Power components and electrical equipment

Abstract

This application relates to a power component and electrical equipment. The power component includes a heat dissipation device and a power plate. The heat dissipation device has two opposite sides along the X direction, each side serving as a heat dissipation mounting surface. A cooling medium flows within the heat dissipation device, and a power plate is mounted on each of the two heat dissipation mounting surfaces. In this application's power component, the two sides of the power heat dissipation device along the X direction are respectively designated as heat dissipation mounting surfaces for mounting the power plate and dissipating heat. This approach helps save space, improves the integration of the power component, and effectively enhances the compactness of the electrical equipment.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to a power component and electrical equipment. Background Technology

[0002] Cooling of various components of the power module in an energy storage converter is a key factor affecting the converter's performance. Energy storage converters in related technologies mostly adopt conventional heat dissipation structures to remove the heat generated by the operation of various components. However, this also leads to a significant increase in the size of the power module and poor performance of the power module. Utility Model Content

[0003] Based on this, a power component and electrical device are provided, which enable the power component to dissipate heat while having a better miniaturized design and superior performance.

[0004] According to one aspect of this application, a power component is provided, the power component comprising:

[0005] A heat dissipation device having two opposing sides along the X direction, each side being configured as a heat dissipation mounting surface, and a cooling medium flowing within the heat dissipation device; and

[0006] A power board is provided on each of the two heat dissipation mounting surfaces.

[0007] In one embodiment, the power board has an extension extending out of the heat dissipation device in the Y direction, the extension is provided with a capacitor, and the capacitor on the corresponding power board is provided on the surface of the corresponding power board facing the other power board;

[0008] The X direction and the Y direction intersect each other.

[0009] In one embodiment, the projection of the capacitor along the X direction is located within the projection range of the extension along the X direction.

[0010] In one embodiment, a power device is disposed on the power board, the power device being attached to the heat dissipation mounting surface and located between the power board and the heat dissipation mounting surface.

[0011] In one embodiment, the heat dissipation device defines a heat dissipation groove for accommodating a heat-generating element.

[0012] In one embodiment, the heat dissipation device includes a heat dissipation body, which includes a base plate, a first side plate, and a second side plate. The first side plate and the second side plate are located on opposite sides of the base plate along the X direction and together with the base plate define the heat dissipation groove. Heat dissipation channels are provided in the first side plate and the second side plate for circulating the cooling medium.

[0013] The first side plate and the second side plate have the heat dissipation mounting surface on the side opposite to the heat dissipation groove.

[0014] In one embodiment, the heat dissipation device further includes a top sealing plate, which has wire holes and potting holes. The wire holes are used for the wires of the heat-generating element in the heat dissipation tank to pass through, and the potting holes are used for injecting thermally conductive adhesive into the heat dissipation tank.

[0015] In one embodiment, the heating element is an inductor, which is encapsulated in the heat sink and connected to the power board via a wire passing through the wire hole.

[0016] In one embodiment, the heat dissipation device further includes an end plate assembly disposed at the end of the heat dissipation groove along the Z direction. At least one of the end plate assemblies includes an inner end plate and an outer end plate, which are stacked on the heat dissipation body along the Z direction. A receiving space communicating with the heat dissipation channel is defined between the inner end plate and the outer end plate.

[0017] The X direction and the Z direction intersect each other.

[0018] In one embodiment, the heat dissipation device further includes a separator disposed within the receiving space of the end plate assembly to divide the receiving space of the end plate assembly into at least two sub-spaces, the at least two sub-spaces connecting each of the heat dissipation channels in sequence.

[0019] In one embodiment, the heat dissipation channel includes a first heat dissipation channel, a second heat dissipation channel, a third heat dissipation channel, and a fourth heat dissipation channel. The first heat dissipation channel is disposed within the first side plate, the second heat dissipation channel is disposed within the bottom plate, the third heat dissipation channel is disposed within the second side plate, and the fourth heat dissipation channel is disposed within both the first and second side plates. A first end of the first heat dissipation channel is used to connect to the output end of an external heat exchanger, and a second end of the first heat dissipation channel is connected to the second end of the second heat dissipation channel. A first end of the second heat dissipation channel is connected to the first end of the third heat dissipation channel, and a second end of the third heat dissipation channel is connected to the second end of the fourth heat dissipation channel. A first end of the fourth heat dissipation channel is used to connect to the input end of the external heat exchanger.

[0020] According to another aspect of this application, an electrical device is provided, including the power component of any of the above embodiments.

[0021] In one embodiment, the electrical equipment further includes a first fan, a second fan, and a radiator. The second fan is located on one side of the radiator, and a cooling medium flows through the radiator. The radiator has a heat dissipation channel for the cooling medium to flow through it. The cooling medium channel in the radiator, the heat dissipation channel, and the cooling medium channel in the external heat exchanger are connected in series. The external heat exchanger is used to cool the cooling medium.

[0022] The electrical equipment also includes a circuit board assembly, which is located on one side of the heat dissipation device. The air blown out by the second fan flows through the circuit board assembly to the first fan, and the air blown out by the first fan flows back to the second fan after passing through the heat dissipation device and the power board.

[0023] In one embodiment, the circuit board assembly is located on one side of the heat dissipation device along the Y direction, the second fan is located on one side of the circuit board assembly along the Z direction, and the first fan is located on the side of the circuit board assembly away from the second fan along the Z direction.

[0024] The X direction, Y direction, and Z direction intersect each other in pairs.

[0025] The aforementioned power components utilize a cooling medium circulating within the heat dissipation device to cool the power board mounted on the heat dissipation mounting surface. Compared to related technologies where the power board is placed around the heat dissipation device, the two heat dissipation mounting surfaces along the X direction in this application facilitate mounting the power board on these surfaces, saving space, increasing the integration of the power components, and effectively improving the compactness of the electrical equipment. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the power component in one embodiment of this application.

[0027] Figure 2 This is a schematic diagram of the heat dissipation device in one embodiment of this application.

[0028] Figure 3 This is a schematic diagram of the structure of the first endplate assembly in one embodiment of this application.

[0029] Figure 4 This is a schematic diagram of the structure of the second endplate assembly in one embodiment of this application.

[0030] Figure 5 This is a schematic diagram of the structure of the heat dissipation body in one embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the structure of an electrical device in one embodiment of this application.

[0032] Figure 7 This is a schematic diagram of the heat exchanger in one embodiment of this application.

[0033] Explanation of icon numbers:

[0034] 10. Heat dissipation device; 1. Heat dissipation body; 11. First heat dissipation channel; 12. Second heat dissipation channel; 13. Third heat dissipation channel; 14. Fourth heat dissipation channel; 15. Base plate; 161. First side plate; 162. Second side plate; 17. Heat dissipation mounting hole; 18. Top sealing plate; 181. Wiring hole; 182. Glue potting hole;

[0035] 21. Inner end plate; 22. Outer end plate;

[0036] 23. First separator; 24. First subspace; 25. Second subspace; 26. Third subspace; 27. Limiting channel;

[0037] 33. Second partition; 34. Fourth subspace; 35. Fifth subspace;

[0038] 41. Liquid inlet; 42. Liquid outlet; 51. Heating element; 52. Power board; 53. Capacitor; 6. Heat sink; 61. Inlet; 62. Outlet; 63. Heat sink fin; 71. Connecting pipe; 72. Connecting pipe; 73. Intermediate pipe; 74. Housing; 8. First fan; 9. Second fan. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] Existing energy storage converters typically employ conventional heat dissipation structures, resulting in significant deficiencies in size control and making it difficult to meet the demands of modern energy storage converters for high performance, miniaturization, and high reliability. There is an urgent need for a new solution that can effectively address these issues.

[0046] Based on this, this application provides a power component and electrical device with better space optimization performance, better integration and overall structural compactness.

[0047] See Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the power component in one embodiment of this application. Figure 2 This is a schematic diagram of the structure of the heat dissipation device 10 in one embodiment of this application.

[0048] The power component provided in this application includes a heat dissipation device 10 and a power plate 52. The heat dissipation device 10 has two opposite sides along the X direction, each side being configured as a heat dissipation mounting surface. A cooling medium flows inside the heat dissipation device 10, and a power plate 52 is provided on each of the two heat dissipation mounting surfaces to effectively cool the power plate 52 through the heat dissipation device 10.

[0049] The power module of this application features a heat dissipation device 10 with two heat dissipation mounting surfaces along the X direction. This facilitates the mounting of two power boards 52 on these surfaces, saving space, increasing the integration of the power module, and effectively improving the compactness of the electrical equipment. Simultaneously, it leverages the structural advantages of the heat dissipation device 10, allowing the heat generated by the power boards 52 during operation to be rapidly transferred through the mounting surfaces to the cooling medium inside the heat dissipation device 10, achieving efficient heat dissipation. Furthermore, by mounting power boards 52 on both heat dissipation mounting surfaces, a double-sided layout of the power boards 52 is achieved. This structural innovation optimizes the internal space utilization of the power module. Compared to the traditional method of mounting a single power board 52, the double-sided heat dissipation mounting of this application can accommodate more power boards 52 within the same volume, thereby increasing the power density of the power module.

[0050] In some embodiments, see Figure 1As shown, the power board 52 has an extension extending from the heat dissipation device 10 along the Y direction. A capacitor 53 is disposed on the extension, and the capacitor 53 on the corresponding power board 52 is disposed on the surface of the corresponding power board 52 facing the other power board 52, wherein the X and Y directions intersect each other. In this way, the capacitor 53 is disposed between the two opposing power boards 52, eliminating the need for additional space to place the capacitor 53. This facilitates full utilization of the space between the two extensions of the two power boards 52, improves the space utilization rate of the power component, and enables the miniaturization design of the power component.

[0051] In some embodiments, continue reading Figure 1 As shown, the projection of capacitor 53 along the X direction is located within the projection range of the extension along the X direction. This facilitates the full utilization of the cooling medium to cool capacitor 53 on power board 52, while further saving the space required for capacitor 53 installation, thus enabling miniaturized design of power components.

[0052] In particular, the extension of the power board 52 can extend from the base plate 15 side of the heat dissipation device 10 along the Y direction, so that the capacitor 53 is located between the power board 52 and the base plate 15 of the heat dissipation body 1. In this way, the capacitor 53 can be cooled by the cooling medium flowing through the heat dissipation channel of the base plate 15. This is beneficial for further utilizing the cooling medium in each heat dissipation channel and improving the utilization rate of the cooling medium.

[0053] In some embodiments, continue reading Figure 1 As shown, power devices are mounted on the power board 52, and are attached to the heat dissipation mounting surface and located between the power board 52 and the heat dissipation mounting surface. The power board 52, the capacitor 53, and the power devices on it are cooled by the cooling medium, which helps to make full use of the heat exchange of the cooling medium and improve the utilization rate of the cooling medium.

[0054] The power board 52 in this application can be a circuit board (PCB), and there are no further restrictions. The power device can be a power semiconductor device, such as an insulated gate bipolar transistor (IGBT), and multiple power devices can be provided, and there are no further restrictions.

[0055] In some embodiments, in addition to capacitors and power devices, other electronic devices are also provided on the power board 52. These other electronic devices can be configured to be located on two different surfaces of the power board 52, respectively, so as to achieve effective utilization of the area on the power board 52.

[0056] In some embodiments of this application, the power devices disposed on the power board 52 are attached to the heat dissipation mounting surface so as to effectively dissipate heat from the high-heat power devices using the heat dissipation device 10.

[0057] In some embodiments, the thickness direction of the power board 52 is perpendicular to the heat dissipation mounting surface, or in other words, the surface of the power board 52 is mounted parallel to the corresponding heat dissipation mounting surface. See reference. Figure 1 The thickness direction of the power board 52 is parallel to the X-direction, and the heat dissipation mounting surface is perpendicular to the X-direction, so that the surface of the power board 52 is mounted parallel to the corresponding heat dissipation mounting surface. This helps to save space, reduce the overall thickness, and facilitates its miniaturization design.

[0058] Furthermore, two power boards 52 can be set up one-to-one, with the corresponding power board 52 surface parallel to the corresponding heat dissipation mounting surface on the two heat dissipation mounting surfaces of the two side plates, so as to make full use of the cooling medium and save installation space.

[0059] In some embodiments, the heat dissipation mounting surface is provided with a plurality of heat dissipation mounting holes 17 for mounting the power board 52. The power board 52 can be mounted on the heat dissipation mounting surface through the heat dissipation mounting holes 17, which facilitates the mounting of the power board 52 on the heat dissipation mounting surface by means of bolts or other structures, thereby improving the stability and convenience of the mounting of the power board 52.

[0060] In some embodiments, in conjunction with reference Figure 2 , Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of the structure of the first endplate assembly in one embodiment of this application. Figure 4 This is a schematic diagram of the structure of the second endplate assembly in one embodiment of this application.

[0061] The heat dissipation device 10 defines a heat dissipation groove for housing the heat-generating element 51. Thus, while using the cooling medium within the heat dissipation channel to cool the power board 52 and capacitor 53 on the heat dissipation mounting surface, the cooling medium can also be used to cool the heat-generating element 51 within the heat dissipation groove, improving the utilization rate of the cooling medium.

[0062] In some embodiments, continue reading Figure 2 , Figure 3 and Figure 4 The heat sink 1 has multiple heat dissipation channels, which are located around the heat sink and contain a cooling medium for dissipating heat from components including but not limited to the heat-generating element 51 and the power board 52.

[0063] In some embodiments, the cooling medium of this application may be a liquid medium such as coolant, and the material may be water plus antifreeze and additives, wherein the antifreeze may be ethylene glycol or propylene glycol, and the additives may be at least one of corrosion inhibitors, scale inhibitors, corrosion inhibitors and antifoaming agents.

[0064] In some embodiments, see Figure 2 , Figure 3 and Figure 4 Combined with reference Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of the heat dissipation body 1 in one embodiment of this application.

[0065] The heat dissipation device 10 includes a heat dissipation body 1, which includes a base plate 15, a first side plate 161, and a second side plate 162. The first side plate 161 and the second side plate 162 are located on opposite sides of the base plate 15 along the X direction and together with the base plate 15 define a heat dissipation groove. Through the combined action of the base plate 15 and the two side plates, a stable heat dissipation groove frame is formed, which can effectively fix and support the heat-generating element 51, while providing a good channel for the circulation of the cooling medium, thus ensuring the structural stability and heat dissipation efficiency of the heat dissipation device 10.

[0066] The first side plate 161 and the second side plate 162 are provided with heat dissipation channels for the flow of cooling medium. The side of the first side plate 161 and the second side plate 162 opposite to the heat dissipation groove has a heat dissipation mounting surface. This facilitates the full flow of cooling medium around the heat dissipation groove, enabling the cooling medium to dissipate heat more evenly and fully to the heat-generating element 51 in the heat dissipation groove and the power board 52 on the heat dissipation mounting surface, further improving the overall performance of the heat dissipation device 10 and enhancing the cooling effect.

[0067] In some embodiments, the base plate 15, the first side plate 161, and the second side plate 162 are integrally formed. This integral structural design can effectively reduce the splicing and assembly processes of the base plate 15 and the side plates, reduce the risk of structural instability caused by loosening or wear at the connection points, thereby improving the structural stability and reliability of the heat dissipation body 1, giving it higher rigidity and strength.

[0068] In some embodiments, such as Figure 2 As shown, the heat dissipation device 10 also includes a top sealing plate 18, which has a wire passage hole 181 and an adhesive filling hole 182. The wire passage hole 181 is used for the wires of the heating element 51 in the heat dissipation tank to pass through, thereby effectively managing the wires of the heating element 51 and ensuring that the wires can be safely led out of the heat dissipation tank. The adhesive filling hole 182 is used to fill the heat dissipation tank with thermally conductive adhesive. The thermally conductive adhesive enhances the heat conduction efficiency between the heat dissipation device 10 and the heating element 51, further improving the heat dissipation performance of the heat dissipation device 10.

[0069] In some embodiments, the heating element 51 of this application may be an inductor, such as a reactor, without further limitation.

[0070] The inductor is encapsulated within a heat sink, and is connected to the power board 52 via a wire passing through a wire hole 181. This allows the wire to be safely led out of the heat sink and electrically connected to the power board 52 without requiring additional wiring, thus saving on wiring path and cost, and facilitating circuit planning.

[0071] In this embodiment, multiple inductors can be placed inside the heat sink, i.e., multiple heat-generating elements 51 can be set, and the heat-generating elements 51 can be set as inductors, simultaneously dissipating heat from multiple inductors. Furthermore, the heat dissipation channels are located on the periphery of the heat sink, which can effectively improve the heat dissipation efficiency for multiple inductor components, ensuring the stable operation of the electronic device.

[0072] In some embodiments, see Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation device 10 also includes an end plate assembly, which is disposed at the end of the heat dissipation groove along the Z direction. At least one end plate assembly includes an inner end plate 21 and an outer end plate 22, which are stacked on top of each other on the heat dissipation body 1 along the Z direction. A receiving space communicating with the heat dissipation channel is defined between the inner end plate 21 and the outer end plate 22. The X direction and the Z direction intersect each other.

[0073] In this way, the space is used to collect heat from multiple heat dissipation channels, eliminating the need for each channel to be connected to an external heat exchanger. This facilitates the entry and exit of the cooling medium and makes the entire heat dissipation device 10 more compact, simplifying the structure and saving costs. It also facilitates the maintenance and cleaning of the heat dissipation channels, extending the service life of the heat dissipation device 10.

[0074] Furthermore, it is understandable that when welding the end plate assembly to the heat sink 1, the welding torch is difficult to extend into the heat sink groove and aim at the connection point between the heat sink 1 and the end plate assembly. Or even if the welding torch is extended into the heat sink groove, the limited space within the heat sink groove makes it difficult to aim the welding torch at the connection point between the heat sink 1 and the end plate assembly at a suitable angle, making it difficult to weld a strong weld point, resulting in low weld strength.

[0075] This application adopts a design that splits the end plate into an inner end plate 21 and an outer end plate 22. This design allows the inner end plate 21 to be welded to the heat sink body 1 from the outside using a welding gun, and then the outer end plate 22 to be placed on top and welded to the heat sink body 1 from the outside using a welding gun. This solves the problem that the welding gun is difficult to insert into the heat sink groove and align with the connection between the heat sink body 1 and the end plate assembly. This improves the ease of welding, reduces the difficulty of welding, and facilitates the formation of strong weld points. It also improves the cooling performance of the heat sink 10, enhances the overall structural strength and reliability of the heat sink 10, and ensures its stability and efficient heat dissipation performance during long-term use.

[0076] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation device 10 also includes a separator, which is disposed within the receiving space of the end plate assembly to divide the receiving space of the end plate assembly into at least two sub-spaces, and the at least two sub-spaces connect each heat dissipation channel in sequence. In this way, by connecting multiple heat dissipation channels in series through the separated sub-spaces, the cooling medium forms a complete circulation system within the heat dissipation device 10, achieving more uniform and efficient heat dissipation.

[0077] In this embodiment, multiple subspaces can be set on the two end plate assemblies at both ends along the Z direction, and multiple heat dissipation channels can be used to realize multiple back-and-forth circulation of the cooling medium, so that the cooling medium can flow fully in the heat dissipation channels and have sufficient heat exchange with the heat-generating element 51, thereby cooling the heat-generating element 51 in the heat dissipation tank.

[0078] In some embodiments, in conjunction with reference Figure 2 and Figure 3 As shown, the outer end plate 22 of the end plate assembly is provided with an inlet 41 and an outlet 42 connected to the receiving space. The inlet 41 and the outlet 42 are respectively connected to the receiving space and the external environment. Thus, the receiving space can be connected to the output end of the external heat exchanger through the inlet 41, and to the input end of the external heat exchanger through the outlet 42. This realizes the circulation of the cooling medium.

[0079] In some embodiments, the heat dissipation channel extends along the Z direction and has a first end and a second end opposite to each other along the Z direction. The cooling medium flows from one end of the first end and the second end of the heat dissipation channel to the other end within the heat dissipation channel, thereby achieving sufficient cooling of the heat dissipation tank.

[0080] In some embodiments, in conjunction with reference Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation device 10 includes two end plate assemblies, which are respectively disposed at both ends of the heat dissipation body 1 along the Z direction. One end plate assembly may have a partition, while the other end plate assembly may not. In other words, one end plate assembly may lack a partition, and the cooling medium is improved by simply stacking an inner end plate 21 and an outer end plate 22. This allows the cooling medium to flow from one end of at least one heat dissipation channel to the other, pass through the receiving space defined between the inner end plate 21 and the outer end plate 22, and then flow back to the starting end through another at least one heat dissipation channel, thus achieving a round-trip circulation of the cooling medium.

[0081] In this embodiment, the heat sink 1, the two end plate assemblies and the top sealing plate 18 together enclose the heat-generating element 51. The heat sink 1, the two end plate assemblies and the top sealing plate 18 can all be made of metal to achieve electromagnetic compatibility shielding (EMC shielding) of the heat-generating element 51, such as a reactor, so as to reduce electromagnetic interference to surrounding equipment and improve its own anti-interference ability during operation.

[0082] In some embodiments, such as Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the heat dissipation channels include a first heat dissipation channel 11, a second heat dissipation channel 12, a third heat dissipation channel 13, and a fourth heat dissipation channel 14. The first heat dissipation channel 11 is used to connect to the output end of the external heat exchanger; specifically, the first end of the first heat dissipation channel 11 is connected to the liquid inlet 41, thus connecting to the output end of the external heat exchanger. The second end of the first heat dissipation channel 11 is connected to the second end of the second heat dissipation channel 12; the first end of the second heat dissipation channel 12 is connected to the first end of the third heat dissipation channel 13; the second end of the third heat dissipation channel 13 is connected to the second end of the fourth heat dissipation channel 14; and the first end of the fourth heat dissipation channel 14 is used to connect to the input end of the external heat exchanger. Specifically, the first end of the fourth heat dissipation channel 14 is connected to the liquid outlet 42, thus connecting to the input end of the external heat exchanger.

[0083] In some embodiments, multiple subspaces can be provided on the two end plate assemblies at both ends along the Z direction, in conjunction with multiple heat dissipation channels, to achieve multiple back-and-forth circulation of the cooling medium, so that the cooling medium can flow fully in the heat dissipation channels and exchange heat with the heat-generating element 51, thereby cooling the heat-generating element 51 in the heat dissipation slot.

[0084] By setting two separators corresponding to each of the two end plate assemblies, a series design can be achieved between the first heat dissipation channel 11, the second heat dissipation channel 12, the third heat dissipation channel 13, and the fourth heat dissipation channel 14. This allows the cooling medium to flow sequentially through each heat dissipation channel and fully cover the periphery of each heat-generating element 51 in the heat dissipation slot. The medium circulates along the Z-direction within the first heat dissipation channel 11, the second heat dissipation channel 12, the third heat dissipation channel 13, and the fourth heat dissipation channel 14, forming a complete circulation system within the heat dissipation device 10. This fully absorbs the heat generated by the heat-generating elements 51 at different locations within the heat dissipation slot, thereby achieving a more efficient and uniform heat dissipation effect. This further improves the overall performance of the heat dissipation device 10, bringing its heat dissipation performance to its optimal state.

[0085] In this embodiment, the first heat dissipation channel 11 can be located within the first side plate 161, the second heat dissipation channel 12 can be located within the bottom plate 15, the third heat dissipation channel 13 can be located within the second side plate 162, and the fourth heat dissipation channel 14 can be located within both the first side plate 161 and the second side plate 162. This ensures that the heat dissipation channels fully cover and are evenly distributed around the periphery of the heat dissipation groove, thereby improving the cooling uniformity of the power board 52 and the heat-generating element 51.

[0086] It is understood that this application can be configured such that the power board 52 extends beyond the heat sink 1 along the side of the base plate 15 of the heat sink 1. When the capacitor 53 is located on the extension of the power board 52, the capacitor 53 is positioned on the side of the power board 52 facing the heat sink 1, or in other words... Figure 1 As shown, capacitor 53 is positioned between power board 52 and base plate 15 of heat sink 1. This allows capacitor 53 to be cooled by the cooling medium flowing through the heat dissipation channels of base plate 15, reducing the ambient temperature within the heat sink and aiding in heat dissipation of capacitor 53. Simultaneously, it also facilitates the full utilization of the cooling medium within each heat dissipation channel, improving the cooling medium utilization rate.

[0087] In some embodiments, the base plate 15 is provided with a plurality of second heat dissipation channels 12, which are spaced apart from each other along the X direction. This allows the cooling medium to be evenly distributed within the base plate 15, fully absorbing heat from the bottom of the heat dissipation groove, improving the heat dissipation capacity of the base plate 15, and further enhancing the heat dissipation effect of the entire heat dissipation device 10.

[0088] The first side plate 161 is provided with multiple first heat dissipation channels 11 and multiple fourth heat dissipation channels 14. The multiple fourth heat dissipation channels 14 are located on one side of the multiple first heat dissipation channels 11 along the Y direction, and the multiple first heat dissipation channels 11 are spaced apart from each other along the Y direction. In this way, multiple heat dissipation paths are formed within the side plate, allowing the cooling medium to more comprehensively cover the side plate area, effectively absorbing heat near the side plate, improving the heat dissipation efficiency of the side plate, and thus further improving the heat dissipation performance of the entire heat dissipation device 10.

[0089] The second side plate 162 is provided with multiple third heat dissipation channels 13 and multiple fourth heat dissipation channels 14. The multiple fourth heat dissipation channels 14 are located on one side of the multiple third heat dissipation channels 13 along the Y direction, and the multiple third heat dissipation channels 13 are spaced apart from each other along the Y direction. The Z, X, and Y directions intersect in pairs. This structure makes the heat dissipation channel layout in the two side plates more balanced, ensuring that the cooling medium can flow evenly in the two side plates, fully absorbing heat from different directions, and further enhancing the heat dissipation uniformity and overall heat dissipation capacity of the heat dissipation device 10.

[0090] In this embodiment, the spacing between the two side plates along the X direction can be determined according to the actual heat dissipation requirements of the product. This embodiment does not impose specific limitations, so that it has a suitable size and can be adapted to heat-generating elements 51 of various sizes.

[0091] In some embodiments, continue reading Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation device 10 also includes two partitions, namely a first partition 23 and a second partition 33. The first partition 23 is disposed within the receiving space of the first end plate assembly and divides the receiving space of the first end plate assembly into a first sub-space 24, a second sub-space 25, and a third sub-space 26. The first sub-space 24 connects the liquid inlet 41 and the first end of the first heat dissipation channel 11. The second sub-space 25 connects the first end of the second heat dissipation channel 12 and the first end of the third heat dissipation channel 13. The third sub-space 26 connects the first end of the fourth heat dissipation channel 14 and the liquid outlet 42. The second partition 33 is disposed within the receiving space of the second end plate assembly and divides the receiving space of the second end plate assembly into a fourth sub-space 34 and a fifth sub-space 35. The fourth sub-space 34 connects the second end of the first heat dissipation channel 11 and the second end of the second heat dissipation channel 12. The fifth sub-space 35 connects the second end of the third heat dissipation channel 13 and the second end of the fourth heat dissipation channel 14. This effectively guides the flow direction of the cooling medium between the various heat dissipation channels, enabling the cooling medium to circulate along a preset path. It also makes the structure of the entire heat dissipation system more compact and orderly, facilitating manufacturing and maintenance, while improving the reliability and stability of the heat dissipation device 10.

[0092] Cooling medium enters the first subspace 24 through inlet 41, then flows from the first subspace 24 into the first end of the first heat dissipation channel 11, and then flows through the first end of the first heat dissipation channel 11 to the second end. Cooling medium flowing out from the second end of the first heat dissipation channel 11 enters the fourth subspace 34, and then flows from the fourth subspace 34 into the second end of the second heat dissipation channel 12, and then flows through the second end of the second heat dissipation channel 12 to the first end. Cooling medium flowing out from the first end of the second heat dissipation channel 12 enters the second subspace 25, and then flows through the second subspace 25 into the first end of the third heat dissipation channel 13, and then flows from the first end of the third heat dissipation channel 13 to the second end. Cooling medium flowing out from the second end of the third heat dissipation channel 13 enters the fifth subspace 35, and then flows from the fifth subspace 35 into the second end of the fourth heat dissipation channel 14, and then flows through the second end of the fourth heat dissipation channel 14 to the first end. Subsequently, the cooling medium flows from the first end of the fourth heat dissipation channel 14 into the third subspace 26, and then flows out from the outlet 42 from the third subspace 26. This achieves the reciprocating flow of the cooling medium in multiple heat dissipation channels, allowing the cooling medium to fully absorb heat within the heat dissipation device 10 and maximize its heat dissipation effect. At the same time, it avoids the problem of local overheating or uneven heat dissipation of the cooling medium, effectively improving the cooling efficiency and performance of the entire heat dissipation device 10.

[0093] In some embodiments, a separator may be provided on one of the two end plate assemblies at both ends along the Z direction to form two subspaces, while the other end plate is not provided with a separator, in conjunction with multiple heat dissipation channels to achieve a single round-trip flow of the cooling medium.

[0094] In this embodiment, the heat dissipation channels include a fifth heat dissipation channel and a sixth heat dissipation channel (not shown). One of the fifth and sixth heat dissipation channels is disposed on the first side plate 161, and the other is disposed on the second side plate 162. The first end of the fifth heat dissipation channel is used to connect to the output end of an external heat exchanger through one of the subspaces within the end plate assembly with a separator. The second end of the fifth heat dissipation channel is connected to the first end of the sixth heat dissipation channel through the receiving space of the end plate assembly without a separator. The second end of the sixth heat dissipation channel is used to connect to the input end of an external heat exchanger through another subspace within the end plate assembly with a separator. In this way, the cooling medium flows from the first end of the sixth heat dissipation channel to the second end, and then from the second end of the fifth heat dissipation channel to the first end, thus realizing that the coolant flows back and forth within the heat dissipation device 10. This eliminates the need for a separator in the second end plate assembly at the connection between the second ends of the fifth and sixth heat dissipation channels. Compared to embodiments with first heat dissipation channels 11, second heat dissipation channels 12, third heat dissipation channels 13, and fourth heat dissipation channels 14, this embodiment has a relatively simple structure, which is beneficial for cost savings.

[0095] In some embodiments, continue reading Figure 2 , Figure 3 and Figure 4 As shown, the separator is disposed on the inner end plate 21 of the corresponding end plate assembly. The separator can be welded to the side of the inner end plate 21 facing the outer end plate 22, or it can be integrally formed with the inner end plate 21 during its fabrication, such as using a die-casting process. This allows the separator to be positioned between the inner end plate 21 and the outer end plate 22, thus isolating the corresponding subspace. No further restrictions are imposed here.

[0096] The outer end plate 22 has a limiting channel 27 that exposes only a portion of the corresponding partition. The inner wall of the limiting channel 27 abuts against at least a portion of the outer wall of the corresponding partition. Thus, the limiting channel 27 limits the abutment of the partition, preventing it from fully abutting against the inner wall of the outer end plate 22 facing the inner end plate 21. It is understood that if the partition were directly and fully abutting against the inner wall of the outer end plate 22, the welding torch would be difficult to insert into the narrow gap between the inner end plate 21 and the outer end plate 22, making welding between the partition and the outer end plate 22 difficult. Consequently, when the cooling medium flow rate is high, or when the heat dissipation device 10 is used for a long time, the outer end plate 22 is prone to deformation and outward protrusion, creating a gap between it and the partition. This prevents the partition from separating the various sub-spaces, thus affecting the flow channel design of the cooling medium.

[0097] The present application provides a limiting channel 27 on the outer end plate 22, so that the corresponding separator can be exposed from the limiting channel 27. In this way, the separator and the corresponding outer end plate 22 can be welded from the outside by a welding gun, making the welding process simple and reliable and improving the convenience of welding.

[0098] In this embodiment, a sealing element can also be provided between the inner wall of the limiting channel 27 and the corresponding outer wall of the corresponding separator to further improve the isolation effect between the various subspaces.

[0099] In some embodiments, see Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of an electrical device in one embodiment of this application. This application also provides an electrical device including the power component from any of the above embodiments. The electrical device of this application can be an energy storage converter, and no further limitations are imposed here. The electrical device of this application, using the aforementioned power component, has better integration and is conducive to miniaturization design.

[0100] In some embodiments, see Figure 6 As shown, the electrical equipment includes a housing 74, an inlet pipe 71, an outlet pipe 72, and an intermediate pipe 73. The inlet pipe 71, outlet pipe 72, and intermediate pipe 73 are all located on the outer wall of the housing 74. The inlet pipe 71 connects to the inlet 61 of the radiator 6, the intermediate pipe 73 connects to the outlet 62 of the radiator 6 and the liquid inlet 41 of the heat dissipation device 10, and the outlet pipe 72 connects to the outlet 42 of the heat dissipation device 10. Furthermore, the inlet pipe 71 connects to the output end of the external heat exchanger, and the outlet pipe 72 connects to the input end of the external heat exchanger, thus achieving the circulation of the cooling medium among the external heat exchanger, the radiator 6, and the heat dissipation device 10.

[0101] In this embodiment, a pump or proportional valve may also be installed on the circulation pipeline between the inlet pipe 71 and the outlet pipe 72 to achieve the circulation of the cooling medium. No further restrictions are imposed here.

[0102] In some embodiments, the electrical equipment further includes a support accessory for mounting the heat dissipation device 10 and its power plate 52 inside the housing 74, thereby improving the installation stability of the heat dissipation device 10 and its power plate 52.

[0103] In some embodiments, see Figure 6 Combined with reference Figure 7 As shown, Figure 7This is a schematic diagram of the structure of the radiator 6 in one embodiment of this application. The electrical equipment also includes the radiator 6, which is used to dissipate heat from the interior of the housing 74. The radiator 6 includes an inlet 61, an outlet 62, and a plurality of heat sinks 63. The inlet 61 and the outlet 62 are respectively connected to the internal space of the heat sinks 63, and the internal space of the heat sinks 63 is used to contain the cooling medium. The inlet 61 is used to connect to an external heat exchanger, and the outlet 62 is used to connect to the containing space through the liquid inlet 41 of the heat dissipation device 10. The cooling medium, after being cooled by the external heat exchanger, circulates sequentially through the inlet 61, the heat sinks 63, the outlet 62, the liquid inlet 41, the containing space, and the liquid outlet 42, so that the cooled medium in the radiator 6 can dissipate heat from the interior of the housing 74 through the radiator 6, and at the same time, dissipate heat from the power plate 52 and the heating element 51 through the heat dissipation body 1.

[0104] In this embodiment, both the inlet 61 and the outlet 62 are equipped with water nozzles including rubber ring sealing groove structures. The connection between the corresponding intermediate pipe 73 and the outlet 62 is realized through the corresponding water nozzles, and the connection between the corresponding access pipe 71 and the inlet 61 is realized through the corresponding water nozzles. Moreover, the rubber ring sealing groove structure of the water nozzles is beneficial for sealing the connection and preventing the leakage of cooling medium.

[0105] In this embodiment, the radiator 6 further includes two liquid collectors, which are respectively connected to both ends of the heat sink 63 for collecting the cooling medium in the multiple heat sinks 63. One of the two liquid collectors is also connected to a water nozzle at the inlet 61, and the other of the two liquid collectors is also connected to a water nozzle at the outlet 62, so that the cooling medium enters the multiple heat sinks 63 for heat dissipation before being centrally output.

[0106] In some embodiments, continue reading Figure 6 As shown, the electrical equipment also includes a first fan 8, a second fan 9, and a radiator 6, all housed within the enclosure 74. The second fan 9 is located on one side of the radiator 6, which contains a cooling medium. The cooling medium channels within the radiator 6, the heat dissipation channels, and the cooling medium channels in the external heat exchanger are connected in series. The external heat exchanger cools the cooling medium. Thus, the cooling medium, after being cooled by the external heat exchanger, passes through the radiator 6 and cools the air blown out by the second fan 9. The air blown out by the second fan 9 then cools the interior of the electrical equipment enclosure 74.

[0107] The electrical equipment also includes a circuit board assembly located on one side of the heat dissipation device 10. The air blown by the second fan 9 passes through the circuit board assembly to the first fan 8. The air blown by the first fan 8 passes through the heat dissipation device 10 and the power board 52 before being transmitted to the second fan 9. Thus, the air blown by the second fan 9 is cooled by the heat sink 6, passes through the circuit board assembly, and is driven by the first fan 8 to the heat dissipation device 10 and the power board 52, and then circulates back to the second fan 9 and the heat sink 6. This air circulation achieves overall air cooling inside the housing 74.

[0108] In this embodiment, see Figure 6 As shown, in addition to the first fan 8 and the second fan 9 driving the air circulation, the inner wall of the housing 74 also blocks the airflow, thereby limiting the direction of airflow and guiding the direction of airflow. That is, the inner wall of the housing 74 also plays an auxiliary guiding role in the air circulation.

[0109] In this embodiment, the radiator 6 can be covered by a sheet metal shell, and a first fan 8 can be installed on the sheet metal shell. The first fan 8 is used to blow air, and the radiator 6 can cool the air blown by the first fan 8, thereby dissipating heat from the inside of the casing 74. The first fan 8 can be an axial fan, and the second fan 9 can have the same structure as the first fan 8, without much restriction.

[0110] In this embodiment, the electrical equipment also includes a duct baffle, which is disposed between the circuit board assembly and the heat dissipation device 10. It also serves to limit or guide the airflow, and guide the airflow in the housing 74 to further circulate.

[0111] In some embodiments, continue reading Figure 6 As shown, the circuit board assembly is located on one side of the heat dissipation device 10 along the Y direction, the second fan 9 is located on one side of the circuit board assembly along the Z direction, and the first fan 8 is located on the side of the circuit board assembly along the Z direction away from the second fan 9. The X, Y, and Z directions intersect each other.

[0112] Understandable, in conjunction with reference Figure 6As indicated by the wind direction arrows, this configuration ensures that the air blown by the first fan 8 flows along the Z-direction towards the circuit board assembly, reaching the end of the circuit board assembly away from the first fan 8 along the Z-direction. At this point, the air is blocked by the inner wall of the housing 74 and the air duct baffle, moving downwards, and then driven by the second fan 9 to move along the Z-direction towards the heat dissipation device 10. It then moves back towards the first fan 8, which again drives it, causing the air to flow along the Z-direction towards the circuit board assembly. Thus, the air-cooling section only requires the first fan 8 and the second fan 9 to achieve overall air cooling within the housing 74. Through the air blown by the first fan 8, combined with the turbulent cooling of the second fan 9, the main heat-generating components inside the machine can efficiently transfer their heat to the heat sink 6, where it is then carried away by the circulating cooling medium, achieving efficient heat dissipation for the main heat-generating components. This ingenious overall heat dissipation design reduces the need for air cooling and helps reduce noise.

[0113] In some embodiments, continue reading Figure 6 As shown, the electrical equipment also includes, but is not limited to, circuit board assemblies, contactors, DC switches, AC switches, circuit breakers, resistors, and the aforementioned power components. The circuit board assemblies, contactors, DC switches, AC switches, circuit breakers, resistors, and the aforementioned power components are all housed within the enclosure 74, and their specific locations are not subject to further restrictions.

[0114] In this embodiment, the circuit board assembly includes, but is not limited to, stacked AC filter circuit boards, power supply boards, and filter capacitor circuit boards arranged at intervals between each other, and no further restrictions are imposed here.

[0115] The power component and electrical equipment of this application, by mounting the power board 52 onto the outer wall of the heat dissipation device 10, realizes the reuse of the cooling medium within the heat dissipation device 10, and also facilitates the reduction of the overall thickness of the power component, increasing its dimensional density and enabling its miniaturization design. Furthermore, the power devices of the electrical equipment of this application are attached to the outer wall of the water-cooled heat dissipation device 10 for heat dissipation, while the heat from the remaining devices is dissipated through the built-in first fan 8 and second fan 9, effectively solving the overall heat problem. Simultaneously, the heat dissipation device 10 adopts a design with split end plates consisting of an inner end plate 21 and an outer end plate 22. This allows the inner end plate 21 to be welded to the heat dissipation body 1 from the outside using a welding torch, followed by the outer end plate 22, which is then welded to the heat dissipation body 1 from the outside using a welding torch. This solves the problem of the welding torch being difficult to insert into the heat dissipation groove to align with the connection between the heat dissipation body 1 and the end plate assembly, thereby improving welding convenience and facilitating the formation of strong solder joints, thus improving the cooling performance of the heat dissipation device 10. The reactor is wrapped in heat dissipation and EMC shielding on all four sides through the heat dissipation body 1, two end plate assemblies and top sealing plate 18.

[0116] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A power assembly, characterized by, The power component includes: A heat dissipation device having two opposing sides along the X direction, each side being configured as a heat dissipation mounting surface, and a cooling medium flowing within the heat dissipation device; and A power board is provided on each of the two heat dissipation mounting surfaces.

2. The power pack of claim 1, wherein, The power board has an extension that extends out of the heat dissipation device in the Y direction, and a capacitor is provided on the extension. The capacitor on the corresponding power board is located on the surface of the corresponding power board facing the other power board. The X direction and the Y direction intersect each other.

3. The power pack of claim 2, wherein, The projection of the capacitor along the X direction is located within the projection range of the extension along the X direction.

4. The power pack of claim 1, wherein, The power board is provided with power devices, which are attached to the heat dissipation mounting surface and located between the power board and the heat dissipation mounting surface.

5. The power component according to claim 1, characterized in that, The heat dissipation device defines a heat dissipation groove for accommodating heat-generating elements.

6. The power component according to claim 5, characterized in that, The heat dissipation device includes a heat dissipation body, which includes a base plate, a first side plate, and a second side plate. The first side plate and the second side plate are located on opposite sides of the base plate along the X direction and together with the base plate define the heat dissipation groove. Heat dissipation channels are provided in the first side plate and the second side plate for circulating the cooling medium. The first side plate and the second side plate have the heat dissipation mounting surface on the side opposite to the heat dissipation groove.

7. The power component according to claim 6, characterized in that, The heat dissipation device also includes a top sealing plate, which has wire holes and glue-filling holes. The wire holes are used for the wires of the heat-generating element in the heat dissipation tank to pass through, and the glue-filling holes are used for filling the heat dissipation tank with thermally conductive adhesive.

8. The power component according to claim 7, characterized in that, The heating element is an inductor, which is encapsulated in the heat sink and connected to the power board via a wire passing through the wire hole.

9. The power component according to claim 6, characterized in that, The heat dissipation device further includes an end plate assembly, which is disposed at the end of the heat dissipation groove along the Z direction. At least one end plate assembly includes an inner end plate and an outer end plate, which are stacked on the heat dissipation body along the Z direction. A receiving space communicating with the heat dissipation channel is defined between the inner end plate and the outer end plate. The X direction and the Z direction intersect each other.

10. The power component according to claim 9, characterized in that, The heat dissipation device further includes a separator disposed within the receiving space of the end plate assembly to divide the receiving space of the end plate assembly into at least two sub-spaces, and the at least two sub-spaces sequentially connect each of the heat dissipation channels.

11. The power component according to claim 6, characterized in that, The heat dissipation channels include a first heat dissipation channel, a second heat dissipation channel, a third heat dissipation channel, and a fourth heat dissipation channel. The first heat dissipation channel is disposed within the first side plate, the second heat dissipation channel is disposed within the bottom plate, the third heat dissipation channel is disposed within the second side plate, and the fourth heat dissipation channel is disposed within both the first and second side plates. The first end of the first heat dissipation channel is used to connect to the output end of an external heat exchanger, and the second end of the first heat dissipation channel is connected to the second end of the second heat dissipation channel. The first end of the second heat dissipation channel is connected to the first end of the third heat dissipation channel, and the second end of the third heat dissipation channel is connected to the second end of the fourth heat dissipation channel. The first end of the fourth heat dissipation channel is used to connect to the input end of the external heat exchanger.

12. An electrical device, characterized in that, Includes the power components as described in any one of claims 1 to 11.

13. The electrical equipment according to claim 12, characterized in that, The electrical equipment also includes a first fan, a second fan, and a radiator. The second fan is located on one side of the radiator. A cooling medium flows through the radiator. The heat dissipation device is provided with a heat dissipation channel for the cooling medium to flow through. The cooling medium channel in the radiator, the heat dissipation channel, and the cooling medium channel in the external heat exchanger are connected in series. The external heat exchanger is used to cool the cooling medium. The electrical equipment also includes a circuit board assembly, which is located on one side of the heat dissipation device. The air blown out by the second fan flows through the circuit board assembly to the first fan, and the air blown out by the first fan flows back to the second fan after passing through the heat dissipation device and the power board.

14. The electrical equipment according to claim 13, characterized in that, The circuit board assembly is located on one side of the heat dissipation device along the Y direction, the second fan is located on one side of the circuit board assembly along the Z direction, and the first fan is located on the side of the circuit board assembly away from the second fan along the Z direction. The X direction, Y direction, and Z direction intersect each other in pairs.

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