A semiconductor chip packaging and feeding device with a buffer structure

Abstract

This utility model discloses a semiconductor chip packaging and feeding device with a buffer structure, including a conveying base plate and mounting brackets set at the four corners of the bottom of the conveying base plate. The semiconductor chip packaging and feeding device is placed on the ground by multiple mounting brackets. A conveying side plate A is set at the top right end of the conveying base plate, and a conveying side plate B is set at the top left end of the conveying base plate. By adding an electrostatic elimination and dust removal device in front of the buffer feeding mechanism, an ion air bar generates positive and negative ions by ionizing the air through a high-voltage generator. Under the action of electric field force and airflow from a cylindrical blower, the static electricity on the chip surface is quickly neutralized, preventing static electricity from attracting dust and damaging the chip. At the same time, the ions charge the dust, which is then discharged through the dustproof net under the push of the airflow. The rectangular hollow box, combined with the U-shaped air outlet guide cover and the strip-shaped air outlet, makes the airflow evenly cover the chip, enhances the dust removal effect, provides a clean environment for chip packaging and feeding, and reduces the product defect rate.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a semiconductor chip packaging and feeding device with a buffer structure. Background Technology

[0002] As the integration and precision of semiconductor chips continue to increase, the reliability of the packaging and loading process directly impacts product yield. Currently, during the packaging and loading process, chips are prone to static electricity generation due to friction due to a lack of effective electrostatic discharge (ESD) elimination measures. This static electricity not only attracts dust from the air, causing chip surface contamination and reducing packaging quality, but more seriously, the instantaneous high voltage generated by electrostatic discharge (ESD) can break down the delicate internal circuitry of the chip, leading to irreversible damage. Meanwhile, although some devices have dust removal capabilities, they are insufficient to effectively remove micron- and nano-sized particulate contaminants commonly found in semiconductor manufacturing environments, and their dust removal efficiency falls far short of the cleanliness requirements for high-precision chip packaging. Utility Model Content

[0003] The purpose of this invention is to provide a semiconductor chip packaging and feeding device with a buffer structure to solve the problems mentioned in the background art, which are that as the integration and precision of semiconductor chips increase, packaging and feeding directly affects the product yield, and that chips are prone to attracting dust due to static electricity during transportation, and that electrostatic discharge may also damage the internal circuit.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor chip packaging and feeding device with a buffer structure, comprising a conveying base plate and mounting brackets disposed at the four corners of the bottom end of the conveying base plate. The semiconductor chip packaging and feeding device is placed on the ground by multiple mounting brackets. A conveying side plate A is disposed at the top right end of the conveying base plate, and a conveying side plate B is disposed at the top left end of the conveying base plate. A feeding conveyor belt is disposed between the conveying side plate A and the conveying side plate B, and the feeding conveyor belt is located above the conveying base plate. A cylinder fixing plate is fixed to the outer wall of the top of the center of the conveying side plate B. A feeding cylinder is fixed to the left end of the cylinder fixing plate by a flange and screws. The cylinder shaft is connected to the inside of the feeding cylinder by a cylinder plunger. A shaft hole is provided inside the center of the cylinder fixing plate, and the right end of the cylinder shaft passes through the shaft hole from left to right. A buffer feeding mechanism is provided at the right end of the cylinder shaft. An electrostatic elimination and dust removal device is connected to the front side of the top center of the conveying side plate A and the conveying side plate B, and the electrostatic elimination and dust removal device is located in front of the buffer feeding mechanism.

[0005] Preferably, the electrostatic elimination and dust removal device includes screw fixing plates, vertical supports, a rectangular hollow box, a cylindrical blower, a dustproof protective net, and a control box. Vertical supports are provided at the bottom of both ends of the rectangular hollow box. Screw fixing plates are welded to the bottom of each of the two vertical supports. Each screw fixing plate is fixed to the top of conveyor side plate A and conveyor side plate B respectively by multiple screws. The rectangular hollow box is positioned parallel to the center of the feeding conveyor belt, above and in front of it. A cylindrical blower is fixed to the center of the outer wall at the top of the rectangular hollow box via a flange and screws. A dustproof protective net is provided at the air inlet at the top of the cylindrical blower. The control box is fixed to the top left end of the rectangular hollow box.

[0006] Preferably, an air inlet is provided at the center of the top of the cuboid hollow box, the air outlet of the cylindrical blower is connected to the interior of the cuboid hollow box through the air inlet, and the cylindrical blower is electrically connected to an external power source through a control box.

[0007] Preferably, the electrostatic elimination and dust removal device further includes a U-shaped air outlet guide hood, a strip-shaped air outlet, and an ionizing air bar. A strip-shaped air outlet is horizontally arranged inside the center of the bottom end of the cuboid hollow box. A U-shaped air outlet guide hood is arranged outside the bottom opening of the strip-shaped air outlet. The U-shaped air outlet guide hood is fixed to the bottom outer wall of the cuboid hollow box. An ionizing air bar is horizontally fixed inside the cuboid hollow box. The ionizing air bar is electrically connected to the control box via an electric wire.

[0008] Preferably, chip ranging and positioning probes are provided on both the front and rear sides of the center of the cylinder fixing plate. Both chip ranging and positioning probes are fixed on the outer wall of the right end of the cylinder fixing plate, and the detection direction of the chip ranging and positioning probes is aligned with the top outer wall of the feeding conveyor belt and above it.

[0009] Preferably, the buffer feeding mechanism is composed of a chip contact push plate, a buffer airbag, and a feeding fixing plate. A connecting flange is provided at the right end of the cylinder shaft, and a feeding fixing plate is provided at the right end of the connecting flange. The feeding fixing plate is fixedly connected to the connecting flange by multiple screws. A buffer airbag is provided at the right end of the feeding fixing plate, and a chip contact push plate is provided at the right end of the buffer airbag.

[0010] Preferably, the cylinder shaft can drive the interconnected chip contact push plate, buffer airbag and feeding fixing plate to move left and right above the feeding conveyor belt, and the distance between the outer walls of the front and rear ends of the chip contact push plate and the feeding fixing plate is less than the distance between the two chip ranging and positioning probes.

[0011] Preferably, a downwardly recessed feeding conveying groove is provided at the center of the top of the conveying side plate A. The feeding conveying groove is located directly to the right of the chip contact push plate. A feeding conveying guide sleeve is fixed to the inner wall of the feeding conveying groove. The feeding conveying guide sleeve has an overall U-shaped structure with the opening facing upward. The inner wall of the bottom end of the feeding conveying guide sleeve is flush with the outer wall of the top end of the feeding conveyor belt.

[0012] Preferably, the right end of the feeding conveyor guide sleeve is connected to the semiconductor chip packaging processing station, the front end of the feeding conveyor belt is provided with an active drive roller, and multiple driven drive rollers are equidistantly arranged on the rear side of the active drive roller. The feeding conveyor motor is fixed at the front end of the conveyor side plate A and located on the outer wall of the right end. The motor shaft of the feeding conveyor motor is connected to the active drive roller through a coupling.

[0013] Compared with the prior art, the present invention provides a semiconductor chip packaging feeding device with a buffer structure, which has the following advantages:

[0014] This invention adds a novel electrostatic elimination and dust removal device in front of the buffer feeding mechanism. When the semiconductor chip to be packaged is conveyed to the right side of the buffer feeding mechanism via the feeding conveyor belt and pushed to the packaging processing station, the chip first passes through the electrostatic elimination and dust removal device. This device, based on the synergistic working principle of ion air bars and airflow, effectively ensures the cleanliness and safety of the semiconductor chip feeding process. The ion air bar ionizes the air at the discharge needle through an internal high-voltage generator, generating a large number of positive and negative ions. These ions, under the dual action of electric field force and airflow generated by the cylindrical blower, rapidly diffuse to the surface of the semiconductor chip, thus ensuring cleanliness and safety during the packaging process. During the loading and conveying process, static electricity generated by friction is quickly neutralized by oppositely polar ions released by the ion bar, preventing problems such as static electricity attracting dust, interfering with chip circuits, or causing component breakdown. At the same time, the ions combine with dust particles in the air to make them charged. The charged dust is driven by the airflow and discharged from the air inlet of the cylindrical blower after being filtered by the dustproof screen. The rectangular hollow box, combined with the U-shaped air outlet guide cover and strip-shaped air outlet design, ensures that the airflow evenly covers the chip surface, further improving the dust removal effect and ensuring that the chip surface is clean and free of contaminants. This provides a reliable clean environment for semiconductor chip packaging and loading, reducing the product defect rate caused by static electricity and dust. Attached Figure Description

[0015] Figure 1 This is a right-side perspective three-dimensional structural diagram of a semiconductor chip packaging and feeding device with a buffer structure according to the present invention.

[0016] Figure 2 This is a top view schematic diagram of a semiconductor chip packaging and feeding device with a buffer structure according to the present invention.

[0017] Figure 3 This is a three-dimensional structural diagram of the buffer feeding mechanism on the right side of the feeding cylinder of this utility model.

[0018] Figure 4 This is a schematic diagram of the external three-dimensional structure of the electrostatic elimination and dust removal device of this utility model.

[0019] Figure 5 This is a schematic diagram of the internal three-dimensional structure of the electrostatic elimination and dust removal device of this utility model.

[0020] In the diagram: 1. Mounting bracket; 2. Feeding conveyor motor; 3. Conveyor side plate A; 4. Conveyor base plate; 5. Feeding conveyor groove; 6. Feeding conveyor guide rail sleeve; 7. Feeding conveyor belt; 8. Conveyor side plate B; 9. Cylinder fixing plate; 10. Feeding cylinder; 11. Chip ranging and positioning probe; 12. Static electricity elimination and dust removal device; 13. Chip contact push plate; 14. Buffer airbag; 15. Cylinder shaft; 16. Feeding fixing plate; 17. Screw fixing plate; 18. Vertical bracket; 19. Rectangular hollow box; 20. Cylindrical blower; 21. Dustproof protective net; 22. Control box; 23. U-shaped air outlet guide cover; 24. Strip-shaped air outlet; 25. Ionizing air bar. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] This utility model provides, for example Figure 1-5The semiconductor chip packaging loading device with a buffer structure shown includes a conveying base plate 4 and mounting brackets 1 located at the four corners of the bottom of the conveying base plate 4. The semiconductor chip packaging loading device is placed on the ground by multiple mounting brackets 1. A conveying side plate A3 is provided at the top right end of the conveying base plate 4, and a conveying side plate B8 is provided at the top left end of the conveying base plate 4. A loading conveyor belt 7 is provided between the conveying side plate A3 and the conveying side plate B8, and the loading conveyor belt 7 is located above the conveying base plate 4. A cylinder is fixed to the outer wall of the top of the center of the conveying side plate B8. The left end of the fixed plate 9 and the cylinder fixing plate 9 is fixed with a feeding cylinder 10 by a flange and screws. The feeding cylinder 10 is connected to a cylinder shaft 15 through a cylinder plunger. The cylinder fixing plate 9 has a shaft hole in its center, and the right end of the cylinder shaft 15 passes through the shaft hole from left to right. A buffer feeding mechanism is provided at the right end of the cylinder shaft 15. The top center of the conveying side plate A3 has a downwardly recessed feeding conveying groove 5, which is located directly to the right of the chip contact push plate 13. The inner wall of the feeding conveying groove 5 is fixed with a feeding conveying guide sleeve 6. The entire assembly of sleeve 6 has an upward-opening U-shaped structure. The inner wall of the bottom end of the feeding conveyor guide sleeve 6 is flush with the outer wall of the top end of the feeding conveyor belt 7. The right end of the feeding conveyor guide sleeve 6 is connected to the semiconductor chip packaging processing station. An active drive roller is installed inside the front end of the feeding conveyor belt 7, and multiple driven drive rollers are equidistantly arranged behind the active drive roller. The feeding conveyor motor 2 is fixed at the front end of the conveyor side plate A3, located on the outer wall of the right end. The motor shaft of the feeding conveyor motor 2 is connected to the active drive roller through a coupling. This semiconductor chip packaging feeding device with a buffer structure is based on... The semiconductor chip is stably fed using the principle of mechanical transmission and buffer protection. The conveyor base plate 4 serves as the basic load-bearing structure and is firmly supported on the ground by the brackets 1 at the four corners. The conveyor side plate A3 and conveyor side plate B8 are installed on the top two sides of the conveyor base plate 4. The feeding conveyor belt 7 between the two is driven by the feeding conveyor motor 2. The motor shaft drives the active transmission roller to rotate, and then the belt drive enables multiple driven transmission rollers to work together to realize the cyclic rotation of the feeding conveyor belt 7, which smoothly transports the semiconductor chip to the designated position.

[0023] like Figure 1 , Figure 2 and Figure 3As shown, chip ranging and positioning probes 11 are provided on both the front and rear sides of the center of the cylinder fixing plate 9. Both chip ranging and positioning probes 11 are fixed to the outer wall of the right end of the cylinder fixing plate 9, and the detection direction of the chip ranging and positioning probes 11 is aligned with the top outer wall of the feeding conveyor belt 7 and above it. The buffer feeding mechanism is composed of a chip contact push plate 13, a buffer airbag 14, and a feeding fixing plate 16. A connecting flange is provided on the right end of the cylinder shaft 15, and a feeding fixing plate 16 is provided on the right end of the connecting flange. The feeding fixing plate 16 is fixedly connected to the connecting flange by multiple screws. A buffer airbag 14 is provided on the right end of the feeding fixing plate 16, and a chip contact push plate 13 is provided on the right end of the buffer airbag 14. The cylinder shaft 15 can drive the interconnected chip contact push plate 13, buffer airbag 14, and feeding fixing plate 16 to move left and right above the feeding conveyor belt 7. The distance between the outer walls of the front and rear ends of the loading fixing plate 16 is less than the distance between the two chip ranging and positioning probes 11. The loading cylinder 10 is fixed to the left end of the cylinder fixing plate 9 and is connected to the cylinder shaft 15 through the cylinder plunger to provide power for chip pushing. The buffer loading mechanism consists of the chip contact push plate 13, the buffer airbag 14 and the loading fixing plate 16. When the cylinder shaft 15 is driven to move left and right by the loading cylinder 10, it can drive the buffer loading mechanism to move synchronously. During the chip pushing process, the buffer airbag 14 plays a buffering role to avoid rigid collision between the chip contact push plate 13 and the chip, effectively protecting the chip from physical damage. In addition, the loading conveying groove 5 at the top of the conveying side plate A3 and the internal loading conveying guide sleeve 6 are flush with the top of the loading conveyor belt 7, providing guidance and limit for chip conveying, ensuring that the chip is accurately conveyed to the loading station along a fixed path.

[0024] like Figure 1 , Figure 2 and Figure 3As shown, when using this semiconductor chip packaging feeding device with a buffer structure, firstly, the power to the feeding conveyor motor 2 and the feeding cylinder 10 is turned on to start the equipment and make the feeding conveyor belt 7 start running. Then, the semiconductor chip to be packaged is placed at the starting end of the feeding conveyor belt 7. The chip moves forward with the conveyor belt. When the chip is transported to the right side of the buffer feeding mechanism, the chip ranging and positioning probes 11 on both sides of the center of the cylinder fixing plate 9 accurately detect the position, size and attitude information of the chip using the principle of laser or infrared sensing. The detection data is transmitted to the control terminal in real time. The system determines whether the chip has reached the appropriate position based on preset parameters. If the position is accurate, the loading cylinder 10 is activated. After the loading cylinder 10 is activated, the cylinder shaft 15 drives the chip contact push plate 13, the buffer airbag 14, and the loading fixing plate 16 to move to the left. The chip contact push plate 13 pushes the chip from the conveyor belt to the loading conveyor guide sleeve 6. The chip is then pushed along the guide sleeve to the semiconductor chip packaging processing station. After the push is completed, the loading cylinder 10 drives the cylinder shaft 15 to reset the buffer loading mechanism, waiting for the next loading command. The above process is repeated to achieve continuous automated chip loading.

[0025] like Figure 1 , Figure 4 and Figure 5 As shown, an electrostatic eliminator and dust removal device 12 is connected to the front side of the top center of the conveyor side plate A3 and the conveyor side plate B8. The electrostatic eliminator and dust removal device 12 is located in front of the buffer feeding mechanism. The electrostatic eliminator and dust removal device 12 includes a screw fixing plate 17, a vertical support 18, a rectangular hollow box 19, a cylindrical blower 20, a dustproof protective net 21, and a control box 22. Vertical supports 18 are provided at the bottom of both ends of the rectangular hollow box 19. Screw fixing plates 17 are welded to the bottom of both vertical supports 18. Both screw fixing plates 17 are fixed to the conveyor side by multiple screws. At the top of plate A3 and conveyor side plate B8, a rectangular hollow box 19 is positioned parallel to the center of the feeding conveyor belt 7, above and in front of it. A cylindrical blower 20 is fixed to the center of the outer wall of the top of the rectangular hollow box 19 by a flange and screws. A dustproof protective net 21 is provided at the air inlet of the top of the cylindrical blower 20. A control box 22 is fixed to the top left of the rectangular hollow box 19. An air inlet is provided at the center of the top of the rectangular hollow box 19. The air outlet of the cylindrical blower 20 is connected to the inside of the rectangular hollow box 19 through the air inlet. The cylindrical blower 20 is electrically connected to an external power source through the control box 22.

[0026] like Figure 1 , Figure 4 and Figure 5As shown, the electrostatic elimination and dust removal device 12 also includes a U-shaped air outlet guide hood 23, a strip-shaped air outlet 24, and an ion bar 25. A strip-shaped air outlet 24 is horizontally arranged inside the center of the bottom of the rectangular hollow box 19. A U-shaped air outlet guide hood 23 is arranged outside the bottom opening of the strip-shaped air outlet 24. The U-shaped air outlet guide hood 23 is fixed to the outer wall of the bottom of the rectangular hollow box 19. An ion bar 25 is horizontally fixed inside the rectangular hollow box 19. The ion bar 25 is electrically connected to the control box 22 via wires. The electrostatic elimination and dust removal device 12 is based on the dual principles of electrostatic neutralization and airflow dust removal. Through the coordinated operation of components such as the ion bar 25 and the cylindrical blower 20, it ensures the cleanliness and safety of the semiconductor chip loading process. The ion bar 25 in the device uses a high-voltage generator to generate a strong electric field at the discharge needle, causing the surrounding air to ionize and form a large number of positive and negative ions. These ions, under the action of the electric field force, could move towards the object with static electricity and neutralize the charge, but... Based on this, the device accelerates the ion transport process through the airflow generated by the cylindrical blower 20. The cylindrical blower 20 draws in air from the top air inlet, filters it through the dustproof protective net 21, and then sends it into the rectangular hollow box 19 through the air inlet. Inside the box, the airflow carries ions generated by the ion bar 25 and blows them out evenly from the strip-shaped air outlet 24. Under the guidance of the U-shaped air outlet guide hood 23, the airflow precisely covers the chip surface. The static electricity on the chip surface will quickly attract ions of opposite polarity, achieving static neutralization and preventing dust adsorption or damage to the chip due to static electricity. At the same time, the airflow carries the charged dust particles attached by the ions, causing them to return to the air inlet of the cylindrical blower 20 with the airflow. After being intercepted and filtered by the dustproof protective net 21, the dust removal process is completed. The control box 22 is responsible for powering and regulating the ion bar 25 and the cylindrical blower 20 to ensure that the ion generation and airflow intensity match the requirements of the feeding process, achieving efficient static elimination and dust removal effects.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip packaging and feeding device with a buffer structure, comprising a conveying base plate (4) and mounting brackets (1) disposed at the four corners of the bottom end of the conveying base plate (4), the semiconductor chip packaging and feeding device being placed on the ground by a plurality of mounting brackets (1), a conveying side plate A (3) being disposed at the top right end of the conveying base plate (4), a conveying side plate B (8) being disposed at the top left end of the conveying base plate (4), a feeding conveyor belt (7) being disposed between the conveying side plate A (3) and the conveying side plate B (8), the feeding conveyor belt (7) being located above the conveying base plate (4), characterized in that: A cylinder fixing plate (9) is fixed to the outer wall of the top of the center of the conveying side plate B (8). A feeding cylinder (10) is fixed to the left end of the cylinder fixing plate (9) by a flange and screws. A cylinder shaft (15) is connected to the inside of the feeding cylinder (10) by a cylinder plunger. A shaft hole is provided inside the center of the cylinder fixing plate (9), and the right end of the cylinder shaft (15) passes through the shaft hole from left to right. A buffer feeding mechanism is provided at the right end of the cylinder shaft (15). A static elimination and dust removal device (12) is connected to the front side of the top center of the conveying side plate A (3) and the conveying side plate B (8). The static elimination and dust removal device (12) is located in front of the buffer feeding mechanism. The electrostatic elimination and dust removal device (12) includes a screw fixing plate (17), a vertical support (18), a cuboid hollow box (19), a cylindrical blower (20), a dustproof net (21), and a control box (22). The bottom of both ends of the cuboid hollow box (19) is provided with a vertical support (18). The bottom of both vertical supports (18) is welded with screw fixing plates (17). Both screw fixing plates (17) are fixed to the top of the conveyor side plate A (3) and the conveyor side plate B (8) respectively by multiple screws. The cuboid hollow box (19) is located parallel to the center of the feeding conveyor belt (7) and above the front side. The center of the outer wall of the top of the cuboid hollow box (19) is fixed with a cylindrical blower (20) by a flange and screws. The air inlet of the top of the cylindrical blower (20) is provided with a dustproof net (21). The top of the left end of the cuboid hollow box (19) is fixed with a control box (22).

2. The semiconductor chip packaging and feeding device with a buffer structure according to claim 1, characterized in that: An air inlet is provided at the center of the top of the rectangular hollow box (19). The air outlet of the cylindrical blower (20) is connected to the interior of the rectangular hollow box (19) through the air inlet. The cylindrical blower (20) is electrically connected to an external power source through a control box (22).

3. The semiconductor chip packaging and feeding device with a buffer structure according to claim 2, characterized in that: The electrostatic elimination and dust removal device (12) also includes a U-shaped air outlet guide hood (23), a strip-shaped air outlet (24), and an ion air bar (25). A strip-shaped air outlet (24) is horizontally arranged inside the center of the bottom end of the rectangular hollow box (19). A U-shaped air outlet guide hood (23) is arranged outside the bottom opening of the strip-shaped air outlet (24). The U-shaped air outlet guide hood (23) is fixed to the bottom outer wall of the rectangular hollow box (19). An ion air bar (25) is horizontally fixed inside the rectangular hollow box (19). The ion air bar (25) is electrically connected to the control box (22) through an electric wire.

4. The semiconductor chip packaging and feeding device with a buffer structure according to claim 1, characterized in that: Chip ranging and positioning probes (11) are provided on both the front and rear sides of the center of the cylinder fixing plate (9). Both chip ranging and positioning probes (11) are fixed on the outer wall of the right end of the cylinder fixing plate (9), and the detection direction of the chip ranging and positioning probes (11) is aligned with the top outer wall of the feeding conveyor belt (7) and above it.

5. A semiconductor chip packaging and feeding device with a buffer structure according to claim 4, characterized in that: The buffer feeding mechanism is composed of a chip contact push plate (13), a buffer airbag (14), and a feeding fixing plate (16). A connecting flange is provided at the right end of the cylinder shaft (15), and a feeding fixing plate (16) is provided at the right end of the connecting flange. The feeding fixing plate (16) is fixedly connected to the connecting flange by multiple screws. A buffer airbag (14) is provided at the right end of the feeding fixing plate (16), and a chip contact push plate (13) is provided at the right end of the buffer airbag (14).

6. The semiconductor chip packaging and feeding device with a buffer structure according to claim 5, characterized in that: The cylinder shaft (15) can drive the interconnected chip contact push plate (13), buffer airbag (14) and loading fixing plate (16) to move left and right above the loading conveyor belt (7). The distance between the outer walls of the front and rear ends of the chip contact push plate (13) and loading fixing plate (16) is less than the distance between the two chip ranging and positioning probes (11).

7. A semiconductor chip packaging and feeding device with a buffer structure according to claim 6, characterized in that: The top center of the conveying side plate A (3) is provided with a downwardly recessed feeding conveying groove (5). The feeding conveying groove (5) is located to the right of the chip contact push plate (13). The inner wall of the feeding conveying groove (5) is fixed with a feeding conveying guide sleeve (6). The feeding conveying guide sleeve (6) has an overall U-shaped structure with the opening facing upward. The bottom inner wall of the feeding conveying guide sleeve (6) is flush with the top outer wall of the feeding conveyor belt (7).

8. The semiconductor chip packaging and feeding device with a buffer structure according to claim 7, characterized in that: The right end of the feeding conveyor guide sleeve (6) is connected to the semiconductor chip packaging processing station. The front end of the feeding conveyor belt (7) is provided with an active drive roller. Multiple driven drive rollers are equidistantly arranged on the rear side of the active drive roller. The feeding conveyor motor (2) is fixed at the front end of the conveyor side plate A (3) and located on the outer wall of the right end. The motor shaft of the feeding conveyor motor (2) is connected to the active drive roller through a coupling.

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