An active heat sink for microcomputers

Abstract

This utility model belongs to the field of computer accessory technology, specifically an active heat sink for microcomputers. Existing CPU cooling solutions typically employ single-fan cooling or heatsinks, but these methods have poor heat dissipation performance. Furthermore, when using heatsinks, dust easily accumulates, significantly reducing CPU cooling efficiency. The proposed solution includes a base frame with four screw-fixed plates symmetrically mounted on its outer side. An mounting bracket is fixedly installed inside the base frame, and a support frame is fixedly mounted on the top. Multiple ventilation holes are evenly spaced on the four inner walls of the support frame. This utility model can absorb and dissipate the heat generated by the CPU during operation, and, combined with air cooling, effectively cools the dissipated heat, thus achieving stable CPU cooling and ensuring stable CPU operation.

Description

Technical Field

[0001] This utility model relates to the field of computer accessories technology, and in particular to an active heat sink for microcomputers. Background Technology

[0002] A microcomputer is a small electronic computer composed of large-scale integrated circuits. It is based on a microprocessor, equipped with internal memory, input / output (I / O) interface circuits, and corresponding auxiliary circuits. A complete microcomputer system consists of two main parts: hardware and software.

[0003] Currently, the internal space of microcomputers is relatively small, and the CPU cooling of their hardware components is generally achieved by using a single fan or heatsink. However, such cooling methods have poor heat dissipation performance, and when using heatsinks, dust easily accumulates on the heatsinks, which greatly reduces the cooling performance of the CPU. Therefore, we propose an active heatsink for microcomputers to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies where CPU cooling in hardware typically relies on single-fan cooling or heat sinks. However, such cooling methods have poor heat dissipation performance, and when using heat sinks, dust easily adheres to the heat sinks, significantly reducing the CPU's cooling performance. Therefore, this invention proposes an active heat sink for microcomputers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An active heatsink for a microcomputer includes a base frame, four screw-mounted plates symmetrically fixed to the outer side of the base frame, a mounting bracket fixedly installed inside the base frame, and a support bracket fixedly installed on the top of the base frame. Multiple ventilation holes are evenly spaced on the four inner walls of the support bracket. A heat-absorbing copper plate is fixedly installed inside the mounting bracket, and the bottom of the heat-absorbing copper plate is coated with a silicone ester coating. The silicone ester coating is used to absorb heat generated by the CPU. The active heatsink also includes:

[0007] The support mechanism is installed on top of the heat-absorbing copper plate. A heat dissipation mechanism is clamped on the support mechanism. The top of the heat dissipation mechanism extends above the support frame and contacts the top of the support frame.

[0008] The suction mechanism is installed on one side of the support frame and is used to remove the heat transferred to the heat dissipation mechanism.

[0009] The air blowing mechanism is installed on the other side of the support frame. The air blowing mechanism is used to blow air onto the heat dissipation mechanism, which can dissipate the heat transferred to the heat dissipation mechanism and blow off the dust that falls on the heat dissipation mechanism.

[0010] In one possible design, the support mechanism includes a conical heat-conducting plate fixedly installed on the top of the heat-absorbing copper plate, a positioning copper plate fixedly installed on the top of the conical heat-conducting plate, and multiple slots equally spaced on the top of the positioning copper plate, with the heat dissipation mechanism engaging with the multiple slots respectively.

[0011] In one possible design, the heat dissipation mechanism includes multiple heat dissipation copper fins, which are snapped into corresponding slots. Multiple air holes are equally spaced on the heat dissipation copper fins. The tops of the multiple heat dissipation copper fins extend above the support frame and are fixedly mounted with the same connecting plate, which is placed on top of the support frame.

[0012] In one possible design, a card plate is fixedly installed on the top of both sides of the support frame, and a hook is provided on the top of one side of the card plate, with both hooks engaging with the connecting plate.

[0013] In one possible design, the suction mechanism includes a first fixed frame fixedly installed on one side of the support frame, the first fixed frame having a first mounting hole, and multiple suction fans fixedly installed at equal intervals in the first mounting hole.

[0014] In one possible design, the air blowing mechanism includes a second fixed frame fixedly installed on the other side of the support frame. The second fixed frame is provided with a second mounting hole, and multiple air blowing fans are fixedly installed at equal intervals in the second mounting hole.

[0015] In this application, during use, the base frame is first installed on the computer motherboard by passing four screws through the corresponding screw fixing plates, ensuring the silicone coating is in close contact with the upper surface of the CPU. Then, multiple heat sinks are inserted into their corresponding slots, allowing them to make close contact with the positioning copper plates. Pushing the connecting plate downwards causes the heat sinks to engage with their corresponding slots. The connecting plate then presses against the hooks on the two mounting plates, bending them until the connecting plate contacts the top of the support frame. At this point, the connecting plate can move below the two hooks, and the mounting plates undergo elastic deformation, allowing the hooks to engage and limit the connection plate. This ensures close contact between the multiple heat sinks and the positioning copper plates, so when the CPU generates heat... The heat is absorbed by the heat-absorbing copper plate, then transferred to the positioning copper plate via the conical heat-conducting plate. Finally, the heat transferred to the positioning copper plate is dispersed and transferred to the heat sink copper fins. The multiple heat sink copper fins have certain gaps between them, allowing the heat to be dispersed. Then, multiple intake fans and multiple exhaust fans are activated. When the intake fans are working, they draw out the heat emitted by the heat sink copper fins, thereby reducing the heat within the support frame and enabling continuous cooling of the heat sink copper fins. When the exhaust fans are working, they blow air into the support frame, and the airflow direction is parallel to the direction in which the multiple heat sink copper fins are set. Therefore, while cooling the heat sink copper fins, it also prevents dust from falling onto them, thus achieving stable cooling of the CPU.

[0016] Beneficial effects: In this utility model, the active heat sink for a microcomputer can be inserted into multiple slots through a support mechanism, thereby enabling the heat sink to be positioned and installed. At the same time, it can make the heat sink in close contact with the positioning copper plate. When the heat-absorbing copper plate absorbs the heat from the CPU, it can transfer the heat to the positioning copper plate through the conical heat-conducting plate, thereby continuously delivering heat to the heat sink.

[0017] In this utility model, the active heat sink for a microcomputer can utilize a heat dissipation mechanism to insert multiple heat dissipation copper fins into corresponding slots, thereby enabling the heat dissipation copper fins to be in close contact with the positioning copper plate. This allows the heat transferred to the positioning copper plate to be dispersed and transferred to the heat dissipation copper fins. Furthermore, there is a certain gap between the multiple heat dissipation copper fins, which allows the heat transferred by the heat dissipation copper fins to be dispersed.

[0018] In this utility model, the active heat sink for microcomputers can be equipped with multiple suction fans installed on the outside of the support frame through the suction mechanism. This allows the heat emitted by the copper heat sink to be drawn out when the multiple suction fans are activated, thereby reducing the heat inside the support frame and enabling the copper heat sink to dissipate heat continuously.

[0019] In this utility model, the active heat sink for a microcomputer can blow air into the support frame after multiple air blowers are powered on through the air blowing mechanism. The air direction is parallel to the direction in which the multiple heat sink copper fins are set. Therefore, it can dissipate heat from the heat sink copper fins while preventing dust from falling on the heat sink copper fins, thereby achieving stable heat dissipation for the CPU.

[0020] This invention can absorb and dissipate the heat generated by the CPU during operation, and in conjunction with air cooling, it can cool the dissipated heat, thereby achieving stable heat dissipation for the CPU and ensuring stable CPU operation. Attached Figure Description

[0021] Figure 1 A three-dimensional schematic diagram of the overall structure of an active heat sink for a microcomputer proposed in this utility model;

[0022] Figure 2 A three-dimensional schematic diagram of the positioning plate and multiple heat dissipation copper fins of an active heat sink for a microcomputer proposed in this utility model.

[0023] Figure 3 A three-dimensional schematic diagram of the connection structure of the base frame, multiple screw fixing plates, silicone ester coating, conical heat-conducting plate and positioning copper plate of an active heat sink for microcomputers proposed in this utility model;

[0024] Figure 4 This is a three-dimensional schematic diagram of the base frame, mounting bracket, and heat-absorbing copper plate connection structure of an active heat sink for microcomputers proposed in this utility model.

[0025] In the diagram: 1. Base frame; 101. Mounting bracket; 2. Screw fixing plate; 3. Heat-absorbing copper plate; 4. Silicone ester coating; 5. Conical heat-conducting plate; 6. Positioning copper plate; 601. Slot; 7. Support frame; 701. Ventilation hole; 8. Clamping plate; 9. Heat dissipation copper fin; 10. Connecting plate; 11. First fixing bracket; 12. Intake fan; 13. Second fixing bracket; 14. Outtake fan. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Example 1: Refer to Figure 1-4A heat sink includes a base frame 1, with four screw mounting plates 2 symmetrically fixed to the outer side of the base frame 1 for securing the heat sink above the CPU of a microcomputer. The base frame 1 contains a mounting bracket 101 for mounting and securing internal components. A support frame 7 is fixed to the top of the base frame 1, and multiple ventilation holes 71 are evenly spaced on the four inner walls of the support frame 7 to enhance airflow.

[0028] A heat-absorbing copper plate 3 is fixed inside the mounting bracket 101, and the bottom of the heat-absorbing copper plate 3 is coated with a silicone ester coating 4. The silicone ester coating 4 has excellent thermal conductivity and is used to absorb the heat generated by the CPU.

[0029] To achieve effective heat dissipation, the radiator also includes a support mechanism, an air intake mechanism, and an air blowing mechanism.

[0030] The support mechanism consists of a conical heat-conducting plate 5 fixedly mounted on top of the heat-absorbing copper plate 3, with a positioning copper plate 6 fixed to the top of the conical heat-conducting plate 5. Multiple slots 601 are evenly spaced on the top of the positioning copper plate 6. The heat dissipation mechanism consists of multiple heat-dissipating copper fins 9, which are fitted into corresponding slots 601. Multiple air holes are evenly spaced on the heat-dissipating copper fins 9 to enhance heat dissipation. The tops of the multiple heat-dissipating copper fins 9 extend above the support frame 7 and are fixedly connected to the same connecting plate 10, which rests on top of the support frame 7.

[0031] Both sides of the support frame 7 are fixed with clamping plates 8, and a hook is provided on the top of one side of the clamping plate 8. When installing the heat dissipation mechanism, the connecting plate 10 is pushed downwards, so that multiple heat dissipation copper fins 9 are inserted into the corresponding slots 601. At this time, the connecting plate 10 will press the hooks on the two clamping plates 8, causing the clamping plates 8 to undergo elastic deformation. When the connecting plate 10 contacts the top of the support frame 7, the clamping plates 8 return to their original shape, and the hooks lock and limit the connection plate 10, thereby fixing the heat dissipation mechanism.

[0032] This application can be used in the field of computer accessories technology, or in other fields applicable to this application.

[0033] Example 2: Reference Figure 1 An improvement upon Embodiment 1: An active heat sink for microcomputers, applied in the field of computer accessory technology, comprises an air intake mechanism consisting of a first fixed frame 11 fixedly mounted on one side of a support frame 7 and multiple air intake fans 12 fixedly mounted at equal intervals on the first fixed frame 11. When the air intake fans 12 are activated, they can draw out the heat emitted by the heat sink copper fins 9, thereby reducing the temperature inside the support frame 7 and achieving continuous heat dissipation of the heat sink copper fins 9.

[0034] The air blowing mechanism consists of a second fixed frame 13 fixedly installed on the other side of the support frame 7 and multiple air blowing fans 14 fixedly installed at equal intervals on the second fixed frame 13. When the air blowing fans 14 are powered on, they blow air into the support frame 7, with the airflow direction parallel to the setting direction of the heat sink 9. This not only dissipates heat from the heat sink 9 but also prevents dust from falling onto it, thereby achieving stable heat dissipation for the CPU.

[0035] After the heat-absorbing copper plate 3 absorbs heat from the CPU, the heat is transferred to the positioning copper plate 6 through the conical heat-conducting plate 5, and then dispersed onto multiple heat dissipation copper fins 9. Because there are gaps between the heat dissipation copper fins 9, the heat is dissipated more effectively. Simultaneously, the synergistic effect of the intake fan 12 and the exhaust fan 14 ensures that heat is quickly carried away and prevents dust accumulation, thus ensuring the heat dissipation effect of the radiator.

[0036] However, as is well known to those skilled in the art, the working principles and wiring methods of the intake fan 12 and the cooling fan 14 are commonplace and are all conventional methods or common knowledge. They will not be described in detail here. Those skilled in the art can make any selections according to their needs or convenience.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An active heat sink for a microcomputer, comprising a base frame (1), four screw fixing plates (2) symmetrically fixed on the outer side of the base frame (1), and a mounting bracket (101) fixedly installed inside the base frame (1), characterized in that, A support frame (7) is fixedly installed on the top of the base frame (1). Multiple ventilation holes (701) are evenly spaced on the four inner walls of the support frame (7). A heat-absorbing copper plate (3) is fixedly installed inside the mounting bracket (101). The bottom of the heat-absorbing copper plate (3) is coated with a silicone ester coating (4). The silicone ester coating (4) is used to absorb the heat generated by the CPU. The active heat sink also includes: The support mechanism is installed on the top of the heat-absorbing copper plate (3). A heat dissipation mechanism is installed on the support mechanism. The top of the heat dissipation mechanism extends above the support frame (7) and contacts the top of the support frame (7). The suction mechanism is installed on one side of the support frame (7) and is used to remove the heat transferred to the heat dissipation mechanism. The air blowing mechanism is installed on the other side of the support frame (7). The air blowing mechanism is used to blow air onto the heat dissipation mechanism, which can dissipate the heat transferred to the heat dissipation mechanism and blow off the dust that falls on the heat dissipation mechanism.

2. The active heat sink for a microcomputer according to claim 1, characterized in that, The support mechanism includes a conical heat-conducting plate (5) fixedly installed on the top of the heat-absorbing copper plate (3). A positioning copper plate (6) is fixedly installed on the top of the conical heat-conducting plate (5). Multiple slots (601) are equally spaced on the top of the positioning copper plate (6), and the heat dissipation mechanism is respectively engaged with the multiple slots (601).

3. The active heat sink for a microcomputer according to claim 1, characterized in that, The heat dissipation mechanism includes multiple heat dissipation copper plates (9), which are installed in corresponding slots (601). Multiple air holes are opened at equal intervals on the heat dissipation copper plates (9). The tops of the multiple heat dissipation copper plates (9) extend to the top of the support frame (7) and are fixedly installed with the same connecting plate (10). The connecting plate (10) is placed on the top of the support frame (7).

4. The active heat sink for a microcomputer according to claim 3, characterized in that, The support frame (7) has a card plate (8) fixedly installed on the top of both sides. A hook is provided on the top of one side of the card plate (8), and both hooks are engaged with the connecting plate (10).

5. The active heat sink for a microcomputer according to claim 1, characterized in that, The suction mechanism includes a first fixed frame (11) fixedly installed on one side of the support frame (7). The first fixed frame (11) is provided with a first mounting hole, and multiple suction fans (12) are fixedly installed at equal intervals in the first mounting hole.

6. The active heat sink for a microcomputer according to claim 1, characterized in that, The air blowing mechanism includes a second fixed frame (13) fixedly installed on the other side of the support frame (7). The second fixed frame (13) is provided with a second mounting hole, and multiple air blowing fans (14) are fixedly installed at equal intervals in the second mounting hole.

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