A BMS motherboard and BDU assembly, battery pack and power unit

Abstract

This utility model discloses a BMS mainboard and BDU assembly, a battery pack, and a power unit. The BMS mainboard and BDU assembly include a BDU housing containing BDU electrical components, a BMS mainboard located on one side of the BDU housing, and a cooling assembly located on the BDU housing away from the BMS mainboard. The BMS mainboard is fixed inside the BDU housing, and the cooling assembly is in contact with the battery pack's liquid cooling system to reduce the temperature inside the BDU housing. This utility model integrates the BMS mainboard within the BDU housing and positions the cooling assembly on the side of the BDU housing away from the BMS mainboard, thus reducing the space occupied by the BDU and BMS within the battery pack, increasing the energy density of the battery pack. Furthermore, by reducing the temperature of the BMS mainboard and BDU assembly through the cooling assembly, the risk of BDU relay failure due to exceeding the temperature limit is reduced, improving the safety of the battery system under high-voltage environments.

Description

Technical Field

[0001] This utility model belongs to the field of power battery technology, specifically relating to a BMS motherboard and BDU assembly, as well as a battery pack and power unit. Background Technology

[0002] With the development of technology, automobiles have become a primary means of transportation. While bringing convenience, automobiles have also caused significant environmental pollution. Energy conservation and emission reduction are key to the sustainable development of the automotive industry, and electric vehicles, due to their energy-saving and environmentally friendly advantages, have become an important component of this sustainable development. For electric vehicles, battery technology is a crucial factor in their development.

[0003] The Battery Management System (BMS) is a system that manages the battery. It typically measures battery voltage and prevents or avoids abnormal conditions such as over-discharge, over-charge, and over-temperature. The Battery Disconnect Unit (BDU), also known as the battery distribution unit, integrates high-voltage devices and includes pre-charge and charge / discharge circuits. It has functions such as current and voltage detection and controls the connection and disconnection of the power battery circuit, providing overload and short-circuit protection. Both the BMS and BDU are usually located at the front of the battery pack. However, due to the current relative arrangement of the BMS and BDU, they occupy a significant amount of space within the battery pack, affecting the energy density. Furthermore, the structure of the BDU casing limits its ability to fully utilize the space between the battery module and the high-voltage connector, resulting in low space utilization within the battery pack and further hindering energy density improvement.

[0004] Utility model patent application number CN202223355406.0 provides an integrated structure of BMS motherboard and BDU and a battery pack. This utility model's integrated structure includes a lower BDU housing located between the front panel and the battery module in the lower housing of the battery pack, and BDU electrical components and the BMS motherboard housed within the lower BDU housing. The lower BDU housing has a front sidewall facing the front panel and a rear sidewall facing the battery module. The front sidewall has a first clearance portion to avoid protruding mounting portions on the front panel, and the rear sidewall has a second clearance portion to avoid external conductive bars. However, this solution does not consider BMS and BDU cooling. Under high-current charging / discharging conditions, the BDU relay temperature exceeding the upper limit poses a risk of malfunction, thus affecting the high-voltage safety of the battery system. Utility Model Content

[0005] The purpose of this invention is to provide a BMS mainboard, BDU assembly, battery pack, and power unit. The BMS mainboard is integrated into the BDU housing, and the cooling component is located on the side of the BDU housing away from the BMS mainboard. This reduces the space occupied by the BDU and BMS within the battery pack, increases the energy density of the battery pack, and lowers the temperature of the BMS mainboard and BDU assembly by setting the cooling component. This reduces the risk of BDU relay failure due to exceeding the temperature limit, and improves the safety of the battery system under high-voltage environments.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: Firstly, a BMS motherboard and BDU assembly is proposed, including a BDU housing with BDU electrical components inside, a BMS motherboard disposed on one side of the BDU housing, and a cooling component disposed on the BDU housing away from the BMS motherboard; the BMS motherboard is fixed inside the BDU housing, and the cooling component is in contact with the battery pack liquid cooling system to reduce the temperature inside the BDU housing.

[0007] In this embodiment, the BDU electrical device includes a heating element, which is fixed to the side of the BDU housing away from the BMS motherboard.

[0008] In this embodiment of the application, a busbar is provided inside the BDU housing. One end of the busbar is connected to the interface of the BDU housing, and the other end of the busbar is detachably connected to the heating device.

[0009] In this embodiment of the application, the BMS motherboard and BDU assembly further include a nickel plate, one end of which is connected to the BMS motherboard and the other end of which is connected to the bus.

[0010] In this embodiment of the application, the BDU housing is provided with a connector, and the pins of the connector are soldered to the BMS motherboard.

[0011] In this embodiment, the cooling component includes a thermal pad, one end of which is connected to the BDU housing and the other end of which abuts against the battery pack liquid cooling system.

[0012] In this embodiment of the application, the bottom of the BDU housing is provided with heat dissipation holes, and the cooling assembly further includes an insulating sheet, one end of which abuts against one end of the thermal pad and the other end of which abuts against the BDU housing.

[0013] In this embodiment, the size of the heat dissipation hole is equal to the size of the heat-generating device.

[0014] Secondly, a battery pack is proposed, the battery pack comprising the BMS motherboard and BDU assembly described in the first aspect.

[0015] Thirdly, a power unit is proposed, the power unit comprising the battery pack described in the second aspect.

[0016] The beneficial effects of this utility model are as follows:

[0017] 1. The present invention proposes a BMS mainboard and BDU assembly, a battery pack and a power unit, which integrates the BMS mainboard into the BDU housing, and sets the cooling component on the side of the BDU housing away from the BMS mainboard. This reduces the space occupied by the BDU and BMS in the battery pack, increases the energy density of the battery pack, and reduces the temperature of the BMS mainboard and BDU assembly by setting the cooling component, thereby reducing the risk of BDU relay failure due to exceeding the temperature limit and improving the safety of the battery system under high voltage environment.

[0018] 2. The present invention proposes a BMS motherboard, BDU assembly, battery pack and power unit, wherein the heat-generating device is arranged on the side of the BDU housing away from the BMS motherboard, thereby preventing the failure rate of the BMS from increasing due to excessive temperature.

[0019] 3. The BMS motherboard, BDU assembly, battery pack, and power unit proposed in this utility model dissipate heat for heat-generating devices through the high thermal conductivity of the thermal pad, thereby providing a good working environment for the heat-generating devices, extending the service life of the heat-generating devices, and improving the performance of the heat-generating devices.

[0020] 4. The present invention proposes a BMS motherboard and BDU assembly, a battery pack and a power unit. The bottom of the BDU housing is provided with heat dissipation holes, and the heat-generating device is inserted into the heat dissipation holes so that the heat-generating device is exposed. The electrical insulation protection of the bottom of the BMS motherboard and BDU assembly is achieved by setting an insulating pad.

[0021] 5. The present invention proposes a BMS motherboard and BDU assembly, a battery pack and a power unit, wherein the size of the heat dissipation hole is equal to the size of the heat-generating device, so as to expand the heat dissipation area of ​​the heat-generating device and improve the heat dissipation effect. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention. In these drawings, similar reference numerals are used to denote similar elements. The drawings described below are some embodiments of the present invention, but not all embodiments. Other drawings will be readily available to those skilled in the art based on these drawings without any inventive effort.

[0023] Figure 1 This is a schematic diagram of a BMS motherboard and BDU assembly according to an embodiment of the present utility model;

[0024] Figure 2 This is a schematic diagram of the electrical components of a BMS motherboard and BDU assembly according to an embodiment of the present invention.

[0025] Figure 3 This is a top view of the electrical component arrangement of a BMS motherboard and BDU assembly according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the BMS motherboard layout of a BMS motherboard and BDU assembly according to an embodiment of the present utility model;

[0027] Figure 5 This is a schematic diagram of the bottom of the BDU housing of a BMS motherboard and BDU assembly according to an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of a cooling component for a BMS motherboard and BDU assembly according to an embodiment of the present invention.

[0029] In the diagram: 1. BDU electrical components; 2. BDU housing; 21. Heat dissipation hole; 22. Busbar; 3. BMS mainboard; 4. Cooling assembly; 41. Thermal pad; 42. Insulating sheet; 5. Nickel sheet; 6. Main positive relay; 7. Main negative relay; 8. Fast charging relay; 9. Main fuse; 10. Pre-charge relay; 11. Pre-charge resistor; 12. Connector. Detailed Implementation

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model and the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort. Furthermore, the design orientation only indicates the relative positional relationship between the components, not the absolute positional relationship.

[0031] In the first aspect, this utility model embodiment provides a BMS motherboard 3 and a BDU assembly, please refer to... Figure 1 , Figure 2 , Figure 3 , Figure 4 It mainly includes the BDU housing 2, the BMS motherboard 3, and the cooling components 4.

[0032] In this embodiment, the BMS mainboard 3 and BDU assembly include a BDU housing 2, a BMS mainboard 3, and a cooling assembly 4. The BDU housing 2 contains BDU electrical components 1. The BMS mainboard 3 is located on one side of the BDU housing 2, and the cooling assembly 4 is located on the side of the BDU housing 2 away from the BMS mainboard 3. The BMS mainboard 3 is fixed inside the BDU housing 2. The cooling assembly 4 is in contact with the battery pack liquid cooling system to reduce the temperature inside the BDU housing 2. The battery pack liquid cooling system includes coolant, a water pump, a cooling plate, and a piping system. The coolant is an aqueous solution of ethylene glycol. The cooling plate is a thin plate or pipe structure made of aluminum. The cooling plate is in contact with the BDU assembly. The piping system includes an inlet pipe and a return pipe. The water pump delivers the coolant to the cooling plate through the inlet pipe and then discharges it through the return pipe. In this application, the BMS mainboard 3 is integrated into the BDU housing 2, and the cooling component 4 is located on the side of the BDU housing 2 away from the BMS mainboard 3. This reduces the space occupied by the BDU and BMS in the battery pack, increases the energy density of the battery pack, and reduces the temperature of the BMS mainboard 3 and the BDU assembly by setting the cooling component 4. This reduces the risk of BDU relay failure due to exceeding the temperature limit, and improves the safety of the battery system under high voltage environment.

[0033] In one possible implementation, the BDU electrical component 1 includes a heating element, a pre-charge relay 10, and a pre-charge resistor 11. The heating component includes a main positive relay 6, a main negative relay 7, a fast-charge relay 8, and a main fuse 9. The heating element is arranged on the side of the BDU housing 2 away from the BMS mainboard 3, thereby preventing the failure rate of the BMS from increasing due to excessive temperature.

[0034] Specifically, a busbar is also provided inside the BDU housing 2. The first end of the first busbar is connected to the B+ interface of the BDU housing 2. The second busbar is connected to the contact of the main fuse 9, and the contact of the main fuse 9 overlaps the first busbar. The second busbar is connected to the contact 1 of the main positive relay 6 and the contact 1 of the fast charging relay 8. The third busbar connects from the contact 2 of the fast charging relay 8 to the FC+ interface of the BDU housing 2. The fourth busbar connects from the contact 2 of the main positive relay 6 to the P+ interface of the BDU housing 2. The fifth busbar connects from the FC- and P- interfaces to the contact 1 of the main negative relay 7. The sixth busbar connects from the contact 2 of the main negative relay 7 to the B- interface. A current sensor is also fixed on the sixth busbar. The first end of the seventh busbar is connected to the main fuse 9, and the other end is connected to the main positive relay 6. The precharge relay 10 and the precharge resistor 11 are connected to the BMS main board 3 through their pins, thereby realizing the connection of the precharge high voltage circuit. The main positive relay 6, the main negative relay 7, and the fast charge relay 8 are fixed to the BMS main board 3 by soldering their pins.

[0035] Furthermore, the BMS motherboard 3 and BDU assembly also include a nickel plate 5. One end of the nickel plate 5 is connected to the BMS motherboard 3, and the other end is soldered to the busbar. The nickel plate 5 enables the BMS motherboard 3 and BDU assembly to be designed without wires, thereby avoiding the occurrence of wire tangles.

[0036] Preferably, the BDU housing 2 is made of insulating material.

[0037] In one possible implementation, the BMS mainboard 3 is provided with a connector 12, the tail of which is a pin. The pin is soldered onto the BMS mainboard 3 to communicate with the vehicle and input power (12V). The connector 12 is a low-voltage communication connector for the vehicle. Compared with the existing method of arranging the connector on the front panel of the battery pack through a wiring harness, this solution can eliminate the need for an adapter wiring harness and reduce costs.

[0038] In one embodiment, the cooling component 4 includes a thermal pad 41, one end of which is connected to the BDU housing 2 and the other end is in contact with the battery pack liquid cooling system. The high thermal conductivity of the thermal pad 41 is used to dissipate heat from the heat-generating device, thereby providing a good working environment for the heat-generating device, extending the service life of the heat-generating device and improving its performance.

[0039] Furthermore, the bottom of the BDU housing 2 is provided with heat dissipation holes 21, and the heat-generating devices are arranged on the heat dissipation holes 21 so that the heat-generating devices are exposed. The cooling assembly 4 also includes an insulating sheet 42, one end of which abuts against one end of the thermal pad 41, and the other end abuts against the BDU housing 2. By setting the insulating pad, electrical insulation protection between the BMS motherboard 3 and the bottom of the BDU assembly is achieved.

[0040] Preferably, the size of the heat dissipation hole 21 is equal to the size of the heat-generating device, so as to increase the heat dissipation area of ​​the heat-generating device and improve the heat dissipation effect.

[0041] Secondly, this utility model embodiment provides a battery pack, which includes the BMS motherboard 3 and BDU assembly described in the first aspect.

[0042] Thirdly, this utility model embodiment provides a power device, which includes the battery pack described in the second aspect.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0044] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific embodiments of the present invention are limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A BMS main board and BDU assembly, characterized in that, The device includes a BDU housing (2) with BDU electrical components (1) inside, a BMS main board (3) located on one side of the BDU housing (2), and a cooling assembly (4) located on the BDU housing (2) away from the BMS main board (3); the BMS main board (3) is fixed inside the BDU housing (2), and the cooling assembly (4) is in contact with the battery pack liquid cooling system to reduce the temperature inside the BDU housing (2).

2. A BMS master board and BDU assembly according to claim 1, wherein, The BDU electrical device (1) includes a heating element, which is fixed to the side of the BDU housing (2) away from the BMS motherboard (3).

3. A BMS master board and BDU assembly according to claim 2, wherein, The BDU housing (2) is provided with a busbar (22), one end of which is connected to the interface of the BDU housing (2), and the other end of which is detachably connected to the heating device.

4. The BMS master board and BDU assembly of claim 3, wherein, The BMS motherboard and BDU assembly also include a nickel plate (5), one end of which is connected to the BMS motherboard (3) and the other end is connected to the bus (22).

5. The BMS master board and BDU assembly of claim 3, wherein, The BDU housing (2) is provided with a connector (12), and the pins of the connector (12) are soldered to the BMS motherboard (3).

6. The BMS motherboard and BDU assembly according to claim 2, characterized in that, The cooling component (4) includes a thermal pad (41), one end of which is connected to the BDU housing (2), and the other end is in contact with the battery pack liquid cooling system.

7. A BMS motherboard and BDU assembly according to claim 6, characterized in that, The bottom of the BDU housing (2) is provided with heat dissipation holes (21), and the cooling assembly (4) also includes an insulating sheet (42). One end of the insulating sheet (42) abuts against one end of the heat-conducting pad (41), and the other end abuts against the BDU housing (2).

8. The BMS motherboard and BDU assembly according to claim 7, characterized in that, The size of the heat dissipation hole (21) is equal to the size of the heat-generating device.

9. A battery pack, characterized in that, The battery pack includes the BMS motherboard and BDU assembly as described in any one of claims 1-8.

10. A power unit, characterized in that, The power unit includes the battery pack as described in claim 9.

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