A domestically produced ruggedized liquid-cooled general-purpose GPGPU module
Through domestic design and liquid cooling technology, the stability and heat dissipation issues of general-purpose GPGPU modules in extreme environments have been solved, achieving optimized space utilization and efficient computing power output, meeting the needs of military, automotive and other scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN GUOXINYUN INTELLIGENT INFORMATION TECHNOLOGY CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-06-30
AI Technical Summary
Existing general-purpose GPGPU modules lack rugged design and cannot meet the needs of military, vehicle, and field operations. Furthermore, the GPU chips rely on imports and cannot meet the requirements for domestic production. They also have low space utilization and insufficient heat dissipation performance.
Adopting a domestically designed architecture, it integrates power conversion circuits, CPU control unit, GPU control unit, and management unit on the same baseboard module. It uses domestically produced DC/DC power conversion chips and a 16-core processor, supports the PCIe Gen5 protocol, and features a surface-mount GPU chip. Combined with a liquid cooling module, it employs pure copper microchannel heat dissipation blocks and liquid cooling interfaces to meet the requirements of extreme environment adaptability and high-load heat dissipation.
It achieves stable operation in extreme environments, meets the impact resistance requirements of military vehicle scenarios, saves more than 35% of space, improves heat dissipation efficiency, stabilizes GPU junction temperature at 75℃±3℃, eliminates the risk of frequency reduction, and maintains a peak computing power of 12TFLOPS.
Smart Images
Figure CN224436888U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of GPGPU module technology, and in particular to a domestically produced reinforced liquid-cooled general-purpose GPGPU module. Background Technology
[0002] Traditional general-purpose GPGPU modules are centered around a GPU chip, enabling CPU-GPGPU heterogeneous computing via PCIe Gen3 / Gen4 buses to meet the ever-increasing computing power demands. Application scenarios include, but are not limited to, AI training / inference, scientific computing, graphics rendering, and edge computing. However, the following problems exist: 1. Existing modules lack ruggedized design, failing to meet the needs of military, automotive, and field operations; 2. The GPU design uses a daughter card format, significantly occupying internal module space; 3. The GPU chips have long relied on imported products from manufacturers such as NVIDIA and Intel, failing to meet the 100% domestic production requirements of certain fields. Utility Model Content
[0003] To address the aforementioned technical problems, this utility model provides a domestically produced ruggedized liquid-cooled general-purpose GPGPU module, comprising: a power conversion circuit A, a CPU control unit B, a GPU control unit C, and a management unit D; the input terminal of the power conversion circuit A is connected to an external DC power supply, and the output terminal is connected to the power supply terminals of the CPU control unit B, the GPU control unit C, and the management unit D, respectively; the CPU control unit B is connected to the GPU control unit C via a PCIe X16 interface.
[0004] The management unit D is connected to the CPU control unit B, GPU control unit C and power conversion circuit A via an I2C bus; the power conversion circuit A, CPU control unit B, GPU control unit C and management unit D are integrated on the same module substrate module.
[0005] Furthermore, the chips of the power conversion circuit A, CPU control unit B, and management unit D are all fixed to the substrate module in a board-mount form.
[0006] Furthermore, the substrate module integrates a liquid cooling heat dissipation module, including a liquid cooling heat conduction block covering the GPU control unit C and the CPU control unit B, as well as a liquid cooling interface for connecting external pipelines.
[0007] Furthermore, the power conversion circuit A uses a domestically produced DC / DC power conversion chip to convert the external 12V DC power into the operating voltage required by each unit.
[0008] Furthermore, the CPU control unit B uses a domestically produced 16-core processor, has 32GB of DDR5 memory chips mounted on the board, and supports the PCIe Gen5 protocol.
[0009] Furthermore, the GPU control unit C uses a domestically produced GPU chip, which supports FP32, FP16 and INT8 multi-precision mixed computing.
[0010] Furthermore, the management unit D collects voltage and temperature signals within the module via the I2C bus and uploads them to an external system.
[0011] The beneficial effects of this utility model are as follows: Improved adaptability to extreme environments: All chips adopt board-mount soldering + underfill adhesive filling process, combined with daughter card-less design, and pass the 20Grms random vibration test of GB / T 2423.10-2019 standard (the failure threshold of traditional modules is only 5Grms), meeting the impact resistance requirements of military vehicle scenarios; Revolutionary optimization of space utilization: The GPU chip is directly integrated into the substrate, saving more than 35% of the internal space of the module, making compact and ruggedized equipment possible; Qualitative improvement in high-load heat dissipation efficiency: The pure copper microchannel heat conduction block and liquid cooling interface (G1 / 4 dual inlet and dual outlet) form a closed-loop heat dissipation. Under a continuous GPU load of 300W, the junction temperature is stable at 75℃±3℃ (traditional air cooling ≥105℃), completely eliminating the risk of frequency reduction, and maintaining a peak computing power of 12TFLOPS. Attached Figure Description
[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0013] Figure 1 This is a connection diagram of the domestically produced reinforced liquid-cooled general-purpose GPGPU module of this utility model;
[0014] In the picture: Detailed Implementation
[0015] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.
[0016] The embodiments of this utility model are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Rather, the embodiments of this utility model include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.
[0017] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
[0018] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0019] like Figure 1 As shown, this utility model provides a domestically produced ruggedized liquid-cooled general-purpose GPGPU module, including: a power conversion circuit A, a CPU control unit B, a GPU control unit C, and a management unit D; the input terminal of the power conversion circuit A is connected to an external DC power supply, and the output terminal is connected to the power supply terminals of the CPU control unit B, the GPU control unit C, and the management unit D respectively; the CPU control unit B is connected to the GPU control unit C via a PCIe X16 interface.
[0020] The management unit D is connected to the CPU control unit B, GPU control unit C and power conversion circuit A via an I2C bus; the power conversion circuit A, CPU control unit B, GPU control unit C and management unit D are integrated on the same module substrate; the power conversion circuit A uses a domestic DC / DC power conversion chip to convert the external 12V DC power into the working voltage required by each unit; the chips of the power conversion circuit A, CPU control unit B and management unit D are all fixed to the substrate module in a board-mount form.
[0021] The baseboard module mainly consists of a power conversion circuit A, a CPU control unit B, a GPU control unit C, and a management unit D. The power conversion circuit A in this baseboard module uses domestically produced DC / DC power conversion chips to convert the power required by each chip in the module from an external 12V DC.
[0022] The CPU control unit B uses a domestically produced 16-core processor, has 32GB of DDR5 memory chips mounted on the board, and supports the PCIe Gen5 protocol.
[0023] The CPU control unit B of this baseboard module uses the domestic Phytium Tengyun S5000C / 16-core processor, with 32GB DDR5 memory chips mounted on the board. It supports PCIE GEN5 and is backward compatible. It connects to the GPU control unit C via PCIE X16, providing industry-leading computing performance, memory access bandwidth and IO expansion capabilities for edge computing and centralized storage.
[0024] The GPU control unit C uses a domestically produced GPU chip, which supports FP32, FP16 and INT8 multi-precision mixed computing.
[0025] The GPU control unit C of this baseboard module uses the domestic Tianshu Zhixin MRC-V100-3165J chip. The chip supports multi-precision mixed computing such as FP32, FP16, and INT8, realizing general computing and AI inference functions. Moreover, the GPU chip is a board-mount design, abandoning the traditional daughter card form, which can save a lot of space in the module.
[0026] Furthermore, the substrate module integrates a liquid cooling system, including a liquid cooling heat conduction block covering the GPU control unit C and the CPU control unit B, as well as a liquid cooling interface for connecting external pipelines.
[0027] This baseboard module features a rugged design, with all chips mounted on the board, making it suitable for various rugged chassis and applications such as military, automotive, and field operations. Liquid cooling maintains the module's temperature at a constant level, preventing GPU throttling under high load and ensuring stable operation. It also supports I2C bus communication with the module's management unit (D) to read voltage, temperature, and other information for remote management.
[0028] The substrate module integrates a liquid cooling heat dissipation module, including a liquid cooling heat conduction block covering the GPU control unit C and the CPU control unit B, and a liquid cooling interface for connecting external pipelines.
[0029] Heat-conducting block processing: A double-helix microchannel (roughness Ra≤1.6μm) is milled on a pure copper block using a CNC machine tool. The inner wall of the channel is electrolytically polished to reduce flow resistance (pressure drop <5kPa / L / min). Substrate module integration: X-23-7762 thermal grease is uniformly applied to the chip surfaces of the GPU control unit C and CPU control unit B. The liquid-cooled heat-conducting block is aligned with the chip position, and the screws are tightened with a torque of 0.6N·m (tightening in a crisscross sequence). Piping connection: The external coolant pipeline (inner diameter φ6mm) is connected to the liquid cooling interface of the substrate module through a quick-connect connector. Recommended coolant: 50% ethylene glycol aqueous solution (freezing point -40℃, boiling point 110℃).
[0030] All components of this baseboard module are provided by domestic manufacturers, meeting the 100% localization requirement for specific fields. When using it, first connect the liquid cooling source to the liquid cooling interface of the baseboard module (GPGPU module) through the pipeline, then insert the baseboard module into the rugged chassis or special base plate, then use DC power to power the baseboard module through the rugged chassis or special base plate, connect the external test cables, and finally turn on the power and wait for it to enter the system before you can start using it.
[0031] Based on the preferred embodiments of this utility model described above, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification but must be determined according to the claims.
Claims
1. A domestically produced ruggedized liquid-cooled general-purpose GPGPU module, characterized in that, include: A. Power conversion circuit; B. CPU control unit; C. GPU control unit; D. Management unit; The input terminal of the power conversion circuit A is connected to an external DC power supply, and the output terminal is connected to the power supply terminals of the CPU control unit B, the GPU control unit C, and the management unit D, respectively. The CPU control unit B is connected to the GPU control unit C via a PCIe X16 interface; The management unit D is connected to the CPU control unit B, the GPU control unit C, and the power conversion circuit A via the I2C bus. The power conversion circuit A, CPU control unit B, GPU control unit C, and management unit D are integrated on the same module substrate module.
2. The domestically produced ruggedized liquid-cooled general-purpose GPGPU module as described in claim 1, characterized in that, The chips of the power conversion circuit A, CPU control unit B, and management unit D are all fixed to the substrate module in a board-mount form.
3. The domestically produced ruggedized liquid-cooled general-purpose GPGPU module as described in claim 2, characterized in that, The substrate module integrates a liquid cooling heat dissipation module, including a liquid cooling heat conduction block covering the GPU control unit C and the CPU control unit B, and a liquid cooling interface for connecting external pipelines.
4. The domestically produced ruggedized liquid-cooled general-purpose GPGPU module as described in claim 3, characterized in that, The power conversion circuit A uses a domestically produced DC / DC power conversion chip to convert the external 12V DC power into the operating voltage required by each unit.
5. A domestically produced ruggedized liquid-cooled general-purpose GPGPU module as described in claim 4, characterized in that, The CPU control unit B uses a domestically produced 16-core processor, has 32GB of DDR5 memory chips mounted on the board, and supports the PCIe Gen5 protocol.
6. A domestically produced ruggedized liquid-cooled general-purpose GPGPU module as described in claim 5, characterized in that, The GPU control unit C uses a domestically produced GPU chip, which supports FP32, FP16 and INT8 multi-precision mixed computing.
7. A domestically produced ruggedized liquid-cooled general-purpose GPGPU module as described in claim 6, characterized in that, The management unit D collects voltage and temperature signals within the module via the I2C bus and uploads them to an external system.