A solenoid valve
By installing a semiconductor cooling chip and heat-conducting fins in the solenoid valve, a heat conduction path is formed, which solves the problem of poor heat dissipation in existing solenoid valves and achieves efficient heat dissipation and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CATOR (NINGBO) IND TECHNOLOGY CO LTD
- Filing Date
- 2025-08-25
- Publication Date
- 2026-06-30
Smart Images

Figure CN224433572U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of valve products, specifically to a solenoid valve. Background Technology
[0002] Currently, the most common solenoid valves on the market are mainly divided into three categories based on their operating principle: direct-acting, step-direct-acting, and pilot-operated. Each type has its own advantages. For example, direct-acting solenoid valves have a relatively simple structure and are widely used in small devices that do not require high flow rates and need rapid response. Pilot-operated solenoid valves are suitable for large-diameter, high-pressure pipeline systems and can control larger flow rates with relatively small electromagnetic forces. However, existing solenoid valves still exhibit many problems that require improvement in practical applications.
[0003] In the prior art, for example, Chinese invention patent (publication number CN120062392A) discloses a high-frequency response solenoid valve, including a valve body and a stationary iron core, a guide rod and a moving iron core disposed inside the valve body; the stationary iron core is provided with a through hole, the inner wall of the through hole is provided with a spiral track, and a heat dissipation component is provided on the top of the valve body. This patent achieves the heat dissipation function by rotating the moving iron core when the coil is energized, and by replacing the movement of the transmission component with the movement of the moving iron core to make the cooling water flow.
[0004] This existing technology attempts to achieve heat dissipation by having a moving iron core rotate when the coil is energized, and by using the movement of the moving iron core to replace the movement of the transmission component to drive the flow of cooling water. However, because the stroke of the moving iron core in the solenoid valve is short, its rotation cannot generate a continuous force to drive air convection, resulting in poor heat dissipation. At the same time, the movement of the moving iron core drives the movement of the transmission component, but it cannot actually drive the flow of cooling water in the pipe, making it difficult to achieve efficient heat dissipation. Moreover, the structure is relatively complex, increasing the possibility of failure. Utility Model Content
[0005] The purpose of this invention is to provide a solenoid valve that simplifies the heat dissipation mechanism by installing a semiconductor cooling chip in the solenoid valve. When the semiconductor cooling chip is energized, it can conduct the heat in the valve sleeve to the outside, thus achieving rapid heat dissipation.
[0006] To address the problems of existing technologies, this utility model provides an electromagnetic valve, comprising: a valve body capable of being installed in a pipeline, with first flanges for connecting to the pipeline connected to both ends of the valve body, and a second flange provided on the top of the valve body; a valve sleeve disposed directly above the top of the valve body, with the bottom of the valve sleeve connected to the second flange; a valve core assembly disposed inside the valve sleeve and capable of controlling the fluid flow in the valve body; a coil disposed inside the valve sleeve and capable of driving the valve core assembly to move up and down; and a heat dissipation assembly disposed inside the valve sleeve for dissipating heat from the coil. The heat dissipation assembly includes a heat-conducting sleeve sleeved outside the coil, and a plurality of semiconductor cooling chips disposed on the heat-conducting sleeve, with one end of each semiconductor cooling chip extending to the outside of the valve sleeve.
[0007] Preferably, the valve sleeve is further provided with a through hole that mates with the thermoelectric cooler, and a sealing ring is provided between the through hole and the thermoelectric cooler.
[0008] Preferably, the heat dissipation assembly further includes a plurality of heat-conducting fins distributed on the inner wall of the heat-conducting sleeve, and the heat-conducting fins are evenly distributed along the circumferential direction of the heat-conducting sleeve.
[0009] Preferably, the semiconductor cooling chip has a plurality of heat dissipation fins distributed on its outer surface, and the heat dissipation fins are evenly distributed along the circumference of the semiconductor cooling chip.
[0010] Preferably, the valve core assembly includes a moving iron core vertically disposed at the center position inside the valve sleeve, and the moving iron core is capable of moving up and down at the center position of the coil.
[0011] Preferably, the valve core assembly further includes a piston fixed to the bottom of the moving iron core, the piston is provided with a spring for resetting the piston, the bottom of the piston is provided with a sealing block for sealing, the valve body is provided with a flow channel, and the sealing block can be inserted into the flow channel in the valve body.
[0012] Preferably, a valve cover is fixed to the top of the valve sleeve by bolts, and a sealing ring for sealing is also provided in the valve cover.
[0013] The advantages of this utility model compared to the prior art are:
[0014] In this application, a coil is installed inside the valve sleeve, and a moving iron core is arranged inside the coil. When the coil is energized, it continuously generates heat during the energy conversion process. If too much heat accumulates, it may affect the working performance and service life of the coil and related components. To achieve efficient heat dissipation, a heat-conducting sleeve is fitted around the coil. Several heat-conducting fins are evenly distributed along the axial and radial directions inside the heat-conducting sleeve. These fins are integrated with the heat-conducting sleeve, significantly increasing the heat-conducting surface area and thus improving heat transfer efficiency, allowing the heat generated by the coil to diffuse more quickly throughout the heat-conducting sleeve. A thermoelectric cooler is also fitted outside the heat-conducting sleeve. The cold end of the thermoelectric cooler is in close contact with the outer wall of the heat-conducting sleeve, while the hot end extends to the outside of the valve sleeve, forming a heat conduction path spanning the inside and outside of the valve sleeve. Furthermore, several heat dissipation fins are fixedly installed on the outer surface of the valve sleeve. These fins further expand the contact area with the external environment, enhancing the ability to dissipate heat to the outside. When the thermoelectric cooler is powered on, its cold end rapidly absorbs heat from the heat-conducting sleeve and fins, and transfers the heat to the hot end located outside the valve sleeve through its own thermoelectric conversion effect. The heat is then quickly dissipated into the surrounding environment through the heat dissipation fins. This structural design creates a complete heat dissipation path from the coil to the heat-conducting sleeve, fins, and then to the thermoelectric cooler, finally dissipating heat to the outside environment via the heat dissipation fins. This effectively achieves efficient heat dissipation of the coil and ensures the stable operation of the entire device. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of an electromagnetic valve according to this utility model.
[0016] Figure 2 This is a side view of the structure of an electromagnetic valve according to this utility model.
[0017] Figure 3 This is a cross-sectional structural diagram of a solenoid valve according to the present invention.
[0018] Figure 4 This is an exploded structural diagram of an electromagnetic valve according to this utility model.
[0019] Figure 5 This is the utility model Figure 4 Enlarged structural diagram at point A in the middle.
[0020] Figure 6 This is a three-dimensional structural diagram of the heat-conducting sleeve of this utility model.
[0021] The following are the labels in the diagram: 1. Valve body; 11. First flange; 12. Second flange; 2. Valve sleeve; 21. Through hole; 3. Valve cover; 31. Sealing ring; 4. Valve core assembly; 41. Piston; 411. Sealing block; 42. Moving iron core; 5. Coil; 6. Heat dissipation assembly; 61. Heat-conducting sleeve; 611. Heat-conducting fins; 62. Semiconductor cooling chip; 621. Heat dissipation fins. Detailed Implementation
[0022] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments.
[0023] Reference Figures 1-6 As shown, this utility model provides a solenoid valve, comprising: a valve body 1, which can be installed in a pipeline, with first flanges 11 connected to both ends of the valve body 1 for connecting to the pipeline, and a second flange 12 provided on the top of the valve body 1; a valve sleeve 2, which is located directly above the top of the valve body 1, and the bottom of the valve sleeve 2 is connected to the second flange 12; a valve core assembly 4, which is located inside the valve sleeve 2 and can control the fluid flow in the valve body 1; a coil 5, which is located inside the valve sleeve 2 and can drive the valve core assembly 4 to move up and down; and a heat dissipation assembly 6, which is located inside the valve sleeve 2 for dissipating heat from the coil 5. The heat dissipation assembly 6 includes a heat-conducting sleeve 61 sleeved outside the coil 5, and a plurality of semiconductor cooling chips 62 are provided on the heat-conducting sleeve 61, with one end of each semiconductor cooling chip 62 extending to the outside of the valve sleeve 2.
[0024] When coil 5 is energized, it generates an electromagnetic force, which acts on valve core assembly 4, driving it to move upward or downward, thus opening the valve core assembly 4. Once open, fluid can flow smoothly through the internal channels of valve body 1. When coil 5 is de-energized, the electromagnetic force disappears, and valve core assembly 4 returns to its initial position, closing the valve core assembly 4 and blocking fluid flow. Throughout the operation, coil 5 generates heat due to the current flowing through it. The heat-conducting sleeve 61 in the heat dissipation assembly 6 conducts the heat to the thermoelectric cooler 62, which then dissipates the heat to the outside of valve sleeve 2, ensuring that coil 5 and the entire solenoid valve operate stably at a suitable temperature.
[0025] The valve sleeve 2 is also provided with a through hole 21 that mates with the thermoelectric cooler 62. A sealing ring is also provided between the through hole 21 and the thermoelectric cooler 62. The core function of the sealing ring is to fill the gap between the two and prevent external dust, moisture, impurities, etc. from entering the interior of the valve sleeve 2 through the through hole 21. This not only prevents the core components such as the valve core assembly 4 and the coil 5 from being contaminated or corroded, but also maintains a relatively clean and dry environment inside the valve sleeve 2, ensuring the stable operation and service life of the solenoid valve.
[0026] The heat dissipation assembly 6 also includes a plurality of heat-conducting fins 611 distributed on the inner wall of the heat-conducting sleeve 61, and the heat-conducting fins 611 are evenly distributed along the circumferential direction of the heat-conducting sleeve 61. A plurality of heat dissipation fins 621 are distributed on the outside of the semiconductor cooling chip 62, and the heat dissipation fins 621 are evenly distributed along the circumferential direction of the semiconductor cooling chip 62.
[0027] Distributed evenly along the circumference on the inner wall of the heat-conducting sleeve 61, the fins significantly increase the contact area (or heat exchange area) between the heat-conducting sleeve 61 and the coil 5. When the coil 5 generates heat, the heat can be quickly transferred to the heat-conducting sleeve 61 through more fins, accelerating the heat transfer efficiency from the coil 5 to the heat-conducting sleeve 61 and preventing heat accumulation in localized areas near the coil 5. The evenly distributed circumferential design ensures that the heat generated in each part of the coil 5 is absorbed by the corresponding fins in a timely manner, guaranteeing uniform heating of the heat-conducting sleeve 61 and improving the overall heat dissipation effect of the heat-conducting sleeve 61 on the coil 5.
[0028] The valve core assembly 4 includes a moving iron core 42 vertically disposed at the center of the valve sleeve 2, and the moving iron core 42 is capable of moving up and down at the center of the coil 5. The valve core assembly 4 also includes a piston 41 fixed to the bottom of the moving iron core 42, and the piston 41 is provided with a spring for resetting the piston 41. The bottom of the piston 41 is also provided with a sealing block 411 for sealing. The valve body 1 is also provided with a flow channel, and the sealing block 411 can be inserted into the flow channel in the valve body 1.
[0029] When coil 5 is energized, it generates an electromagnetic force that attracts the moving iron core 42 to move upward. The moving iron core 42 then drives the piston 41 to move upward synchronously, compressing the spring on the piston 41. As the piston 41 moves upward, the sealing block 411 at the bottom disengages from the flow channel of the valve body 1, opening the flow channel and allowing fluid to flow through the internal passage of the valve body 1. When coil 5 is de-energized, the electromagnetic force disappears, and the spring on the piston 41 releases its elastic potential energy, pushing the piston 41 (and the moving iron core 42) downward to reset. The sealing block 411 then moves downward and inserts into the flow channel of the valve body 1, tightly sealing the flow channel and blocking fluid flow.
[0030] The valve cover 3 is fixed to the top of the valve sleeve 2 by bolts, and the valve cover 3 is also provided with a sealing ring 31 for sealing.
[0031] The valve cover 3 is rigidly connected to the valve sleeve 2 by bolts, which not only ensures the firmness of the assembly, but also facilitates the later maintenance of the internal components of the valve sleeve 2.
[0032] The above embodiments only illustrate one or more implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.
Claims
1. A solenoid valve, characterized in that, include: The valve body (1) can be installed in a pipeline, and the two ends of the valve body (1) are connected to a first flange (11) for connecting to the pipeline, and a second flange (12) is provided on the top of the valve body (1). Valve sleeve (2), which is located directly above the top of the valve body (1), and the bottom of the valve sleeve (2) is connected to the second flange (12); The valve core assembly (4) is located inside the valve sleeve (2) and is capable of controlling the fluid flow in the valve body (1); The coil (5) is located inside the valve sleeve (2) and is capable of driving the valve core assembly (4) to move up and down. A heat dissipation component (6) is installed inside the valve sleeve (2) to dissipate heat from the coil (5); The heat dissipation assembly (6) includes a heat-conducting sleeve (61) sleeved outside the coil (5), and a plurality of semiconductor cooling chips (62) are also provided on the heat-conducting sleeve (61), and one end of the semiconductor cooling chip (62) extends to the outside of the valve sleeve (2).
2. The solenoid valve according to claim 1, characterized in that, The valve sleeve (2) is also provided with a through hole (21) that cooperates with the semiconductor cooling chip (62), and a sealing ring is provided between the through hole (21) and the semiconductor cooling chip (62).
3. The solenoid valve according to claim 1, characterized in that, The heat dissipation assembly (6) also includes a number of heat-conducting fins (611) distributed on the inner wall of the heat-conducting sleeve (61), and the heat-conducting fins (611) are evenly distributed along the circumferential direction of the heat-conducting sleeve (61).
4. A solenoid valve according to claim 3, characterized in that, The semiconductor cooling chip (62) has a number of heat dissipation fins (621) distributed on its exterior, and the heat dissipation fins (621) are evenly distributed along the circumference of the semiconductor cooling chip (62).
5. A solenoid valve according to claim 1, characterized in that, The valve core assembly (4) includes a moving iron core (42) vertically disposed at the center of the valve sleeve (2), and the moving iron core (42) can move up and down at the center of the coil (5).
6. A solenoid valve according to claim 5, characterized in that, The valve core assembly (4) also includes a piston (41) fixed to the bottom of the moving iron core (42). The piston (41) is also provided with a spring for resetting the piston (41). The bottom of the piston (41) is also provided with a sealing block (411) for sealing. The valve body (1) is also provided with a flow channel. The sealing block (411) can enter the flow channel in the valve body (1).
7. A solenoid valve according to claim 1, characterized in that, The valve sleeve (2) is fixed to the top of the valve cover (3) by bolts, and the valve cover (3) is also provided with a sealing ring (31) for sealing.
Citation Information
Patent Citations
High-frequency response electromagnetic valve
CN120062392A