Small communication module, contactless smart card and dual-interface smart card

Abstract

The utility model discloses a small -size communication module, non -contact intelligent card and double interface intelligent card, wherein the antenna unit of small -size communication module is composed of graphene material, and graphene material is as a kind of high conductivity, low resistance material, can reduce antenna occupation, keep signal high transmission efficiency, simultaneously not limited to the dielectric constant of base material, expand the selectivity of base material material, match high frequency communication demand;Non -contact intelligent card and double interface intelligent card adopt small -size communication module, effectively reduce the whole card thickness and have excellent bending strength simultaneously.

Description

Technical Field

[0001] This disclosure relates to the field of smart card communication, specifically to a small communication module, a contactless smart card equipped with a small communication module, and a dual-interface smart card. Background Technology

[0002] Smart cards, as an intelligent identification tool, are widely used in daily life. Based on their usage, they can be divided into contact smart cards and contactless smart cards. Traditional smart cards have the following technical drawbacks:

[0003] (1) Traditional contact chips and contactless chips need to be manufactured separately and embedded in the card body, which leads to complex processes, long card production cycle and high card production cost.

[0004] (2) Chips with a single communication mode are easy to copy, and the contact and non-contact functions are separated, making it impossible to achieve dual-channel encryption verification, resulting in a low security level.

[0005] (3) Non-contact antennas require the use of copper coils or etched metal layers, and the substrate must have a specific dielectric constant. This limits the card carrier to a few materials such as PVC and PET. In addition, the antenna occupies a large area and is easily oxidized, resulting in low signal transmission efficiency and difficulty in meeting the needs of high-frequency communication.

[0006] (4) The junction between the chip and the card body is prone to cracking due to bending or high and low temperature cycles, resulting in a short service life. Utility Model Content

[0007] To address the aforementioned technical problems, this disclosure provides a small communication module, which includes a chip and an antenna unit. The antenna unit is made of graphene material, and the chip includes a non-contact front-end pin. The antenna unit is electrically connected to the non-contact front-end pin.

[0008] In one embodiment, the small communication module further includes a flexible circuit board, which integrates an antenna unit and a positioning and binding area for the chip. The antenna unit is etched on the surface of the flexible circuit board and electrically connected to the non-contact front-end pins of the chip.

[0009] In one embodiment, the small communication module further includes a metal contact, the antenna unit is made of graphene material and is adapted to be mounted on the inner side of the metal contact through a conformal overlapping structure, and the chip further includes contact communication pins, which are connected to the metal contact of the outer interface, and are physically isolated from non-contact front-end pins.

[0010] In one embodiment, the chip integrates contact and non-contact communication protocol stacks. The contact communication pins and non-contact front-end pins of the chip are selectively connected through a switching circuit. The communication protocol stack includes a time-division control module and a scene control module for switching between contact and non-contact communication modes.

[0011] In one embodiment, the small communication module further includes a flexible circuit board, which integrates an antenna unit, a chip bonding area, and a metal contact bonding area. The antenna unit is etched on the surface of the flexible circuit board and electrically connected to the non-contact front-end pins of the chip. The metal contact is connected to the contact communication pins of the chip through a conductive path in the inner layer of the flexible circuit board.

[0012] In one embodiment, the antenna unit is a coil formed by winding graphene or a graphene printed circuit.

[0013] In one embodiment, a dynamic impedance matching circuit composed of resistive and / or capacitive elements is integrated inside the chip or between the chip and the antenna unit to automatically adjust the antenna resonant frequency.

[0014] In one embodiment, the metal contact and antenna unit are integrally formed from graphene material.

[0015] This disclosure provides a contactless smart card, equipped with a small communication module, and further includes:

[0016] A substrate layer made of insulating material, with mounting grooves for embedding chips.

[0017] The protective layer includes a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding mesh surrounding the antenna unit to suppress electromagnetic interference.

[0018] This disclosure provides a dual-interface smart card, configured with a small communication module. The chip also includes a security processor for executing encryption algorithms and independently managing contact and contactless communication protocols, and further includes:

[0019] The substrate layer is made of insulating material and has mounting grooves for embedding chips. The contact interface module is arranged on the outer interface of the substrate layer.

[0020] The protective layer includes a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding mesh surrounding the antenna unit to suppress electromagnetic interference.

[0021] The small communication module, contactless smart card, and dual-interface smart card provided in this application have the following advantages:

[0022] (1) The antenna unit is made of graphene material. As a material with high conductivity and low resistance, graphene material can reduce the antenna footprint and maintain high signal transmission efficiency. At the same time, it is not limited by the dielectric constant of the substrate, expands the selectivity of substrate materials, and matches the high frequency communication requirements.

[0023] (2) The conformal overlapping structure of the graphene antenna and the metal contact further avoids the problem of resistance change in traditional point contact, effectively reducing the contact resistance.

[0024] (3) The contactless smart card and the dual-interface smart card adopt a small communication module, which effectively reduces the thickness of the card and has excellent bending strength. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0027] Figure 1 This is one of the structural diagrams of a small communication module;

[0028] Figure 2 This is the second structural schematic diagram of a small communication module;

[0029] Figure 3 This is one of the structural diagrams of a dual-interface smart card;

[0030] Figure 4 This is the second schematic diagram of a dual-interface smart card.

[0031] Explanation of key component symbols:

[0032] 1. Chip;

[0033] 2. Antenna unit;

[0034] 3. Metal contact plate;

[0035] 4. Smart card. Detailed Implementation

[0036] In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and "axial," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixed connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] Smart cards, as an intelligent identification tool, are widely used in daily life. Based on their usage, they can be divided into contact smart cards and contactless smart cards. Traditional smart cards have the following technical drawbacks: traditional contact and contactless chips need to be manufactured independently and embedded separately in the card body, resulting in complex processes, long card production cycles, and high production costs; chips with a single communication mode are easily copied, and the separation of contact and contactless functions makes dual-channel encryption verification impossible, leading to low security levels; contactless antennas require copper coils or etched metal layers, demanding a specific dielectric constant in the substrate, limiting card carriers to a few materials such as PVC and PET, and the antenna occupies a large area, hindering miniaturization applications; the junction between the chip and the card body is prone to cracking due to bending or high / low temperature cycling, resulting in a short lifespan.

[0040] To overcome the shortcomings of the existing technology, this utility model provides a small communication module, a contactless smart card equipped with a small communication module, and a dual-interface smart card, which solves the problems of large antenna size, severe signal attenuation, slow response in dual-mode applications, and poor packaging reliability of traditional smart cards.

[0041] The following describes specific embodiments and appendices. Figure 1 - Appendix Figure 4 The plan will be further elaborated and explained.

[0042] This utility model discloses a small communication module, comprising a chip 1 and an antenna unit 2. The antenna unit 2 is made of graphene material. The chip 1 includes contactless front-end pins, and the antenna unit 2 is electrically connected to the contactless front-end pins. Graphene material, as a material with high conductivity and low resistance, can reduce the antenna footprint, maintain high signal transmission efficiency, and is not limited by the dielectric constant of the substrate, thus expanding the selectivity of substrate materials and matching the requirements of high-frequency communication. Optionally, the graphene antenna thickness is 0.01mm-0.1mm, suitable for ultra-thin smart cards, and effectively reduces resistivity, improves antenna signal transmission efficiency, and stabilizes communication distance.

[0043] In one embodiment, the small communication module further includes a flexible circuit board. A graphene antenna unit 2 is etched onto the surface of the flexible circuit board, and a chip 1 positioning and bonding area is provided at the bottom, with the chip 1 fixed by conductive adhesive. The graphene antenna unit 2 is electrically connected to the non-contact front-end pins of the chip 1. The antenna and chip 1 are integrated and mounted on the flexible circuit board. The antenna unit 2 and the chip 1 pins are directly pressed together by conductive adhesive or anisotropic conductive film. The chip 1 is directly adhered to the chip 1 bonding area of ​​the flexible circuit board, and the chip 1 and antenna unit 2 are connected by gold wire bonding. This avoids the introduction of parasitic parameters (such as parasitic resistance / capacitance / inductance) due to soldered leads, reduces resonant frequency deviation, and improves communication efficiency. Furthermore, the flexible circuit board can use soft material films such as TPU, PET, PI, and PDMS, with a bending radius ≤5mm, adapting to curved surfaces of wearable devices.

[0044] In one embodiment, to expand the contact communication function, the small communication module also includes a metal contact 3. The antenna element 2 is made of graphene material and is fitted onto the inner side of the metal contact 3 via a conformal overlapping structure. The conformal overlapping structure between the graphene antenna and the metal contact 3 further avoids the resistance abrupt change problem of traditional point contact, effectively reducing contact resistance and space occupation. Optionally, the contact area of ​​the conformal overlapping structure covers more than 70% of the surface of the metal contact 3, further optimizing the reliability of antenna transmission.

[0045] In one embodiment, chip 1 further includes a contact communication pin, which is connected to the metal contact 3 of the outer interface and is physically isolated from the non-contact front-end pin. The contact communication pin can be connected to the metal contact 3 of the outer interface via a conductive path, which can be a copper pillar embedded in the substrate layer. Optionally, an insulating isolation groove with a width of 0.3 mm or more and filled with epoxy resin is provided between the non-contact front-end pin and the contact pin, thereby increasing the isolation impedance between the two pins and reducing crosstalk.

[0046] In one embodiment, chip 1 integrates both contact and contactless communication protocol stacks. The contact communication pins and contactless front-end pins of chip 1 are selectively switched via a switching circuit. The communication protocol stack includes a time-division control module and a scene control module for switching between contact and contactless communication modes. For example, the switching circuit uses a MOSFET array with a switching time of <10ns; the time-division control module polls the contact and contactless interfaces at a 5ms cycle to ensure fast dual-mode switching response and reduce power consumption.

[0047] In one embodiment, the small communication module further includes a flexible circuit board, which integrates an antenna unit 2, a bonding area for the chip 1, and a bonding area for a metal contact 3. The antenna unit 2 is etched on the surface of the flexible circuit board and electrically connected to the non-contact front-end pins of the chip 1. The metal contact 3 is connected to the contact communication pins of the chip 1 through an inner conductive path of the flexible circuit board. The inner conductive path shields external interference, which is beneficial to improving the contact communication rate. The surface antenna unit 2 and the inner conductive path are isolated, thereby reducing crosstalk.

[0048] In one embodiment, antenna element 2 is composed of a coil formed by winding graphene or a graphene printed circuit. For example, the graphene-wound coil can have a linewidth of 45μm, a winding spacing of 55μm, and a sheet resistance of 0.08Ω / sq; the graphene printed circuit adopts a screen printing process, the paste contains 80wt% graphene powder, and the linewidth / spacing ratio is 1:1.3. By selecting the linewidth / spacing parameters of the coil and the printed circuit, the inductance value of the winding coil and the dielectric loss of the printed circuit can be effectively controlled to meet the requirements of high-frequency communication.

[0049] In one embodiment, a dynamic impedance matching circuit composed of resistive and / or capacitive elements is integrated inside chip 1 or between chip 1 and antenna unit 2 for automatically adjusting the antenna resonant frequency. The dynamic impedance matching circuit includes an adjustable capacitor array and a microstrip line, with the capacitance adjustment range extended to 10–150 pF, for automatically adjusting the antenna resonant frequency and adapting to control the automatic resonant frequency deviation under different temperature environments. Specifically, a capacitor with a capacitance of 50–100 pF is connected in parallel across antenna unit 2 to increase the antenna Q value to above 40. The capacitor, which can be a multilayer ceramic capacitor, is connected across antenna unit 2 to further increase the antenna Q value to above 40, extending the effective communication distance. Simultaneously, a series and / or parallel resistor circuit is configured to work with the capacitor to construct an LC resonant network, thereby optimizing power transmission and signal integrity.

[0050] In one embodiment, the metal contact 3 and the antenna unit 2 are integrally formed from graphene material. For example, the contact-type metal contacts can be extended or rearranged, and the contact shape can be optimized (such as ring or spiral) to form a closed loop, acting as a radio frequency antenna for contactless communication, thereby achieving electromagnetic coupling using the conductive path of the contacts themselves. This eliminates the need for antenna embedding, welding, and substrate materials, shortening the card manufacturing process and reducing costs.

[0051] This disclosure also provides a contactless smart card equipped with a small communication module, and further includes: a substrate layer made of insulating material, the substrate layer having mounting grooves for embedding a chip 1; a protective layer including a resin encapsulation layer covering the chip 1, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding mesh for suppressing electromagnetic interference surrounding the antenna unit 2. The contactless smart card using the small communication module has an extremely thin overall card thickness while possessing excellent bending strength. Optionally, the metal shielding mesh is a copper-nickel alloy with a mesh density of 200 meshes and a shielding effectiveness >30dB.

[0052] This disclosure also provides a dual-interface smart card 4, equipped with a small communication module. The chip 1 further includes a security processor for executing encryption algorithms and independently managing contact and contactless communication protocols. The dual-interface smart card 4 also includes: a substrate layer made of insulating material, with mounting grooves for embedding the chip 1 on the substrate layer, and a contact interface module disposed on the outer interface of the substrate layer; a protective layer, including a resin encapsulation layer covering the chip 1, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding mesh for suppressing electromagnetic interference surrounding the antenna unit 2. The dual-interface smart card using the small communication module has an extremely thin overall card thickness and excellent bending strength, and generates keys in real time through the security processor, making it suitable for bank cards, identity authentication cards, etc. with high anti-counterfeiting levels.

[0053] The above provides a detailed description of the small communication module, contactless smart card, and dual-interface smart card provided by this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas and methods of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A small communication module, characterized in that, The small communication module includes a chip and an antenna unit made of graphene material. The chip includes a contactless front-end pin, and the antenna unit is electrically connected to the contactless front-end pin.

2. The small communication module according to claim 1, characterized in that, It also includes a flexible circuit board, which integrates the antenna unit and the positioning and binding area of ​​the chip. The antenna unit is etched on the surface of the flexible circuit board and electrically connected to the non-contact front-end pins of the chip.

3. The small communication module according to claim 1, characterized in that, The small communication module also includes a metal contact piece. The antenna unit is made of graphene material and is adapted to be installed on the inner side of the metal contact piece through a conformal overlapping structure. The chip also includes a contact communication pin, which is connected to the metal contact piece on the outer interface, and the contact communication pin is physically isolated from the non-contact front-end pin.

4. The small communication module according to claim 3, characterized in that, The chip integrates contact and contactless communication protocol stacks. The contact communication pins and contactless front-end pins of the chip are selectively connected through a switching circuit. The communication protocol stack includes a time-division control module and a scene control module for switching between contact and contactless communication modes.

5. The small communication module according to claim 3, characterized in that, The metal contact and the antenna unit are integrally formed from graphene material.

6. The small communication module according to any one of claims 3-5, characterized in that, It also includes a flexible circuit board, which integrates the antenna unit, the bonding area of ​​the chip, and the bonding area of ​​the metal contact. The antenna unit is etched on the surface of the flexible circuit board and electrically connected to the non-contact front-end pin of the chip. The metal contact is connected to the contact communication pin of the chip through the conductive path of the inner layer of the flexible circuit board.

7. The small communication module according to claim 1, characterized in that, The antenna unit is composed of a coil formed by winding graphene or a graphene printed circuit.

8. The small communication module according to claim 1, characterized in that, A dynamic impedance matching circuit composed of resistive and / or capacitive elements is integrated inside the chip or between the chip and the antenna unit for automatically adjusting the antenna resonant frequency.

9. A contactless smart card, characterized in that, The device is equipped with a small communication module as described in any one of claims 1, 2, 7, or 8, and further includes: A substrate layer made of insulating material, wherein the substrate layer has mounting grooves for embedding the chip; a protective layer including a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding mesh for suppressing electromagnetic interference disposed around the antenna unit.

10. A dual-interface smart card, characterized in that, The chip, configured with a small communication module as described in any one of claims 1 to 3-8, further includes a security processor for executing encryption algorithms and independently managing contact and contactless communication protocols, and also includes: A substrate layer made of insulating material, wherein the substrate layer has mounting grooves for embedding the chip, and a contact interface module is provided on the outer interface of the substrate layer; a protective layer including a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding mesh for suppressing electromagnetic interference arranged around the antenna unit.

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