Chip packaging carrier board with pin bend protection
By setting support and protection components on the chip packaging substrate, the problem of pins being easily bent during installation and transportation is solved, thereby improving pin stability and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BIATAI TECH CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-06-30
AI Technical Summary
During installation and transportation, the pins of traditional chip packaging substrates are easily bent due to impacts, which affects their service life.
Support and protective components, including a support cover, protective plate, heat-conducting plate and heat dissipation holes, are used to improve the support stability and heat dissipation effect of the pins and prevent bending.
It effectively prevents pins from bending during installation and transportation, improves stability and lifespan, and enhances heat dissipation performance.
Smart Images
Figure CN224439289U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging substrate technology, specifically to a chip packaging substrate with pin bend protection. Background Technology
[0002] Chip packaging substrates are the direct carriers for the integrated packaging of semiconductor chips and various passive devices. They also serve as the carriers that connect and transmit signals between bare chips and printed circuit boards, playing a crucial role in providing functions such as cell interconnection, performance enhancement, fixed support, heat dissipation, and isolation protection for chips.
[0003] Chip packaging substrates can be classified into four categories according to the packaging method: WB, FC, BGA, and CSP. Among them, WB (wire bonding) uses wires to connect the bare chip to the substrate and is widely used in RF modules; FC (flip-chip) flips the bare chip and connects it directly to the substrate with solder balls and bumps, and is widely used in CPU, GPU, and other product packaging; BGA (ball grid array) is one of the mainstream packaging technologies and is suitable for high-performance processors in PCs and servers; CSP (chip-scale packaging) allows the ratio of chip area to package area to be close to ideal and is suitable for mobile chips.
[0004] In traditional chip packaging substrates, the pins are easily bent due to impacts during installation and subsequent transportation, which can cause damage and affect subsequent use, thus reducing the service life or rendering the substrate unusable. Utility Model Content
[0005] The purpose of this invention is to provide a chip packaging carrier board with pin bending protection, which solves the problem that in the prior art, chip packaging carrier boards are prone to pin bending due to collisions during installation and transportation, thus affecting subsequent use.
[0006] This utility model provides the following technical solution: a chip packaging carrier board with pin bending protection, including a packaging carrier board body, a circuit board fixedly connected to the upper side of the packaging carrier board body, and pin bodies fixedly connected to both sides of the circuit board. The pin body is fixedly connected to the packaging carrier board body at the end away from the circuit board. A support component is provided on the outer side of the pin body at the end away from the circuit board, and the support component includes a support cover fixedly connected to the lower outer side of the pin body. A first heat dissipation hole is opened at the outer end of the support cover, and a protective component is provided on the inner side of the pin body. A heat conduction component is provided between the two sets of circuit boards, and a heat dissipation component is provided on the upper end of the heat conduction component.
[0007] As a preferred embodiment of the above technical solution, the protective component includes a protective plate disposed between two sets of pin bodies, with one end of the protective plate near the circuit board fixedly connected to the circuit board, and support plates fixedly connected to both sides of the protective plate, with the end of the support plate away from the protective plate fixedly connected to the pin body.
[0008] The above technical solution enhances the stability of the pin body by using protective and support plates.
[0009] As a preferred embodiment of the above technical solution, a first heat-conducting plate is fixedly connected to the inner side of the protective plate, and multiple sets of second heat dissipation holes are opened at both ends of the protective plate and the first heat-conducting plate.
[0010] The above technical solution improves the heat conduction and dissipation effects at the protective plate and support plate through the first heat-conducting plate and the second heat dissipation hole.
[0011] As a preferred embodiment of the above technical solution, the heat-conducting component includes a second heat-conducting plate fixedly connected inside the encapsulation carrier plate body, and a third heat-conducting plate fixedly connected to the upper side of the second heat-conducting plate.
[0012] The above technical solution uses a second heat-conducting plate and a third heat-conducting plate to conduct and dissipate heat from the packaging carrier body.
[0013] As a preferred embodiment of the above technical solution, the heat dissipation component includes a third heat dissipation hole in the middle of the third heat-conducting plate, and heat dissipation grooves are provided at both ends of the third heat-conducting plate.
[0014] The above technical solution enhances the heat conduction and dissipation of the third heat-conducting plate through the third heat dissipation hole and heat dissipation groove.
[0015] As a preferred embodiment of the above technical solution, the three sets of heat dissipation slots are arranged in an array, and the heat dissipation slots are arranged in an arc shape.
[0016] As a preferred embodiment of the above technical solution, the support cover is configured as a funnel shape, and multiple sets of first heat dissipation holes are arranged in a circumferential array inside the support cover.
[0017] Compared with the prior art, the beneficial effects of this utility model are:
[0018] This chip packaging carrier board with pin bend protection can protect the pin body through the cooperation of support components and protective components, effectively improving its stability after installation and avoiding bending caused by installation and transportation. Attached Figure Description
[0019] Figure 1 A schematic diagram of the three-dimensional structure of a chip packaging carrier board with pin bend protection;
[0020] Figure 2This is an enlarged cross-sectional view of the chip packaging carrier circuit board with pin bend protection and the third heat-conducting plate.
[0021] Figure 3 for Figure 1 Enlarged schematic diagram of the structure at point A in the middle;
[0022] Figure 4 for Figure 2 Enlarged schematic diagram of the structure at point B.
[0023] In the figure: 1. Packaging carrier board body; 11. Circuit board; 12. Pin body; 2. Support assembly; 21. Support cover; 22. First heat dissipation hole; 3. Protective assembly; 31. Protective plate; 32. Support plate; 33. First heat conduction plate; 34. Second heat dissipation hole; 4. Heat conduction assembly; 41. Second heat conduction plate; 42. Third heat conduction plate; 5. Heat dissipation assembly; 51. Third heat dissipation hole; 52. Heat dissipation groove. Detailed Implementation
[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0025] like Figure 1 - Figure 4 As shown, this utility model provides a technical solution: a chip packaging carrier board with pin anti-bending protection, including a packaging carrier board body 1, a circuit board 11 fixedly connected to the upper side of the packaging carrier board body 1, and pin bodies 12 fixedly connected to both sides of the circuit board 11. The pin body 12 is fixedly connected to the packaging carrier board body 1 at one end away from the circuit board 11. A support component 2 is provided on the outer side of the pin body 12 away from the circuit board 11. The support component 2 includes a support cover 21 fixedly connected to the outer side of the lower end of the pin body 12. A first heat dissipation hole 22 is opened at the outer end of the support cover 21. A protective component 3 is provided on the inner side of the pin body 12. A heat conduction component 4 is provided between the two sets of circuit boards 11. A heat dissipation component 5 is provided on the upper end of the heat conduction component 4.
[0026] like Figure 3 As shown, the protective component 3 includes a protective plate 31 disposed between two sets of pin bodies 12, and the end of the protective plate 31 near the circuit board 11 is fixedly connected to the circuit board 11. Support plates 32 are fixedly connected to both sides of the protective plate 31, and the end of the support plate 32 away from the protective plate 31 is fixedly connected to the pin body 12.
[0027] like Figure 3 As shown, a first heat-conducting plate 33 is fixedly connected to the inner side of the protective plate 31, and multiple sets of second heat dissipation holes 34 are opened at both ends of the protective plate 31 and the first heat-conducting plate 33. The heat at the circuit board 11 is conducted and dissipated through the first heat dissipation hole 22, the first heat-conducting plate 33 and the second heat dissipation hole 34.
[0028] like Figure 2 As shown, the heat-conducting component 4 includes a second heat-conducting plate 41 fixedly connected inside the packaging carrier body 1, and a third heat-conducting plate 42 fixedly connected to the upper side of the second heat-conducting plate 41. The second heat-conducting plate 41 and the third heat-conducting plate 42 protect the outer sides of both ends of the pin body 12, and dissipate the heat conducted at the third heat-conducting plate 42 by using the third heat dissipation hole 51 and the heat dissipation groove 52.
[0029] like Figure 2 As shown, the heat dissipation component 5 includes a third heat dissipation hole 51 opened in the middle of the third heat conduction plate 42, and heat dissipation grooves 52 are opened at both ends of the third heat conduction plate 42.
[0030] like Figure 2 As shown, three sets of heat dissipation slots 52 are arranged in an array, and the heat dissipation slots 52 are set in an arc shape. The heat dissipation holes 51 and heat dissipation slots 52 are used to dissipate the heat conducted at the third heat conduction plate 42, thereby further improving the protection effect and heat dissipation effect.
[0031] like Figure 3 As shown, the support cover 21 is funnel-shaped, and multiple sets of first heat dissipation holes 22 are arranged in a circumferential array inside the support cover 21. The support cover 21, the protective plate 31 and the support plate 32 support the pin body 12. At the same time, the heat at the circuit board 11 is conducted and dissipated through the first heat dissipation holes 22, the first heat conduction plate 33 and the second heat dissipation holes 34.
[0032] Working principle: During the installation of the pin body 12 and subsequent transportation, the pin body 12 is supported by the support cover 21, the protective plate 31 and the support plate 32. At the same time, the heat of the circuit board 11 is conducted and dissipated through the first heat dissipation hole 22, the first heat conduction plate 33 and the second heat dissipation hole 34. At the same time, the outer sides of both ends of the pin body 12 are protected by the second heat conduction plate 41 and the third heat conduction plate 42, and the heat conducted by the third heat dissipation hole 51 and the heat dissipation groove 52 is used to dissipate the heat conducted by the third heat conduction plate 42, thereby further improving the protection effect and heat dissipation effect.
[0033] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A chip package board with pin anti-bending protection, comprising a package board body (1), a circuit board (11) is fixedly connected to the upper side of the package board body (1), pin bodies (12) are fixedly connected to the two sides of the circuit board (11), and the pin bodies (12) are fixedly connected to the package board body (1) away from the circuit board (11), characterized in that: A support component (2) is provided on the outer side of the pin body (12) away from the circuit board (11), and the support component (2) includes a support cover (21) fixedly connected to the outer side of the lower end of the pin body (12). A first heat dissipation hole (22) is opened at the outer end of the support cover (21), and a protective component (3) is provided on the inner side of the pin body (12). A heat conduction component (4) is provided between the two sets of circuit boards (11), and a heat dissipation component (5) is provided on the upper end of the heat conduction component (4). 2. The chip on board package with lead bend protection of claim 1, wherein: The protective component (3) includes a protective plate (31) disposed between two sets of pin bodies (12), and the protective plate (31) is fixedly connected to the circuit board (11) at one end. Support plates (32) are fixedly connected to both sides of the protective plate (31), and the support plate (32) is fixedly connected to the pin body (12) at one end away from the protective plate (31).
3. The chip on board package with lead bend protection of claim 2, wherein: The protective plate (31) is fixedly connected to the inner side of the first heat-conducting plate (33), and multiple sets of second heat dissipation holes (34) are opened at both ends of the protective plate (31) and the first heat-conducting plate (33).
4. The chip on board package with lead bend protection of claim 1, wherein: The heat-conducting component (4) includes a second heat-conducting plate (41) fixedly connected inside the encapsulation carrier plate body (1), and a third heat-conducting plate (42) is fixedly connected to the upper side of the second heat-conducting plate (41).
5. The chip on board package with lead bend protection of claim 1, wherein: The heat dissipation component (5) includes a third heat dissipation hole (51) in the middle of the third heat-conducting plate (42), and heat dissipation grooves (52) are provided at both ends of the third heat-conducting plate (42).
6. The chip packaging carrier board with pin bend protection according to claim 5, characterized in that: The three sets of heat dissipation slots (52) are arranged in an array, and the heat dissipation slots (52) are set in an arc shape.
7. The chip packaging carrier board with pin bend protection according to claim 1, characterized in that: The support cover (21) is configured as a funnel shape, and multiple sets of first heat dissipation holes (22) are arranged in a circumferential array inside the support cover (21).