annealing apparatus according to claim 9, characterized in that, An observation port is provided at the top of the housing, and a sealing groove is provided around the observation port.

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