A camera module imaging unit and a vertical periscope camera module

Abstract

This utility model discloses an imaging unit and a vertical periscope camera module. The imaging unit includes a circuit board, a chip, a bracket, and a filter. Electronic components are disposed on the circuit board, and several gold wires connect the chip to the circuit board. The bracket has a vertically penetrating light-transmitting hole, with the chip located directly below the light-transmitting hole and the filter located directly above it. A mounting gap is formed between the bracket and the circuit board, and a potting structure is disposed in the mounting gap to encapsulate the electronic components and gold wires. In this utility model, by providing a potting structure to encapsulate the electronic components and gold wires, the compressive strength of the camera module can be increased, and stray light caused by the gold wires can be reduced. It can also shorten the safety distance above the components, reduce the thickness of the bracket, and decrease the volume of the camera module.

Description

Technical Field

[0001] This utility model belongs to the field of camera modules, and in particular relates to a camera module imaging unit and a vertical periscope camera module. Background Technology

[0002] A periscope module is a special type of camera module characterized by its lens module located inside the camera. It refracts light to the image sensor via light deflectors and prisms to achieve image formation. The lens groups in a periscope module are arranged horizontally, and a unique triangular prism allows light to enter the lens. This design is very space-saving, preventing the lens from protruding and improving the camera's sealing. In existing periscope modules, the chip and circuit board are electrically connected via gold wires. Since gold wires reflect light, they produce gold wire stray light. Additionally, the IR bracket cavity also reflects light, producing bracket stray light. Both of these stray lights negatively impact image quality; therefore, it is necessary to minimize or avoid them. Utility Model Content

[0003] In view of the shortcomings of the prior art, the technical problem to be solved by this utility model is to provide a camera module imaging unit and a vertical periscope camera module.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0005] An imaging unit for a camera module includes a circuit board, a chip, an IR bracket, and a filter. The circuit board has a chip mounting area, and electronic components are arranged around the chip mounting area. The chip is fixedly mounted in the chip mounting area, and several gold wires connect the chip and the circuit board. The IR bracket is located above the chip and has a vertically penetrating light-transmitting hole. The chip is located directly below the light-transmitting hole, and the filter is located directly above the light-transmitting hole. A mounting gap is formed between the IR bracket and the circuit board, and a potting structure is arranged in the mounting gap to encapsulate the electronic components and the gold wires.

[0006] Furthermore, a low-reflection coating is provided on the wall of the light-transmitting hole of the IR bracket.

[0007] Furthermore, the low-reflection coating is formed by spraying black paint.

[0008] Furthermore, the upper surface of the IR bracket has an annular recessed step around the opening of the light-transmitting hole, and the filter is disposed in the area enclosed by the recessed step.

[0009] Furthermore, a raised ring is formed on the lower end face of the IR bracket corresponding to the opening of the light-transmitting hole. The chip is positioned directly below the raised ring, and the photosensitive area of ​​the chip is aligned with the light-transmitting hole. The lower end face of the chip is in contact with the upper end face of the circuit board. The mounting gap includes a first gap formed between the area on the circuit board corresponding to the outer side of the chip and the IR bracket, and a second gap formed between the area on the outer side of the chip corresponding to the raised ring and the IR bracket.

[0010] Furthermore, the upper surface of the circuit board is provided with a plurality of first pads corresponding to the area of ​​the first gap, and the upper surface of the chip is provided with a plurality of second pads corresponding to the area of ​​the second gap; the first end of each gold wire is connected to a first pad in the first gap, and the second end of each gold wire is bent downward and extends from the first gap into the second gap to connect to a second pad.

[0011] Furthermore, the glue-filling structure is formed by filling the sealed space with glue after the IR bracket and external mold are used to form a sealed space and then curing it.

[0012] Furthermore, the upper end of the potting structure is connected to the IR bracket, and the lower end is connected to the circuit board.

[0013] A vertical periscope camera module includes a housing, in which a prism and a lens assembly are disposed. One end of the housing has an opening, and an imaging unit is disposed at the opening. The imaging unit is an imaging unit of a camera module as described in any of the above claims.

[0014] Furthermore, the prism is disposed at one end of the housing away from the imaging unit, the lens assembly is disposed between the prism and the imaging unit, and a light inlet is provided at the upper end of the housing corresponding to the position of the prism, and a cover plate is provided above the light inlet; the prism includes a light-inlet surface disposed in the horizontal direction, a light-outlet surface disposed in the vertical direction, and a reflective surface connecting the light-inlet surface and the light-outlet surface, the light-inlet surface facing the light inlet, and the light-outlet surface facing the lens assembly.

[0015] In this invention, the electronic components and gold wires are completely encapsulated by a potting structure, which increases the strength of the imaging unit and avoids the reflection effect of the gold wires. Furthermore, the isolation effect of the potting structure shortens the safety gap between the electronic components and the IR bracket, thereby reducing the size of the periscope module in the y-axis direction. This allows it to be used in modules with smaller lens back focal lengths, aligning with the trend of miniaturizing camera modules. By applying a low-reflection coating to the aperture wall of the IR bracket, light reflection from the aperture wall is reduced, minimizing bracket stray light and improving imaging performance. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 This is a schematic diagram of the structure of an imaging unit of a camera module according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 Exploded view.

[0019] Figure 3 for Figure 1 Top view.

[0020] Figure 4 for Figure 3 A schematic diagram of the AA-direction cross section.

[0021] Figure 5 This is a schematic diagram of the IR support structure.

[0022] Figure 6 This is a schematic diagram of an embodiment of a vertical periscope camera module according to the present invention.

[0023] Figure 7 This is a schematic diagram showing the relative positions of the prism, lens assembly, and imaging unit.

[0024] The diagrams in the instruction manual are labeled as follows:

[0025] Imaging unit - 100; Circuit board - 110; First pad - 111; Chip mounting area - 112; Electronic components - 113; Chip - 120; Second pad - 121; Photosensitive area - 122; IR bracket - 130; Light passage - 131; Low-reflection coating - 132; Recessed step - 133; Boss - 134; Filter - 140; Mounting gap - 150; First gap - 151; Second gap - 152; Encapsulation structure - 160; Gold wire - 170;

[0026] Housing - 200; Light inlet - 201; Opening - 202; Cover plate - 210; Prism - 300; Light inlet surface - 301; Reflective surface - 302; Light outlet surface - 303; Lens assembly - 400. Detailed Implementation

[0027] The following specific examples illustrate the implementation of this utility model. The illustrations provided in the following embodiments are only schematic representations of the basic concept of this utility model. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0028] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an embodiment of a camera module imaging unit according to the present invention. The camera module imaging unit of this embodiment includes a circuit board 110, a chip 120, an IR bracket 130, and a filter 140. Please refer to... Figure 2 , Figure 3 and Figure 4 The circuit board 110 has a chip mounting area 112, and electronic components 113 are arranged around the chip mounting area 112. The chip 120 is fixedly mounted within the chip mounting area 112, and several gold wires 170 connect the chip 120 to the circuit board 110. It should be noted that, for ease of demonstration of the internal structure of the imaging unit 100, [the following text is incomplete and requires further context]. Figure 2 The gold line 170 is not shown in the image. Figure 4 The potting structure 160 was removed.

[0029] The IR bracket 130 is disposed on the upper end of the chip 120. The IR bracket 130 has a vertically penetrating light-transmitting hole 131. The chip 120 is located directly below the light-transmitting hole 131, and the filter 140 is disposed directly above the light-transmitting hole 131. In this embodiment, the upper end surface of the IR bracket 130 forms an annular recessed step 133 around the opening of the light-transmitting hole 131. The filter 140 is disposed in the area enclosed by the recessed step 133, and the outer area of ​​the filter 140 is generally bonded and fixed to the stepped surface of the recessed step 133.

[0030] Because the IR bracket 130 is close to the photosensitive area, it is prone to stray light. To solve this problem, in this embodiment, a low-reflection coating 132 is provided on the wall of the light-transmitting hole 131 of the IR bracket 130. The low-reflection coating 132 is used to reduce light reflection from the wall of the light-transmitting hole 131, reduce stray light, and improve imaging effect. The low-reflection coating 132 can be formed by spray painting and blackening. The material used for spray painting and blackening is generally chosen to be a material that will not generate dust during use, so as not to affect imaging.

[0031] Please see Figure 5An installation gap 150 is formed between the IR bracket 130 and the circuit board 110. A potting structure 160 is disposed within the installation gap 150, encapsulating the electronic component 113 and the gold wire 170. In this embodiment, a raised platform 134 is formed on the lower end face of the IR bracket 130 corresponding to the opening of the light-transmitting hole 131. The chip 120 is positioned directly below the raised platform 134, with its photosensitive area 122 aligned with the light-transmitting hole 131. The lower end face of the chip 120 is in contact with the upper end face of the circuit board 110. The installation gap 150 includes a first gap 151 formed between the area of ​​the circuit board 110 corresponding to the outer side of the chip 120 and the IR bracket 130, and a second gap 152 formed between the area of ​​the chip 120 corresponding to the outer side of the raised platform 134 and the IR bracket 130.

[0032] The upper surface of the circuit board 110 has a plurality of first pads 111 in the area corresponding to the first gap 151, and the upper surface of the chip 120 has a plurality of second pads 121 in the area corresponding to the second gap 152. The first end of each gold wire 170 is connected to a first pad 111 in the first gap 151, and the second end of each gold wire 170 is bent downward and extends from the first gap 151 into the second gap 152 to connect to a second pad 121.

[0033] The potting structure 160 utilizes the IR bracket 130 and an external mold (not shown in the figure) to form a sealed space, enclosing the gold wire 170 and electronic components 113 within this space. Adhesive is then poured into this sealed space and cured, thus sealing the gold wire 170 and electronic components 113. The upper end of the potting structure 160 is connected to the IR bracket 130, and the lower end is connected to the circuit board 110, providing support and increasing the pressure resistance of the camera module. Because the gold wire 170 and electronic components 113 are sealed with adhesive, light from the camera module will not hit the gold wire 170, reducing the risk of stray light from the gold wire. Furthermore, the potting structure 160 can shorten the safety gap above the electronic components 113, which is beneficial for the miniaturization of the camera module.

[0034] In this embodiment, by completely encapsulating the electronic component 113 and the gold wire 170 with the potting structure 160, the strength of the imaging unit 100 is increased and the reflection effect of the gold wire 170 is avoided. In addition, the isolation effect of the potting structure 160 can shorten the safety gap between the electronic component 113 and the IR bracket 130, which is beneficial to the miniaturization of the camera module. By providing a low-reflection coating 132 on the hole wall of the light-transmitting hole 131 of the IR bracket 130, the reflection of light by the hole wall of the light-transmitting hole 131 can be reduced, stray light from the bracket can be reduced, and the imaging effect can be improved.

[0035] Please see Figure 6, Figure 6 This is a schematic diagram of an embodiment of a vertical periscope camera module according to the present invention. It should be noted that, for ease of demonstration of the structure of the outer casing 200, Figure 6 The positions of the cover plate 210 and the imaging unit 100 were moved to expose the opening 202 and the light inlet 201.

[0036] A vertical periscope camera module according to this embodiment includes a housing 200, in which a prism 300 and a lens assembly 400 are disposed. One end of the housing 200 has an opening 202, and an imaging unit 100 is disposed at the opening 202, thereby sealing the opening 202. The imaging unit 100 adopts an imaging unit of a camera module as described in any of the above embodiments. Of course, the vertical periscope camera module also includes a prism bracket 130 for fixing the prism 300, a lens bracket 130 for fixing the lens, a motor for moving the lens assembly 400, and other components, all of which are conventional structures and will not be described in detail here.

[0037] Please see Figure 7 The prism 300 is disposed at the end of the housing 200 away from the imaging unit 100. The lens assembly 400 is disposed between the prism 300 and the imaging unit 100. A light inlet 201 is provided at the upper end of the housing 200 corresponding to the position of the prism 300. A cover plate 210 is provided above the light inlet 201, so that the light inlet 201 can be closed by the cover plate 210. The prism 300 includes a light-inlet surface 301 arranged in the horizontal direction, a light-outlet surface 303 arranged in the vertical direction, and a reflective surface 302 connecting the light-inlet surface 301 and the light-outlet surface 303. The light-inlet surface 301 faces the light inlet 201, and the light-outlet surface 303 faces the lens assembly 400.

[0038] The vertical periscope module uses a prism at its front end to reflect vertically incident light rays, transforming them into horizontal rays that enter the camera module. This allows the camera module to be placed horizontally, reducing its height. In this embodiment, light enters the housing 200 through the light inlet 201, first passing through the light inlet surface 301 into the prism 300. Then, it is reflected by the reflective surface 302, changing the direction of light propagation from vertical to horizontal. The light then exits horizontally from the light outlet surface 303, passes through the lens assembly 400, and is imaged in the imaging unit 100.

[0039] The structure of this embodiment provides higher intensity for the imaging unit 100 and reduces stray light in the imaging optical path, thus improving imaging performance. Furthermore, the isolation provided by the potting structure 160 shortens the safety gap between the electronic components 113 and the IR support 130, thereby reducing the risk of damage to the periscope module. Figure 6 The dimensions along the y-axis can be used in modules with smaller lens back focal lengths, which aligns with the trend of miniaturizing camera modules.

[0040] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An imaging unit of a camera module, characterized by: The device includes a circuit board, a chip, an IR bracket, and a filter. The circuit board has a chip mounting area, and electronic components are arranged around the chip mounting area. The chip is fixedly mounted in the chip mounting area, and several gold wires connect the chip and the circuit board. The IR bracket is located above the chip and has a vertically penetrating light-transmitting hole. The chip is located directly below the light-transmitting hole, and the filter is located directly above the light-transmitting hole. A mounting gap is formed between the IR bracket and the circuit board, and a potting structure is arranged in the mounting gap to encapsulate the electronic components and gold wires. 2.The camera module imaging unit of claim 1, wherein: The light-transmitting hole of the IR bracket is coated with a low-reflection coating.

3. The imaging unit of a camera module as described in claim 2, characterized in that: The low-reflection coating is formed by spraying black paint.

4. The imaging unit of a camera module as described in claim 1, characterized in that: The upper surface of the IR bracket has an annular recessed step around the opening of the light-transmitting hole, and the filter is disposed in the area enclosed by the recessed step.

5. The imaging unit of a camera module as described in claim 1, characterized in that: The lower end of the IR bracket has a raised ring at the opening of the light-transmitting hole. The chip is positioned directly below the raised ring, and the photosensitive area of ​​the chip is aligned with the light-transmitting hole. The lower end of the chip is in contact with the upper end of the circuit board. The mounting gap includes a first gap formed between the area of ​​the circuit board corresponding to the outer side of the chip and the IR bracket, and a second gap formed between the area of ​​the chip corresponding to the raised ring and the IR bracket.

6. The imaging unit of a camera module as described in claim 5, characterized in that: The upper surface of the circuit board is provided with a plurality of first pads corresponding to the area of ​​the first gap, and the upper surface of the chip is provided with a plurality of second pads corresponding to the area of ​​the second gap; the first end of each gold wire is connected to a first pad in the first gap, and the second end of each gold wire is bent downward and extends from the first gap into the second gap to connect to a second pad.

7. The imaging unit of a camera module as described in claim 1, characterized in that: The glue-filling structure is formed by filling a sealed space with glue after the IR support and external mold are used to create a sealed space and then curing the glue.

8. The imaging unit of a camera module as described in claim 1, characterized in that: The upper end of the potting structure is connected to the IR bracket, and the lower end is connected to the circuit board.

9. A vertical periscope camera module, characterized in that: The device includes a housing, in which a prism and a lens assembly are disposed. One end of the housing has an opening, and an imaging unit is disposed at the opening. The imaging unit is a camera module imaging unit as described in any one of claims 1 to 8.

10. A vertical periscope camera module as described in claim 9, characterized in that: The prism is disposed at one end of the housing away from the imaging unit, and the lens assembly is disposed between the prism and the imaging unit. A light inlet is provided at the upper end of the housing corresponding to the position of the prism, and a cover plate is provided above the light inlet. The prism includes a light-inlet surface arranged in a horizontal direction, a light-outlet surface arranged in a vertical direction, and a reflective surface connecting the light-inlet surface and the light-outlet surface. The light-inlet surface faces the light inlet, and the light-outlet surface faces the lens assembly.

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