Negative pressure tab platform and bonding apparatus

Abstract

The utility model provides a kind of negative pressure tab platform and bonding equipment, it is related to chip packaging technical field.Negative pressure tab platform includes platform body and sealing element;Platform body has opposite first surface and second surface, first surface is provided with multiple negative pressure grooves, the inner wall of multiple negative pressure grooves is all provided with through-hole, the end of through-hole away from negative pressure groove is used to connect vacuum pump, second surface is provided with multiple groups of adsorption holes, every group of adsorption holes corresponds with a negative pressure groove, and it is communicated with corresponding negative pressure groove;Sealing element is set to first surface, and multiple negative pressure grooves are sealed respectively.Put product after bonding to the adsorption hole on second surface, above-mentioned negative pressure tab platform can attract product, it is favorable that product falls off from the adsorption tool in bonding equipment, to improve the problem that it cannot be normally discharged after bonding, improve production line capacity, it is favorable for automation production.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a negative pressure bonding platform and bonding equipment. Background Technology

[0002] After the Micro-LED (Micro light emitting diode) bonding process is completed, there may be situations where products adsorbed on the adsorption tool cannot be properly placed into the unloading carrier, requiring manual unloading, which is inconvenient and not conducive to automated production. Utility Model Content

[0003] In order to solve the problems existing in the prior art, the purpose of this utility model is to provide a negative pressure bonding platform.

[0004] This utility model provides the following technical solution:

[0005] A negative pressure contact platform includes a platform body and a sealing element;

[0006] The platform body has a first surface and a second surface facing away from each other. The first surface is provided with a plurality of negative pressure grooves. The inner wall of each of the plurality of negative pressure grooves is provided with a through hole. The end of the through hole away from the negative pressure groove is used to connect to a vacuum pump. The second surface is provided with a plurality of sets of adsorption holes. Each set of adsorption holes corresponds to one of the negative pressure grooves and is connected to the corresponding negative pressure groove.

[0007] The sealing element is disposed on the first surface and seals the plurality of negative pressure grooves respectively.

[0008] As a further optional solution for the negative pressure contact platform, the negative pressure groove extends along a first direction, and a plurality of the negative pressure grooves are arranged along a second direction;

[0009] Each group of adsorption pores includes at least two adsorption pores, and the at least two adsorption pores are arranged along the first direction;

[0010] The first direction and the second direction are perpendicular to each other and are both parallel to the first surface.

[0011] As a further alternative to the negative pressure contact platform, the pore size of each set of adsorption pores gradually decreases along the first direction.

[0012] As a further optional solution for the negative pressure contact platform, at least a portion of the adsorption holes are provided with a sealing element, which is detachably connected to the hole wall of the adsorption hole.

[0013] As a further optional solution for the negative pressure contact platform, the adsorption hole is a threaded hole, and the sealing component is a screw adapted to the threaded hole.

[0014] As a further optional solution for the negative pressure contact platform, the sealing element is provided with a plurality of sealing grooves on the side facing the negative pressure groove, each sealing groove corresponding to one of the negative pressure grooves and arranged around the corresponding negative pressure groove, and a sealing ring is embedded in the sealing groove.

[0015] As a further optional solution for the negative pressure contact platform, the first surface is provided with a positioning groove, a plurality of negative pressure grooves are provided at the bottom of the positioning groove, and the sealing element is embedded in the positioning groove.

[0016] As a further optional solution for the negative pressure contact platform, the second surface is provided with a contact groove, and a plurality of adsorption holes are provided at the bottom of the contact groove.

[0017] Another objective of this invention is to provide a bonding device.

[0018] This utility model provides the following technical solution:

[0019] A bonding device includes multiple vacuum pumps, multiple valves, and the aforementioned negative pressure bonding platform. The vacuum pumps, valves, and negative pressure grooves are in one-to-one correspondence, and the vacuum pumps are connected to the corresponding negative pressure grooves through the corresponding valves.

[0020] As a further optional feature of the bonding device, the valve is an electromagnetic pneumatic valve;

[0021] The bonding device also includes a DC power supply and a relay, wherein the DC power supply is electrically connected to the electromagnetic pneumatic valve through the relay.

[0022] The embodiments of this utility model have the following beneficial effects:

[0023] In the aforementioned negative pressure bonding platform, the first surface of the platform body is provided with multiple negative pressure grooves. Sealing elements on the first surface seal these grooves, forming multiple independent chambers, thus enabling independent operation of multiple negative pressure channels. When the vacuum pump connected to the end of the through-hole furthest from the negative pressure groove is started, the gas in the negative pressure groove is drawn away through the through-hole. The adsorption holes connected to the negative pressure groove are also under negative pressure, capable of adsorbing objects covering the adsorption holes. Furthermore, due to the independent operation of multiple negative pressure channels, the adsorption force generated at the adsorption holes is stronger. Based on this, when the bonded product is placed at the adsorption holes on the second surface, the negative pressure bonding platform can adsorb the product, facilitating its detachment from the adsorption tools in the bonding equipment. This improves the problem of improper unloading after bonding, increases production line capacity, and promotes automated production.

[0024] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This diagram shows an overall structural schematic of a negative pressure bonding platform provided in an embodiment of the present invention.

[0027] Figure 2 This diagram illustrates the structure of the lower surface of the platform body in a negative pressure bonding platform provided in an embodiment of the present invention.

[0028] Figure 3 This diagram illustrates the structure of the upper surface of the platform body in a negative pressure bonding platform provided by an embodiment of the present invention.

[0029] Figure 4 This diagram illustrates the structure of the lower surface of a seal in a negative pressure contact plate platform according to an embodiment of the present invention.

[0030] Figure 5 This diagram illustrates the structure of the upper surface of a seal in a negative pressure contact plate platform according to an embodiment of the present invention.

[0031] Figure 6 A schematic diagram of a bonding device provided in an embodiment of the present invention is shown.

[0032] Explanation of key component symbols:

[0033] 10-Negative pressure receiving plate platform; 20-Vacuum pump; 30-Valve; 40-DC power supply; 50-Relay; 60-Power controller; 70-Connecting board; 80-Remote controller; 90-Remote control indicator light; 100-Platform body; 110-First surface; 120-Second surface; 130-Negative pressure groove; 140-Through hole; 150-Adsorption hole; 160-First mounting hole; 170-Receiving plate groove; 180-Positioning groove; 200-Seal; 210-Second mounting hole; 220-Sealing groove; Y-First direction; X-Second direction. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0039] The Micro-LED bonding process is similar to the conventional bonding process. It mainly involves using bonding equipment to adjust the pressure, time, and temperature to form a gold-indium or gold-tin bond between the pads of the driver chip and the LED chip, thereby achieving the bonding connection between the driver chip and the LED chip.

[0040] The inventors of this application have discovered that the presence of adhesive foreign matter on the surface of the bonded driver chip or LED chip may cause the driver chip or LED chip to adhere to the adsorption tool, which in turn prevents the product adsorbed on the adsorption tool from being properly placed into the unloading carrier, requiring manual unloading, which is inconvenient and not conducive to automated production.

[0041] To address the aforementioned issues, this embodiment provides a negative pressure bonding platform 10. Please refer to... Figure 1 The negative pressure contact platform 10 includes a platform body 100 and a sealing element 200.

[0042] The platform body 100 has a first surface 110 and a second surface 120 facing away from each other. The first surface 110 is provided with a plurality of negative pressure grooves 130, and the inner wall of each negative pressure groove 130 is provided with a through hole 140. The end of the through hole 140 away from the negative pressure groove 130 is used to connect to a vacuum pump 20 (see...). Figure 6 The second surface 120 is provided with multiple sets of adsorption holes 150, each set of adsorption holes 150 corresponding to a negative pressure groove 130 and connected to the corresponding negative pressure groove 130.

[0043] Accordingly, the seal 200 is disposed on the first surface 110 and seals the plurality of negative pressure grooves 130 respectively.

[0044] In the aforementioned negative pressure bonding platform 10, the first surface 110 of the platform body 100 is provided with multiple negative pressure grooves 130. Sealing elements 200 on the first surface 110 seal the multiple negative pressure grooves 130, forming multiple independent chambers, thereby enabling independent operation of multiple negative pressure channels. When the vacuum pump 20 connected to the end of the through hole 140 away from the negative pressure groove 130 is started, the gas in the negative pressure groove 130 is drawn away by the vacuum pump 20 through the through hole 140. The adsorption hole 150, which communicates with the negative pressure groove 130, is also in a negative pressure state, capable of adsorbing objects covering the adsorption hole 150. Furthermore, due to the independent operation of multiple negative pressure channels, the adsorption force generated at the adsorption hole 150 is stronger. Based on this, when the bonded product is placed at the adsorption hole 150 on the second surface 120, the aforementioned negative pressure bonding platform 10 can adsorb the product, facilitating its detachment from the adsorption tool in the bonding equipment. This improves the problem of improper unloading after bonding, increases production line capacity, and promotes automated production.

[0045] For example, the platform body 100 is horizontally disposed, and the first surface 110 and the second surface 120 are two surfaces of the platform body 100 along the thickness direction. The first surface 110 is the lower surface of the platform body 100, the second surface 120 is the upper surface of the platform body 100, and the second surface 120 serves as the bearing surface for carrying the product.

[0046] Please combine Figure 2Furthermore, the first surface 110 is also provided with a plurality of first mounting holes 160. The plurality of first mounting holes 160 are evenly distributed on the first surface 110, avoiding each negative pressure groove 130. Correspondingly, the seal 200 is provided with a plurality of second mounting holes 210 (see...). Figure 4 The first mounting hole 160 and the second mounting hole 210 correspond one-to-one and are aligned with each other.

[0047] During assembly, the bolt shank passes through the second mounting hole 210 and engages with the threaded first mounting hole 160, so that the head of the bolt presses against the seal 200, thereby fixing the seal 200 to the lower surface of the platform body 100.

[0048] Please see Figure 2 In some embodiments, the negative pressure groove 130 extends along the first direction Y, and a plurality of negative pressure grooves 130 are arranged along the second direction X.

[0049] Each set of adsorption pores 150 includes at least two adsorption pores 150, and the at least two adsorption pores 150 are arranged along the first direction Y.

[0050] The first direction Y and the second direction X are perpendicular and both are parallel to the first surface 110.

[0051] In other words, along the first direction Y, each adsorption hole 150 located in the same column is connected to the same negative pressure tank 130 and is under negative pressure. In use, each adsorption hole 150 adsorbs one product.

[0052] For example, the through hole 140 is provided on one end face of the inner wall of the negative pressure groove 130 along the first direction Y, and the axis of the through hole 140 is parallel to the first direction Y. The end of the through hole 140 away from the negative pressure groove 130 extends to the side of the platform body 100 and is then connected to the vacuum pump 20.

[0053] For example, there are four negative pressure grooves 130, and each group of adsorption holes 150 includes five adsorption holes 150.

[0054] For example, the platform body 100 is square in shape. A first direction Y is parallel to one side of the platform body 100, and a second direction X is parallel to another side adjacent to that side.

[0055] Furthermore, the pore size of each adsorption pore 150 gradually decreases along the first direction Y.

[0056] Taking the diagram as an example, the adsorption pores 150 are divided into five rows from top to bottom. The first row of adsorption pores 150 has the largest pore size, the second row has the next largest pore size, and so on, with the fifth row having the smallest pore size.

[0057] During material feeding, the bonded product is first placed at the first row of adsorption holes 150. At this time, except for the first row of adsorption holes 150, the other adsorption holes 150 are not covered, resulting in gas leakage. That is, gas from the external environment can enter the negative pressure tank 130 through the other adsorption holes 150, causing the pressure difference inside and outside the negative pressure tank 130 to be relatively low. However, since the first row of adsorption holes 150 has the largest pore size, i.e., the largest adsorption area, the product is still subjected to a sufficiently large adsorption force, thus ensuring that the product detaches from the adsorption tool in the bonding equipment.

[0058] Then, place the bonded product at the second row of adsorption holes 150, and so on.

[0059] When the product is placed at the fifth row of adsorption holes 150, all adsorption holes 150 connected to the same negative pressure tank 130 are covered by the product, there is no gas leakage in the negative pressure tank 130, and the pressure difference inside and outside the negative pressure tank 130 reaches its maximum. Therefore, even if the pore size of the fifth row of adsorption holes 150 is the smallest, the product can still be subjected to a sufficiently large adsorption force to ensure that the product is detached from the adsorption tool in the bonding equipment.

[0060] Furthermore, at least a portion of the adsorption holes 150 are provided with a sealing element (not shown in the figure), and the sealing element is detachably connected to the hole wall of the adsorption hole 150.

[0061] When the adsorption capacity of the adsorption hole 150 is sufficient, the user can remove the sealing element from the corresponding adsorption hole 150 to adsorb the maximum amount of product. When the adsorption capacity of the adsorption hole 150 is insufficient, the user can use the sealing element to seal a portion of the adsorption holes 150 connected to the same negative pressure tank 130, reducing gas leakage in the negative pressure tank 130, thereby increasing the pressure difference inside and outside the negative pressure tank 130 and improving the adsorption capacity of other adsorption holes 150 connected to the negative pressure tank 130 that are not sealed.

[0062] In this embodiment, the adsorption hole 150 is a threaded hole, and the sealing component is a screw that is compatible with the threaded hole.

[0063] Understandably, machining threaded holes on the second surface 120 of the platform body 100 is relatively easy. At the same time, screws are readily available as sealing components.

[0064] In another embodiment of this application, the sealing element may also be a rubber plug or the like, which is interference-fitted with the wall of the adsorption hole 150, thereby achieving a detachable connection between the sealing element and the wall of the adsorption hole 150.

[0065] Please refer to the following: Figure 1 and Figure 3 In some embodiments, the second surface 120 is provided with a receiving groove 170, and multiple sets of adsorption holes 150 are provided at the bottom of the receiving groove 170.

[0066] In use, the bottom of the splice slot 170 serves as the bearing surface for the product, while the side wall of the splice slot 170 can limit the product placed in the splice slot 170, making it difficult for the product to slide out of the splice slot 170.

[0067] For example, the depth of the splice groove 170 is 1 mm, and the thickness of the product is typically 300-700 μm.

[0068] Please refer to the following: Figure 1 and Figure 2 In some embodiments, the first surface 110 is provided with a positioning groove 180, a plurality of negative pressure grooves 130 are provided at the bottom of the positioning groove 180, and the sealing member 200 is embedded in the positioning groove 180.

[0069] In addition, multiple first mounting holes 160 are also provided at the bottom of the positioning groove 180.

[0070] When assembling the negative pressure contact plate platform 10, the sealing element 200 is placed in the positioning groove 180. The positioning groove 180 is used to position the sealing element 200, which helps to quickly align the second mounting hole 210 on the sealing element 200 with the first mounting hole 160 on the platform body 100, thereby facilitating the fixing of the sealing element 200.

[0071] For example, the positioning groove 180 has a depth of 4 mm and the seal 200 has a thickness of 3 mm.

[0072] Please refer to the following: Figure 4 and Figure 5 Furthermore, the sealing element 200 has a plurality of sealing grooves 220 on the side facing the negative pressure groove 130. Each sealing groove 220 corresponds to a negative pressure groove 130 and is arranged around the corresponding negative pressure groove 130. A sealing ring (not shown in the figure) is embedded in the sealing groove 220.

[0073] Understandably, the sealing rings enhance the sealing performance between the seal 200 and the platform body 100, specifically by enhancing the sealing performance between the surface of the seal 200 and the bottom of the positioning groove 180. Since the sealing groove 220 surrounds the corresponding negative pressure groove 130, each sealing ring can further isolate the corresponding negative pressure groove 130, better enabling independent operation of multiple negative pressure channels.

[0074] In summary, in the aforementioned negative pressure bonding platform 10, the first surface 110 of the platform body 100 is provided with multiple negative pressure grooves 130. Sealing elements 200 on the first surface 110 seal the multiple negative pressure grooves 130, forming multiple independent chambers, thereby achieving independent operation of multiple negative pressure channels. When the vacuum pump 20 starts, the gas in the negative pressure grooves 130 is drawn away by the vacuum pump 20 through the through holes 140. The adsorption holes 150, which are connected to the negative pressure grooves 130, are also in a negative pressure state, capable of adsorbing objects covering the adsorption holes 150. Furthermore, due to the independent operation of multiple negative pressure channels, the adsorption force generated at the adsorption holes 150 is stronger. Based on this, when the bonded product is placed at the adsorption hole 150, the aforementioned negative pressure bonding platform 10 can adsorb the product, facilitating its detachment from the adsorption tool in the bonding equipment. This improves the problem of improper unloading after bonding, increases production line capacity, and is beneficial for automated production.

[0075] Please see Figure 6 This embodiment also provides a bonding device, including multiple vacuum pumps 20, multiple valves 30, and the aforementioned negative pressure bonding platform 10.

[0076] The vacuum pump 20, valve 30 and negative pressure tank 130 are in one-to-one correspondence, and the vacuum pump 20 is connected to the corresponding negative pressure tank 130 through the corresponding valve 30.

[0077] Specifically, the vacuum pump 20 is connected to the wall of the through hole 140 away from the negative pressure groove 130 via an air pipe, and thus connected to the corresponding negative pressure groove 130. The valve 30 is installed on the air pipe and located between the vacuum pump 20 and the negative pressure receiving plate platform 10.

[0078] During use, the vacuum pump 20 runs continuously. By controlling the opening and closing of the valve 30, the user can control whether the corresponding negative pressure tank 130 is in a negative pressure state, thereby controlling the corresponding adsorption hole 150 to adsorb or release the product.

[0079] In some embodiments, valve 30 is an electromagnetic pneumatic valve.

[0080] Accordingly, the bonding device also includes a DC power supply 40 and a relay 50, and the DC power supply 40 is electrically connected to the solenoid pneumatic valve through the relay 50.

[0081] The statement that the DC power supply 40 is electrically connected to the electromagnetic pneumatic valve through the relay 50 means that the positive terminal of the DC power supply 40 is electrically connected to one pole of the electromagnetic pneumatic valve through the relay 50, and the other pole of the electromagnetic pneumatic valve is directly electrically connected to the negative terminal of the DC power supply 40.

[0082] In use, the user controls the relay 50 to turn on or off, thereby controlling the opening and closing of the valve 30. During this process, the position of the valve core of the electromagnetic pneumatic valve changes, thus switching the air path.

[0083] Understandably, without the relay 50, the valve 30 can be controlled by turning the DC power supply 40 on and off. However, when controlling the DC power supply 40 to turn on or off, the signal processing time inside the DC power supply 40 is relatively long, which can easily lead to a delayed response from the valve 30.

[0084] In contrast, by keeping the DC power supply 40 on and controlling the opening and closing of the valve 30 by controlling the relay 50 to be on or off, the response time of the valve 30 can be shortened to be consistent with the response time of the relay 50, reaching the millisecond or even microsecond level, thereby effectively improving the response speed of the valve 30.

[0085] In this embodiment, the bonding device further includes a power controller 60, a terminal block 70, a remote controller 80, and a remote control indicator light 90.

[0086] The power controller 60 is connected to AC power via a terminal block 70, and is also electrically connected to the vacuum pump 20 and the DC power supply 40 via the terminal block 70. The power controller 60 is also wirelessly connected to the remote controller 80. The remote control indicator lights 90 are connected in parallel with each solenoid pneumatic valve, and are also electrically connected to the DC power supply 40 via relays 50.

[0087] In use, the user operates the remote control 80 to start the power controller 60, which then supplies power to the vacuum pump 20 and the DC power supply 40. The user further controls the relay 50 to close, which in turn supplies power to the solenoid pneumatic valve and the remote control indicator light 90 from the DC power supply 40.

[0088] Understandably, the remote control indicator light 90 is used to indicate the status of the solenoid pneumatic valve, and it is usually located on the control panel of the bonding equipment. Therefore, using a lower power remote control indicator light 90 and powering it with DC power supply 40 is safer.

[0089] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0090] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0091] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A negative pressure bonding platform, characterized in that, Including the platform body and seals; The platform body has a first surface and a second surface facing away from each other. The first surface is provided with a plurality of negative pressure grooves. The inner wall of each of the plurality of negative pressure grooves is provided with a through hole. The end of the through hole away from the negative pressure groove is used to connect to a vacuum pump. The second surface is provided with a plurality of sets of adsorption holes. Each set of adsorption holes corresponds to one of the negative pressure grooves and is connected to the corresponding negative pressure groove. The sealing element is disposed on the first surface and seals the plurality of negative pressure grooves respectively.

2. The negative pressure bonding platform according to claim 1, characterized in that, The negative pressure groove extends along a first direction, and a plurality of the negative pressure grooves are arranged along a second direction; Each group of adsorption pores includes at least two adsorption pores, and the at least two adsorption pores are arranged along the first direction; The first direction and the second direction are perpendicular to each other and are both parallel to the first surface.

3. The negative pressure bonding platform according to claim 2, characterized in that, The pore size of each group of adsorption pores gradually decreases along the first direction.

4. The negative pressure bonding platform according to claim 2, characterized in that, At least a portion of the adsorption pores are provided with a sealing element, which is detachably connected to the pore wall of the adsorption pore.

5. The negative pressure bonding platform according to claim 4, characterized in that, The adsorption hole is a threaded hole, and the sealing component is a screw that is adapted to the threaded hole.

6. The negative pressure bonding platform according to claim 1, characterized in that, The sealing element has multiple sealing grooves on the side facing the negative pressure groove. Each sealing groove corresponds to one of the negative pressure grooves and is arranged around the corresponding negative pressure groove. A sealing ring is embedded in the sealing groove.

7. The negative pressure bonding platform according to claim 1, characterized in that, The first surface is provided with a positioning groove, and a plurality of negative pressure grooves are provided at the bottom of the positioning groove, and the sealing element is embedded in the positioning groove.

8. The negative pressure bonding platform according to claim 1, characterized in that, The second surface is provided with a receiving groove, and multiple sets of adsorption holes are provided at the bottom of the receiving groove.

9. A bonding apparatus, characterized in that, It includes multiple vacuum pumps, multiple valves, and a negative pressure plate platform as described in any one of claims 1-8, wherein the vacuum pumps, valves, and negative pressure tanks are in one-to-one correspondence, and the vacuum pumps are connected to the corresponding negative pressure tanks through the corresponding valves.

10. The bonding apparatus according to claim 9, characterized in that, The valve is an electromagnetic pneumatic valve; The bonding device also includes a DC power supply and a relay, wherein the DC power supply is electrically connected to the electromagnetic pneumatic valve through the relay.

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