A platform temperature precision control device

By setting thermocouple sensors and independently controlled heating wires on the film-coating platform, combined with a closed-loop temperature control system using sliding rheostats and solid-state relays, the problem of uneven temperature control on the film-coating platform was solved, achieving high-precision temperature control and improving wafer film-coating quality and equipment consistency.

CN224436822UActive Publication Date: 2026-06-30SHENZHEN HESHENG SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN HESHENG SEMICONDUCTOR EQUIPMENT CO LTD
Filing Date
2025-09-23
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The existing film-coating platform has insufficient temperature control uniformity and precision, leading to problems such as poor wafer film coating and wafer damage.

Method used

The platform surface temperature is collected in real time using thermocouple sensors. Combined with the fine adjustment of heating wire current by sliding rheostat and the rapid on/off control by solid-state relay, a closed-loop temperature control system is constructed. Temperature uniformity and accuracy are improved by using four sets of serpentine heating wires with independent zone control.

Benefits of technology

It significantly improves the uniformity and accuracy of temperature control on the film application platform, solves the problems of poor film application and wafer damage, and improves wafer film application yield and process consistency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of wafer manufacturing technology. To address the technical problem of insufficient uniformity and precision in temperature control of existing film-coating platforms, this utility model discloses a precise temperature control device for the platform. A heating plate is mounted above a mounting base, and a film-coating platform is mounted above the heating plate. A thermocouple sensor is positioned between the two. A heating wire is arranged inside the heating plate. The device includes a sliding rheostat, a solid-state relay for controlling power supply switching, and a circuit breaker for controlling the main power supply. One end of the heating wire is connected to the first load side of the circuit breaker, and the other end is connected to the load side of the solid-state relay via the sliding rheostat. The power input terminal of the solid-state relay is connected to the second load side of the circuit breaker. The coil control terminal of the solid-state relay is connected to the drive terminal of a temperature controller, and the thermocouple sensor is connected to the temperature input terminal of the temperature controller. This device solves the problem of high-precision temperature control for the film-coating platform in wafer film-coating equipment.
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