optical module

Abstract

This application provides an optical module including a circuit board, conductive lines, and multiple laser components. The laser components are arranged side-by-side on one side of the circuit board. The circuit board has a ground connection line and multiple sets of circuit board transmission lines arranged side-by-side, each set of circuit board transmission lines corresponding to one laser component. The ground connection line extends along the side-by-side direction of the circuit board transmission lines on the side adjacent to the laser component, and electrically connects to the first and second circuit board ground lines of each set of circuit board transmission lines to surround the circuit board signal lines of each set of circuit board transmission lines. Each laser component includes a laser signal line and a laser ground line. The laser ground line surrounds the laser signal line from the side of the laser signal line closest to the circuit board. Furthermore, multiple parallel conductive lines are added between the ground connection line and the laser ground line. This effectively reduces electromagnetic interference and improves the integrity of the ground return path, thereby increasing the optical module speed.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] In the field of optical communication technology, with the continuous improvement of data transmission rates, the requirements for signal integrity are also constantly increasing. High-speed optical modules, as key components in optical communication systems, are responsible for converting electrical signals into optical signals and transmitting them efficiently. The performance of high-speed optical modules directly affects the stability and transmission efficiency of the entire communication system. The transmission of high-speed electrical signals is a crucial component of optical modules, requiring the assurance of signal integrity during transmission and the reduction of signal loss and interference.

[0003] However, existing optical modules still suffer from problems such as electromagnetic interference (EMI) and crosstalk, which greatly affect the integrity and stability of high-speed transmission signals, making it difficult to further improve the high-speed transmission rate. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this application is to provide an optical module that solves the problem that existing optical modules are affected by electromagnetic interference and inter-channel crosstalk, making it difficult to further improve high-speed transmission rates.

[0005] To achieve one of the above-mentioned application objectives, one embodiment of this application provides an optical module, including a circuit board, conductive lines, and multiple laser components, wherein the multiple laser components are arranged side by side on one side of the circuit board;

[0006] The circuit board is provided with a ground connection line and multiple sets of circuit board transmission lines. The multiple sets of circuit board transmission lines are arranged side by side. Each set of circuit board transmission lines corresponds to one of the laser components. The first end of each set of circuit board transmission lines is adjacent to the laser component. The ground connection line extends along the side-by-side direction of the multiple sets of circuit board transmission lines on one side of the first end of the circuit board transmission line.

[0007] Each set of circuit board transmission lines includes a first circuit board ground line, a circuit board signal line, and a second circuit board ground line that extend side by side in sequence and are insulated from each other. The first circuit board ground line and the second circuit board ground line of each set of circuit board transmission lines are both connected to the ground connection line. The circuit board signal line of each set of circuit board transmission lines is insulated from the ground connection line.

[0008] Each laser assembly includes an LD substrate and a laser chip. The LD substrate has laser signal lines and laser ground lines. The laser chip is mounted on the LD substrate and electrically connected to the laser signal lines and laser ground lines. The laser signal lines and laser ground lines are insulated from each other. The laser ground lines include a first laser ground line, a second laser ground line, and a third laser ground line. The first laser ground line, the laser signal line, and the second laser ground line extend side by side in sequence. The third laser ground line is located on the side of the laser signal line closest to the circuit board and connects the first laser ground line and the second laser ground line.

[0009] The conductive lines include a first conductive line and a second conductive line. The laser grounding line of each laser component is electrically connected to the grounding connection line on the circuit board through multiple parallel second conductive lines. The laser signal line of each laser component is electrically connected to the circuit board signal line through multiple parallel first conductive lines, and the first conductive line crosses over the second conductive line.

[0010] As a further improvement of one embodiment of this application, a plurality of second conductive wires are spaced apart along the extension direction of the grounding connection wire.

[0011] As a further improvement of one embodiment of this application, the laser ground wire of each laser assembly is also connected to the first circuit board ground wire and the second circuit board ground wire of a corresponding set of circuit board transmission lines via multiple parallel second conductive wires.

[0012] As a further improvement of one embodiment of this application, the LD substrate is further provided with a first ground plane, and the laser chip is mounted on the first ground plane;

[0013] The conductive line also includes multiple third conductive lines, and the first ground plane is electrically connected to the ground connection line on the circuit board through the multiple third conductive lines.

[0014] As a further improvement of one embodiment of this application, multiple third conductive wires are spaced apart along the extension direction of the grounding connection wire.

[0015] As a further improvement of one embodiment of this application, multiple third conductive lines are provided on both sides of the multiple second conductive lines electrically connected between each laser component and the corresponding set of circuit board transmission lines.

[0016] As a further improvement of one embodiment of this application, the conductive line further includes multiple fourth conductive lines, and the first ground planes of two adjacent laser components are electrically connected through the multiple fourth conductive lines.

[0017] As a further improvement of one embodiment of this application, multiple fourth conductive lines are arranged side by side along the opposite edges of the LD substrates of two adjacent laser assemblies.

[0018] As a further improvement of one embodiment of this application, the laser assembly further includes an RF substrate, which is mounted on the first ground plane;

[0019] The laser signal line and the laser ground line are located on the upper surface of the RF substrate away from the LD substrate. The lower surface of the RF substrate facing the LD substrate has a second ground plane. The laser ground line is electrically connected to the second ground plane and is electrically connected to the first ground plane through the second ground plane.

[0020] As a further improvement of one embodiment of this application, the third laser grounding wire is disposed at one end of the RF substrate near the circuit board and extends along the edge of the RF substrate adjacent to the circuit board.

[0021] As a further improvement of one embodiment of this application, the circuit board is a multilayer circuit board, and the circuit board signal line includes a first sub-signal line and a second sub-signal line. The first sub-signal line is located on the surface layer of the multilayer circuit board and is connected to the first conductive line. The second sub-signal line is located on the inner layer of the multilayer circuit board and is electrically connected to the first sub-signal line through a conductive via.

[0022] As a further improvement of one embodiment of this application, the laser assembly is located outside the circuit board and is disposed close to the edge of the circuit board; the grounding connection line is disposed at one end of the circuit board close to the laser assembly and extends along the edge of the circuit board.

[0023] As a further improvement of one embodiment of this application, the laser signal line includes a single signal line or a pair of differential signal lines;

[0024] The circuit board signal lines include a single signal line or a pair of differential signal lines.

[0025] As a further improvement of one embodiment of this application, the conductive line further includes multiple fifth conductive lines, and multiple fifth conductive lines are connected between each laser component and the corresponding circuit board transmission line; the fifth conductive lines are respectively connected to one of the first circuit board ground line, the second circuit board ground line, the ground connection line and the laser ground line, and the multiple fifth conductive lines cross over the first conductive line and are arranged to intersect above the first conductive line.

[0026] As a further improvement of one embodiment of this application, the LD substrate of the plurality of laser components is integrally formed.

[0027] Compared with the prior art, this application has the following beneficial effects: The optical module of this application improves the multi-channel parallel transmission line design by adding ground connection lines to the circuit board to connect multiple circuit board transmission lines, so that the circuit board signal lines are surrounded by the first circuit board ground line, the second circuit board ground line, and the ground connection lines. A laser ground line is added at the end of the laser component near the circuit board to form a laser ground line design that surrounds the laser signal lines, thereby forming a shielding effect for both the circuit board signal lines and the laser signal lines, which can effectively reduce electromagnetic interference. At the same time, multiple parallel second conductive lines are added between the laser ground line and the ground connection lines on the circuit board, which can effectively improve the integrity of the ground return path between the laser component and the circuit board, thereby improving the high-frequency performance of the optical module and facilitating further improvement of the optical module speed. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the optical module in Embodiment 1 of this application;

[0029] Figure 2 This is a schematic diagram of the laser assembly according to Embodiment 1 of this application;

[0030] Figure 3 This is a longitudinal cross-sectional view of the laser assembly of Embodiment 1 of this application;

[0031] Figure 4 This is a schematic diagram of the circuit board transmission line of Embodiment 1 of this application;

[0032] Figure 5 This is another schematic diagram of the circuit board transmission line in Embodiment 1 of this application.

[0033] Figure 6 This is a schematic diagram of the optical module in Embodiment 2 of this application.

[0034] 100. Optical module; 1. Circuit board; 11. Grounding connection wire; 12. Circuit board transmission line; 121. First end; 122. First circuit board grounding wire; 123. Circuit board signal line; 1231. First sub-signal line; 1232. Second sub-signal line; 124. Second circuit board grounding wire; 13. Surface layer; 14. Inner layer; 15. Conductive via; 2. Conductive line; 21. First conductive line; 22. Second conductive line; 23. Third conductive line; 24. Fourth conductive line; 25. Fifth conductive line 3. Laser assembly; 31. LD substrate; 311. Laser signal line; 312. Laser ground line; 3121. First laser ground line; 3122. Second laser ground line; 3123. Third laser ground line; 313. First ground plane; 3131. First mounting area; 3132. Second mounting area; 3133. Non-mounting area; 32. Laser chip; 321. Signal electrode; 322. Ground electrode; 33. RF substrate; 331. Second ground plane. Detailed Implementation

[0035] The present application will now be described in detail with reference to the specific embodiments shown in the accompanying drawings.

[0036] In the various figures of this application, for ease of illustration, certain dimensions of structures or parts are enlarged relative to other structures or parts; therefore, they are only used to illustrate the basic structure of the subject matter of this application.

[0037] It should be understood that although the terms first, second, etc., may be used in this document to describe various elements or structures, the objects being described should not be limited by these terms. These terms are only used to distinguish these objects from one another.

[0038] Optical modules are key components in optical communication, used to transmit and receive optical signals, as well as convert optical signals into electrical signals, in fiber optic communication systems. An optical module typically includes a housing, a printed circuit board (PCB), and optical components, with the PCB and optical components housed within the housing. The PCB usually contains signal processors and drivers, such as DSPs (Digital Signal Processors) and CDRs (Clock and Data Recovery), as well as multiple signal transmission lines. The optical components of a high-speed optical module typically include a transmitting section and a receiving section. The transmitting section usually includes multiple laser components. Electrical signals are processed by drivers on the PCB, driving the laser components to emit modulated optical signals. This optical signal is then output from the optical module and transmitted via optical fiber to the receiving end of a remote optical module. In the receiving section, the received optical signal is converted into an electrical signal by a photodetector.

[0039] With the explosive growth of information volume, the demand for data centers is constantly increasing, and the requirements for transmission rates and bandwidth are also continuously rising. Optical modules are also developing towards multi-channel integration and miniaturization. However, the size of optical modules is limited by relevant standards and cannot be changed, making it difficult to further improve the transmission rate by increasing the number of internal signal channels. This application aims to improve the high-frequency performance of optical modules in order to further improve their transmission rate.

[0040] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0041] Example 1

[0042] See Figure 1 One embodiment of this application provides an optical module 100, including a circuit board 1, conductive lines 2, and multiple laser components 3. The multiple laser components 3 are arranged side by side on one side of the circuit board 1.

[0043] The circuit board 1 includes a grounding connection line 11 and multiple sets of circuit board transmission lines 12. These multiple sets of transmission lines 12 are arranged side-by-side. Each set of transmission lines 12 corresponds to a laser component 3. The first end 121 of each set of transmission lines 12 is adjacent to the laser component 3. The grounding connection line 11 extends along the parallel direction of the multiple sets of transmission lines 12 from one side of the first end 121. By arranging multiple laser components 3 side-by-side and corresponding one-to-one with the circuit board transmission lines 12, a multi-channel integrated design of the optical module 100 is achieved, thereby realizing a high-speed optical module.

[0044] In this embodiment, each set of circuit board transmission lines 12 includes a first circuit board ground line 122, a circuit board signal line 123, and a second circuit board ground line 124. The first circuit board ground line 122, the circuit board signal line 123, and the second circuit board ground line 124 extend side by side in sequence and are insulated from each other. The first circuit board ground line 122 and the second circuit board ground line 124 of each set of circuit board transmission lines 12 are both connected to the ground connection line 11. The circuit board signal line 123 of each set of circuit board transmission lines 12 is insulated from the ground connection line 11.

[0045] In this way, the optical module 100 improves the multi-channel parallel transmission line design by adding a ground connection line 11 to the circuit board 1 to connect the circuit board ground lines of multiple circuit board transmission lines 12, so that the circuit board signal line 123 is surrounded by the first circuit board ground line 122, the second circuit board ground line 124 and the ground connection line 11, thereby forming a shielding effect on the circuit board signal line 123 and effectively reducing electromagnetic interference.

[0046] Combination Figure 2 Each laser assembly 3 includes an LD substrate 31 and a laser chip 32. The LD substrate 31 is a laser substrate used to mount the laser chip 32.

[0047] The LD substrate 31 has a laser signal line 311 and a laser ground line 312. A laser chip 32 is mounted on the LD substrate 31 and electrically connected to the laser signal line 311 and the laser ground line 312. The laser signal line 311 and the laser ground line 312 are insulated from each other. The laser ground line 312 includes a first laser ground line 3121, a second laser ground line 3122, and a third laser ground line 3123. The first laser ground line 3121, the laser signal line 311, and the second laser ground line 3122 extend side-by-side sequentially. The third laser ground line 3123 is located on the side of the laser signal line 311 closest to the circuit board 1, and the third laser ground line 3123 connects to the first laser ground line 3121 and the second laser ground line 3122. Thus, by using a multi-channel parallel transmission line design, a laser grounding wire 312 is added to one end of the laser assembly 3 near the circuit board 1, forming a laser grounding wire design that surrounds the laser signal line 311, thereby creating a shielding effect on the laser signal line 311 and effectively reducing electromagnetic interference.

[0048] In this embodiment, the conductive line 2 includes a first conductive line 21 and a second conductive line 22. The laser ground line 312 of each laser assembly 3 is electrically connected to the ground connection line 11 on the circuit board 1 via multiple parallel second conductive lines 22. The laser signal line 311 of each laser assembly 3 is electrically connected to the circuit board signal line 123 via multiple parallel first conductive lines 21. Furthermore, the first conductive line 21 crosses over the second conductive lines 22.

[0049] Thus, by further adding multiple parallel second conductive lines 22 between the laser grounding line 312 and the grounding connection line 11 on the circuit board 1, the integrity of the ground return path between the laser assembly 3 and the circuit board 1 can be effectively improved, thereby enhancing the high-frequency performance of the optical module 100 and further improving the speed of the optical module 100.

[0050] The conductive wire 2 is preferably made of gold wire and can be connected by wire bonding process.

[0051] Multiple second conductive lines 22 are spaced apart along the extension direction of the grounding connection line 11. This spaced arrangement of multiple second conductive lines 22 creates a more balanced ground return path between the laser assembly and the circuit board. Furthermore, the multiple second conductive lines 22 are evenly distributed below the first conductive line, providing better electromagnetic shielding and reducing interference.

[0052] See Figures 1 to 5The LD substrate 31 is also provided with a first ground plane 313, and the laser chip 32 is mounted on the first ground plane 313. The first ground plane 313 provides a reference ground plane for the laser chip 32.

[0053] The conductive line 2 also includes multiple third conductive lines 23. The first ground plane 313 is electrically connected to the ground connection line 11 on the circuit board 1 through the multiple third conductive lines 23. By connecting the first ground plane 313 and the ground connection line 11 through the multiple third conductive lines 23, the integrity of the return ground between the LD substrate 31, i.e., the laser substrate, and the circuit board 1 is ensured.

[0054] Multiple third conductive lines 23 are spaced apart along the extension direction of the grounding connection line 11. The spaced distribution of multiple third conductive lines 23 can optimize the grounding current distribution, reduce the inductive effect between the first grounding plane 313 and the circuit board 1, and improve high-frequency response characteristics.

[0055] Multiple second conductive lines 22 electrically connected between each laser component 3 and a corresponding set of circuit board transmission lines 12 have multiple third conductive lines 23 on both sides.

[0056] In other words, between each laser component 3 and its corresponding set of circuit board transmission lines 12, there are multiple third conductive lines 23 distributed on both sides of multiple second conductive lines 22.

[0057] Thus, the third conductive line 23 forms a local shielding structure on both sides of the second conductive line 22, which can reduce signal interference between adjacent channels. In addition, the third conductive lines 23 located on both sides can provide the shortest ground return path for high-frequency signals, thereby further improving high-frequency performance.

[0058] See Figure 1 The conductive line 2 also includes multiple fourth conductive lines 24. The first ground planes 313 of two adjacent laser components 3 are electrically connected via these multiple fourth conductive lines 24. Thus, by achieving equipotential connection of the first ground planes 313 of two adjacent laser components 3 through the multiple fourth conductive lines 24, the radiated signals between channels can flow better to the ground plane, avoiding crosstalk between channels, and also reducing interference from the radiated signals at the transmitting end to the receiving end.

[0059] Multiple fourth conductive lines 24 are arranged side-by-side along the opposite edges of the LD substrates 31 of two adjacent laser components 3. That is, each fourth conductive line 24 connects to the opposite edges of the LD substrates 31 of two adjacent laser components 3. In this way, not only can the central area of ​​the LD substrate 31 be avoided, thus leaving layout space for other components, but the grounding path can also be effectively shortened, parasitic inductance reduced, and the stability of multi-component collaborative operation improved.

[0060] See Figures 1 to 5 The laser assembly 3 also includes an RF substrate 33, which is mounted on a first ground plane 313.

[0061] Among them, the RF substrate 33 is a radio frequency substrate used to set the laser signal line 311 and the laser ground line 312 of the laser assembly 3.

[0062] Specifically, the first ground plane 313 includes a first mounting area 3131, a second mounting area 3132, and a non-mounting area 3133. The RF substrate 33 is disposed in the first mounting area 3131, and the laser chip 32 is disposed in the second mounting area 3132. The non-mounting area 3133 is the area on the first ground plane 313 other than the first mounting area 3131 and the second mounting area 3132. The third conductive line 23 connects the non-mounting area 3133 and the ground connection line 11 on the circuit board 1.

[0063] See Figure 2 The laser chip 32 has a signal electrode 321 and a ground electrode 322. An RF substrate 33 is spaced apart from the laser chip 32. A laser signal line 311 is connected to the signal electrode 321, forming a signal transmission path between them. A laser ground line 312 is connected to the ground electrode 322, forming a grounding path between them. Two ground electrodes 322 are provided, and each ground electrode 322 is connected to a first laser ground line 3121 and a second laser ground line 3122, respectively.

[0064] The laser signal line 311 and the laser ground line 312 are located on the upper surface of the RF substrate 33 away from the LD substrate 31.

[0065] Combination Figure 3 The upper surface of the RF substrate 33 is roughly flush with the upper surface of the laser chip 32 to shorten the length of the wiring between the signal line, the ground line and the laser chip 32, thereby optimizing the impedance characteristics of the high-frequency link and improving high-frequency performance.

[0066] See Figure 4 and Figure 5 The RF substrate 33 has a second ground plane 331 on its lower surface facing the LD substrate 31. The laser ground line 312 is electrically connected to the second ground plane 331. The RF substrate 33 can be soldered to the LD substrate 31 through the two ground planes, and the laser ground line 312 can be electrically connected to the first ground plane 313 through the second ground plane 331.

[0067] See Figure 1The third laser grounding line 3123 is located at the end of the RF substrate 33 near the circuit board 1, and extends along the edge of the RF substrate 33 adjacent to the circuit board 1. This significantly shortens the distance between the third laser grounding line 3123 and the grounding connection line 11 of the circuit board 1, reducing the transmission path of the grounding loop, lowering the grounding loop impedance and parasitic inductance, reducing the impact of grounding inductance on the rise time of high-speed signals, and improving signal return efficiency and package bandwidth.

[0068] That is, the first laser grounding wire 3121, the third laser grounding wire 3123, and the second laser grounding wire 3122 are connected in sequence to form a U-shaped laser grounding wire 312 with an opening, and the U-shaped laser grounding wire 312 surrounds the outside of the laser signal line 311.

[0069] See Figure 4 The circuit board 1 is a multilayer circuit board. The circuit board signal line 123 includes a first sub-signal line 1231 and a second sub-signal line 1232. The first sub-signal line 1231 is located on the surface layer 13 of the multilayer circuit board 1 and is connected to the first conductive line 21. The second sub-signal line 1232 is located on the inner layer 14 of the multilayer circuit board 1 and is electrically connected to the first sub-signal line 1231 through a conductive via 15.

[0070] By employing a multi-layer circuit board and placing a portion of the circuit board signal line 123 in the inner layer while retaining the portion connected to the first conductive line 21 in the outer layer, electromagnetic radiation interference can be reduced. Correspondingly, the first circuit board ground line 122 and the second circuit board ground line 124 also adopt the same design, retaining the portion connected to the second conductive line 22 in the outer layer, while the remaining portion of the ground line is located in the same inner layer as the second sub-signal line 1232, thus shielding the circuit board signal line 123.

[0071] See Figure 5 In other embodiments, the circuit board signal line 123 may also be located entirely on the surface layer 13 of the circuit board 1. This can reduce production costs and process complexity.

[0072] The laser assembly 3 is located on the outside of the circuit board 1, and the laser assembly 3 is positioned close to the edge of the circuit board 1.

[0073] The grounding connection line 11 is located at one end of the circuit board 1 near the laser assembly 3, and the grounding connection line 11 extends along the edge of the circuit board 1 toward the laser assembly 3.

[0074] This ensures that the radiated signals between channels can flow better to the grounding connection line, and then to the reference ground through the grounding connection line and the circuit board grounding line, thereby reducing crosstalk between channels.

[0075] The laser signal line 311 includes a single signal line for single-ended signal transmission; or, the laser signal line 311 includes a pair of differential signal lines for differential signal transmission. This allows for design based on different signal transmission modes to suit various application scenarios.

[0076] Similarly, the circuit board signal line 123 may also include a single signal line for use in a single-ended signal transmission mode; or, the circuit board signal line 123 may include a pair of differential signal lines for use in a differential signal transmission mode, thus matching the type of the laser signal line 311.

[0077] In this embodiment, the LD substrates 31 of the multiple laser components 3 are independent of each other. This improves the flexibility of the optical module 100, allowing the number of laser components 3 to be selected according to actual channel requirements.

[0078] In other embodiments, the LD substrate 31 of multiple laser components 3 can also be integrally formed. This can reduce assembly errors, improve the alignment accuracy between the laser components 3, and reduce production costs and complexity.

[0079] Example 2

[0080] The optical module 100 in this embodiment is basically the same as that in the previous embodiment 1, except that:

[0081] See Figure 6 The conductive line 2 also includes multiple fifth conductive lines 25, with each laser component 3 connected to the corresponding circuit board transmission line 12 via multiple fifth conductive lines 25. The fifth conductive lines 25 are respectively connected to one of the first circuit board grounding line 122, the second circuit board grounding line 124, the grounding connection line 11, and the laser grounding line 312. The multiple fifth conductive lines 25 cross over the first conductive line 21, and are arranged intersecting above the first conductive line 21.

[0082] like Figure 6As shown, in this embodiment, two intersecting fifth conductive lines 25 are provided between the laser assembly 3 and the circuit board transmission line 12 corresponding to each channel. Both fifth conductive lines 25 cross over the first conductive line 21, and their intersection is located directly above the first conductive line 21, forming a better electromagnetic shielding effect above the first conductive line 21 to further reduce interference. In the illustration, one fifth conductive line 25 is electrically connected to the first circuit board ground line 122 and the second laser ground line 3122, and the other fifth conductive line 25 is electrically connected to the second circuit board ground line 124 and the first laser ground line 3121. In other embodiments, the number of fifth conductive lines 25 can also be greater, such as 4 or 6. The fifth conductive wire 25 can also be electrically connected between the grounding connection wire 11 and the third laser grounding wire 3123, or between the grounding connection wire 11 and the first laser grounding wire 3121, or between the grounding connection wire 11 and the second laser grounding wire 3122, or between the first circuit board grounding wire 11 and the third laser grounding wire 3123, or between the second circuit board grounding wire 124 and the third laser grounding wire 3123, etc. As long as multiple fifth conductive wires 25 cross over the first conductive wire 21 and intersect above the first conductive wire 21, it is acceptable.

[0083] Apart from the differences mentioned above, the remaining technical content is exactly the same as in Embodiment 1 above, and will not be repeated here.

[0084] The optical module 100 provided in this application improves the multi-channel parallel transmission line design. A ground connection line 11 is added to the circuit board 1 to connect the circuit board ground lines of multiple circuit board transmission lines 12, so that the circuit board signal line 123 is surrounded by the first circuit board ground line 123, the second circuit board ground line 124, and the ground connection line 11. A laser ground line 312 is added at the end of the laser assembly 3 near the circuit board 1 to form a laser ground line design surrounding the laser signal line 311, thereby forming a shielding effect for the circuit board signal line 123 and the laser signal line 311, which can effectively reduce electromagnetic interference. At the same time, multiple parallel second conductive lines 22 are added between the laser ground line 312 and the ground connection line 11 on the circuit board 1, which can effectively improve the integrity of the ground return path between the laser assembly 3 and the circuit board 1, thereby improving the high-frequency performance of the optical module 100 and further improving the speed of the optical module 100.

[0085] The above description is merely a specific embodiment of the present invention, but the present invention is not limited thereto. Various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the appended claims.

[0086] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0087] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

Claims

1. An optical module, characterized in that, It includes a circuit board, conductive lines, and multiple laser components, with the multiple laser components arranged side by side on one side of the circuit board; The circuit board is provided with a ground connection line and multiple sets of circuit board transmission lines. The multiple sets of circuit board transmission lines are arranged side by side. Each set of circuit board transmission lines corresponds to one of the laser components. The first end of each set of circuit board transmission lines is adjacent to the laser component. The ground connection line extends along the side-by-side direction of the multiple sets of circuit board transmission lines on one side of the first end of the circuit board transmission line. Each set of circuit board transmission lines includes a first circuit board ground line, a circuit board signal line, and a second circuit board ground line that extend side by side in sequence and are insulated from each other. The first circuit board ground line and the second circuit board ground line of each set of circuit board transmission lines are both connected to the ground connection line. The circuit board signal line of each set of circuit board transmission lines is insulated from the ground connection line. Each laser assembly includes an LD substrate and a laser chip. The LD substrate has laser signal lines and laser ground lines. The laser chip is mounted on the LD substrate and electrically connected to the laser signal lines and laser ground lines. The laser signal lines and laser ground lines are insulated from each other. The laser ground lines include a first laser ground line, a second laser ground line, and a third laser ground line. The first laser ground line, the laser signal line, and the second laser ground line extend side by side in sequence. The third laser ground line is located on the side of the laser signal line closest to the circuit board and connects the first laser ground line and the second laser ground line. The conductive lines include a first conductive line and a second conductive line. The laser grounding line of each laser component is electrically connected to the grounding connection line on the circuit board through multiple parallel second conductive lines. The laser signal line of each laser component is electrically connected to the circuit board signal line through multiple parallel first conductive lines, and the first conductive line crosses over the second conductive line.

2. The optical module according to claim 1, characterized in that, Multiple second conductive wires are spaced apart along the extension direction of the grounding connection wire.

3. The optical module according to claim 1, characterized in that, The laser ground wire of each laser assembly is also connected to the first circuit board ground wire and the second circuit board ground wire of the corresponding set of circuit board transmission lines via multiple parallel second conductive wires.

4. The optical module according to claim 1, characterized in that, The LD substrate is further provided with a first ground plane, and the laser chip is mounted on the first ground plane; The conductive line also includes multiple third conductive lines, and the first ground plane is electrically connected to the ground connection line on the circuit board through the multiple third conductive lines.

5. The optical module according to claim 4, characterized in that, Multiple third conductive wires are spaced apart along the extension direction of the grounding connection wire.

6. The optical module according to claim 4, characterized in that, Each of the multiple second conductive lines electrically connected between each laser component and a corresponding set of circuit board transmission lines has multiple third conductive lines on both sides.

7. The optical module according to claim 4, characterized in that, The conductive line also includes multiple fourth conductive lines, and the first ground planes of two adjacent laser components are electrically connected through the multiple fourth conductive lines.

8. The optical module according to claim 7, characterized in that, Multiple fourth conductive lines are arranged side-by-side along the opposite edges of the LD substrates of two adjacent laser assemblies.

9. The optical module according to any one of claims 4 to 8, characterized in that, The laser assembly also includes an RF substrate, which is mounted on the first ground plane; The laser signal line and the laser ground line are located on the upper surface of the RF substrate away from the LD substrate. The lower surface of the RF substrate facing the LD substrate has a second ground plane. The laser ground line is electrically connected to the second ground plane and is electrically connected to the first ground plane through the second ground plane.

10. The optical module according to claim 9, characterized in that, The third laser grounding wire is located at one end of the RF substrate near the circuit board and extends along the edge of the RF substrate adjacent to the circuit board.

11. The optical module according to claim 1, characterized in that, The circuit board is a multilayer circuit board, and the circuit board signal lines include a first sub-signal line and a second sub-signal line. The first sub-signal line is located on the surface layer of the multilayer circuit board and is connected to the first conductive line. The second sub-signal line is located on the inner layer of the multilayer circuit board and is electrically connected to the first sub-signal line through a conductive via.

12. The optical module according to claim 1, characterized in that, The laser assembly is located outside the circuit board and close to the edge of the circuit board; the grounding connection line is located at one end of the circuit board close to the laser assembly and extends along the edge of the circuit board.

13. The optical module according to claim 1, characterized in that, The laser signal line includes a single signal line or a pair of differential signal lines; The circuit board signal lines include a single signal line or a pair of differential signal lines.

14. The optical module according to claim 1, characterized in that, The conductive line also includes multiple fifth conductive lines, and each laser component is connected to the corresponding circuit board transmission line via multiple fifth conductive lines. The fifth conductive lines are respectively connected to one of the first circuit board grounding line, the second circuit board grounding line, the grounding connection line, and the laser grounding line, and the multiple fifth conductive lines cross over the first conductive line and are arranged to intersect above the first conductive line.

15. The optical module according to claim 1, characterized in that, The LD substrate of the multiple laser components is integrally formed.

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