Chip high and low temperature aging experiment box anti-condensation device
By combining sampling, control, execution, and monitoring modules, precise anti-condensation control and fault detection of the high and low temperature aging test chamber are achieved, solving the problem of inaccurate anti-condensation control in the transition zone of traditional aging test chambers and improving the reliability and safety of testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI QITAI FENHUA SEMICON TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-06-26
AI Technical Summary
Traditional high and low temperature aging test chambers have difficulty in achieving precise temperature regulation in the transition zone due to condensation control, and lack an effective fault detection mechanism, which leads to the failure of the anti-condensation function and affects the accuracy and safety of the test.
By combining sampling, control, execution, and monitoring modules, and through various anti-condensation measures and closed-loop control, combined with humidity and temperature sensors and dry compressed air equipment, precise anti-condensation control is achieved, and a monitoring module is set up for fault detection.
It improved the anti-condensation effect, reduced the impact of equipment failure on testing, and ensured the accuracy and safety of testing.
Smart Images
Figure CN224417202U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of chip testing technology, and in particular relates to an anti-condensation device for a chip high and low temperature aging test chamber. Background Technology
[0002] Aging test chambers, as a crucial product in the environmental testing industry, are primarily used to simulate extreme temperature environments to evaluate the durability and reliability of electronic products. Aging testing is particularly vital for semiconductor memory. Semiconductor memory devices have a certain probability of failure during their lifespan, typically exhibiting a "bathtub curve" characteristic—high failure rates in the early and late stages, with relative stability in the intermediate phase. To ensure product quality, manufacturers utilize aging test chambers to apply high-temperature and low-temperature cyclic stress to memory devices, accelerating the exposure of potential defects, thereby eliminating defective products early and enabling the remaining products to quickly reach a stable operating stage.
[0003] Aging tests for memory chips require continuous operation for a specific duration in a precisely controlled high and low temperature environment, which places stringent requirements on the technical performance of the aging test chamber.
[0004] To meet the high and low temperature testing requirements of memory chips, modern high and low temperature aging test chambers for memory chips are designed with multiple temperature control zones, including a low temperature zone, a high temperature zone, a transition zone (insulation zone), and a normal temperature zone. The high and low temperature zones and the normal temperature zone already have effective anti-condensation technologies, while the transition zone generally uses an anti-condensation heating belt and a single temperature controller to achieve the same purpose. However, traditional single-heating control modes often struggle to achieve precise temperature regulation and lack effective fault detection mechanisms. This can lead to the failure of the anti-condensation function, resulting in serious problems such as short circuits on the test board, severely impacting the accuracy and safety of the test.
[0005] Therefore, it is necessary to improve and optimize the anti-condensation function of existing aging test chambers to enhance their anti-condensation effect, and at the same time, to set up effective fault monitoring devices to reduce the impact of equipment failures on testing. Utility Model Content
[0006] This invention provides an anti-condensation device for a high and low temperature aging test chamber for chips. Based on sampling results, it combines various anti-condensation measures to improve the anti-condensation effect. At the same time, it is combined with a monitoring module to monitor each module of the anti-condensation device, promptly detect equipment failures, and reduce the impact of equipment failures on the test.
[0007] Other objects and advantages of this utility model can be further understood from the technical features disclosed herein.
[0008] To achieve one or more of the above objectives or other objectives, this utility model provides a chip high and low temperature aging test chamber anti-condensation device, comprising a sampling module, a control module, an execution module, and a monitoring module; the sampling module is installed inside the high and low temperature aging test chamber to collect data from the chamber; the sampling results collected by the sampling module are transmitted to the control module; the control module analyzes the condensation risk of the high and low temperature aging test chamber based on the sampling results and controls the execution module to implement various anti-condensation measures; the monitoring module monitors the sampling module, the control module, and the execution module.
[0009] The execution module includes an anti-condensation heating belt, a drying compressed air device, and an anti-condensation fan.
[0010] The dry compressed air equipment includes a solenoid valve installed in the anti-condensation zone of the high and low temperature aging test chamber. Dry compressed air generated by external equipment enters the anti-condensation zone of the high and low temperature aging test chamber under the control of the solenoid valve.
[0011] The sampling module includes a humidity sensor, a temperature sensor, a gas flow sensor connected in series in the end pipe of the solenoid valve to detect the flow rate of dry compressed air transmitted to the anti-condensation area, and a fan Hall sensor integrated in the anti-condensation fan stator to detect the fan speed.
[0012] The temperature sensors are respectively installed in the high temperature zone, the heat preservation zone, and the normal temperature zone of the high and low temperature aging test chamber; the humidity sensors are respectively installed in the heat preservation zone and the normal temperature zone of the high and low temperature aging test chamber.
[0013] The sampling module collects data on the dry compressed air flow rate, fan speed, temperature of the high and low temperature zones, temperature and humidity of the insulation zone, and temperature and humidity of the normal temperature zone, and transmits these data to the control module for data analysis. Based on the sampling results from the sampling module, the control module sends control commands to the execution module.
[0014] It also includes a power supply module, which supplies power to the anti-condensation heating belt, the drying compressed air equipment, and the anti-condensation fan; the power supply module includes a transformer that converts the incoming mains power into a low-voltage output; a solid-state relay is also installed on the connection line between the anti-condensation heating belt and the transformer.
[0015] The control module communicates with the solenoid valve, the anti-condensation fan, and the solid-state relay; based on the sampling results of the sampling module, the control module controls the opening and closing of the solenoid valve, the anti-condensation fan, and the solid-state relay.
[0016] The monitoring module is connected to the sampling module, the control module, and the execution module respectively, and is used to monitor the sampling results of the sampling module, the control status of the control module, and the execution status of the execution module; the monitoring module is a separate controller, or the monitoring module is a monitoring subroutine embedded in the control module.
[0017] The monitoring module includes a sensor monitoring module connected to the sampling module, a controller status monitoring module connected to the control module, an anti-condensation heating belt status monitoring module connected to the anti-condensation heating belt, a solenoid valve status monitoring module connected to the solenoid valve, and a fan monitoring module connected to the fan.
[0018] Compared with the prior art, the beneficial effects of this utility model mainly include:
[0019] 1. The anti-condensation device for the high and low temperature aging test chamber of this utility model is equipped with a sampling module, a control module and an execution module. The control module outputs corresponding control signals to the execution module according to the results collected by the sampling module to implement single or multiple anti-condensation measures to obtain better anti-condensation effect.
[0020] 2. The anti-condensation device of the high and low temperature aging test chamber of this utility model is also equipped with a monitoring module. The monitoring module monitors the sampling module, control module and execution module, and can detect fault information in a timely manner. If a single anti-condensation measure is detected to be ineffective, the information can be summarized and a decision can be made on whether the anti-condensation system is usable. This reduces the impact of a single fault on the test system and improves the reliability of the high and low temperature aging test chamber for memory chips. The anti-condensation device of the high and low temperature aging test chamber of this utility model realizes closed-loop control.
[0021] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the anti-condensation device for the high and low temperature aging test chamber of this utility model.
[0024] Figure 2 This is a schematic diagram showing the composition and installation location of the sampling module of this utility model.
[0025] Figure 3For this Figure 1 The diagram shows the specific connections between the control module, sampling module, and execution module.
[0026] Figure 4 This is a schematic diagram of the control module of this utility model.
[0027] Figure 5 This is a schematic diagram showing the connection between the execution module and the power supply module of this utility model.
[0028] Figure 6 This is a schematic diagram of the monitoring module of this utility model. Detailed Implementation
[0029] The foregoing and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the scope of this utility model.
[0030] Example 1
[0031] Example 1 provides an anti-condensation device for a high and low temperature aging test chamber for chips, such as... Figure 1 As shown, the system includes a sampling module, a control module, an execution module, and a monitoring module. The sampling module is located inside the high and low temperature aging test chamber and collects data from the chamber, specifically, it can collect data such as temperature and humidity within the chamber. The sampling results collected by the sampling module are transmitted to the control module. The control module analyzes the condensation risk in the high and low temperature aging test chamber based on the sampling results and controls the execution module to implement various anti-condensation measures. The monitoring module monitors the sampling module, control module, and execution module.
[0032] like Figure 2 As shown, the sampling module of this utility model includes multiple sensors, including a temperature sensor RTD1 installed in the inner chamber (i.e., the high and low temperature zone of the high and low temperature aging test chamber), a temperature sensor RTD2 and a humidity sensor HS1 installed in the transition zone (insulation zone), and a temperature sensor RTD3 and a humidity sensor HS1 installed in the outer chamber (normal temperature zone).
[0033] The sampling module of this utility model includes a variety of sensors, including a gas flow sensor connected in series in the end pipeline of the anti-condensation dry compressed air solenoid valve, and a fan Hall sensor integrated in the stator of the anti-condensation fan.
[0034] The sampling module collects the temperature of the inner chamber to control the start and stop timing of the anti-condensation system. It also collects the temperature and humidity of the transition zone and outer chamber area to assess condensation risk, allowing the control module to fine-tune the anti-condensation measures implemented in the execution module to achieve the desired effect. The module collects the dry compressed air flow rate and fan speed to achieve closed-loop control of the anti-condensation system. The dry compressed air flow rate, fan speed, temperature of the high and low temperature zones, temperature and humidity of the insulation zone, and temperature and humidity of the normal temperature zone collected by the sampling module are sent to the control module for data analysis. The control module then sends control commands to the execution module to implement one or more anti-condensation measures.
[0035] like Figure 5 As shown, the execution module of this utility model includes an anti-condensation heating belt, a CDA (dry compressed air) solenoid valve, and an anti-condensation fan.
[0036] Dry compressed air is introduced into the transition zone by a CDA solenoid valve (by controlling the opening and closing of the solenoid valve) to maintain positive pressure in the transition zone and prevent external humid air from entering.
[0037] The anti-condensation heating belt, CDA solenoid valve, and anti-condensation fan are all powered by mains electricity. This mains power needs to be transformed by a transformer before supplying power to the anti-condensation heating belt, CDA solenoid valve, and anti-condensation fan. A solid-state relay is also installed on the line supplying power to the anti-condensation heating belt via the transformer. This solid-state relay communicates with the control module, receiving control signals from the control module and thus controlling the on / off timing of the anti-condensation heating belt.
[0038] like Figure 3 The present invention describes a control module that, based on the sampling results of the sampling module, controls the execution module to implement various anti-condensation measures. The control module assesses the risk of condensation based on collected data of temperature, humidity, fan speed, and drying gas flow rate, and then controls the execution module to implement these measures. The solid-state relay, solenoid valve, and anti-condensation fan within the execution module communicate with the control module. The control module controls the solid-state relay within the execution module to operate the anti-condensation heating element; controls the solenoid valve to adjust the flow rate of the drying gas; and controls the anti-condensation fan to turn it on and control its speed.
[0039] like Figure 4As shown, the control module includes input interfaces, output interfaces, a processor, a memory, a communication interface, and expansion interfaces. These components communicate with each other via a bus. Specifically, the input interface receives data from the sampling module, the output interface connects to the execution module, the processor controls the execution module to perform anti-condensation actions by calling logic control instructions stored in the memory, the communication interface connects to a touchscreen or host computer to transmit real-time operating data and fault information, and the expansion module provides interfaces for reserved or redundant hardware.
[0040] like Figure 6 As shown, the monitoring module of this utility model includes a sampling sensor monitoring module, a controller status monitoring module, a heating belt status monitoring module, a solenoid valve status monitoring module, and a fan status monitoring module. The aforementioned status monitoring modules monitor the sampling module, the control module, and the execution module respectively, thereby achieving comprehensive monitoring of the anti-condensation control system.
[0041] The monitoring module can monitor the anti-condensation control system and output corresponding monitoring results to the system to facilitate system decision-making. The monitoring module of this invention can be a separate controller, containing multiple control programs or sub-modules to monitor the sampling module, control module, and execution module. Alternatively, the monitoring module can be a control subroutine or sub-module embedded within the control module to achieve the monitoring module function of this invention.
[0042] As a monitoring and control strategy for the monitoring module, after the sampling sensor monitoring module detects fault information, it transmits the sensor data before and during the fault to the control system (built into the monitoring module). The control system then retrieves historical data for comparison to confirm whether the sensor in the sampling module is truly faulty. When the controller status monitoring module detects a controller fault, the control system shuts down and saves the data before and after the fault. When the heating belt status monitoring module, solenoid valve status monitoring module, and fan status monitoring module detect fault information, they transmit the corresponding operating data before and after the anti-condensation heating belt fault, solenoid valve fault, and fan fault to the control system. The control system confirms the uploaded data with historical data, outputs the fault judgment result, and triggers the fault response processing program. The system takes into account temperature, humidity, and the fault status of the execution module to take appropriate action. The fault response processing program sets corresponding weight ratios based on the anti-condensation effects of the three anti-condensation measures in the execution module, and combines the fault status of the anti-condensation measures with the current temperature and humidity of the high and low temperature aging test chamber to determine whether to shut down or output alarm information without shutting down.
[0043] The above provides a detailed description of the anti-condensation device for a high and low temperature aging test chamber for chips provided by this utility model. Specific examples have been used to illustrate the structure and working principle of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core idea of this utility model. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.
Claims
1. A chip high and low temperature aging experiment box anti-condensation device, characterized in that, It includes a sampling module, a control module, an execution module, and a monitoring module; The sampling module is installed inside the high and low temperature aging test chamber to collect data from the high and low temperature aging test chamber. The sampling results collected by the sampling module are transmitted to the control module; The control module analyzes the condensation risk in the high and low temperature aging test chamber based on the sampling results, and controls the execution module to implement various anti-condensation measures. The monitoring module monitors the sampling module, control module, and execution module.
2. The condensation-preventing device for a chip high-low temperature aging experiment box according to claim 1, characterized in that, The execution module includes an anti-condensation heating belt, a drying compressed air device, and an anti-condensation fan.
3. The condensation-preventing device for a chip high-low temperature aging test chamber according to claim 2, characterized in that, The dry compressed air equipment includes a solenoid valve installed in the anti-condensation zone of the high and low temperature aging test chamber. Dry compressed air generated by external equipment enters the anti-condensation zone of the high and low temperature aging test chamber under the control of the solenoid valve.
4. The condensation-preventing device of a chip high-low temperature aging experiment box according to claim 3, characterized in that, The sensors in the sampling module include a humidity sensor, a temperature sensor, and a gas flow sensor connected in series in the pipeline at the end of the solenoid valve, which are used to detect the flow rate of dry compressed air transmitted to the anti-condensation area. And a fan Hall sensor integrated in the anti-condensation fan stator for detecting fan speed.
5. The condensation-preventing device for a chip high-low temperature aging test chamber according to claim 4, characterized in that, The temperature sensors are respectively installed in the high temperature zone, the heat preservation zone, and the normal temperature zone of the high and low temperature aging test chamber; The humidity sensors are respectively installed in the heat preservation area and the normal temperature area of the high and low temperature aging test chamber.
6. The condensation-preventing device for a chip high-low temperature aging test chamber according to claim 4, characterized in that, The sampling module transmits the collected data, including dry compressed air flow rate, fan speed, temperature of the high and low temperature zones, temperature and humidity of the insulation zone, and temperature and humidity of the normal temperature zone, to the control module for data analysis. The control module sends control commands to the execution module based on the sampling results of the sampling module.
7. The condensation-preventing device for a chip high-low temperature aging experiment box according to claim 3, characterized in that, It also includes a power supply module, which supplies power to the anti-condensation heating belt, the drying compressed air equipment, and the anti-condensation fan; The power supply module includes a transformer that converts the incoming mains power into a low-voltage output; A solid-state relay is also installed on the connection line between the anti-condensation heating belt and the transformer.
8. The condensation-preventing device for a chip high-low temperature aging experiment box according to claim 7, characterized in that, The control module communicates with the solenoid valve, the anti-condensation fan, and the solid-state relay. The control module controls the opening and closing of the solenoid valve, anti-condensation fan, and solid-state relay based on the sampling results of the sampling module.
9. The condensation-preventing device for a chip high-low temperature aging experiment box according to claim 3, characterized in that, The monitoring module is connected to the sampling module, the control module, and the execution module respectively, and is used to monitor the sampling results of the sampling module, the control status of the control module, and the execution status of the execution module. The monitoring module is either a separate controller or a monitoring subroutine embedded in the control module.
10. The condensation-preventing device for a chip high-low temperature aging test chamber according to claim 9, characterized in that, The monitoring module includes a sensor monitoring module connected to the sampling module, a controller status monitoring module connected to the control module, an anti-condensation heating belt status monitoring module connected to the anti-condensation heating belt, a solenoid valve status monitoring module connected to the solenoid valve, and a fan monitoring module connected to the fan.