A pen-collecting device for semiconductor chips

Abstract

This utility model relates to the field of chip testing technology, specifically a suction pen device for semiconductor chips, comprising: a suction tube, one end of which is connected to an inner connecting tube, and the other end of which is connected to a protective plate; an inner connecting tube is disposed inside a first pen body, and the other end of which is connected to a side threaded tube; a second pen body is disposed on the side of the mounting mechanism; the beneficial effects are: the device can realize dual-mode switching operation, and can be used in both manual and automatic modes, increasing the application scenarios; when using the device, the protective plate on the device can protect the semiconductor chip adsorbed on the suction cup, so that the chip will not collide with the fixture wall during the transfer process, thereby reducing the possibility of chip falling off and improving reliability; and the first pen body makes it convenient for personnel to hold the device, without having to press the soft pen body continuously, avoiding the phenomenon of chip falling off due to unstable suction caused by inconsistent pressing force during operation.

Description

Technical Field

[0001] This utility model relates to the field of chip testing, specifically to a pen-collecting device for semiconductor chips. Background Technology

[0002] In the current semiconductor chip industry, chips must undergo aging tests, functional tests, high and low temperature operation tests, etc., before leaving the factory. Chips are usually stored and transported in trays during transportation. However, during the testing process, aging test boards or functional test boards are often used. This requires transferring chips from the chip tray to the test board. However, test boards usually have locking devices installed to keep the chips in place. Therefore, during the chip transfer process, a jig is needed to press on the test board to open the chip position. Then, a vacuum nozzle is used to pick up the chip from the chip tray and transfer the picked-up chip to the test board through the jig. Especially during aging tests, it is necessary not only to transfer chips from the tray to the test board, but also to transfer chips from different test boards. The chip transfer operation often causes damage to the chips.

[0003] However, when the suction pen is inserted deep into the fixture, the chip may collide with the fixture wall, causing the chip to fall off. Also, because the main body of the suction pen is made of soft rubber, inconsistent pressure applied to the main body during operation can lead to unstable suction, causing the chip to fall off as well. Utility Model Content

[0004] The purpose of this invention is to provide a pen-collecting device for semiconductor chips to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a pen-collecting device for semiconductor chips, comprising: a straw, one end of which is connected to an inner connecting tube, and the other end of which is connected to a protective plate;

[0006] The first pen body has an inner connecting tube inside, the other end of which is connected to a side threaded tube, and an outer connecting air tube is connected to the inner connecting tube.

[0007] The mounting mechanism has a second pen body on its side.

[0008] Preferably, a one-way valve is fixedly installed at the end of the second pen body, the second pen body is fixedly connected to the mounting mechanism, the threaded hole on the mounting mechanism can be threadedly connected to the side threaded pipe, and the side threaded pipe is fixedly connected to the inner connecting pipe.

[0009] Preferably, the inner connecting tube is fixedly connected to the first pen body, and an outer connecting air tube is fixedly connected to the first pen body. The outer connecting air tube is fixedly connected to the inner connecting tube, and the inner connecting tube and the outer connecting air tube are internally connected.

[0010] Preferably, one end of the straw is fixedly installed on one end of the inner connecting tube, the inner connecting tube is connected to the straw, and a protective plate is fixedly connected to the other end of the straw. The protective plate has a concave plate structure.

[0011] Preferably, the suction tube is threaded in the opening at one end of the protective plate, and the suction tube can be threaded to the second external threaded tube. The second external threaded tube is fixedly connected to the mounting plate, and the mounting plate is a combination of a circular plate and a square plate. A suction cup is fixedly installed on the mounting plate.

[0012] Preferably, a first sealing ring and a first external threaded tube are fixedly connected to the first pen body. The first external threaded tube can be threadedly connected to the thread inside the sealing cap. A sealing head is fixedly connected to the sealing cap. The sealing head has a cylindrical structure and can be inserted into the opening of the external connecting air tube. The diameter of the sealing head is equal to the inner diameter of the external connecting air tube. A second sealing ring is fixedly connected to the side of the external connecting air tube.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention proposes a suction pen device for semiconductor chips. The device can switch between two modes: manual and automatic. An external air tube connects to a pipe on an external suction mechanism for automatic operation, while a manual mode is achieved by pressing the second pen body to activate the suction. This expands the device's usability. Furthermore, the protective plate on the device protects the semiconductor chip adsorbed on the suction cup, preventing collisions with the fixture wall during transfer and reducing the likelihood of chip detachment, thus improving reliability. The first pen body also allows for easy handholding, eliminating the need for constant pressing of the soft pen body and preventing inconsistent suction that could cause the chip to fall off. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the device structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the disassembled structure of the device of this utility model;

[0017] Figure 3 for Figure 2 Enlarged structural diagram at point A in the middle;

[0018] Figure 4 for Figure 2 Enlarged structural diagram at point B;

[0019] Figure 5 This is a partial cross-sectional view of the device of this utility model.

[0020] In the diagram: 1. First pen body; 2. Inner connecting pipe; 3. First sealing ring; 4. Side threaded pipe; 5. Mounting mechanism; 6. Second pen body; 7. One-way valve; 8. Sealing cap; 9. Sealing head; 10. First external threaded pipe; 11. External connecting air pipe; 12. Second sealing ring; 13. Suction tube; 14. Protective plate; 15. Second external threaded pipe; 16. Suction cup; 17. Mounting plate. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] Example 1

[0023] Please see Figures 1-5 This utility model provides a technical solution: a pen-collecting device for semiconductor chips, comprising: a straw 13, one end of which is connected to an inner connecting tube 2 and the other end of which is connected to a protective plate 14; a first pen body 1, wherein an inner connecting tube 2 is disposed inside the first pen body 1, the other end of which is connected to a side threaded tube 4, and an external connecting air tube 11 is connected to the inner connecting tube 2; and a mounting mechanism 5, wherein a second pen body 6 is disposed on the side of the mounting mechanism 5.

[0024] In actual use, press the second pen body 6 to allow the gas inside the second pen body 6 to be discharged from the suction cup 16 and the one-way valve 7, then make the suction cup 16 contact the semiconductor chip, release the second pen body 6, and the semiconductor chip can be adsorbed onto the suction cup 16 by suction force.

[0025] Example 2

[0026] Based on Embodiment 1, in order to improve the effectiveness of the device, the following features are provided: the inner connecting tube 2 is fixedly connected to the first pen body 1, and the outer connecting air tube 11 is fixedly connected to the first pen body 1. The outer connecting air tube 11 is fixedly connected to the inner connecting tube 2, and the inner connecting tube 2 and the outer connecting air tube 11 are internally connected. The first pen body 1 is made of a hard material, which makes it convenient for personnel to hold the device and avoids the phenomenon that the chip falls off due to unstable suction caused by pressing the main body during operation. By pressing the second pen body 6, the gas in the second pen body 6 is discharged from the suction cup 16 and the one-way valve 7, and then the suction cup 16 is brought into contact with the semiconductor chip. When the second pen body 6 is released, the semiconductor chip can be adsorbed onto the suction cup 16 by suction.

[0027] One end of the straw 13 is fixedly installed on one end of the inner connecting tube 2, and the inner connecting tube 2 is connected to the straw 13. A protective plate 14 is fixedly connected to the other end of the straw 13. The protective plate 14 has a concave plate structure and is made of transparent material. The protective plate 14 can protect the semiconductor chip adsorbed on the suction cup 16, so that the chip will not collide with the fixture wall during the transfer process, thereby reducing the possibility of chip falling off and improving reliability.

[0028] Example 3

[0029] Based on Embodiment 2, a second pen body 6 is provided for ease of use. A one-way valve 7 is fixedly installed at the end of the second pen body 6. The second pen body 6 is fixedly connected to the mounting mechanism 5. The threaded hole on the mounting mechanism 5 can be threadedly connected to the side threaded pipe 4. The side threaded pipe 4 is fixedly connected to the inner connecting pipe 2. The second pen body 6 is made of rubber and is threadedly connected to the side threaded pipe 4 through the threaded hole on the mounting mechanism 5. The first sealing ring 3 is located between the first pen body 1 and the mounting mechanism 5. The first sealing ring 3 can improve the sealing between the first pen body 1 and the mounting mechanism 5. The first sealing ring 3 has an annular plate structure, which allows the second pen body 6 to be installed on the first pen body 1. When the second pen body 6 is damaged, it can be disassembled and replaced with a new one for easy use. The threaded hole on the mounting mechanism 5 penetrates the entire mounting mechanism 5 and communicates with the inner cavity of the second pen body 6, as in the example. Figure 5 As shown, when the mounting mechanism 5 is installed on the first pen body 1, the second pen body 6 can be connected to the side threaded pipe 4 and the inner connecting pipe 2.

[0030] The straw 13 is threaded in the opening at one end of the protective plate 14. The straw 13 can be threaded to the second external threaded tube 15. The second external threaded tube 15 is fixedly connected to the mounting plate 17. The mounting plate 17 is a combination of a circular plate and a square plate. A suction cup 16 is fixedly installed on the mounting plate 17. The opening at one end of the suction cup 16 corresponds to the opening on the mounting plate 17 and corresponds to the inner hole of the second external threaded tube 15, so that the suction cup 16 can communicate with the straw 13 and the inner connecting tube 2.

[0031] A first sealing ring 3 and a first external threaded tube 10 are fixedly connected to the first pen body 1. The first external threaded tube 10 can be threadedly connected to the threaded opening inside the sealing cap 8. A sealing head 9 is fixedly connected to the sealing cap 8. The sealing head 9 has a cylindrical structure and can be inserted into the opening of the external connecting air tube 11. The diameter of the sealing head 9 is equal to the inner diameter of the external connecting air tube 11. A second sealing ring 12 is fixedly connected to the side of the external connecting air tube 11. The external connecting air tube 11 can be connected to the pipe on the external blowing mechanism. The first sealing ring 3 has a circular plate structure. The contact and compression between ring 3 and the pipe on the external blowing mechanism can improve the sealing of the connection, enabling automatic adsorption in automatic mode through the external blowing mechanism. This eliminates the need for manual pressing of the second pen body 6 to achieve the adsorption function, making it convenient for personnel to use. Personnel can also thread the sealing cap 8 to the first external threaded pipe 10, allowing the sealing head 9 to be inserted into the external connecting air pipe 11 to seal it. This allows switching to manual mode, where personnel can press the second pen body 6 and adsorb the semiconductor chip through the suction cup 16, making it convenient for personnel to use.

[0032] In actual use, the device can switch between two modes, allowing for both manual and automatic operation. The external air tube 11 can connect to the pipe on the external suction mechanism for automatic mode, and manual mode can be achieved by pressing the second pen body 6 to activate the suction function, thus expanding the application scenarios. When using the device, the protective plate 14 can protect the semiconductor chip adsorbed on the suction cup 16, preventing the chip from colliding with the fixture wall during transfer, thereby reducing the possibility of chip falling off and improving reliability. Furthermore, the first pen body 1 is designed to make it convenient for personnel to hold the device without constantly pressing the soft pen body, avoiding the phenomenon of chip falling off due to unstable suction caused by inconsistent pressing force during operation.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pen-collecting device for semiconductor chips, comprising: The straw (13) is characterized in that: one end of the straw (13) is connected to the inner connecting tube (2), and the other end of the straw (13) is connected to the protective plate (14); The first pen body (1) has an inner connecting tube (2) inside it. The other end of the inner connecting tube (2) is connected to the side threaded tube (4). An external connecting air tube (11) is connected to the inner connecting tube (2). The mounting mechanism (5) has a second pen body (6) on its side.

2. The pen-collecting device for semiconductor chips according to claim 1, characterized in that: A one-way valve (7) is fixedly installed at the end of the second pen body (6). The second pen body (6) is fixedly connected to the mounting mechanism (5). The threaded hole on the mounting mechanism (5) can be threadedly connected to the side threaded pipe (4). The side threaded pipe (4) is fixedly connected to the inner connecting pipe (2).

3. The pen-collecting device for semiconductor chips according to claim 1, characterized in that: The inner connecting tube (2) is fixedly connected to the first pen body (1), and an outer connecting air tube (11) is fixedly connected to the first pen body (1). The outer connecting air tube (11) is fixedly connected to the inner connecting tube (2), and the inner connecting tube (2) and the outer connecting air tube (11) are internally connected.

4. The pen-collecting device for semiconductor chips according to claim 1, characterized in that: One end of the straw (13) is fixedly installed on one end of the inner connecting tube (2), and the inner connecting tube (2) is connected to the straw (13). A protective plate (14) is fixedly connected to the other end of the straw (13), and the protective plate (14) has a concave plate structure.

5. A pen-collecting device for semiconductor chips according to claim 1, characterized in that: The suction tube (13) is threaded in the opening at one end of the protective plate (14). The suction tube (13) can be threaded to the second external threaded tube (15). The second external threaded tube (15) is fixedly connected to the mounting plate (17). The mounting plate (17) is a combination of a circular plate and a square plate. A suction cup (16) is fixedly installed on the mounting plate (17).

6. The pen-collecting device for semiconductor chips according to claim 1, characterized in that: The first pen body (1) is fixedly connected with a first sealing ring (3) and a first external threaded tube (10). The first external threaded tube (10) can be threadedly connected to the thread inside the sealing cap (8). The sealing cap (8) is fixedly connected with a sealing head (9). The sealing head (9) has a cylindrical structure and can be inserted into the opening of the external connecting air tube (11). The diameter of the sealing head (9) is equal to the inner diameter of the external connecting air tube (11). The side of the external connecting air tube (11) is fixedly connected with a second sealing ring (12).

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