A low-power Bluetooth circuit integrating multi-protocol communication and RF optimization

Abstract

This utility model discloses a low-power Bluetooth circuit integrating multi-protocol communication and RF optimization, relating to the field of Bluetooth circuit technology. This low-power Bluetooth circuit includes a core chip circuit, a power supply circuit, a clock circuit, an RF module, and an interface circuit. The pins of the core chip circuit are electrically connected to the power supply circuit, clock circuit, RF module, and interface circuit, respectively. The core chip circuit includes a TLSR8258 chip supporting the SIG Mesh protocol stack and the IEEE 802.15.4 standard. The RF module forms an impedance matching network through matching components to achieve efficient signal transmission between the TLSR8258 chip and the antenna. The core chip circuit addresses the instability problem of low-power Bluetooth connections, while the RF module enhances signal strength and reduces the impact of electromagnetic interference on communication. Ferrite beads and LC filter circuits suppress power supply noise, ensuring stable operation of the RF module and digital circuits.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth circuit technology, and in particular to a low-power Bluetooth circuit that integrates multi-protocol communication and radio frequency optimization. Background Technology

[0002] Low-power Bluetooth circuits integrating multi-protocol communication and RF optimization are suitable for use in illuminance sensors that support Bluetooth communication, i.e., the hardware circuit structure of illuminance sensors with Bluetooth communication, which has a significant effect on energy saving and carbon reduction in low-power smart building systems. However, existing circuits suffer from unstable low-power Bluetooth connections, and system compatibility and scalability need to be improved. Therefore, there is an urgent need to develop a low-power Bluetooth circuit integrating multi-protocol communication and RF optimization to meet the needs of practical applications. Utility Model Content

[0003] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a low-power Bluetooth circuit that integrates multi-protocol communication and RF optimization. It solves the problem of unstable low-power Bluetooth connections by employing a core chip circuit, enhances signal strength by using an RF module, and reduces the impact of electromagnetic interference on communication. The TLSR8258 chip supports the SIG Mesh protocol stack and the IEEE 802.15.4 standard, improving system compatibility and scalability. Power supply noise is suppressed through ferrite beads and LC filter circuits, ensuring stable operation of the RF module and digital circuits.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A low-power Bluetooth circuit integrating multi-protocol communication and RF optimization includes a core chip circuit for integrating RF transceiver, MCU, storage, and power management; a power supply circuit for stable power supply and noise filtering; a clock circuit for providing a clock signal; an RF module for antenna matching and signal transceiver; and an interface circuit for external communication and functional expansion. The pins of the core chip circuit are electrically connected to the power supply circuit, clock circuit, RF module, and interface circuit, respectively. The core chip circuit includes a TLSR8258 chip supporting the SIG Mesh protocol stack and the IEEE 802.15.4 standard. The RF module forms an impedance matching network through matching components to achieve efficient signal transmission between the TLSR8258 chip and the antenna.

[0006] As a preferred embodiment, the power supply circuit includes an EMI filter bead for suppressing power supply noise and ensuring the purity of the 1V2 power supply, and a decoupling capacitor for providing a stable 1V2 power supply to the core circuit of the chip. The EMI filter bead is connected in series on the power supply line.

[0007] As a preferred embodiment: the decoupling capacitors include capacitors C1, C2, C19, C20, C21, and C22. Capacitor C1 is used to filter out low-frequency noise, and capacitor C2 is used to filter out high-frequency noise. The TLSR8258 chip has pins VDDIO and VDDD, which are respectively connected to capacitors C19, C20, C21, and C22.

[0008] As a preferred embodiment, the power supply circuit further includes an LC filter circuit for filtering out the ripple of the 3V3 power supply to power the IO pins and interface circuits of the TLSR8258 chip. The LC filter circuit includes an inductor L3 and a capacitor C33, and the IO pins and interface circuits of the TLSR8258 chip are electrically connected to the LC filter circuit.

[0009] As a preferred embodiment: the clock circuit includes a crystal oscillator X1, a load capacitor C6, and a load capacitor C9. The crystal oscillator X1, together with the load capacitors C6 and C9, forms a crystal oscillation circuit to provide a precise system clock for the TLSR8258 chip. The crystal oscillation circuit is electrically connected to the TLSR8258 chip.

[0010] As a preferred embodiment: the RF module includes a Bluetooth antenna ANT1 for transmitting and receiving wireless signals; the matching elements include high-frequency inductors L1 and L2 for adjusting the inductive reactance of the RF signal, and high-frequency capacitors C4, C5, C8, and C10 for adjusting the capacitive reactance of the RF signal; the RF output signal of the TLSR8258 chip is optimized by the matching network and then transmitted by the Bluetooth antenna ANT1; the signal received by the Bluetooth antenna ANT1 is then transmitted to the TLSR8258 chip through the matching network to realize BLE wireless communication.

[0011] As a preferred embodiment: the interface circuit includes a UART interface, an I2C interface, an ADC interface, a PWM interface, and a GPIO interface. The UART interface is used to communicate with external devices for data transmission or program debugging; the I2C interface is used for serial communication between multiple devices; the pins of the TLSR8258 chip are configured as analog-to-digital converters (ADCs) for acquiring external analog signals; the pins of the TLSR8258 chip output pulse width modulation (PWM) signals for controlling the expansion of peripheral GPIO interfaces.

[0012] As a preferred embodiment, the GPIO interface has pins PD4, PD7, and PA0 for use as a general-purpose input / output interface, which can be configured as input or output as required.

[0013] Compared with the prior art, this utility model has significant advantages and beneficial effects. Specifically, as can be seen from the above technical solution, the low-power Bluetooth circuit provided by this application can significantly improve the communication stability, battery life, and scenario adaptability of the TLSR8258 chip in low-power Bluetooth devices, providing a reliable hardware foundation for IoT applications; it solves the problem of unstable low-power Bluetooth connection by adopting the core circuit of the chip, and enhances signal strength by adopting an RF module, reducing the impact of electromagnetic interference on communication; the TLSR8258 chip supports the SIG Mesh protocol stack and the IEEE 802.15.4 standard, improving system compatibility and scalability; and it suppresses power supply noise through ferrite beads and LC filter circuits, ensuring the stable operation of the RF module and digital circuits.

[0014] To more clearly illustrate the structural features and effects of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0015] Figure 1 This invention relates to a low-power Bluetooth circuit that integrates multi-protocol communication and radio frequency optimization. Detailed Implementation

[0016] This utility model is as follows Figure 1 As shown, a low-power Bluetooth circuit integrating multi-protocol communication and RF optimization includes a core chip circuit for integrating RF transceiver, MCU, storage, and power management; a power supply circuit for stable power supply and noise filtering; a clock circuit for providing the clock signal; an RF module for antenna matching and signal transceiver; and an interface circuit for external communication and functional expansion.

[0017] The pins in the core circuit of this chip are electrically connected to the power supply circuit, clock circuit, RF module, and interface circuit, respectively. The core circuit of this chip includes a SIG Mesh protocol stack and a TLSR8258 chip that supports the IEEE 802.15.4 standard. The RF module forms an impedance matching network through matching components to achieve efficient signal transmission between the TLSR8258 chip and the antenna.

[0018] The power supply circuit includes an EMI filter bead for suppressing power supply noise and ensuring a clean 1V2 power supply, and a decoupling capacitor for providing a stable 1V2 power supply to the core circuit of the chip. The EMI filter bead is connected in series on the power supply line.

[0019] The decoupling capacitors include capacitors C1, C2, C19, C20, C21, and C22. Capacitor C1 is used to filter out low-frequency noise, and capacitor C2 is used to filter out high-frequency noise. The TLSR8258 chip has pins VDDIO and VDDD, which are connected to capacitors C19, C20, C21, and C22, respectively.

[0020] The power supply circuit also includes an LC filter circuit for filtering out the ripple of the 3V3 power supply to power the IO pins and interface circuits of the TLSR8258 chip. The LC filter circuit includes an inductor L3 and a capacitor C33. The IO pins and interface circuits of the TLSR8258 chip are electrically connected to the LC filter circuit.

[0021] The clock circuit includes a crystal oscillator X1, a load capacitor C6, and a load capacitor C9. The crystal oscillator X1, together with the load capacitors C6 and C9, forms a crystal oscillation circuit to provide a precise system clock for the TLSR8258 chip. The crystal oscillation circuit is electrically connected to the TLSR8258 chip.

[0022] The RF module includes a Bluetooth antenna ANT1 responsible for transmitting and receiving wireless signals. The matching components include high-frequency inductors L1 and L2 for adjusting the inductive reactance of the RF signal, and high-frequency capacitors C4, C5, C8, and C10 for adjusting the capacitive reactance of the RF signal. The RF output signal of the TLSR8258 chip is optimized by the matching network and then transmitted by the Bluetooth antenna ANT1. The signal received by the Bluetooth antenna ANT1 is then fed into the TLSR8258 chip through the matching network to realize BLE wireless communication.

[0023] The interface circuit includes a UART interface, an I2C interface, an ADC interface, a PWM interface, and a GPIO interface. It communicates with external devices through the UART interface for data transmission or program debugging; the I2C interface is used for serial communication between multiple devices; the pins of the TLSR8258 chip are configured as analog-to-digital converters (ADCs) for acquiring external analog signals; the pins of the TLSR8258 chip output pulse width modulation (PWM) signals for controlling the expansion of peripheral GPIO interfaces.

[0024] This GPIO interface has pins PD4, PD7, and PA0 for use as a general-purpose input / output interface, which can be configured as input or output as needed.

[0025] Core circuit of the chip: TC1; IC1 is a Bluetooth Low Energy (BLE) SoC chip that integrates RF transceiver, MCU, memory, power management and other functions, and is the "brain" of the circuit. Pin connections cover power, clock, RF, GPIO (general purpose input / output) functions.

[0026] Power supply circuit: stable power supply and noise filtering; the power supply is the foundation for stable circuit operation. This part uses ferrite beads, inductors, and capacitors to achieve power filtering and voltage regulation. 1V2 low-voltage power supply (core power supply) BLM15BD601SN1D: EMI filter ferrite bead, connected in series on the power line, suppresses power supply noise (such as high-frequency interference) and ensures the purity of the 1V2 power supply.

[0027] C1 (2.2μF) and C2 (100nF): Decoupling capacitors. The former filters out low-frequency noise, and the latter filters out high-frequency noise. Together, they provide a stable 1V2 power supply for the core circuits of the chip (such as radio frequency and CPU).

[0028] 3V3 power supply (IO and peripheral power supply); L3 (47μH), C33 (1μF): LC filter circuit, inductor L3 and capacitor C33 filter out the ripple of the 3V3 power supply and supply power to the chip's IO pins and external interfaces (such as UART, I2C).

[0029] Chip pins VDDIO and VDDD: Connect decoupling capacitors C19 (1μF), C20 (1μF), C21 (1μF), and C22 (100nF) respectively to further filter power supply noise and ensure the stability of the internal modules of the chip.

[0030] Clock circuit: A 24MHz crystal oscillator provides the system clock; Crystal X1 is a 24MHz crystal oscillator (marked 24M / 12pf / 10ppm, indicating a frequency of 24MHz, a load capacitance of 12pF, and an accuracy of 10ppm), which, together with two load capacitors C6 (1.2pF) and C9 (1.2pF), form a crystal oscillation circuit to provide a precise system clock (similar to a computer's "heartbeat") for the TLSR8258 chip.

[0031] RF module: Antenna matching and signal transmission / reception;

[0032] The Bluetooth antenna ANT1 is responsible for transmitting and receiving wireless signals. Radio frequency (RF) signals have extremely high impedance matching requirements; therefore, an impedance matching network composed of a series of capacitors and inductors is used to ensure efficient signal transmission between the chip and the antenna. Matching components: High-frequency inductor L1 (3.3nH), high-frequency inductor L2 (1.3nH): adjust the inductive reactance of the RF signal. High-frequency capacitors C4 (1.2pF), C5 (0.75pF), C8 (220pF), and C10 (18pF): adjust the capacitive reactance of the RF signal. NC (No Connect): indicates that this position is "unconnected" and needs to be adjusted according to the actual requirements of the antenna, environment, etc.

[0033] Functional logic: The chip's RF output signal is optimized by the matching network and then transmitted by ANT1; conversely, the signal received by the antenna enters the chip after passing through the matching network, realizing BLE wireless communication.

[0034] Interface Circuit: External Communication and Function Expansion; the circuit achieves "external interaction" through multiple interfaces, including UART, I2C, ADC, PWM, and GPIO interfaces. UART Interface (JP1 header): JP1 is a 6-pin header with the following pin definitions: 1-3V3 (power supply), 2-GND (ground), 3-SWS (software control signal, such as wake-up / configuration), 4-URXD (UART receive), 5-PA1 (GPIO, customizable function), 6-UTXD (UART transmit). Function: Communicates with external devices (such as MCUs and computers) via UART for data transmission or program debugging. I2C Interface: R8 (330Ω), R9 (4.7kΩ): Pull-up resistors. The I2C bus needs to be kept high when idle; therefore, the SCL (clock) and SDA (data) pins are pulled up to the power supply through resistors. Function: Expands I2C peripherals (such as sensors and EEPROMs) to enable serial communication between multiple devices. ADC and PWM Interfaces: PC4 (ADC): The chip pin is configured as an analog-to-digital converter (ADC) to acquire external analog signals (such as temperature sensor voltage). PWM Interface: The chip pin outputs pulse width modulation (PWM) signals for controlling peripheral GPIO expansion; Pins PD4, PD7, and PA0: These serve as general purpose input / output (GPIO) pins and can be configured as inputs (such as button detection) or outputs (such as indicator light control) as needed.

[0035] Auxiliary components: filtering, decoupling, and functional optimization; numerous capacitors, inductors, and ferrite beads in the circuit perform "auxiliary functions": Ferrite bead (BLM15BD601SN1D): suppresses high-frequency power supply noise and protects sensitive circuits. Decoupling capacitors (such as decoupling capacitor C1, decoupling capacitor C2, and decoupling capacitor C19): placed close to the chip's power supply pins, quickly filtering out power supply spike noise and ensuring stable power supply.

[0036] RF matching components (such as inductors L1 and L2, capacitors C4 and C5): finely adjust impedance to maximize RF signal transmission and reception efficiency.

[0037] Function Summary

[0038] The circuit provided in this application is a Bluetooth Low Energy (BLE) module circuit based on TLSR8258, which integrates: a stable power supply system (1V2 core power supply + 3V3 IO power supply); a precise clock (24MHz crystal oscillator); high-efficiency radio frequency (antenna matching network); and flexible interfaces (UART, I2C, ADC, PWM, GPIO). It is suitable for Internet of Things (IoT) devices, wireless sensors, BLE communication terminals, and other scenarios, and can realize data transmission, device control, and sensor data acquisition functions via Bluetooth.

[0039] The collaborative logic of "core SoC + layered support" is as follows: The SoC (TLSR8258) is the "command center," coordinating the work of RF, MCU, and peripherals; the power supply / clock is the "basic guarantee," providing stable power and timing for all modules; the RF front end is the "wireless bridge," enabling efficient transmission and reception of Bluetooth signals through a matching network; the external interface is the "data pipeline," connecting to the external world (sensors, MCU, user commands); and the capacitors / inductors / ferrite beads are the "invisible guardians," filtering out noise, stabilizing signals, and ensuring the clean operation of each module.

[0040] I. Resolving the issue of unstable low-power Bluetooth connections:

[0041] As a Bluetooth Low Energy (BLE) chip, the TLSR8258 faces a typical challenge in its applications due to unstable connections. The circuit diagram addresses these specific issues through multi-dimensional design: Signal interference and insufficient RF performance: Signal strength is enhanced and the impact of electromagnetic interference on communication is reduced by optimizing antenna design (e.g., external antenna or PCB antenna matching). Simultaneously, the chip supports the BLE 5.0 protocol specification, improving anti-interference capabilities and transmission distance. Inappropriate connection parameter configuration: The circuit design includes a parameter adjustment interface, allowing configuration of connection intervals (15-40ms) and monitoring timeout times (200-500ms) via firmware, adapting to low-latency communication or long-term stable connection scenarios. Protocol stack and firmware defects: The circuit diagram supports firmware upgrade functionality, allowing for updates to fix protocol stack vulnerabilities and reduce the risk of connection drops.

[0042] II. Achieving efficient and low-power management:

[0043] The low-power characteristics of the TLSR8258 chip require a combination of hardware design and software configuration. The circuit diagram focuses on addressing the following power consumption issues: Multi-mode low-power control: The chip supports multiple low-power modes such as Deep Sleep Mode. The circuit diagram uses power management modules (such as LDOs and capacitor filters) to ensure power supply stability during mode switching, reducing the impact of power consumption fluctuations on the system. Standby power optimization: Static power consumption is reduced by simplifying peripheral circuits (such as retaining only necessary UART and GPIO interfaces) and selecting low-power components (such as ceramic capacitors and miniature inductors).

[0044] III. Improve system compatibility and scalability:

[0045] The circuit design fully considers the diverse needs of IoT devices, addressing compatibility and functional expansion issues: Multi-protocol and interface support: The TLSR8258 supports the SIG Mesh protocol stack and the IEEE 802.15.4 standard. The circuit diagram reserves PWM, ADC, and PGA interfaces for connecting peripherals such as sensors and actuators, making it suitable for smart home, industrial monitoring, and other scenarios. Security assurance: An integrated AES encryption module and hardware encryption circuit design address data security issues in wireless communication, meeting the privacy protection requirements of IoT devices.

[0046] IV. Key Optimization Measures in Hardware Design:

[0047] To verify the effectiveness of the solutions to the above problems, the circuit diagram also includes the following detailed designs: Power supply filtering and anti-interference: Power supply noise is suppressed through ferrite beads and LC filter circuits (such as a 47μH inductor with a 1μF capacitor) to ensure stable operation of the RF module and digital circuits. Test and debugging interfaces: Onboard dual-row pin headers and serial port interfaces support connection to debugging tools, facilitating parameter configuration verification and problem localization.

[0048] The usage and principle of this low-power Bluetooth circuit that integrates multi-protocol communication and RF optimization are as follows:

[0049] Power-on Initialization: After the power supply is filtered and stabilized, the SoC (IC1) powers on, the crystal oscillator starts oscillating to provide the clock, and the SoC loads the program and initializes the Bluetooth protocol stack and peripheral interfaces. RF Communication: Transmission: The SoC's internal baseband signal is modulated and amplified, then transmitted to the antenna via the matching network, converting it into spatial electromagnetic waves; Reception: The antenna captures the electromagnetic waves, which are then sent to the SoC for demodulation via the matching network and restored to digital signals. External Interaction: UART / I2C receives external data, which is encapsulated into Bluetooth data packets by the SoC for transmission; Bluetooth-received data packets are parsed by the SoC and forwarded to external devices via UART / I2C; GPIO / ADC implements status detection and peripheral control (such as power management and sensor triggering). Power Management: The TLSR8258 chip supports low-power mode, VBAT-OK detects battery status, PWM is used for power saving control (such as dynamic voltage regulation), and it enters sleep mode when idle, waking up by an interrupt (INT).

[0050] The key design feature of this invention is that the low-power Bluetooth circuit provided in this application can significantly improve the communication stability, battery life, and scenario adaptability of the TLSR8258 chip in low-power Bluetooth devices, providing a reliable hardware foundation for IoT applications; it solves the problem of unstable low-power Bluetooth connection by adopting the core circuit of the chip, enhances signal strength by adopting an RF module, and reduces the impact of electromagnetic interference on communication; the TLSR8258 chip supports the SIG Mesh protocol stack and the IEEE 802.15.4 standard, improving system compatibility and scalability; and it suppresses power supply noise through ferrite beads and LC filter circuits, ensuring the stable operation of the RF module and digital circuits.

[0051] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization, characterized in that: The chip includes a core circuit for integrating RF transceiver, MCU, storage, and power management; a power supply circuit for stable power supply and noise filtering; a clock circuit for providing a clock signal; an RF module for antenna matching and signal transmission and reception; and an interface circuit for external communication and functional expansion. The pins of the core chip circuit are electrically connected to the power supply circuit, clock circuit, RF module, and interface circuit, respectively. The core chip circuit includes a TLSR8258 chip that supports the SIG Mesh protocol stack and the IEEE 802.15.4 standard. The RF module forms an impedance matching network through matching components to achieve efficient signal transmission between the TLSR8258 chip and the antenna.

2. The low-power Bluetooth circuit integrating multi-protocol communication and RF optimization according to claim 1, characterized in that: The power supply circuit includes an EMI filter bead for suppressing power supply noise and ensuring a clean 1V2 power supply, and a decoupling capacitor for providing a stable 1V2 power supply to the core circuit of the chip. The EMI filter bead is connected in series on the power supply line.

3. The low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization according to claim 2, characterized in that: The decoupling capacitors include capacitors C1, C2, C19, C20, C21, and C22. Capacitor C1 is used to filter out low-frequency noise, and capacitor C2 is used to filter out high-frequency noise. The TLSR8258 chip has pins VDDIO and VDDD, which are respectively connected to capacitors C19, C20, C21, and C22.

4. The low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization according to claim 2, characterized in that: The power supply circuit also includes an LC filter circuit for filtering out the ripple of the 3V3 power supply to power the IO pins and interface circuits of the TLSR8258 chip. The LC filter circuit includes an inductor L3 and a capacitor C33. The IO pins and interface circuits of the TLSR8258 chip are electrically connected to the LC filter circuit.

5. A low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization according to claim 1, characterized in that: The clock circuit includes a crystal oscillator X1, a load capacitor C6, and a load capacitor C9. The crystal oscillator X1, together with the load capacitors C6 and C9, forms a crystal oscillation circuit to provide a precise system clock for the TLSR8258 chip. The crystal oscillation circuit is electrically connected to the TLSR8258 chip.

6. The low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization according to claim 1, characterized in that: The radio frequency module includes a Bluetooth antenna ANT1 for transmitting and receiving wireless signals. The matching elements include high-frequency inductors L1 and L2 for adjusting the inductive reactance of the radio frequency signal, and high-frequency capacitors C4, C5, C8, and C10 for adjusting the capacitive reactance of the radio frequency signal. The radio frequency output signal of the TLSR8258 chip is optimized by the matching network and then transmitted by the Bluetooth antenna ANT1. The signal received by the Bluetooth antenna ANT1 is then transmitted to the TLSR8258 chip through the matching network to realize BLE wireless communication.

7. A low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization according to claim 1, characterized in that: The interface circuit includes a UART interface, an I2C interface, an ADC interface, a PWM interface, and a GPIO interface. The UART interface is used to communicate with external devices for data transmission or program debugging; the I2C interface is used for serial communication between multiple devices; the pins of the TLSR8258 chip are configured as analog-to-digital converters for acquiring external analog signals; the pins of the TLSR8258 chip output pulse width modulation signals for controlling the expansion of peripheral GPIO interfaces.

8. A low-power Bluetooth circuit integrating multi-protocol communication and radio frequency optimization according to claim 7, characterized in that: The GPIO interface has pins PD4, PD7, and PA0 for use as a general-purpose input / output interface, which can be configured as input or output as needed.

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