Power conversion device

Abstract

This application proposes a power conversion device, comprising: a magnetic core including multiple surfaces; a circuit board unit including: at least one flexible board; a first rigid board including opposing first and second surfaces, the first surface having multiple pads for connection to a system circuit board; at least one second rigid board, each second rigid board being connected to the first rigid board via a flexible board, and the first rigid board and each second rigid board being respectively disposed on one surface of the magnetic core.

Description

Technical Field

[0001] This application relates to the field of power supplies, and in particular to power conversion devices. Background Technology

[0002] With the rise of AI applications, the requirements for server power processing capabilities are becoming increasingly stringent. For example, the amount of data to be processed is increasing dramatically, and the requirements for computing speed are becoming increasingly stringent, which necessitates that server power supplies have the highest possible power.

[0003] Therefore, server power supply designs are becoming increasingly complex, and the space reserved for server power supplies on system motherboards is also shrinking. How to make good use of space and meet the system's requirements for server power, efficiency, and functionality has become a key research focus in the industry.

[0004] Based on the above requirements, stacked power supply design (vertical power supply method) has emerged, which has advantages such as saving the board space occupied by the server power supply on the system motherboard, a shorter circuit path from input to output, and better thermal design. However, it also has problems such as more complex mechanical design, high requirements for material specification precision, extremely high requirements for process and manufacturing precision, and extremely complex magnetic core design and processing. Utility Model Content

[0005] According to one embodiment, this application provides a power conversion device, including: a magnetic core including multiple surfaces; a circuit board unit including: at least one flexible board; a first rigid board including opposing first and second surfaces, the first surface having multiple pads for connection with a system circuit board; at least one second rigid board, each second rigid board being connected to the first rigid board via a flexible board, and the first rigid board and each second rigid board being respectively disposed on one surface of the magnetic core.

[0006] Furthermore, the at least one second hard board is a main board on which power devices are disposed, and the main power device on one of the second hard boards is the main power device of at least one phase converter of the power conversion device.

[0007] Furthermore, one of the at least one second hard board is a control board, on which a controller and its peripheral circuits are disposed; the remaining second hard boards are main boards, on which power devices are disposed, and the main power device on one of the second hard boards is the main power device of at least one phase converter of the power conversion device.

[0008] Furthermore, at least one of the at least one second rigid plate is a heat sink.

[0009] Furthermore, the flexible board is connected to the first rigid board and the at least one second rigid board via copper foil.

[0010] Furthermore, the first rigid plate and each of the second rigid plates are respectively disposed on one side of the magnetic core via the bent flexible plate.

[0011] Furthermore, the flexible circuit board is equipped with an input capacitor or controller and its peripheral circuitry.

[0012] Furthermore, the power conversion device is a multiphase buck power conversion device.

[0013] Furthermore, the magnetic core is an inductor in a multiphase buck power converter.

[0014] Furthermore, the magnetic core is provided with at least one through hole, and a copper pin is provided in the through hole; the devices on the surface of the at least one second hard plate, the at least one second hard plate and the copper pin, and the first hard plate and the copper pin are soldered by reflow soldering.

[0015] The features and technical advantages of this disclosure have been outlined quite extensively above to facilitate a better understanding of the detailed description that follows. Additional features and advantages of this disclosure, which form the subject matter of the claims, will be described below. Those skilled in the art will understand that the disclosed concepts and specific embodiments can be readily used as the basis for modifying or designing other structures or processes to achieve the same purpose as this disclosure. Those skilled in the art will also recognize that such equivalent structures do not depart from the spirit and scope of this disclosure as set forth in the appended claims. Attached Figure Description

[0016] To gain a more complete understanding of this disclosure and its advantages, the following description is given in conjunction with the accompanying drawings, wherein:

[0017] Figure 1 A schematic diagram of a power conversion device according to an embodiment of this application is shown;

[0018] Figure 2 An exploded schematic diagram of a power conversion device according to an embodiment of this application is shown;

[0019] Figure 3 A side view of a power conversion device according to an embodiment of this application is shown;

[0020] Figure 4 A schematic diagram of a circuit board unit according to an embodiment of this application is shown;

[0021] Figure 5 A schematic diagram of a power conversion device according to another embodiment of this application is shown;

[0022] Figure 6 A schematic diagram of a circuit board unit according to another embodiment of this application is shown;

[0023] Figure 7A schematic diagram of the flexible circuit board after bending is shown in a circuit board unit according to another embodiment of this application.

[0024] Unless otherwise stated, corresponding numbers and symbols in the various figures generally refer to corresponding parts. These figures are drawn to clearly illustrate relevant aspects of the various embodiments and are not necessarily drawn to scale. Detailed Implementation

[0025] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] One embodiment of this application provides a power conversion device; please refer to [link / reference]. Figure 1 The diagram shown is a schematic diagram of a power conversion device according to an embodiment of this application. Figure 2 The diagram shown is an exploded view of a power conversion device according to an embodiment of this application. Figure 3 The side view of a power conversion device according to an embodiment of this application is shown, and Figure 4 The diagram shown is a schematic diagram of a circuit board unit according to an embodiment of this application. A power conversion device according to an embodiment of this application includes:

[0027] Magnetic core 1 includes multiple surfaces;

[0028] Circuit board unit 2 includes:

[0029] At least one flexible circuit board 21;

[0030] The first rigid board 22 includes a first side 221 and a second side 222 opposite to each other. A plurality of pads 223 are provided on the first side 221, and the plurality of pads 223 are used to connect to the system circuit board 100.

[0031] At least one second rigid plate 23, each second rigid plate 23 is connected to the first rigid plate 22 via a flexible plate 21, and the first rigid plate 22 and each second rigid plate 23 are respectively disposed on one surface of the magnetic core 1.

[0032] Please see Figure 2 As shown, the magnetic core 1 has at least one through hole, and a copper pin 12 is disposed in the through hole. The through hole extends from the side facing the first rigid plate 22 to the side facing the second rigid plate 23, so the copper pin 12 also extends from the side facing the first rigid plate 22 to the side facing the second rigid plate 23, so that the second rigid plate 23 and the first rigid plate 22 are electrically connected through the copper pin 12.

[0033] for Figures 1 to 4The second rigid board 23 is the main board, on which power devices 231 are mounted. Power devices 231 are the main power devices of the two-phase converter in the power conversion device. In practical applications, when the multiple pads 223 on the first rigid board 22 are connected to the system circuit board 100, the power conversion device transmits power to the system. Please refer to [link to relevant documentation]. Figure 3 The current flows from the system circuit board 100 through the pads 223 on the first side 221 of the first rigid board 22 into the first rigid board 22, then through the flexible board 21 into the second rigid board 23. After being transformed by the power device 231 on the second rigid board 23, the current returns to the first rigid board 22 through the copper pin 12, and then flows back to the system circuit board 100 through the pads 223 on the first side 221 of the first rigid board 22.

[0034] from Figure 4 As can be seen from the current path shown, there is a layout wiring in the flexible board 21 to provide a path for the current, and a stacked power supply design is realized through the copper pins 12 in the magnetic core 1, that is, vertical power supply is realized. This makes the power conversion device provided by this application have the advantages of saving the board area occupied by the server power supply on the system motherboard, a shorter path from input to output circuit, reduced loss, and favorable thermal design.

[0035] In one embodiment of this application, the flexible board 21 is connected to the first rigid board 22 and the second rigid board 23 via copper foil. Therefore, the current path of the power conversion device in this application is entirely composed of copper conductors. Copper has a relatively low resistivity, resulting in low loss and high efficiency in the power conversion device. Furthermore, this is particularly suitable for high-current applications such as server power supplies, as it can better reduce losses and improve efficiency. In practical applications, AI server power supplies have relatively high current ratings, such as over 100 amps; therefore, the power conversion device in this application is particularly suitable for AI server power supplies.

[0036] In actual implementation, circuit board unit 2 is obtained first, as can be found in [reference]. Figure 2 As shown, it can be purchased from a supplier or manufactured in-house. Then, please refer to... Figure 4 As shown, the device is surface-mounted on the first surface of the second rigid board 23, wherein the first surface of the second rigid board 23 and the first surface of the first rigid board 22 are on the same plane. Then, refer to... Figure 2 As shown, one side of the magnetic core 1 is placed on the second side 222 of the first rigid plate 22. Then, a fixture is used to bend the flexible plate 21 onto the first rigid plate 22, and each of the second rigid plates 23 is respectively placed on one side of the magnetic core 1 through the bent flexible plate 21. Finally, the device is soldered onto the second rigid plate 23 by reflow soldering, and the two ends of the copper leads 12 are respectively soldered onto the second rigid plate 23 and the first rigid plate 22, thus forming... Figure 1 The power conversion device shown.

[0037] As described above, in terms of process, the flexible circuit board 21 is bent using a fixture, and then reflowed to connect the components to the circuit board and the circuit board to the magnetic core 1. This demonstrates a simple process that improves production efficiency and increases profit margins. The flexible circuit board 21 used for connecting circuit boards can be bent as needed, and the copper pins 12 within the magnetic core 1 can have their area and position adjusted as required. Therefore, the requirements for material specifications and precision can be reduced, thereby lowering design costs.

[0038] In practical applications, the flexible circuit board 21 is thinner, which leaves more space for the magnetic core 1. Therefore, the magnetic core 1 can be made larger, thereby increasing the power level of the power conversion device, improving the performance of the power conversion device, and increasing the power density of the power conversion device.

[0039] For further details, please refer to Figure 5 The schematic diagram of another embodiment of the power conversion device shown in this application illustrates that, in practical applications, an input capacitor 211 can also be provided on the flexible circuit board 21 to improve the dynamic response speed of the power conversion device and achieve greater power and current. In actual operation, the input capacitor 211 and the components on the second rigid board 23 are surface-mounted together on the flexible circuit board 21 and soldered together on the flexible circuit board 21 by reflow soldering, thus requiring no additional process.

[0040] In practical applications, devices can be selected to be set on the flexible board 21 as needed. For example, a controller and its peripheral circuits can also be set on the flexible board 21, so that the flexible board 21 becomes a control board for controlling the power devices 231 (such as switching transistors) on the second rigid board 23. This improves the power density of the power conversion device and can also expand the function of the power conversion device.

[0041] In practical applications, the power conversion device is a multiphase buck power conversion device, specifically, it can be multiphase buck converters connected in parallel with interleaved connections. Figures 1 to 4 The power conversion device shown can realize two-phase buck circuits in parallel, that is, the power devices of the two-phase buck circuit are set on the second rigid board 23. At this time, the power devices may include switching transistors, input capacitors, output capacitors, etc.

[0042] In practical applications, to increase the power rating of the power conversion device, it is desirable to increase the number of phases in the buck circuit, which means more secondary rigid boards 23 are needed. Based on this, please refer to... Figure 6 The schematic diagram of another embodiment of the circuit board unit shown in this application illustrates that the circuit board unit 2 includes a first rigid board 22, four second rigid boards 23, and four flexible boards 21. Each second rigid board 23 is connected to the first rigid board 22 via a flexible board 21. Thus, the four second rigid boards 23 are connected to the four edges of the first rigid board 22 via the four flexible boards 21. If each second rigid board 23 serves as a main board, and a two-phase buck power device 231 is placed on each main board... Figure 6 The circuit board unit 2 shown can implement an eight-phase buck circuit. Of course, in practical applications, the number of second rigid boards 23 can be selected according to actual needs.

[0043] Please see Figure 7 The schematic diagram shown below illustrates the flexible circuit board after bending in a circuit board unit according to another embodiment of this application. Figure 7 As shown, since the four second hard plates 23 and the first hard plate 22 are each respectively disposed on one face of the magnetic core 1, for the hexahedral magnetic core 1, relative to Figures 1 to 4 The power conversion device shown needs to reduce the area of ​​the flexible circuit board 21, and the length (or width) of the flexible circuit board 21 should be sufficient to bend it so that the first rigid plate 22 and the second rigid plate 23 are located on different surfaces of the magnetic core 1. For example... Figure 7 As shown, the flexible plate 21 can be bent to cross the edge of the magnetic core 1 (not shown in the figure).

[0044] In one embodiment, the second rigid board 23 in the above embodiments can all be main boards, on which power devices 231 are disposed, and the main power device 231 on one of the second rigid boards 23 is the main power device 231 of at least one phase converter of the power conversion device. The control board for controlling the power conversion device can be a separate circuit board, as shown in the figure.

[0045] In one embodiment, to improve the integration of the power conversion device, one of the at least one second hard board 23 is a control board, on which a controller and its peripheral circuits are disposed; the other second hard boards 23 are main boards, on which power devices 231 are disposed, and the main power device 231 on one of the second hard boards 23 is the main power device 231 of at least one phase converter of the power conversion device.

[0046] In one embodiment, to improve the heat dissipation efficiency of the power conversion device and further improve the efficiency of the power conversion device, at least one of the at least one second rigid plate 23 is a heat sink, such as a copper foil.

[0047] As can be seen from the above description, magnetic core 1 is the inductor in the multiphase buck power converter, that is, the inductor in the multiphase buck power converter is magnetically integrated.

[0048] Although embodiments of the present disclosure and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations may be made herein without departing from the spirit and scope of the present disclosure as defined by the appended claims.

[0049] Furthermore, the scope of this application is not intended to be limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, apparatuses, methods, and steps described in the specification. As will be readily understood by those skilled in the art from the disclosure of this publication, processes, machines, manufactures, compositions of matter, means, methods, or steps that perform substantially the same function, currently exist or will be developed or implemented thereafter, will yield substantially the same results as the corresponding embodiments described herein that are available according to this disclosure. Therefore, the appended claims are intended to include such processes, machines, manufactures, compositions of matter, apparatuses, methods, or steps within their scope.

Claims

1. A power conversion device, characterized in that, include: A magnetic core consists of multiple surfaces; The circuit board unit includes: At least one flexible printed circuit board; A first rigid board includes a first side and a second side opposite to each other. A plurality of pads are provided on the first side, the plurality of pads being used to connect to a system circuit board. At least one second rigid plate, each second rigid plate being connected to the first rigid plate via a flexible plate, and the first rigid plate and each second rigid plate being disposed on one surface of the magnetic core respectively.

2. The power conversion device according to claim 1, characterized in that, The at least one second hard board is a main board, on which power devices are disposed, and the main power device on one of the second hard boards is the main power device of at least one phase converter of the power conversion device.

3. The power conversion device according to claim 1, characterized in that, One of the at least one second hard board is a control board, on which a controller and its peripheral circuits are disposed; the other second hard boards are main boards, on which power devices are disposed, and the main power device on one of the second hard boards is the main power device of at least one phase converter of the power conversion device.

4. The power conversion device according to claim 1, characterized in that, At least one of the at least one second rigid plate is a heat sink.

5. The power conversion device according to claim 1, characterized in that, The flexible board is connected to the first rigid board and the at least one second rigid board via copper foil.

6. The power conversion device according to claim 5, characterized in that, The first rigid plate and each of the second rigid plates are respectively disposed on one side of the magnetic core by means of the bent flexible plate.

7. The power conversion device according to claim 1 or 6, characterized in that, The flexible circuit board is equipped with an input capacitor or controller and its peripheral circuits.

8. The power conversion device according to claim 1, characterized in that, The power conversion device is a multiphase buck power conversion device.

9. The power conversion device according to claim 1, characterized in that, The magnetic core is an inductor used in a multiphase buck power converter.

10. The power conversion device according to claim 1, characterized in that, The magnetic core has at least one through hole, and a copper lead is disposed in the through hole; The devices mounted on the at least one second rigid board, the at least one second rigid board and the copper pins, and the first rigid board and the copper pins are soldered by reflow soldering.

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