An avionics controller chassis
By introducing a heat dissipation system consisting of semiconductor cooling chips and heat sink fins into the aircraft controller chassis, the problem of component damage at high temperatures is solved, achieving effective heat dissipation and cooling effects, and ensuring equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING ZHONG CHUANG HU LIAN TECH CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-06-26
AI Technical Summary
Existing aircraft controller chassis cannot effectively dissipate heat at high temperatures, causing avionics components such as processors and sensors to experience parameter drift, solder joint detachment, or capacitor explosion, affecting normal use.
The heat dissipation mechanism consists of a semiconductor cooling chip, a cooling plate, a circulating fan, and heat dissipation fins. It cools down the semiconductor cooling chip by circulating air and collecting condensate, and combines the cooling fan with the cooling process to prevent the semiconductor cooling chip from overheating.
It effectively reduces the internal temperature of the chassis, prevents damage to avionics components due to high temperatures, and ensures stable operation of the equipment.
Smart Images
Figure CN224419072U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of controller chassis technology, specifically an aviation controller chassis. Background Technology
[0002] An aircraft controller enclosure is a physical shell or structure in avionics used to house, protect, and support critical control components, and is an essential part of the aviation system. It is a hardware enclosure specifically designed for the aviation environment to integrate and protect core electronic components of flight control, navigation, and communication systems. Its design must meet stringent aviation standards to ensure stable operation under extreme conditions. A robust enclosure structure, such as aluminum alloys or composite materials, resists mechanical stresses such as vibration, shock, and high pressure, protecting sensitive internal components from damage.
[0003] In existing technologies, such as the aviation controller chassis disclosed in publication number CN207369520U, there is a main body cavity made of aluminum alloy, an upper cover plate, a lower cover plate, and a front panel. A partition in the middle of the main body cavity divides it into a DC voltage regulator mounting cavity and a main control module mounting cavity. The upper and lower cover plates are respectively fixed to the upper and lower end faces of the main body cavity, and the front panel is fixed to the end of the main body cavity. The main control module of the aviation controller is fixed to the partition in the main control module mounting cavity. This design minimizes the possibility of electromagnetic waves propagating through the gap between the housing and the cover plate, isolates the DC voltage regulator and the main control module on opposite sides of the metal plate (partition), and reduces electromagnetic interference between them.
[0004] Existing chassis minimize the possibility of electromagnetic waves propagating through the gap between the shell and the cover, and isolate the DC regulator and the main control module on opposite sides of a metal plate (partition), reducing electromagnetic interference between the two. However, they cannot dissipate heat from the internal components during use, which can cause avionics components, such as processors and sensors, to experience parameter drift, solder joint detachment, or capacitor explosion at high temperatures, affecting normal use. Utility Model Content
[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.
[0006] Given that the existing technology has the problem of not being able to dissipate heat from internal components during use, it can cause avionics components, such as processors and sensors, to experience parameter drift, solder joint detachment, or capacitor explosion at high temperatures, affecting normal use.
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] An aircraft controller chassis includes a chassis shell, the upper end of which is connected to a heat sink, the heat sink having a heat dissipation mechanism for dissipating heat from components inside, and a fixing mechanism for assembling components inside the chassis shell.
[0009] The heat dissipation mechanism includes a thermoelectric cooler, which is fixed to the upper end of the inner wall of the heat sink. A heat-conducting plate is connected to the lower surface of the thermoelectric cooler. Two fixing plates are installed horizontally inside the heat sink, and a circulating fan is installed inside each of the two fixing plates.
[0010] As a further embodiment of this utility model: the upper surface of the semiconductor cooling chip is connected to heat dissipation fins, and the upper end of the heat dissipation fins is fixed to a mounting plate by bolts.
[0011] As a further improvement of this utility model: two cooling fans are installed inside the mounting plate, and a water collection tank is connected to the lower surface of the heat sink.
[0012] As a further improvement of this utility model: the lower surface of the water collection tank is connected to a drain valve, and the end of the drain valve is connected to a drain pipe.
[0013] As a further improvement of this utility model: a protective cover is movably connected to the side wall of the chassis shell, and a fixing bolt is installed inside the protective cover.
[0014] As a further improvement of this utility model, the end of the fixing bolt is threaded with a mounting hole opened on the outer casing of the chassis.
[0015] As a further embodiment of this utility model: the fixing mechanism includes a movable plate, which is horizontally installed inside the casing, and one end of the movable plate is provided with a groove.
[0016] As a further improvement of this utility model: a filter capacitor is installed on the upper surface of the movable plate, and connecting blocks that slide and connect with the outer casing of the chassis are welded to both ends of the movable plate.
[0017] Compared with the prior art, the beneficial effects of this utility model are:
[0018] 1. This utility model draws air from inside the chassis shell into the heat sink, and a circulating fan blows the air from inside the heat sink into the chassis shell. When the air passes through the cooling fins, it can be cooled, thereby dissipating heat from the inside of the device.
[0019] 2. In this invention, the cooling water generated during air cooling adheres to the surface of the cooling fins and drips into the water collection tank under its own gravity. The heat dissipation fins can absorb the heat generated by the semiconductor cooling chip during operation, and the cooling fan on the mounting plate blows air to dissipate heat from the heat dissipation fins, thereby cooling the semiconductor cooling chip and reducing the possibility of damage due to excessive temperature. Attached Figure Description
[0020] Figure 1 This is a three-dimensional structural diagram of an aircraft controller chassis;
[0021] Figure 2 This is a three-dimensional structural diagram of the outer casing of an aviation controller enclosure;
[0022] Figure 3 This is a schematic cross-sectional view of the outer casing of an aircraft controller enclosure.
[0023] Figure 4 This is a schematic diagram of the internal structure of a heat sink component in an aircraft controller chassis.
[0024] Figure 5 This is a schematic cross-sectional view of a heat sink component in an aircraft controller chassis.
[0025] In the diagram: 1. Chassis shell; 2. Heat sink; 3. Semiconductor cooling chip; 31. Cooling fin; 32. Mounting plate; 33. Circulating fan; 34. Heat sink fins; 35. Mounting plate; 36. Cooling fan; 37. Water collection tank; 38. Drain valve; 39. Drain pipe; 4. Protective cover; 5. Fixing bolts; 6. Mounting hole; 7. Movable plate; 71. Groove; 72. Filter capacitor; 73. Connecting block. Detailed Implementation
[0026] To make the above-mentioned objectives, features and advantages of this utility model more readily understood, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0028] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.
[0029] Example 1
[0030] Please see Figures 1-5 This is the first embodiment of the present utility model. This embodiment provides an aviation controller chassis, including a chassis shell 1, a heat sink 2 connected to the upper end of the chassis shell 1, a heat sink 2 is provided inside the heat sink 2 for heat dissipation of parts, and a fixing mechanism for assembling parts is provided inside the chassis shell 1.
[0031] The heat dissipation mechanism includes a thermoelectric cooler 3, which is fixed to the upper end of the inner wall of the heat sink 2. A heat conduction plate 31 is connected to the lower surface of the thermoelectric cooler 3. Two fixing plates 32 are installed horizontally inside the heat sink 2, and a circulating fan 33 is installed inside each of the two fixing plates 32.
[0032] Specifically, a heat dissipation fin 34 is connected to the upper surface of the semiconductor cooling chip 3, and a mounting plate 35 is fixed to the upper end of the heat dissipation fin 34 by bolts.
[0033] Furthermore, the heat dissipation fins 34 can absorb the heat generated by the semiconductor cooling chip 3 during operation.
[0034] Specifically, two cooling fans 36 are installed inside the mounting plate 35, and a water collection tank 37 is connected to the lower surface of the heat sink 2.
[0035] Furthermore, the cooling fan 36 on the mounting plate 35 blows air onto the cooling fins 34 to dissipate heat, thereby cooling the semiconductor cooling chip 3.
[0036] Specifically, a drain valve 38 is connected to the lower surface of the water collection tank 37, and a drain pipe 39 is connected to the end of the drain valve 38.
[0037] Furthermore, the condensate drips into the water collection tank 37 under its own gravity for collection, and can be discharged to the outside through the drain valve 38 and drain pipe 39.
[0038] During use, the electronic components assembled inside the chassis 1 generate heat. The thermoelectric cooler 3 installed in the heat sink 2 is activated, which cools the heat conduction plate 31. At the same time, the circulating fans 33 on the two mounting plates 32 are activated. One circulating fan 33 draws air from inside the chassis 1 into the heat sink 2, while the other circulating fan 33 blows air from the heat sink 2 into the chassis 1. As the air passes over the heat conduction plate 31, it is cooled. The condensate generated during the cooling process adheres to the surface of the heat conduction plate 31 and drips into the water collection tank 37 by gravity. The water can be discharged to the outside through the drain valve 38 and drain pipe 39. The heat dissipation fins 34 can absorb the heat generated by the thermoelectric cooler 3 during operation, and the cooling fan 36 on the mounting plate 35 blows air onto the heat dissipation fins 34 to cool the thermoelectric cooler 3, thereby reducing the risk of damage to the thermoelectric cooler 3 due to overheating.
[0039] In summary, when the aviation controller chassis is in use, the circulating fan 33 on the fixed plate 32 is started to circulate the air inside the chassis shell 1. When the air passes through the cooling fins 31, it can be cooled down, thereby dissipating heat from the inside of the device.
[0040] Example 2
[0041] Please see Figures 1-5 This is the second embodiment of the present utility model.
[0042] Specifically, a protective cover 4 is movably connected to the side wall of the chassis shell 1, and a fixing bolt 5 is installed inside the protective cover 4. The end of the fixing bolt 5 is threadedly connected to a mounting hole 6 opened on the chassis shell 1.
[0043] Furthermore, the protective cover 4 is assembled onto the chassis shell 1, and the fixing bolts 5 are tightened so that the fixing bolts 5 are threadedly connected to the mounting holes 6 on the chassis shell 1, thereby fixing the protective cover 4.
[0044] Specifically, the fixing mechanism includes a movable plate 7, which is installed horizontally inside the chassis shell 1, and a groove 71 is provided at one end of the movable plate 7.
[0045] Furthermore, by inserting a hand into the pull groove 71, the movable plate 7 can be pulled, thereby removing the movable plate 7 from the chassis housing 1.
[0046] Specifically, a filter capacitor 72 is installed on the upper surface of the movable plate 7, and connecting blocks 73 that are slidably connected to the outer casing 1 are welded to both ends of the movable plate 7.
[0047] Furthermore, with the cooperation of the connecting block 73, the movable plate 7 can be limited, thereby ensuring the stability of the movable plate 7.
[0048] In use, place the chassis shell 1 in a suitable position. Through the movable plate 7 provided inside the chassis shell 1, you can insert your hand into the pull groove 71. With the cooperation of the connecting block 73, you can pull the movable plate 7 and pull it out of the chassis shell 1. This makes it convenient to assemble electronic components such as circuit boards and filter capacitors 72 on the movable plate 7. After assembly, push the movable plate 7 back into the chassis shell 1. Screws can be used to fix the movable plate 7. Then, assemble the protective cover 4 onto the chassis shell 1 and tighten the fixing bolts 5 so that the fixing bolts 5 are threadedly connected to the mounting holes 6 on the chassis shell 1, thereby fixing the protective cover 4.
[0049] In summary, when the aviation controller chassis is in use, the circulating fan 33 on the fixed plate 32 is activated to circulate the air inside the chassis shell 1. When the air passes through the cooling fins 31, it can be cooled, thereby dissipating heat inside the device. Furthermore, the heat dissipation fins 34 can absorb the heat generated by the thermoelectric cooler 3 during operation. The cooling fan 36 blows air onto the heat dissipation fins 34 to cool the thermoelectric cooler 3, reducing the possibility of damage to the thermoelectric cooler 3 due to excessive temperature.
[0050] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.
[0051] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.
[0052] It should be understood that numerous specific implementation decisions can be made during the development of any actual implementation method, and in any engineering or design project. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.
[0053] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. An aircraft controller chassis, comprising a chassis shell (1), characterized in that: The upper end of the chassis shell (1) is connected to a heat sink (2), and the heat sink (2) is provided with a heat dissipation mechanism for heat dissipation of the parts, and the chassis shell (1) is provided with a fixing mechanism for assembly of the parts. The heat dissipation mechanism includes a semiconductor cooling chip (3), which is fixed to the upper end of the inner wall of the heat sink (2). A cooling plate (31) is connected to the lower surface of the semiconductor cooling chip (3). Two fixing plates (32) are installed horizontally inside the heat sink (2), and a circulating fan (33) is installed inside each of the two fixing plates (32).
2. The aircraft controller chassis according to claim 1, characterized in that: The upper surface of the semiconductor cooling chip (3) is connected to a heat dissipation fin (34), and the upper end of the heat dissipation fin (34) is fixed with a mounting plate (35) by bolts.
3. The aircraft controller chassis according to claim 2, characterized in that: The mounting plate (35) has two cooling fans (36) installed inside, and the lower surface of the heat sink (2) is connected to a water collection tank (37).
4. The aircraft controller chassis according to claim 3, characterized in that: The lower surface of the water collection tank (37) is connected to a drain valve (38), and the end of the drain valve (38) is connected to a drain pipe (39).
5. The aircraft controller chassis according to claim 1, characterized in that: The side wall of the chassis shell (1) is movably connected to a protective cover (4), and a fixing bolt (5) is installed inside the protective cover (4).
6. The aviation controller chassis according to claim 5, characterized in that: The end of the fixing bolt (5) is threaded with a mounting hole (6) on the outer casing (1).
7. An aviation controller chassis according to claim 6, characterized in that: The fixing mechanism includes a movable plate (7), which is installed horizontally inside the chassis shell (1), and a groove (71) is provided at one end of the movable plate (7).
8. An aviation controller chassis according to claim 7, characterized in that: The upper surface of the movable plate (7) is equipped with a filter capacitor (72), and both ends of the movable plate (7) are welded with connecting blocks (73) that are slidably connected to the outer casing (1).