Intercepting and adsorbing device for preventing short circuit of electroplating tank

Abstract

The utility model discloses an intercepting and adsorbing device for preventing short circuit of electroplating tank relates to electroplating tank protection technical field, including the shell body, the upper end of shell body is equipped with the upper package frame, the lower end of shell body is equipped with the lower package frame, the side wall of shell body is equipped with the import and export, install the intercepting mechanism in the shell body, and the intercepting mechanism includes the PTFE grid board of fixed mounting in the shell body, and the PTFE grid board below is fixedly installed with ceramic porous plate, and there is the gap of two millimeters between PTFE grid board and ceramic porous plate, and the installation frame is fixedly installed below ceramic porous plate, and the porous diaphragm is equipped below installation frame, and the adsorbing mechanism is installed at the import and export, and the installation groove is equipped with on installation frame. This intercepting and adsorbing device for preventing short circuit of electroplating tank, the metal impurity in the intercepting mechanism can intercept the electrolyte, prevent the short circuit and the case of firing from happening, and the adsorbing mechanism can adsorb iron cobalt nickel etc. metal impurity, prevent the metal impurity and gather on the surface of porous diaphragm.

Description

Technical Field

[0001] This utility model relates to the field of electroplating tank protection technology, specifically an interception and adsorption device for preventing short circuits in electroplating tanks. Background Technology

[0002] The electroplating tank is the core equipment in the electroplating process. It is usually made of corrosion-resistant materials and is used to hold the plating solution and the workpiece to be plated. The tank is equipped with an anode and cathode system, a heating / cooling device, a stirrer, and a filtration system to maintain the stability of the electrolyte composition, temperature, and fluidity.

[0003] In the prior art, the authorized announcement number CN222990263U describes an electroplating tank with an anode diaphragm, comprising: an electroplating tank, an anode box, an anode diaphragm, a filtration mechanism, a first water pump, and a second water pump. The anode box is disposed inside the electroplating tank, and an opening is provided on the side wall of the anode box.

[0004] During electrolysis, as the electroplating operation continues, the composition of the plating solution gradually changes, especially with the potential accumulation of metallic impurities such as iron, cobalt, and nickel reaching high concentrations. These impurities exhibit strong conductivity under the influence of an electric field, potentially forming one or more conductive paths between the anode and cathode of the electrolytic cell. Once these paths are formed, current rapidly flows through them, causing a sharp drop in resistance between the anode and cathode, leading to a short circuit. Short circuits are often accompanied by arcing, which not only disrupts the stability of the electrolysis process but can also damage equipment and even cause safety accidents. Therefore, a short-circuit interception and adsorption device for preventing short circuits in electroplating tanks is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide an interception and adsorption device for preventing short circuits in electroplating tanks, so as to solve the problems in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an interception and adsorption device for preventing short circuits in an electroplating tank, comprising a housing, an upper encapsulation frame at the upper end of the housing, a lower encapsulation frame at the lower end of the housing, an inlet and outlet on the side wall of the housing, an interception mechanism installed inside the housing, the interception mechanism comprising a PTFE mesh plate fixedly installed inside the housing, a ceramic porous plate fixedly installed below the PTFE mesh plate, with a two-millimeter gap between the PTFE mesh plate and the ceramic porous plate, an installation frame fixedly installed below the ceramic porous plate, a porous diaphragm below the installation frame, and an adsorption mechanism installed at the inlet and outlet.

[0007] Preferably, the mounting frame has a mounting groove, and a sealing strip is fixedly installed in the mounting groove. The mounting groove on the mounting frame is aligned with the inlet and outlet on the outer shell. A positioning frame is fixedly installed at the bottom of the mounting frame, and a porous diaphragm is fixedly installed in the positioning frame.

[0008] Preferably, the outer casing is provided with a slot, and the PTFE mesh plate and the ceramic porous plate are both connected to the outer casing through the slot.

[0009] Preferably, the porous diaphragm is fixed to the bottom of the outer casing by a positioning frame, and a slot is provided on the inner wall of the mounting groove, through which the sealing strip is installed on the inner wall of the mounting groove.

[0010] Preferably, the adsorption mechanism includes a magnet array fixedly installed in the inlet and outlet housing and slidably installed in the mounting groove. A plastic partition is fixedly installed on the inner wall of the mounting frame. A nut seat is fixedly installed on the housing. A sealing ring is fixedly installed at the end of the nut seat. An adjusting screw is threaded onto the nut seat. A knob is fixedly installed at one end of the adjusting screw. The other end of the adjusting screw is rotatably installed on the magnet array.

[0011] Preferably, the magnet array is provided with a rotary connector, and the adjusting screw is rotatably connected to the magnet array through the rotary connector.

[0012] Preferably, the nut seat has a groove at its end, and the sealing ring is connected to the end of the nut seat through the groove.

[0013] Preferably, the magnet array is mounted on the mounting frame via a mounting slot, and the adjusting screw is mounted on the housing via a nut seat.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. In this application, the electrolyte in the electrolytic cell flows sequentially through a polyPTFE mesh plate, a ceramic porous plate, and a porous membrane. The PTFE mesh plate can intercept metal impurities with a diameter greater than 500 micrometers, the ceramic porous plate can intercept metal impurities with a diameter in the range of 50 to 100 micrometers, and the porous membrane can capture and filter micron-sized metal impurities. This three-layer interception structure not only ensures the flow performance of the electrolyte but also constructs a stepped impurity filtration barrier, blocking large metal particles from forming conductive paths, thereby preventing short circuits and sparking.

[0016] 2. In this application, the magnet array can adsorb metallic impurities such as iron, cobalt, and nickel, preventing these impurities from accumulating on the porous membrane surface. Simultaneously, the plastic separator prevents the magnet array from directly adsorbing the metallic impurities. When a large amount of metallic impurities accumulates on the plastic separator, the adjusting screw can be rotated outwards. Rotating the adjusting screw outwards will move the magnet array into the housing, weakening the magnetism on the metallic impurities accumulated on the plastic separator surface, causing them to automatically peel off. This facilitates the user's cleaning of small metallic impurities, allowing the entire interception device to be reused. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a partial structural schematic diagram of the present invention;

[0019] Figure 3 This is a schematic diagram of the interception mechanism of this utility model;

[0020] Figure 4 This is a schematic diagram of the adsorption mechanism of this utility model.

[0021] The diagram shows the following markings: 1. Outer shell; 2. Upper encapsulation frame; 3. Lower encapsulation frame; 4. Inlet / outlet; 5. Interception mechanism; 501. PTFE mesh plate; 502. Ceramic porous plate; 503. Mounting frame; 504. Mounting groove; 505. Sealing strip; 506. Positioning frame; 507. Porous diaphragm; 6. Adsorption mechanism; 601. Storage shell; 602. Magnet array; 603. Plastic spacer; 604. Knob; 605. Adjusting screw; 606. Sealing ring; 607. Nut seat. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1: As Figure 1 and Figure 2 As shown, this utility model provides a technical solution for an interception and adsorption device for preventing short circuits in an electroplating tank. It includes a housing 1, an upper encapsulation frame 2 at the upper end of the housing 1, a lower encapsulation frame 3 at the lower end of the housing 1, an inlet / outlet 4 on the side wall of the housing 1, an interception mechanism 5 installed inside the housing 1, and adsorption mechanisms 6 installed at the inlet / outlet 4.

[0024] Specifically, by using the upper encapsulation frame 2 and the lower encapsulation frame 3 together, the interception mechanism 5 can be encapsulated in the outer shell 1. The interception mechanism 5 can intercept metal impurities in the electrolyte to prevent short circuits and sparks. The adsorption mechanism 6 can adsorb metal impurities such as iron, cobalt, and nickel to prevent metal impurities from accumulating on the surface of the porous membrane 507.

[0025] Example 2: Figure 2 and Figure 3 As shown, the interception mechanism 5 includes a PTFE mesh plate 501 fixedly installed inside the outer shell 1. A ceramic porous plate 502 is fixedly installed below the PTFE mesh plate 501, and there is a two-millimeter gap between the PTFE mesh plate 501 and the ceramic porous plate 502. An installation frame 503 is fixedly installed below the ceramic porous plate 502. A porous diaphragm 507 is provided below the installation frame 503. An installation groove 504 is provided on the installation frame 503, and a sealing strip 505 is fixedly installed in the installation groove 504. The installation groove 504 on the installation frame 503 is aligned with the inlet and outlet 4 on the outer shell 1. A positioning frame 506 is fixedly installed at the bottom of the installation frame 503, and the porous diaphragm 507 is fixedly installed in the positioning frame 506. A slot is provided inside the outer shell 1, and the PTFE mesh plate 501 and the ceramic porous plate 502 are both connected to the outer shell 1 through the slot.

[0026] Specifically, the electrolyte in the electrolytic cell flows sequentially through a PTFE mesh plate 501, a ceramic porous plate 502, and a porous membrane 507. The PTFE mesh plate 501 can intercept metal impurities with a diameter greater than 500 micrometers, the ceramic porous plate 502 can intercept metal impurities with a diameter between 50 and 100 micrometers, and the porous membrane 507 can capture and filter micron-sized metal impurities. This three-layer interception structure not only ensures the flow of the electrolyte but also constructs a stepped impurity filtration barrier, which can block large metal particles from forming conductive paths, thereby preventing short circuits and sparking.

[0027] Example 3: Figure 2 and Figure 4 As shown, the adsorption mechanism 6 includes a housing 601 fixedly installed in the inlet / outlet 4 and a magnet array 602 slidably installed in the mounting groove 504. A plastic partition 603 is fixedly installed on the inner wall of the mounting frame 503. A nut seat 607 is fixedly installed on the housing 601. A sealing ring 606 is fixedly installed at the end of the nut seat 607. An adjusting screw 605 is threaded on the nut seat 607. A knob 604 is fixedly installed at one end of the adjusting screw 605. The other end of the adjusting screw 605 is rotatably installed on the magnet array 602. A rotary connector is provided on the magnet array 602. The adjusting screw 605 is rotatably connected to the magnet array 602 through the rotary connector.

[0028] Specifically, the magnet array 602 can adsorb metallic impurities such as iron, cobalt, and nickel, preventing these impurities from accumulating on the surface of the porous membrane 507. Meanwhile, the plastic spacer 603 prevents metallic impurities from being directly adsorbed by the magnet array 602.

[0029] When a large amount of metal impurities accumulate on the plastic separator 603, the adjusting screw 605 can be turned outwards. Turning the adjusting screw 605 outwards will cause the magnet array 602 to move into the housing 601, reducing the magnetism on the metal impurities accumulated on the surface of the plastic separator 603, thus causing them to peel off automatically. This makes it easier for users to clean small metal impurities, allowing the entire interception device to be reused.

[0030] Working principle: During use, the electrolyte in the electrolytic cell passes sequentially through the PTFE mesh plate 501, the ceramic porous plate 502, and the porous membrane 507. The PTFE mesh plate 501 can intercept metal impurities with a diameter greater than 500 micrometers, the ceramic porous plate 502 can intercept metal impurities with a diameter of 50 to 100 micrometers, and the porous membrane 507 can capture and filter metal impurities in the micrometer range. The three-layer interception structure can not only ensure the flow of electrolyte, but also form a stepped impurity filtration barrier, blocking large metal particles from forming a conductive path and preventing short circuits and sparks. Secondly, the magnet array 602 can adsorb metal impurities such as iron, cobalt, and nickel, preventing them from accumulating on the surface of the porous membrane 507. At the same time, the plastic septum 603 can prevent metal impurities from being directly adsorbed by the magnet array 602. When a large amount of metal impurities accumulate on the plastic septum 603, the adjusting screw 605 can be rotated outward. After rotating the adjusting screw 605 outward, it will drive the magnet array 602 to move into the housing 601, which will reduce the magnetism on the surface of the plastic septum 603 and cause it to peel off automatically. This makes it convenient for users to clean small metal impurities, allowing the entire interception device to be reused.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A short-circuit interception and adsorption device for electroplating tanks, comprising a housing (1), an upper encapsulation frame (2) at the upper end of the housing (1), a lower encapsulation frame (3) at the lower end of the housing (1), and an inlet and outlet (4) on the side wall of the housing (1), characterized in that: An interception mechanism (5) is installed inside the outer shell (1). The interception mechanism (5) includes a PTFE mesh plate (501) fixedly installed inside the outer shell (1). A ceramic porous plate (502) is fixedly installed below the PTFE mesh plate (501), and there is a two-millimeter gap between the PTFE mesh plate (501) and the ceramic porous plate (502). An installation frame (503) is fixedly installed below the ceramic porous plate (502), and a porous diaphragm (507) is provided below the installation frame (503). An adsorption mechanism (6) is installed at the inlet and outlet (4).

2. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 1, characterized in that: The mounting frame (503) has a mounting groove (504) and a sealing strip (505) is fixedly installed in the mounting groove (504). The mounting groove (504) on the mounting frame (503) is aligned with the inlet and outlet (4) on the outer shell (1). A positioning frame (506) is fixedly installed at the bottom of the mounting frame (503), and a porous diaphragm (507) is fixedly installed in the positioning frame (506).

3. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 2, characterized in that: The outer shell (1) is provided with a slot, and the PTFE mesh plate (501) and the ceramic porous plate (502) are both connected to the outer shell (1) through the slot.

4. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 3, characterized in that: The porous diaphragm (507) is fixed to the bottom of the outer shell (1) by the positioning frame (506). The inner wall of the mounting groove (504) is provided with a slot, and the sealing strip (505) is installed on the inner wall of the mounting groove (504) through the slot.

5. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 4, characterized in that: The adsorption mechanism (6) includes a housing (601) fixedly installed in the inlet / outlet (4) and a magnet array (602) slidably installed in the mounting groove (504). A plastic partition (603) is fixedly installed on the inner wall of the mounting frame (503). A nut seat (607) is fixedly installed on the housing (601). A sealing ring (606) is fixedly installed at the end of the nut seat (607). An adjusting screw (605) is threaded on the nut seat (607). A knob (604) is fixedly installed at one end of the adjusting screw (605). The other end of the adjusting screw (605) is rotatably installed on the magnet array (602).

6. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 5, characterized in that: The magnet array (602) is provided with a rotary connector, and the adjusting screw (605) is rotatably connected to the magnet array (602) through the rotary connector.

7. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 6, characterized in that: The nut seat (607) has a groove at its end, and the sealing ring (606) is connected to the end of the nut seat (607) through the groove.

8. The interception and adsorption device for preventing short circuits in an electroplating tank according to claim 7, characterized in that: The magnet array (602) is mounted on the mounting frame (503) via the mounting slot (504), and the adjusting screw (605) is mounted on the storage housing (601) via the nut seat (607).

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