MEMS heat dissipation device and electronic equipment

Abstract

The utility model provides a kind of MEMS heat dissipation device, including MEMS heat dissipation chip, microchannel radiator of being attached to MEMS heat dissipation chip, the size of gas passage of microchannel radiator is micrometer level, and the heat dissipation surface of microchannel radiator is used to be attached to the surface of heat source.The utility model further provides corresponding electronic equipment.The MEMS heat dissipation device of the utility model combines MEMS heat dissipation chip with extremely high back pressure and low power consumption characteristics with specially designed microchannel radiator, overcomes the inherent high flow resistance of microchannel by the high back pressure capacity of MEMS, so that it is possible to realize efficient forced convection heat exchange in extremely small volume, thereby solving the efficient heat dissipation problem under extremely limited space.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices. Specifically, it relates to a heat dissipation device using microelectromechanical systems (MEMS) technology and an electronic device using the heat dissipation device, which is particularly suitable for efficient active heat dissipation of high-performance electronic components with strict space constraints. Background Technology

[0002] As electronic devices become smaller and more powerful, their internal space becomes increasingly compact. High-performance components such as solid-state drive (SSD) controllers, NAND flash memory, high-frequency DRAM memory, and high-speed memory cards generate a lot of heat, making heat dissipation a growing problem.

[0003] Currently, heat dissipation technologies for electronic devices mainly include passive heat dissipation and active heat dissipation.

[0004] Passive cooling refers to heat dissipation primarily through natural convection and radiation via heat sinks, heat pipes, etc. However, for high-performance components with limited space and high heat generation, passive cooling is often inefficient, easily leading to frequency throttling due to overheating, thus affecting performance and stability.

[0005] Active cooling in current technology typically refers to forced convection cooling using a fan. However, traditional fans (including micro fans) have the following problems:

[0006] (1) Size limitation: The size of traditional fans is difficult to adapt to devices with extremely small internal space, such as thin and light laptops, handheld consoles, external hard drives, and memory modules.

[0007] (2) Insufficient back pressure: The back pressure capability (i.e. the ability to overcome airflow resistance) of micro fans is usually low. When used with microchannel heat sinks with a high surface area to volume ratio (such heat sinks can provide a larger heat exchange area, but the airflow channels are small, resulting in high flow resistance), low back pressure fans have difficulty driving enough airflow, resulting in poor heat dissipation.

[0008] Therefore, in current electronic devices, especially high-performance devices with limited internal space, traditional passive cooling methods are insufficient to meet the requirements, while traditional active cooling methods are limited by size and back pressure capacity and cannot be effectively combined with high-efficiency microchannel heat dissipation structures. Traditional cooling methods (such as fans and large heat sinks) are difficult to apply to devices with extremely limited internal space, such as thin and light laptops, handheld consoles, external hard drives, cameras, and memory modules. This leads to high-performance components (such as SSD controllers, NAND, high-frequency DRAM, and high-speed memory cards) being prone to overheating and frequency reduction due to insufficient heat dissipation, affecting user experience and device reliability.

[0009] Currently, there is an urgent need for a new type of heat dissipation solution that can overcome high flow resistance and achieve efficient active heat dissipation in extremely compact spaces. Utility Model Content

[0010] The purpose of this invention is to provide a MEMS heat dissipation device and electronic device to solve the problem of efficient heat dissipation under extreme space constraints.

[0011] To achieve the above objectives, this utility model provides a MEMS heat dissipation device, including a MEMS heat dissipation chip and a microchannel heat sink attached to the MEMS heat dissipation chip. The gas channels of the microchannel heat sink are micrometer-sized, and the heat dissipation surface of the microchannel heat sink is used to be attached to the surface of a heat source.

[0012] Preferably, the MEMS heat dissipation chip and the microchannel heat sink are stacked vertically, or one side of the microchannel heat sink is attached to the side of the MEMS heat dissipation chip.

[0013] Preferably, the MEMS heat dissipation device further includes two ventilation openings, one of which is located on the top surface, bottom surface, or side of the MEMS heat dissipation chip, and the other is located on the side of the microchannel heat sink; and one of the ventilation openings serves as an air inlet and the other as an air outlet.

[0014] Preferably, a dustproof screen is provided at the ventilation opening of the microchannel heat sink, or a dustproof screen is provided at the ventilation opening of the MEMS heat sink chip.

[0015] Preferably, the microchannel heat sink includes heat dissipation fins.

[0016] Preferably, the size of the heat dissipation fins is in the micrometer range; and / or the heat dissipation fins are disposed on the inner wall surface of the gas channel, and the length extension direction of the heat dissipation fins is consistent with the gas flow direction of the gas channel; and / or the material of the heat dissipation fins is copper.

[0017] Preferably, the microchannel heat sink has a highly thermally conductive material on its heat dissipation surface in contact with the heat source; and / or the microchannel heat sink is elongated.

[0018] Preferably, the heat source is located on the circuit board or is a memory card in a slot;

[0019] The number of MEMS heat dissipation chips and microchannel heat sinks is one set, and they are set on the same side of the circuit board or on one side of the memory card slot; or, the number of MEMS heat dissipation chips and microchannel heat sinks is two sets, and the two sets of MEMS heat dissipation chips and microchannel heat sinks are set on both sides of the circuit board or on both sides of the memory card slot.

[0020] For a set of MEMS heat dissipation chips and microchannel heat sinks, the number of microchannel heat sinks is 1, and the number of MEMS heat dissipation chips is 1 or 2.

[0021] Preferably, the heat source is disposed on the circuit board; the MEMS heat dissipation chip is fixed on the circuit board by padding material; or the MEMS heat dissipation chip is fixed on one of the heat sources and fixed on the circuit board by the heat source.

[0022] On the other hand, this utility model provides an electronic device, including a heat source, on which the above-described MEMS heat dissipation device is mounted.

[0023] The MEMS heat dissipation device of this invention combines a MEMS heat dissipation chip with extremely high back pressure and low power consumption characteristics with a specially designed microchannel heat sink. By leveraging the high back pressure capability of MEMS, the inherent high flow resistance of microchannels is overcome, making it possible to achieve efficient forced convection heat transfer in a very small volume. This is something that traditional low back pressure micro fans cannot achieve, thus solving the problem of efficient heat dissipation under extremely limited space. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of an integrated single-point MEMS heat dissipation device according to the first embodiment of the present invention.

[0025] Figure 2 Is it like this? Figure 1 The side view of the microchannel heat sink of the integrated single-point MEMS heat dissipation device shown.

[0026] Figure 3 This is a schematic diagram of the structure of an integrated single-point MEMS heat dissipation device according to the second embodiment of the present invention.

[0027] Figure 4 This is a structural schematic diagram of an integrated single-point MEMS heat dissipation device according to the third embodiment of the present invention.

[0028] Figure 5 This is a structural schematic diagram of an integrated single-point MEMS heat dissipation device according to the fourth embodiment of the present invention.

[0029] Figure 6 This is a schematic diagram of the structure of a MEMS heat dissipation device for a mobile device according to the fifth embodiment of the present invention. Detailed Implementation

[0030] The present invention will be further described below with reference to specific embodiments. It should be understood that the following embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0031] First embodiment: Integrated single-point MEMS heat dissipation device

[0032] like Figure 1 The diagram shows a MEMS heat dissipation device according to a first embodiment of the present invention, primarily targeting a single heat source. The MEMS heat dissipation device includes a MEMS heat dissipation chip 10 (i.e., the airflow generating part) and a microchannel heat sink 20. The MEMS heat dissipation chip 10 and the microchannel heat sink 20 are stacked vertically, such that the top surface of the microchannel heat sink 20 is attached to the MEMS heat dissipation chip. The bottom surface of the microchannel heat sink 20 serves as a heat dissipation surface and is used to attach to the surface of a heat source (such as a heat-generating element).

[0033] In this embodiment, the heat source is a single main heat-generating component, such as an SSD controller chip, NAND flash memory, DRAM chips, or other small chips requiring powerful point-to-point heat dissipation. The MEMS heat sink 10 and the microchannel heat sink 20 are both present in a single unit, directly integrated into a compact module. This embodiment achieves the most compact structure and integrated active heat dissipation.

[0034] Among them, the MEMS heat dissipation chip 10 is an existing product that is currently available on the market, such as the XMC-2400μCooling active micro fan cooling chip. The MEMS heat dissipation chip has a high back pressure (reaching over 1000Pa) and very low power (typically in the tens of milliwatts). At the same time, the heat dissipation chip itself is dustproof and waterproof, and can switch between blowing and suction modes via control signals.

[0035] The microchannel heat sink 20 includes gas channels and heat dissipation fins.

[0036] The heat dissipation fins are positioned on the inner wall of the gas channels, with their length extending in the same direction as the gas flow. The internal structure of the microchannel heatsink must meet the following requirements: ① All parallel microchannels should be as geometrically consistent as possible (width, depth, length). Significant dimensional deviations will cause the flow resistance of that channel to differ from other channels, thus affecting flow distribution; ② Control the cross-sectional dimensions (width × depth) and total length of the microchannels to avoid excessive pressure drop leading to insufficient airflow at the far end. The heat dissipation fins are made of materials similar to those used in traditional laptops and other mobile devices, employing excellent thermal conductivity materials such as copper.

[0037] In this embodiment, the microchannel heat sink 20 has a high thermal conductivity material (such as a VC heat sink) on its heat dissipation surface that is in contact with the heat source, so as to directly contact the heat source and improve the heat conduction efficiency.

[0038] Because the use of MEMS heat dissipation chips can generate back pressure far greater than that of conventional small fans, the dimensions of the gas channels and heat dissipation fins are on the micrometer scale, greatly increasing the surface area-to-volume ratio of the heat sink and thus increasing heat dissipation efficiency. Furthermore, due to the extremely small size of the gas channels, the microchannel heat sink 20 has micrometer-sized dust filters 30 at the vents to prevent airflow blockage.

[0039] In some embodiments, such as Figure 1 and Figure 2 As shown, the top surface of the microchannel heat sink 20 is attached to the MEMS heat dissipation device and has a vent (as an air outlet) for the microchannel heat sink 20. The side surface has a vent (as an air inlet) for the microchannel heat sink and is covered with a dustproof mesh 30. The bottom surface is attached to the heat source. Accordingly, the integrated single-point MEMS heat dissipation device operates as follows: the MEMS scattering chip 10 draws in air from one direction through the microchannel heat sink, forces the air to flow through the internally integrated microchannel heat sink, and discharges the heated air from another direction.

[0040] In other embodiments, if the top surface of the microchannel heat sink 20 is attached to the MEMS heat dissipation device and has a vent (as an air inlet) for the microchannel heat sink 20, and a vent (as an air outlet) for the microchannel heat sink on the side, then the dustproof mesh 30 is not required. Accordingly, the integrated single-point MEMS heat dissipation device operates as follows: the MEMS scattering chip 10 draws in air from one direction, forces the air to flow through the internally integrated microchannel heat sink as it flows out, and discharges the heated air from another direction.

[0041] Second and third embodiments: Coverage-type multi-point MEMS heat dissipation device (for distributed heat sources on a circuit board)

[0042] like Figure 3 and Figure 4 The cover-type multi-point MEMS heat dissipation device shown in the second and third embodiments of the present invention includes a MEMS heat dissipation chip 10 and a strip-shaped microchannel heat sink 20. One side of the microchannel heat sink 20 is attached to the side of the MEMS heat dissipation chip 10, and the heat dissipation surface of the microchannel heat sink 20 is attached to the heat source.

[0043] In the second and third embodiments, there are multiple heat sources, all of which are disposed on the same circuit board 50.

[0044] Among them, such as Figure 3 As shown, according to the second embodiment of this utility model, the heat source can be, for example, as shown in the figure. Figure 3The solid-state drive (SSD) shown contains the main controller and all NAND flash chips (or a row of DRAM chips on a memory module). All heat sources are located on the same side of the circuit board 50; therefore, the MEMS heat sink 10 and the microchannel heat sink 20 are in one group and located on the same side of the circuit board 50.

[0045] Ventilation openings (as air outlets) can be provided on the top surface or side of the MEMS heat sink 10. For example, the ventilation openings on the top of the MEMS heat sink 10... Figure 3 The solid-state drive (SSD) shown is designed for easy ventilation through the opening in the laptop's D-shell. Furthermore, the microchannel heatsink 20 has a vent (serving as an air intake) on its side furthest from the MEMS heat dissipation chip 10.

[0046] In addition, the MEMS heat dissipation chip 10 is fixed on the circuit board 50 by the padding material 40, so that the MEMS heat dissipation chip 10 and the microchannel heat sink 20 are at the same height.

[0047] like Figure 4 As shown, the difference from the second embodiment of this utility model is that, according to the third embodiment of this utility model, the heat source can be, for example, as shown in the diagram. Figure 4 The DRAM chip shown is double-sided. All heat sources are located on both sides of the circuit board 50. Therefore, there are two MEMS heat dissipation chips 10 and two microchannel heat sinks 20, and the two sets of MEMS heat dissipation chips 10 and microchannel heat sinks 20 are located on both sides of the circuit board 50.

[0048] The MEMS heat dissipation chip 10 is directly fixed to one of the heat sources using thermally conductive materials such as thermally conductive adhesive, and then fixed to the circuit board 50 by the heat source, so that the MEMS heat dissipation chip 10 and the microchannel heat sink 20 are at the same height. The MEMS heat dissipation chip 10 is also connected to the power supply and drive circuit of the circuit board 50 by means of ribbon cables or flying wires.

[0049] Ventilation openings (as air outlets) can be provided above or to the side of the MEMS heat sink 10. Furthermore, ventilation openings (as air inlets) are provided on the side of the microchannel heat sink 20 furthest from the MEMS heat sink 10.

[0050] In the second and third embodiments, the length of the microchannel heat sink 20 is set sufficient to cover multiple heat sources on the circuit board 50. For example, it can cover the main controller and all NAND flash chips on a 2280 or other type of solid-state drive (SSD), thereby actively cooling the entire SSD; or it can cover single-sided or double-sided DRAM chips on a DDR5 memory module, and can be designed in an ultra-thin form compatible with existing heatsinks, thereby achieving heat dissipation for single-sided or even double-sided DRAM chips.

[0051] The working principle of the covered multi-point MEMS heat dissipation device is as follows: the MEMS heat dissipation chip acts as a power source, drawing (or blowing) air from one end, allowing the air to flow through the entire length of the microchannel heat sink and exchange heat with all the heat sources covered below.

[0052] The advantages of the second and third embodiments are that they can provide unified active cooling for multiple distributed heat sources at the same time, the solution is thin and suitable for integration into standard boards (SSD, memory modules), and it is easy to combine with the overall airflow of the device.

[0053] Fourth embodiment: MEMS heat dissipation device for memory card slots (for CF / SD flash memory card slots, etc.)

[0054] like Figure 5 The image shows a MEMS heat dissipation device for a memory card slot according to a fourth embodiment of the present invention, which is used to dissipate heat from the memory card slot 60, especially for flash memory card slots such as CF / SD cards.

[0055] According to the fourth embodiment of the present invention, the MEMS heat dissipation device of the memory card slot 60 includes a MEMS heat dissipation chip 10 and a microchannel heat sink 20. One side of the microchannel heat sink 20 is attached to the side of the MEMS heat dissipation chip 10, and the MEMS heat dissipation chip 10 and the microchannel heat sink 20 are jointly attached to the upper surface and / or lower surface of the memory card slot 60.

[0056] In this embodiment, there are two sets of MEMS heat dissipation chips 10 and microchannel heat sinks 20, which are respectively attached to the upper and lower surfaces of the memory card slot 60. In other embodiments, when there is only one set of MEMS heat dissipation chips 10 and microchannel heat sinks 20, they are attached to either the upper or lower surface of the memory card slot 60.

[0057] In addition, the microchannel heat sink 20 is provided with a heat dissipation surface that can be attached to an inserted flash memory card (especially a CFexpress card), and a thermally conductive material layer is provided on the heat dissipation surface for close contact with the flash memory card as a heat source.

[0058] The outer casing of the device housing the card slot needs to have ventilation holes 70 corresponding to the positions of the microchannel heat sink 20. These ventilation holes 70 can serve as either air inlets or outlets. Accordingly, the MEMS heat dissipation device for the memory card slot operates as follows: the MEMS scattering chip 10 exhausts (or draws in) air through an external air inlet, and draws (or blows) air through the microchannel heat sink. As the air flows through the microchannel, it carries away the heat conducted from the flash memory card to the heat sink. The heated air is then exhausted from the device through a dedicated exhaust vent.

[0059] The advantage of the fourth embodiment lies in its direct design addressing the heat dissipation problem of memory cards. By structurally modifying the card slot area of ​​devices (such as cameras), it transforms passive heat dissipation into active heat dissipation, improving the stability of continuous high-performance read and write operations. Therefore, the MEMS heat dissipation device for memory card slots can be applied to specifically solve the overheating and speed reduction problem caused by the huge heat generated and insufficient passive heat dissipation of high-speed memory cards (such as CFexpress, high-speed SD) in devices such as cameras and card readers.

[0060] Fifth embodiment: MEMS heat dissipation device for mobile devices

[0061] like Figure 6 The image shows a MEMS heat dissipation device for a mobile device according to a fifth embodiment of the present invention, which provides efficient active heat dissipation for the SoC chip of an electronic device (such as a mobile device) and utilizes external air for heat exchange.

[0062] According to the fifth embodiment of the present invention, the MEMS heat dissipation device of the memory card slot includes a MEMS heat dissipation chip 10 and a microchannel heat sink 20. The bottom surface of one side of the microchannel heat sink 20 is attached to the top surface of the MEMS heat dissipation chip 10, and the heat dissipation surface of the microchannel heat sink 20 is attached to the surface above the heat source.

[0063] In this embodiment, the heat source is the SoC chip on the circuit board 50 of the electronic device.

[0064] In this embodiment, there is one microchannel heat sink 20 and two MEMS heat dissipation chips 10, which are respectively attached to the two sides of the MEMS heat dissipation chip 10, thus forming a set of MEMS heat dissipation chips 10 and microchannel heat sink 20. Therefore, the MEMS heat dissipation chips at both ends are activated simultaneously, forming a push-pull or end-to-end driven airflow system, generating forced airflow. When one of the microchannel heat sinks 20 acts as the air inlet, the other must act as the air outlet.

[0065] In other embodiments, for a set of MEMS heat dissipation chips 10 and microchannel heat sinks 20, the number of microchannel heat sinks 20 is 1, and the number of MEMS heat dissipation chips 10 is 1 or 2.

[0066] The microchannel heat sink 20 includes gas channels and heat dissipation fins.

[0067] The heat dissipation fins are located on the inner wall of the gas channel, and their length extends in the same direction as the gas flow. The fins are made of a material similar to that used in traditional laptops and other mobile devices, employing excellent thermal conductivity materials such as copper.

[0068] In this embodiment, the microchannel heat sink 20 has a VC heat spreader 80 on its heat dissipation surface in contact with the heat source. The length of the microchannel heat sink 20 is equal to the length of the VC heat spreader 80 plus the length of the two microchannel heat sinks 20 on both sides, and the size of the heat source is smaller than the size of the VC heat spreader 80. Therefore, the heat generated by the SoC chip is first quickly absorbed and evenly distributed by the adjacent VC heat spreader, achieving heat transfer. Subsequently, the heat is efficiently conducted from the VC heat spreader to the fins and channel walls of the upper microchannel layer.

[0069] In this embodiment, a ventilation opening is provided on the side of the MEMS heat dissipation chip 10, and a dustproof mesh is provided at the ventilation opening of the MEMS heat dissipation chip 10.

[0070] The working principle of the MEMS heat dissipation device for mobile devices of this invention is as follows: The MEMS heat dissipation chip 10 at the air intake end draws in cool air from the external environment through the air intake of the electronic device's casing. The air is forced to flow through a microchannel heat sink 20 filled with hot fins. Forced convection heat exchange occurs between the air and the high-temperature fins, efficiently removing heat. The heated air reaches the other end of the microchannel heat sink 20. The MEMS heat dissipation chip 10 at the exhaust end extracts this hot air and discharges it to the outside of the device through the exhaust port of the device casing, thus achieving external air circulation and heat dissipation. Through continuous external air circulation, the heat generated by the SoC is continuously removed, effectively reducing the chip temperature and maintaining device performance. Furthermore, waterproof and breathable membranes are used as dust filters at both the airflow inlet and outlet, and the airflow direction can be changed through a push-pull working mode, thereby reversing the flow of dust from the air intake.

[0071] On the other hand, the present invention can also provide an electronic device, which includes a heat source, on which the above-described MEMS heat dissipation device is mounted.

[0072] The electronic device can be an electronic device with a circuit board and a heat source, an electronic device with a memory card slot for installing a memory card, or simply a single heat-generating element.

[0073] The specific structural design of the MEMS heat dissipation device is exactly the same as described above.

[0074] This invention's MEMS heat dissipation device combines a MEMS heat dissipation chip with extremely high back pressure (e.g., 1000 Pa level) and low power consumption (tens of milliwatts level) with a specially designed microchannel heat sink. The high back pressure capability of the MEMS overcomes the inherent high flow resistance of the microchannel, making it possible to achieve highly efficient forced convection heat transfer within a very small volume. This is difficult to achieve with traditional low-back-pressure micro fans, thus solving the problem of efficient heat dissipation under extremely limited space. It significantly improves the surface area-to-volume ratio of the heat dissipation structure, achieving heat dissipation performance far exceeding that of passive cooling or traditional micro fans in the same or smaller space.

[0075] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various variations can be made to the above embodiments of this utility model. All simple and equivalent changes and modifications made based on the claims and description of this utility model application fall within the protection scope of the claims of this utility model patent. Any aspects not described in detail in this utility model are conventional technical content.

Claims

1. A MEMS heat dissipation device, characterized in that, It includes a MEMS heat dissipation chip and a microchannel heat sink attached to the MEMS heat dissipation chip. The gas channels of the microchannel heat sink are in the micrometer range, and the heat dissipation surface of the microchannel heat sink is used to attach to the surface of the heat source.

2. The MEMS heat dissipating device of claim 1, wherein, The MEMS heat dissipation chip and the microchannel heat sink are stacked vertically, or one side of the microchannel heat sink is attached to the side of the MEMS heat dissipation chip.

3. The MEMS heat dissipating device of claim 1, wherein, It also includes two ventilation openings, one of which is located on the top surface, bottom surface, or side of the MEMS heat dissipation chip, and the other is located on the side of the microchannel heat sink; and one of the ventilation openings serves as an air inlet and the other as an air outlet.

4. The MEMS heat dissipating device of claim 3, wherein, The microchannel heat sink is equipped with a dustproof screen at the ventilation opening, or the MEMS heat sink chip is equipped with a dustproof screen at the ventilation opening.

5. The MEMS heat dissipating device of claim 1, wherein, The microchannel heat sink includes heat dissipation fins.

6. The MEMS heat dissipating device of claim 5, wherein, The heat dissipation fins are in the micrometer range in size; and / or The heat dissipation fins are disposed on the inner wall surface of the gas channel, and the length extension direction of the heat dissipation fins is consistent with the gas flow direction of the gas channel; and / or The heat dissipation fins are made of copper.

7. The MEMS heat dissipating device of claim 1, wherein, The microchannel heat sink has a highly thermally conductive material on its heat dissipation surface in contact with the heat source; and / or The microchannel heat sink is elongated in shape.

8. The MEMS heat dissipation device according to claim 1, characterized in that, The heat source is located on the circuit board or is a memory card in a slot; The number of MEMS heat dissipation chips and microchannel heat sinks is one set, and they are set on the same side of the circuit board or on one side of the memory card slot; or, the number of MEMS heat dissipation chips and microchannel heat sinks is two sets, and the two sets of MEMS heat dissipation chips and microchannel heat sinks are set on both sides of the circuit board or on both sides of the memory card slot. For a set of MEMS heat dissipation chips and microchannel heat sinks, the number of microchannel heat sinks is 1, and the number of MEMS heat dissipation chips is 1 or 2.

9. The MEMS heat dissipating device of claim 1, wherein, The heat source is disposed on the circuit board; the MEMS heat dissipation chip is fixed on the circuit board by padding material; or the MEMS heat dissipation chip is fixed on one of the heat sources and fixed on the circuit board by the heat source.

10. An electronic device, characterized in that, It includes a heat source, on which a MEMS heat dissipation device according to any one of claims 1-9 is mounted.

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