A testing system for a thin-film pressure sensor

Abstract

This utility model relates to the field of sensor testing technology, specifically a testing system for a thin-film pressure sensor. The device includes a pressure measurement module, a lifting module, a pressure acquisition module, and a host computer. The pressure measurement module applies pressure to the thin-film pressure sensor under test and measures and acquires the applied pressure calibration value. The lifting module drives the pressure measurement module to descend at a constant speed to apply pressure to the thin-film pressure sensor under test. The pressure acquisition module acquires the pressure acquisition value output by the thin-film pressure sensor under test. The host computer connects to the pressure measurement module, the lifting module, and the pressure acquisition module, and controls the lifting module to drive the pressure measurement module to descend at a constant speed, acquire the pressure calibration value and the pressure acquisition value, and generate a calibration file based on the calibration pressure value and the corresponding pressure acquisition value. This application ensures that the results of the same thin-film pressure sensor are stable in repeated pressure tests, and that the test results of the same batch of thin-film pressure sensors are consistent under the same pressure.

Description

Technical Field

[0001] This utility model relates to the field of sensor testing technology, and in particular to a testing system for a thin-film pressure sensor. Background Technology

[0002] Thin-film pressure sensors operate based on the piezoresistive effect and are widely used in consumer electronics, healthcare, and industrial control due to their advantages such as simple structure, high flexibility, and low cost.

[0003] In related technologies, the testing of thin-film pressure sensors often relies on manual operation. However, manual testing makes it difficult to guarantee the consistency of the applied force speed, contact area, and alignment each time. This leads to drift and deviation in the results of repeated pressure tests on a single sensor, resulting in poor repeatability. In addition, due to structural factors such as thin-film coating thickness and the randomness of conductive particle distribution, the output signals of sensors in the same batch often differ significantly under the same pressure, resulting in poor interchangeability.

[0004] Without calibration, the poor repeatability and interchangeability of thin-film pressure sensors make it difficult to meet the requirements of accurate pressure testing. Therefore, in scenarios with high requirements for repeatability and interchangeability, systematic testing and calibration of different sensors within the same batch and different batches of sensors must be performed during the testing and calibration process. Utility Model Content

[0005] This utility model provides a testing system for a thin-film pressure sensor to solve the problems of poor repeatability of multiple tests on a single thin-film pressure sensor and poor consistency and interchangeability of test results of the same batch of thin-film pressure sensors in existing testing methods.

[0006] This utility model discloses a testing system for a thin-film pressure sensor, comprising:

[0007] The pressure measurement module is used to apply pressure to the pressure sensor of the thin film under test and measure and obtain the calibration value of the applied pressure;

[0008] A lifting module is connected to the pressure measurement module and drives the pressure measurement module to descend at a constant speed to apply pressure to the pressure sensor under test.

[0009] The pressure acquisition module can be connected to the signal output terminal of the pressure sensor of the thin film under test to acquire the pressure acquisition value output by the pressure sensor of the thin film under test.

[0010] The host computer is connected to the pressure measurement module, the lifting module, and the pressure acquisition module. The host computer is used to control the lifting module to drive the pressure measurement module to descend at a constant speed, and to acquire the pressure calibration value and the pressure acquisition value. Based on the calibration pressure value and the corresponding pressure acquisition value, the host computer generates a calibration file for calibrating the pressure acquisition value of the pressure sensor under test.

[0011] Optionally, the pressure acquisition module includes a main control chip, a voltage divider circuit, and a connector. The pressure sensor under test is connected in series with the voltage divider circuit through the connector, and the series connection is between the external power supply and ground. The main control chip connects the voltage divider circuit and the series connection node of the pressure sensor under test to acquire the pressure acquisition value of the pressure sensor under test and transmit it to the host computer.

[0012] Optionally, the voltage divider circuit includes a voltage divider resistor, which is connected in series with the pressure sensor of the thin film under test through the connector, the series node is connected to the main control chip, and the other end of the voltage divider resistor is grounded.

[0013] Optionally, the pressure measurement module includes a push-pull force gauge, which is connected to the lifting module and the host computer. The lifting module drives the push-pull force gauge to descend at a constant speed so that the measuring end of the push-pull force gauge presses against the pressure sensor of the thin film to be measured.

[0014] Optionally, the main control chip has a built-in non-volatile memory for storing the calibration file. The main control chip is also used to calibrate the pressure acquisition value output by the thin-film pressure sensor under test according to the calibration file and then output it.

[0015] Optionally, the testing system further includes a display module connected to the main control chip, used to display the pressure value after calibration by the calibration file.

[0016] Optionally, the host computer is provided with a display interface, which is used to display the pressure calibration value and the corresponding pressure acquisition value.

[0017] Optionally, the testing system further includes a working platform with a positioning slot for placing and positioning the pressure sensor of the thin film to be tested, and the lifting module is installed on the working platform.

[0018] Optionally, the test system further includes a signal conversion module and an interface module. The signal conversion module is located between the main control chip and the interface module, and is used to convert the digital signal output by the main control chip into a serial port signal, and transmit it to the host computer through the interface module.

[0019] Optionally, the signal conversion module includes a serial port conversion chip, the interface module includes a Type-C interface, the serial port conversion chip is connected to the main control chip and the Type-C interface, and the Type-C interface is also connected to a host computer.

[0020] The beneficial effects of the testing system for the thin-film pressure sensor provided in this embodiment are as follows: By setting the upper computer to control the lifting module to drive the pressure measurement module to descend at a uniform speed, replacing the manual operation of the pressure measurement module to apply pressure to the thin-film pressure sensor under test, the consistency of the applied force speed, contact area, and alignment can be ensured, thus ensuring the consistency of test results for repeated pressure tests. The test results are stable and have good repeatability. When the pressure measurement module applies pressure to the thin-film pressure sensor under test, it can also simultaneously acquire the applied pressure calibration value. The upper computer acquires the pressure acquisition value acquired by the pressure acquisition module and the pressure calibration value measured by the pressure measurement module, and can generate a calibration file based on the calibration pressure value and the corresponding pressure acquisition value. The calibration file can be used to calibrate the pressure acquisition value of the thin-film pressure sensor under test, which helps to quickly and accurately measure the output difference of thin-film pressure sensors in the same batch under the same pressure, and helps to screen out thin-film pressure sensors with good consistency under the same pressure, ensuring the consistency and better interchangeability of thin-film pressure sensors in the same batch. Attached Figure Description

[0021] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0022] Figure 1 This is a structural block diagram of the testing system for the thin-film pressure sensor according to an embodiment of this utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the connection between the lifting module and the pressure measuring module provided in this embodiment of the utility model;

[0024] Figure 3 This is a schematic diagram of the circuit principle of the main control chip in an embodiment of this utility model;

[0025] Figure 4 This is a schematic diagram of the circuit principle of the voltage divider circuit and the connector in an embodiment of this utility model;

[0026] Figure 5 This is a schematic diagram of the circuit principle of the serial port conversion chip according to an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the circuit principle of the Type-C interface according to an embodiment of this utility model;

[0028] Figure 7This is a schematic diagram of the circuit principle of the connector according to an embodiment of the present invention.

[0029] The labels for the attached figures are as follows:

[0030] 10. Pressure measurement module; 11. Push-pull force gauge; 20. Lifting module; 30. Pressure acquisition module; 31. Voltage divider circuit; 40. Host computer; 50. Display module; 60. Signal conversion module; 70. Interface module; 80. Working platform; 80a. Positioning slot;

[0031] U1, main control chip; U2, serial port conversion chip; J1, connector; J2, type-C interface; J3, connector socket; R1, voltage divider resistor. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0033] This utility model provides a testing system for a thin-film pressure sensor, such as... Figure 1 and Figure 2 As shown, the test system for the thin-film pressure sensor includes a pressure measurement module 10, a lifting module 20, a pressure acquisition module 30, and a host computer 40.

[0034] The pressure measurement module 10 is used to apply pressure to the pressure sensor of the thin film under test and to measure and obtain the calibration value of the applied pressure.

[0035] The lifting module 20 is connected to the pressure measurement module 10 and drives the pressure measurement module 10 to descend at a constant speed to apply pressure to the membrane pressure sensor under test. The lifting module 20 can precisely control the displacement and speed of the pressure measurement module 10 in the direction of gravity, thereby applying or removing pressure to the membrane pressure sensor under test. This eliminates errors such as uneven speed and unstable pressure caused by human operation, ensuring that each test and each sensor is conducted under exactly the same conditions. This provides a scientific and reliable basis for evaluating the consistency and repeatability of membrane pressure sensors.

[0036] The pressure acquisition module 30 is connected to the signal output terminal of the pressure sensor of the membrane under test, and is used to acquire the pressure acquisition value output by the pressure sensor of the membrane under test.

[0037] The host computer 40 connects to the pressure measurement module 10, the lifting module 20, and the pressure acquisition module 30. The host computer 40 controls the lifting module 20 to drive the pressure measurement module 10 to descend at a uniform speed, and acquires pressure calibration values ​​and pressure acquisition values. Based on the calibration pressure values ​​and the corresponding pressure acquisition values, it generates a calibration file for calibrating the pressure acquisition values ​​of the thin-film pressure sensor under test. The calibration file can correct for the nonlinearity and individual differences of the thin-film pressure sensor, reducing errors in repeatable measurements.

[0038] In this embodiment, the host computer 40 controls the lifting module 20 to drive the pressure measurement module 10 to descend at a uniform speed, replacing manual operation of the pressure measurement module 10 to apply pressure to the pressure sensor under test. This ensures consistency in the speed, contact area, and alignment of the applied force across multiple tests, guaranteeing stable test results for repeated pressure tests and exhibiting good repeatability. It also automates the testing of the pressure sensor under test. Simultaneously, the pressure measurement module 10 acquires the applied pressure calibration value while applying pressure to the pressure sensor. The host computer 40 obtains the pressure acquisition value from the pressure acquisition module 30 and the pressure measurement module 10. The pressure calibration value obtained from the measurement can generate a calibration file based on the calibration pressure value and the corresponding pressure acquisition value. The calibration file can be used to calibrate the pressure acquisition value of the thin-film pressure sensor under test, which helps to quickly and accurately measure the output difference of thin-film pressure sensors in the same batch under the same pressure. It helps to screen out thin-film pressure sensors with good consistency under the same pressure, ensuring the consistency and good interchangeability of thin-film pressure sensors in the same batch. It can also be used to help detect whether the working range of the thin-film pressure sensor is qualified and analyze its key characteristics such as linearity and hysteresis, providing a powerful tool for the research and development and quality control of thin-film pressure sensors.

[0039] The pressure measurement module 10 applies different forces to the pressure sensor under test due to varying heights. The host computer 40 then obtains multiple pressure calibration values ​​and corresponding pressure acquisition values. Based on these values, the host computer 40 performs multi-point fitting, interpolation calculations, or other calibration model operations to generate a calibration file for the pressure sensor. The host computer 40 can be a computer, embedded controller, or similar device, serving as the control and data processing center for the lifting module 20. The host computer 40 can also adjust the rising or falling speed of the lifting module 20 to ensure the smoothness of the pressure application process.

[0040] A calibration file can be a function relating pressure acquisition values ​​to pressure calibration values. This means that subsequent tests on the thin-film pressure sensor under test can utilize this function, such as Y=aX+b, where Y is the pressure calibration value and X is the pressure acquisition value. The acquired pressure value can then be directly calibrated using this function. This function can be written into firmware for use with the thin-film pressure sensor under test. Alternatively, a calibration file can be an array of pressure acquisition values ​​and their corresponding calibration values. Subsequent tests on the thin-film pressure sensor under test can use this array to interpolate and calibrate the acquired pressure values ​​to obtain the calibrated pressure value.

[0041] The host computer 40 can perform multi-point fitting, interpolation calculation, or other calibration model operations on the pressure calibration value and the corresponding pressure acquisition value using existing reproducible software programs, and such software is not an innovation of this application. The embodiments of this application include specific hardware structures such as the pressure measurement module 10, the lifting module 20, the pressure acquisition module 30, and the host computer 40. Some hardware components involve software programs during operation. The software programs that assist the operation of the testing system for the thin-film pressure sensor in the embodiments of this application are all existing reproducible software programs and do not constitute an innovation of this application.

[0042] The lifting module 20 can be connected to the host computer 40 via a serial port to achieve command control and data communication. The host computer 40 can control the lifting module 20 to automatically and uniformly descend the pressure measurement module 10 to the preset test starting position, and then control the lifting module 20 to move downwards at a slow and constant speed, applying pressure uniformly to the sensor placed on the test platform. The host computer 40 saves the current pressure calibration value and the corresponding collected pressure value as a set of valid data points to the host computer 40's background data file.

[0043] refer to Figure 1 , Figure 3 and Figure 4 In an optional embodiment of this application, the pressure acquisition module 30 includes a main control chip U1, a voltage divider circuit 31, and a connector J1. The pressure sensor under test is connected in series with the voltage divider circuit 31 through the connector J1, and the series connection is between the external power supply and the ground. The main control chip U1 connects the series node of the voltage divider circuit 31 and the pressure sensor under test to acquire the pressure acquisition value of the pressure sensor under test and transmit it to the host computer 40.

[0044] Connector J1 allows the detachable connection of the thin-film pressure sensor under test (TFT) into the circuit. When testing the TFT, it can be connected in series with the voltage divider circuit 31 via connector J1. After testing, the TFT can be removed, making the connection very convenient. The voltage divider circuit 31 is connected in series with the TFT via connector J1, forming a series circuit to capture the resistance change of the TFT in a voltage-dividing manner. Specifically, the TFT can be considered as a variable resistor; pressing it produces a resistance change. When the resistance of the TFT changes, the voltage across the TFT and the voltage divider circuit 31 changes accordingly, converting the resistance of the TFT into a measurable voltage signal. The main control chip U1 collects the voltage signal from the voltage divider circuit 31. The main control chip U1, such as a common microcontroller, usually integrates an analog-to-digital converter port, which can directly acquire voltage signals. The voltage divider circuit 31 and the series node of the pressure sensor under test are connected to the analog-to-digital converter port of the main control chip U1 to complete the signal acquisition. No additional resistance measurement module is required, which simplifies the hardware connection and software programming difficulty and reduces the module cost.

[0045] Optionally, connector J1 can be a connector of model HX12501-2AWB, which can enable the thin-film pressure sensor to be tested to be connected to the circuit.

[0046] Optional, see reference Figure 3 and Figure 4 The voltage divider circuit 31 includes a voltage divider resistor. The voltage divider resistor is connected in series with the thin-film pressure sensor under test through connector J1. The series node is connected to the main control chip U1, and the other end of the voltage divider resistor is grounded.

[0047] Specifically, an external power supply provides a stable voltage (e.g., 3.3V). Current flows from the positive terminal of the power supply, passing sequentially through the pressure sensor under test and the voltage divider resistor, finally flowing into ground. When the pressure sensor under test is subjected to pressure, its resistance changes, and the voltage divider voltage obtained by the main control chip U1 changes accordingly. Using a single voltage divider resistor as the voltage divider circuit 31 simplifies the circuit structure and reduces hardware costs and assembly difficulty.

[0048] In other embodiments, the voltage divider circuit 31 can also be composed of multiple resistors connected in series or in parallel and then connected in series with the connected thin-film pressure sensor to be tested, so as to detect the voltage signal.

[0049] In an optional embodiment of this application, the main control chip U1 has a built-in non-volatile memory for storing calibration files. The main control chip U1 is also used to calibrate the pressure acquisition value output by the thin-film pressure sensor under test according to the calibration file and then output it.

[0050] Before leaving the factory, the corresponding calibration file of the thin-film pressure sensor is pre-stored in the non-volatile memory of the main control chip U1. When the user connects the thin-film pressure sensor to the application device, the main control chip U1 can be connected together. There is no need to rely on external devices for calibration configuration. The main control chip U1 can directly call the calibration file in the memory to correct the collected pressure value and output the calibrated pressure value, which simplifies the application process of the thin-film pressure sensor.

[0051] Further reference Figure 1 , Figure 3 and Figure 7 The testing system also includes a display module 50, which is connected to the main control chip U1 and is used to display the pressure value after calibration by the calibration file.

[0052] The display module 50 can present the calibrated pressure value, allowing testers or operators to quickly observe the output results of the diaphragm pressure sensor under test. For example, during the pre-shipment testing of the diaphragm pressure sensor, the displayed value can directly indicate whether the calibration has taken effect and whether the pressure acquisition is accurate, reducing reliance on external equipment and improving debugging efficiency. The real-time display function of the display module 50 also allows non-professionals to intuitively obtain pressure data without complex operation training, making it particularly suitable for end users to quickly read information in real-world scenarios.

[0053] Optional, see reference Figure 1 , Figure 3 and Figure 7 The display module 50 includes a connector J3 and a display screen. The connector J3 is connected to the main control chip U1, and the display screen is plugged into the connector J3. The display screen can be an OLED (Organic Light-Emitting Diode) display screen, an LCD (Liquid Crystal Display) display screen, or other display devices.

[0054] refer to Figure 1 , Figure 3 , Figure 5 and Figure 6 In an optional embodiment of this application, the test system further includes a signal conversion module 60 and an interface module 70. The signal conversion module 60 is located between the main control chip U1 and the interface module 70, and is used to convert the digital signal output by the main control chip U1 into a serial port signal and transmit it to the host computer 40 through the interface module 70.

[0055] Specifically, the main control chip U1 acquires the pressure value, i.e., the voltage signal. This is processed by the analog-to-digital converter within the main control chip U1, converting the acquired analog voltage value into a processable digital signal. The signal conversion module 60 then converts the digital signal into a serial port signal recognizable by the host computer 40, which is transmitted to the host computer 40 via the interface module 70. Therefore, by setting up the signal conversion module 60 and the interface module 70, the pressure acquisition module can be adapted to the host computer 40, enabling signal transmission between the pressure acquisition module and the host computer 40.

[0056] Optional, see reference Figure 3 , Figure 5 and Figure 6 The signal conversion module 60 includes a serial port conversion chip U2, and the interface module 70 includes a type-c interface J2. The serial port conversion chip U2 is connected to the main control chip U1 and the type-c interface J2. The type-c interface J2 is also connected to the host computer 40.

[0057] The pressure acquisition module 30 uses a Type-C interface J2 as the connection method with the host computer 40. Combined with the serial port conversion chip U2, the pressure acquisition module 30 can connect to various host computers 40 through the Type-C interface J2, which has high device compatibility. The Type-C interface supports reversible insertion, avoiding the risk of damage caused by incorrect orientation of traditional interfaces (such as Micro-USB), simplifying the operation process, and is especially suitable for testing scenarios with frequent plugging and unplugging.

[0058] refer to Figure 1 and Figure 2 In an optional embodiment of this application, the pressure measurement module 10 includes a push-pull force gauge 11, which is connected to the lifting module 20 and the host computer 40. The lifting module 20 drives the push-pull force gauge 11 to descend at a constant speed so that the measuring end of the push-pull force gauge 11 presses against the pressure sensor of the thin film to be measured.

[0059] The push-pull force gauge 11 is a standard force measurement device, typically featuring high precision and high resolution. It accurately measures the actual pressure value applied to the pressure sensor under test, i.e., the pressure calibration value. Simultaneously, the measuring end of the push-pull force gauge 11 can stably contact the pressure sensor under test, applying pressure. The host computer 40 controls the lifting module 20 to lower the push-pull force gauge 11 at a uniform speed, ensuring consistent pressure application rate, contact area, and alignment for each test. This stable loading condition avoids speed fluctuations during manual operation (such as uneven force during manual pressing), significantly improving the consistency of test results in repeated tests.

[0060] In an optional embodiment of this application, the host computer 40 is provided with a display interface, which is used to display the pressure calibration value and the corresponding pressure acquisition value.

[0061] Specifically, the display interface can show the pressure calibration value (actual value) and the sensor acquisition value at the same time. Operators can monitor the changes in the pressure calibration value and the pressure acquisition value in real time, directly observe the deviation between the two, and evaluate the performance of the thin-film pressure sensor under test. The display interface can also provide data analysis functions, such as plotting curves or histograms, to help operators analyze the relationship between the pressure calibration value and the acquisition value more intuitively.

[0062] Optionally, the host computer 40 may also include an operation interface for selecting whether to burn the generated calibration file into the main control chip U1 of the pressure acquisition module 30 and store it in the non-volatile memory of the main control chip U1. When the main control chip U1 subsequently tests the same thin-film pressure sensor that has already been tested, it can calculate and compensate in real time according to the parameters in the calibration file, and finally output the calibrated and accurate pressure value, which can be displayed through the display module 50.

[0063] refer to Figure 2 In an optional embodiment of this application, the testing system further includes a work platform 80, on which a positioning groove 80a is provided. The positioning groove 80a is used to place and position the pressure sensor of the film to be tested. The lifting module 20 is installed on the work platform 80.

[0064] The positioning slot 80a on the work platform 80 ensures that the pressure sensor under test is accurately placed in a fixed position, so that the pressure sensor under test can be positioned without the need for equipment outside the test system. Operators can quickly and accurately place the pressure sensor under test, simplifying the operation process.

[0065] In an optional embodiment of this application, the lifting module 20 may be a motor, which drives the pressure measurement module 10 to descend at a constant speed to apply pressure to the pressure sensor of the thin film to be tested.

[0066] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. A testing system for a thin-film pressure sensor, characterized in that, include: The pressure measurement module is used to apply pressure to the pressure sensor of the thin film under test and measure and obtain the calibration value of the applied pressure; A lifting module is connected to the pressure measurement module and drives the pressure measurement module to descend at a constant speed to apply pressure to the pressure sensor under test. The pressure acquisition module can be connected to the signal output terminal of the pressure sensor of the thin film under test to acquire the pressure acquisition value output by the pressure sensor of the thin film under test. The host computer is connected to the pressure measurement module, the lifting module, and the pressure acquisition module. The host computer is used to control the lifting module to drive the pressure measurement module to descend at a constant speed, and to acquire the pressure calibration value and the pressure acquisition value. Based on the calibration pressure value and the corresponding pressure acquisition value, the host computer generates a calibration file for calibrating the pressure acquisition value of the pressure sensor under test.

2. The testing system for the thin-film pressure sensor according to claim 1, characterized in that, The pressure acquisition module includes a main control chip, a voltage divider circuit, and a connector. The pressure sensor under test is connected in series with the voltage divider circuit through the connector, and the series connection is between the external power supply and ground. The main control chip connects the voltage divider circuit and the series connection node of the pressure sensor under test to acquire the pressure acquisition value of the pressure sensor under test and transmit it to the host computer.

3. The testing system for the thin-film pressure sensor according to claim 2, characterized in that, The voltage divider circuit includes a voltage divider resistor, which is connected in series with the pressure sensor of the thin film to be tested through the connector. The series node is connected to the main control chip, and the other end of the voltage divider resistor is grounded.

4. The testing system for the thin-film pressure sensor according to claim 1, characterized in that, The pressure measurement module includes a push-pull force gauge, which is connected to the lifting module and the host computer. The lifting module drives the push-pull force gauge to descend at a constant speed so that the measuring end of the push-pull force gauge presses against the pressure sensor of the thin film to be measured.

5. The testing system for the thin-film pressure sensor according to claim 2, characterized in that, The main control chip has a built-in non-volatile memory, which is used to store the calibration file. The main control chip is also used to calibrate the pressure acquisition value output by the thin-film pressure sensor under test according to the calibration file and then output it.

6. The testing system for the thin-film pressure sensor according to claim 5, characterized in that, The testing system also includes a display module, which is connected to the main control chip and is used to display the pressure value after calibration by the calibration file.

7. The testing system for the thin-film pressure sensor according to claim 1, characterized in that, The host computer is equipped with a display interface, which is used to display the pressure calibration value and the corresponding pressure acquisition value.

8. The testing system for the thin-film pressure sensor according to any one of claims 1-7, characterized in that, The testing system also includes a work platform with a positioning slot for placing and positioning the pressure sensor of the thin film to be tested. The lifting module is installed on the work platform.

9. The testing system for the thin-film pressure sensor according to claim 2, characterized in that, The testing system also includes a signal conversion module and an interface module. The signal conversion module is located between the main control chip and the interface module, and is used to convert the digital signal output by the main control chip into a serial port signal, and transmit it to the host computer through the interface module.

10. The testing system for the thin-film pressure sensor according to claim 9, characterized in that, The signal conversion module includes a serial port conversion chip, and the interface module includes a Type-C interface. The serial port conversion chip is connected to the main control chip and the Type-C interface, and the Type-C interface is also connected to a host computer.

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