A device data acquisition and transmission control terminal
The data acquisition and transmission device, with its fully enclosed, detachable structure and dual-interface design, solves the stability issues caused by environmental differences, achieving reliable data transmission and efficient processing, and reducing the burden on the back-end monitoring center.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 青岛市地铁规划设计院有限公司
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-26
AI Technical Summary
Existing data acquisition and transmission devices have poor working stability in different environments, are prone to failure due to factors such as humidity, and are easily lost when communication fails.
It adopts a fully enclosed and detachable structure design, combined with heat sinks for heat dissipation. The dual-interface design ensures that data can be exported in the event of communication failure. It uses high-reliability storage modules and edge computing technology, and independently sets up data signal input/output and power supply interfaces.
It improves the stability of the device in humid environments, ensures no data loss, and reduces the processing load and hardware costs of the back-end monitoring center.
Smart Images
Figure CN224419070U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensor-based data acquisition device technology, and more particularly to the field of device technology for converting raw analog signals acquired by sensors into digital signals for transmission to realize remote automated monitoring. Specifically, it relates to a device data acquisition and transmission control terminal. Background Technology
[0002] Remote data monitoring is currently the primary means for various industries to collect, view, record, and analyze the real-time status of monitored objects. Remote data monitoring is a complex and large-scale system, implemented through various methods that vary significantly depending on the monitored object. However, the main technical approach is based on front-end raw data collection using sensors, followed by data conversion, and finally transmission to a cloud server or back-end monitoring center via communication to achieve remote monitoring. However, different technical solutions differ in their degree of automation, cost, and the reliability and stability of data transmission. As a superior solution, edge computing can significantly reduce costs while improving data processing efficiency and alleviating the data processing load on the back-end monitoring center. This necessitates deploying data acquisition devices on the monitored equipment side. Since different devices operate in different environments, with significant variations in temperature, humidity, and dust levels, designing a data acquisition and transmission device with good resistance to large temperature differences, waterproofing, and moisture resistance is essential. Utility Model Content
[0003] To address the issue of poor operational stability caused by the significant environmental variations in data acquisition and transmission devices installed on the equipment side, this application provides a device data acquisition and transmission control terminal, which has the following advantages compared to existing similar devices:
[0004] 1. In terms of structure: It adopts a fully enclosed, detachable main structure design and uses an integrated heat sink for heat dissipation, which fundamentally solves the problems of high energy consumption, high failure rate and poor resistance to humid environments in existing fan cooling methods; the fully enclosed, detachable shell structure can balance working stability and convenient maintenance and repair in waterproof and moisture-proof environments.
[0005] 2. In terms of data acquisition and processing: This utility model adopts a dual-interface design with a data interface and a backup interface, which can export data under normal communication and communication line failure conditions, ensuring that data is not lost.
[0006] 3. In terms of data storage, compared with the existing storage method that combines SRAM, SD card and mechanical hard drive, it has significantly improved in terms of resistance to voltage fluctuations, data preservation and shock resistance. By using dynamically allocated storage areas, data storage efficiency is higher and preservation is more complete.
[0007] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0008] A device data acquisition and transmission control terminal includes an outer shell with a sealed cavity formed by a top cover, a housing, a bottom plate, and a sealing plate detachably and sealed together. A PCB integrated circuit board for data acquisition and transmission control is installed inside the sealed cavity. The PCB integrated circuit board has a data interface for connecting a sensing module and communication, and a backup interface for exporting backup data, respectively, at both ends. Any of the data interfaces is detachably and sealedly mounted on the housing. The backup interface is sealed through the sealing plate and extends to the outside of the sealing plate. A sealing cover for sealingly blocking the backup interface is detachably and sealedly mounted on the sealing plate.
[0009] To independently configure the input, output, and power supply of data signals, preferably, the data interface includes a first data interface for connecting the sensing module, a second data interface for power supply, and a third data interface for data transmission and communication. Independent interface connections enable data splitting, avoid interference, and allow for faster identification of fault points and reduced maintenance difficulty during subsequent operation and maintenance.
[0010] More preferably, the backup interface includes two USB ports and a fiber optic / broadband port arranged side by side. The USB ports are responsible for power supply and data reading and operation, while the fiber optic / broadband port is mainly used to connect an external wireless communication module to realize wireless data transmission to a cloud server or back-end monitoring center, avoiding the cumbersome process of wired data export and import. Of course, when wireless transmission is not possible, data can also be directly exported to a removable storage medium, such as a laptop or mobile smart terminal, via the USB port.
[0011] In a further preferred embodiment, the PCB integrated circuit board includes a power supply module electrically connected to the data interface and the backup interface respectively, a data acquisition and processing module electrically connected to the power supply module, and a sensing module, a communication module, a storage module, and the data interface and the backup interface connected to the data acquisition and processing module.
[0012] Preferably, the power supply module includes a power management unit, a DC input interface electrically connected to the power management unit, a lithium battery, and a supercapacitor; the data acquisition and processing module includes an ADC module for analog-to-digital conversion, an FPGA module for preprocessing the raw data output by the ADC module, a real-time core connected to the FPGA module for high-precision timing control of the ADC module, and a main control unit for processing the preprocessed data and sending control commands.
[0013] To improve storage reliability and data preservation efficiency, the storage module preferably includes a 128MB DDR4 cache unit, a 64GB eMMC runtime storage unit, and a 1TB SSD archive storage unit.
[0014] To improve installation convenience and sealing performance, preferably, the upper end face of the housing is provided with a U-shaped connecting groove along the edge for installing fasteners, and at least one side of the connecting groove is provided with a sealing groove for installing a sealing ring.
[0015] To achieve interface sealing and prevent water seepage and corrosion at the interface, preferably, the first data interface includes an interface housing, and a snap ring for sealing and nesting on the housing is provided at one end of the interface housing near the housing. The interface housing is provided with a first annular groove, a second annular groove and an external thread extending axially relative to the snap ring end. A first sealing ring and a second sealing ring are respectively installed in the first annular groove and the second annular groove, as well as multiple signal pins electrically connected to the PCB integrated circuit board.
[0016] More preferably, the sealing plate is provided with a first clearance hole, a second clearance hole, and a third clearance hole for avoiding the fiber optic / broadband interface and the two USB interfaces, respectively.
[0017] To improve heat dissipation performance and prevent the internal PCB integrated circuit board from operating at excessively high temperatures, preferably, one or more surfaces of the top cover, housing, bottom plate, sealing plate, and sealing cover are provided with heat sinks.
[0018] Beneficial effects:
[0019] 1. In terms of structure: It adopts a fully enclosed, detachable main structure design and uses an integrated heat sink for heat dissipation, which fundamentally solves the problems of high energy consumption, high failure rate and poor resistance to humid environments in existing fan cooling methods; the fully enclosed, detachable shell structure can balance working stability and convenient maintenance and repair in waterproof and moisture-proof environments.
[0020] 2. In terms of data acquisition and processing: This utility model adopts a dual-interface design with a data interface and a backup interface, which can export data under normal communication and communication line failure conditions, ensuring that data is not lost.
[0021] 3. In terms of data storage, compared with the existing storage method that combines SRAM, SD card and mechanical hard drive, it has significantly improved in terms of resistance to voltage fluctuations, data preservation and shock resistance. By using dynamically allocated storage areas, data storage efficiency is higher and preservation is more complete.
[0022] 4. This utility model adopts edge intelligent processing technology, which has higher data processing efficiency and stronger edge computing capabilities compared with the traditional centralized processing method of platform computing center. The amount of data processed by the background monitoring center is greatly compressed, which greatly reduces the hardware cost investment of the background monitoring center. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is an isometric view of the external structure of this utility model.
[0025] Figure 2 yes Figure 1 Axonometric view of the reverse visual structure.
[0026] Figure 3 yes Figure 1 Exploded view of the structure.
[0027] Figure 4 yes Figure 3 Enlarged view of the structure in the middle K region.
[0028] Figure 5 yes Figure 3 Another visual structure exploded view.
[0029] Figure 6 This is an enlarged view of the structure in region L of the diagram.
[0030] Figure 7 It is an isometric view of the data interface structure.
[0031] Figure 8 yes Figure 7 A sectional view with the section symbol AA along the center line.
[0032] Figure 9 yes Figure 7Axonometric drawing of the structure.
[0033] Figure 10 This is the main view of the data interface.
[0034] In the diagram: 1-Top cover; 11-Heat sink; 2-Housing; 21-First data interface; 22-Second data interface; 23-Third data interface; 24-Connecting groove; 25-Sealing groove; 3-Base plate; 4-Sealing plate; 41-First clearance hole; 42-Second clearance hole; 43-Third clearance hole; 5-Sealing cover; 6-PCB integrated circuit board; 61-USB interface; 62-Fiber optic / broadband interface; 211-Interface housing; 212-Snap-fit ring; 213-First sealing ring; 214-Second sealing ring; 215-External thread; 216-First annular groove; 217-Second annular groove; 218-Signal pin. Detailed Implementation
[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0036] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0038] In the description of this application, it should be noted that the use of terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" to indicate orientation or positional relationships is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product is in use. These terms are used solely for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the use of terms such as "first" and "second" in the description of this application is only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0039] Furthermore, the use of terms such as "horizontal" and "vertical" in the description of this application does not imply that the component is required to be absolutely horizontal or suspended, but rather that it may be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it may be slightly tilted.
[0040] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0041] Example 1:
[0042] This embodiment provides a device data acquisition and transmission control terminal, see appendix. Figures 1-7 As shown, the device includes an outer shell with a sealed cavity, which is detachably and sealed by a top cover 1, a housing 2, a bottom plate 3, and a sealing plate 4. A PCB integrated circuit board 6 for data acquisition and transmission control is installed in the sealed cavity. The PCB integrated circuit board 6 has a data interface for connecting a sensing module and communication, and a backup interface for exporting backup data, respectively, at both ends. Any of the data interfaces is detachably and sealed on the housing 2. The backup interface is sealed through the sealing plate 4 and extends to the outside of the sealing plate 4. A sealing cover 5 is detachably and sealed on the sealing plate 4 to seal and block the backup interface.
[0043] Explanation of working principle:
[0044] The control terminal provided in this embodiment is installed on the monitored device and performs functions such as raw data acquisition, data preprocessing, and transmission. It is deployed based on an intelligent edge computing architecture. The raw data to be acquired is read by the sensor module to read the original analog signal. It is then input into the PCB integrated circuit board 6 via the data interface for sequential analog-to-digital conversion, digital filtering, FFT processing, and spectral feature extraction. The raw waveform data and feature value data are stored, and finally transmitted to the back-end monitoring center via the data interface or sent to the back-end monitoring center or cloud server via the built-in wireless communication module, thereby realizing remote data acquisition and transmission. Compared with the prior art, the control terminal provided in this embodiment is mainly designed with features such as... Figures 1-3 , Figure 5The detachable, fully enclosed structure shown provides a completely sealed cavity for the PCB integrated circuit board 6 for data processing, ensuring stable operation of the control terminal regardless of the humidity level and preventing issues such as poor contact or short circuits due to moisture. Furthermore, this embodiment also includes a separate backup interface covered by a detachable, sealed cover 5. In the event of a failure in the conventional communication line or data interface, preventing data transmission, data can be exported through the backup interface, further ensuring data integrity and security.
[0045] Example 2:
[0046] This embodiment is an optimized and improved version of Embodiment 1, and is a preferred embodiment of this utility model. Specifically, it includes the following:
[0047] In order to independently configure the input, output, and power supply of data signals, in this embodiment, see... Figure 1 and Figure 3 As shown, the data interface includes a first data interface 21 for connecting the sensor module, a second data interface 22 for power supply, and a third data interface 23 for data transmission and communication. Independent interface connections enable data splitting, avoid interference, and allow for faster fault location during subsequent maintenance, reducing maintenance difficulty. In this embodiment, the backup interface includes two parallel USB interfaces 61 and a fiber optic / broadband interface 62. See also... Figure 5 As shown, the USB interface 61 is responsible for power supply and data reading and operation, while the fiber optic / broadband interface 62 is mainly used to connect an external wireless communication module to realize wireless data transmission to the cloud server or the background monitoring center, avoiding the cumbersome process of wired data export and import. Of course, when wireless transmission is not possible, data can also be directly exported to a removable storage medium, such as a laptop or mobile smart terminal, through the USB interface 61.
[0048] Further optimization and improvement: In this embodiment, the PCB integrated circuit board 6 includes a power supply module electrically connected to the data interface and the backup interface, a data acquisition and processing module electrically connected to the power supply module, and a sensing module, a communication module, a storage module, and the data interface and the backup interface, all connected to the data acquisition and processing module. The power supply module includes a power management unit, a DC input interface electrically connected to the power management unit, a lithium battery, and a supercapacitor. The power supply architecture of the power supply module operates with a wide DC 9-36V voltage range, outputting 3.3V digital power through a buck converter to power the ADC module via a low-noise LDO; simultaneously, another path outputs 5V analog power through a boost converter to power the sensing module via an isolated power supply. The lithium battery and supercapacitor are charged simultaneously; the supercapacitor should have at least 300ms of emergency storage capacity, and the lithium battery should have enough power to maintain standby power for 72 hours.
[0049] The data acquisition and processing module includes an ADC module for analog-to-digital conversion, an FPGA module for preprocessing the raw data output from the ADC module, a real-time core connected to the FPGA module for high-precision timing control of the ADC module, and a main control unit for processing the preprocessed data and sending control commands. In this embodiment, the ADC module adopts a 24-bit high-precision Σ-Δ architecture with a synchronous sampling rate of 100kSPS×8 channels, a built-in PGA, and supports 1-128 times adjustment. The preprocessing FPGA module performs real-time digital filtering, and the main control unit adopts a dual-core architecture, using a Cortex-A53 to process complex logic and a Cortex-M7 as the FreeRTOS real-time core to ensure 1μs-level timing accuracy and feed it back to the ADC module, thereby achieving efficient and accurate data processing, realizing intelligent edge computing, and reducing the data processing volume of the background monitoring center by at least 70%, or even more.
[0050] To improve storage reliability and data preservation efficiency, in this embodiment, the storage module includes a 128MB DDR4 cache unit, which can improve voltage fluctuation resistance by at least 2-3 times compared to the existing 8MB SRAM; a 64GB eMMC running storage unit, which can increase the lifespan of the existing pluggable SD card from 10,000 cycles to 30,000 cycles; and a 1TB SSD archiving storage unit that can withstand 50G impact, solving the problem of vibration damage that is common in existing mechanical hard drives.
[0051] Example 3:
[0052] To improve installation convenience and sealing performance, this embodiment further refines and improves the structure based on any of the above embodiments. See the appendix of the instruction manual for details. Figures 6-10As shown, the upper end face of the housing 2 is provided with a U-shaped connecting groove 24 for installing fasteners along the edge, and at least one side of the connecting groove 24 is provided with a sealing groove 25 for installing a sealing ring.
[0053] To achieve a sealed interface and prevent water leakage, corrosion, etc., at the interface, please refer to... Figures 7-9 As shown, the first data interface 21 includes an interface housing 211. A snap-fit ring 212 for sealing and nesting on the housing 2 is provided at one end of the interface housing 211 near the housing 2. The interface housing 211, extending axially relative to the snap-fit ring 212, has a first annular groove 216, a second annular groove 217, and an external thread 215. A first sealing ring 213 and a second sealing ring 214 are respectively installed in the first annular groove 216 and the second annular groove 217, as well as multiple signal pins 218 electrically connected to the PCB integrated circuit board 6. The first data interface 21, the second data interface 22, and the third data interface 23 adopt the same structural configuration. See also... Figure 10 As shown, the same data interface has multiple signal pins 218, and these multiple signal pins 218 can be divided into multiple groups according to the different input / output signal sources / receiving sources, thus achieving the problem of data interface unification. For example... Figure 10 One of the solutions shown integrates data sets B, C, D, E, F, G, H, I, and J into a single data interface. After the unified cable interface is connected, the data is then split and connected at the actual sensor deployment location. This avoids the problem of multiple and inconsistent interfaces in traditional control terminals.
[0054] In this embodiment, the sealing plate 4 is provided with a first clearance hole 41, a second clearance hole 42, and a third clearance hole 43 for respectively avoiding the optical fiber / broadband interface 62 and the two USB interfaces 61, as shown below. Figure 5 As shown.
[0055] To improve heat dissipation and prevent the internal PCB integrated circuit board 6 from overheating, such as Figure 1 As shown, heat sinks 11 are provided on any one or more surfaces of the top cover 1, the housing 2, the bottom plate 3, the sealing plate 4, and the sealing cover 5.
[0056] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A device data acquisition and transmission control terminal, characterized in that: The housing includes a sealed cavity formed by a detachable and sealed connection of a top cover (1), a housing (2), a bottom plate (3), and a sealing plate (4). A PCB integrated circuit board (6) for data acquisition and transmission control is installed in the sealed cavity. The PCB integrated circuit board (6) has a data interface for connecting a sensing module and communication and a backup interface for exporting backup data at both ends. Any of the data interfaces is detachably and sealed on the housing (2). The backup interface is sealed through the sealing plate (4) and extends to the outside of the sealing plate (4). A sealing cover (5) for sealing and blocking the backup interface is detachably and sealed on the sealing plate (4).
2. The device data acquisition and transmission control terminal according to claim 1, characterized in that: The data interface includes a first data interface (21) for connecting the sensing module, a second data interface (22) for power supply, and a third data interface (23) for data transmission communication.
3. The device data acquisition and transmission control terminal according to claim 1, characterized in that: The spare interfaces include two USB interfaces (61) arranged side by side and an optical fiber / broadband interface (62).
4. The device data acquisition and transmission control terminal according to claim 1, characterized in that: The PCB integrated circuit board (6) includes a power supply module electrically connected to the data interface and the backup interface respectively, a data acquisition and processing module electrically connected to the power supply module, and a sensing module, a communication module, a storage module, and the data interface and the backup interface connected to the data acquisition and processing module.
5. The device data acquisition and transmission control terminal according to claim 4, characterized in that: The power supply module includes a power management unit, a DC input interface electrically connected to the power management unit, a lithium battery, and a supercapacitor; the data acquisition and processing module includes an ADC module for analog-to-digital conversion, an FPGA module for preprocessing the raw data output by the ADC module, a real-time core connected to the FPGA module for high-precision timing control of the ADC module, and a main control unit for processing the preprocessed data and sending control commands.
6. The device data acquisition and transmission control terminal according to claim 4, characterized in that: The storage module includes a 128MB DDR4 cache unit, a 64GB eMMC runtime storage unit, and a 1TB SSD archive storage unit.
7. A device data acquisition and transmission control terminal according to any one of claims 1-6, characterized in that: The upper end face of the housing (2) is provided with a U-shaped connecting groove (24) for installing fasteners along the edge, and at least one side of the connecting groove (24) is provided with a sealing groove (25) for installing a sealing ring.
8. The device data acquisition and transmission control terminal according to claim 2, characterized in that: The first data interface (21) includes an interface housing (211), and a snap ring (212) for sealing and nesting on the housing (2) is provided at one end of the interface housing (211) near the housing (2). The interface housing (211) is provided with a first annular groove (216), a second annular groove (217) and an external thread (215) respectively extending axially at one end relative to the snap ring (212). A first sealing ring (213) and a second sealing ring (214) are respectively installed in the first annular groove (216) and the second annular groove (217), as well as multiple signal pins (218) electrically connected to the PCB integrated circuit board (6).
9. A device data acquisition and transmission control terminal according to claim 3, characterized in that: The sealing plate (4) is provided with a first clearance hole (41), a second clearance hole (42) and a third clearance hole (43) for avoiding the fiber optic / broadband interface (62) and the two USB interfaces (61).
10. A device data acquisition and transmission control terminal according to any one of claims 1-6, characterized in that: Heat sinks (11) are provided on any one or more surfaces of the top cover (1), the shell (2), the bottom plate (3), the sealing plate (4), and the sealing cover (5).