A fast heat dissipation type multilayer PCBA substrate

Abstract

This utility model discloses a fast heat dissipation multilayer PCBA substrate, comprising multiple single-layer PCBA boards, with heat dissipation substrates disposed between adjacent single-layer PCBA boards. Each heat dissipation substrate has an array of honeycomb-shaped through holes. The single-layer PCBA boards have connection holes, and the connection holes are filled with a first thermally conductive filling layer for connecting the upper and lower heat dissipation substrates. The single-layer PCBA boards and heat dissipation substrates are stacked alternately to form a multilayer PCBA substrate. Multiple heat dissipation substrates are connected by thermally conductive filling layers to form a three-dimensional heat dissipation structure. A second thermally conductive filling layer is disposed between the heat dissipation substrates and the single-layer PCBA boards. Multiple inclined metal thermally conductive pillars are installed between the top single-layer PCBA board and the bottom PCBA board. This utility model connects multiple heat dissipation substrates through thermally conductive filling layers to form a three-dimensional heat dissipation structure, integrating the heat dissipation substrates into one unit, thereby achieving a better heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the technical field of PCBA substrates, specifically a fast heat dissipation type multilayer PCBA substrate. Background Technology

[0002] Printed circuit boards (PCBs) are the providers of electrical connections for electronic components, and their development has a history of over 100 years. Their design mainly involves layout design. The main advantages of using PCBs are that they greatly reduce wiring and assembly errors, improve automation levels and production efficiency. According to the number of layers, PCBs can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards, and other multi-layer PCBs.

[0003] However, in the process of powering on existing multilayer circuit boards, all the boards operate simultaneously, which causes each board to generate heat at the same time. Furthermore, since the boards are in direct contact with each other, the heat generated is trapped between the boards, resulting in relatively concentrated heat and high temperatures that can easily affect the normal use of the circuit board and thus reduce its lifespan. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a fast heat dissipation type multilayer PCBA substrate.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] This utility model discloses a fast heat dissipation multilayer PCBA substrate, comprising multiple single-layer PCBA boards, with heat dissipation substrates disposed between adjacent single-layer PCBA boards. Each heat dissipation substrate has an array of honeycomb-shaped through holes. The single-layer PCBA boards have connection holes, and the connection holes are filled with a first thermally conductive filling layer for connecting the upper heat dissipation substrate and the lower heat dissipation substrate. The single-layer PCBA boards and heat dissipation substrates are stacked alternately to form a multilayer PCBA substrate. Multiple heat dissipation substrates are connected by thermally conductive filling layers to form a three-dimensional heat dissipation structure. A second thermally conductive filling layer is disposed between the heat dissipation substrates and the single-layer PCBA boards. Multiple metal thermally conductive pillars are installed between the top single-layer PCBA board and the bottom single-layer PCBA board.

[0007] As a preferred embodiment of this utility model, both the top single-layer PCBA board and the bottom single-layer PCBA board are signal layers, and a shielding layer is provided between the single-layer PCBA board, the bottom PCBA board and the heat dissipation substrate.

[0008] As a preferred embodiment of this invention, the surface of the heat dissipation substrate is provided with microgrooves.

[0009] As a preferred embodiment of this invention, the surface of the single-layer PCBA board is provided with a graphene-resin hybrid layer.

[0010] As a preferred embodiment of this invention, the metal heat-conducting pillars are in close contact with each heat dissipation substrate.

[0011] As a preferred embodiment of this utility model, a heat dissipation block is fixedly mounted on the surface of the metal heat-conducting column.

[0012] The beneficial effects of this utility model are:

[0013] This type of rapid heat dissipation multilayer PCBA substrate features heat dissipation substrates positioned between adjacent single-layer PCBA boards. Each heat dissipation substrate has an array of honeycomb-shaped through-holes forming a heat dissipation path. Multiple heat dissipation substrates are connected by a thermally conductive filler layer to form a three-dimensional heat dissipation architecture, integrating the heat dissipation substrates into a single unit. A second thermally conductive filler layer is positioned between the heat dissipation substrates and the single-layer PCBA boards, filling the through-holes. This provides a large heat exchange area between the second thermally conductive filler layer and the heat dissipation substrates, thereby improving heat exchange and heat dissipation efficiency. Multiple inclined metal thermally conductive pillars are installed between the top single-layer PCBA board and the bottom PCBA board, further integrating the heat dissipation substrates and achieving excellent heat dissipation performance. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of the structure of a fast heat dissipation type multilayer PCBA substrate according to this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the first thermally conductive filling layer of a fast heat dissipation type multilayer PCBA substrate according to this utility model;

[0017] Figure 3 This is a schematic diagram of the through-hole structure of a fast heat dissipation type multilayer PCBA substrate according to this utility model;

[0018] Figure 4 This is a schematic diagram of the connection hole structure of a fast heat dissipation type multilayer PCBA substrate according to this utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the metal heat-conducting pillar of a fast heat dissipation multilayer PCBA substrate according to this utility model;

[0020] Figure 6This is a schematic diagram of the installation of a heat sink for a fast-heat dissipation multilayer PCBA substrate according to this utility model.

[0021] Figure 7 This is a schematic diagram of the microgroove structure of a fast heat dissipation type multilayer PCBA substrate according to this utility model.

[0022] In the figure: 1. Single-layer PCBA board; 2. Heat dissipation substrate; 3. Through hole; 4. Connection hole; 5. First thermally conductive filling layer; 6. Second thermally conductive filling layer; 7. Metal thermally conductive pillar; 8. Shielding layer; 9. Microgroove; 10. Graphene-resin hybrid layer; 11. Heat sink. Detailed Implementation

[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0024] Example: Figure 1-7 As shown, this utility model discloses a fast heat dissipation type multilayer PCBA substrate, including multiple single-layer PCBA boards 1, with heat dissipation substrates 2 disposed between adjacent single-layer PCBA boards 1. Each heat dissipation substrate 2 is provided with an array of honeycomb-shaped through holes 3. The single-layer PCBA boards 1 are provided with connection holes 4, and the connection holes 4 are filled with a first thermally conductive filling layer 5 for connecting the upper heat dissipation substrate 2 and the lower heat dissipation substrate 2. The single-layer PCBA boards 1 and heat dissipation substrates 2 are stacked alternately to form a multilayer PCBA substrate. Multiple heat dissipation substrates 2 are connected by the thermally conductive filling layer 5 to form a three-dimensional heat dissipation structure. A second thermally conductive filling layer 6 is provided between the heat dissipation substrate 2 and the single-layer PCBA boards 1. Multiple metal heat-conducting pillars 7 are installed between the top single-layer PCBA board 1 and the bottom single-layer PCBA board 1. A heat dissipation substrate 2 is disposed between adjacent single-layer PCBA boards 1. Each heat dissipation substrate 2 has an array of honeycomb-shaped through holes 3 to form a heat dissipation path. Multiple heat dissipation substrates 2 are connected by a thermally conductive filling layer to form a three-dimensional heat dissipation architecture, connecting the heat dissipation substrates 2 into one unit. A second thermally conductive filling layer 6 is disposed between the heat dissipation substrate 2 and the single-layer PCBA board 1, and the second thermally conductive filling layer 6 fills the through holes 3. This provides a large heat exchange area between the second thermally conductive filling layer 6 and the heat dissipation substrate 2, thereby improving heat exchange and heat dissipation efficiency. Multiple inclined metal thermally conductive pillars 7 are installed between the top single-layer PCBA board 1 and the bottom PCBA board. These metal thermally conductive pillars 7 also connect the heat dissipation substrates 2 into one unit, thus achieving a good heat dissipation effect.

[0025] The single-layer PCBA board 1 at the top and the single-layer PCBA board 1 at the bottom are both signal layers. A shielding layer 8 is provided between the single-layer PCBA board 1, the single-layer PCBA board 1, the bottom PCBA board 1 and the heat dissipation substrate 2. This provides shielding and prevents the metal heat dissipation substrate from forming an antenna and affecting the signal reception of the signal layer.

[0026] The surface of the heat dissipation substrate 2 is provided with microgrooves 9, which allows for a better heat exchange area between the heat dissipation substrate and the second thermally conductive filling layer, thereby achieving a better heat transfer effect.

[0027] The single-layer PCBA board 1 has a graphene-resin hybrid layer 10 on its surface, so that the heat on the single-layer PCBA board is transferred along the graphene-resin hybrid layer, which facilitates the transfer of heat to the heat dissipation substrate.

[0028] The metal heat-conducting pillars 7 are in close contact with each heat dissipation substrate 2, so that the heat on the heat dissipation substrate is transferred along the heat-conducting pillars and transferred to the heat dissipation block for heat dissipation.

[0029] The surface of the metal heat-conducting column is fixed with a heat dissipation block.

[0030] During operation, this type of fast-heat dissipation multilayer PCBA substrate has heat dissipation substrates 2 positioned between adjacent single-layer PCBA boards 1. Each heat dissipation substrate 2 has an array of honeycomb-shaped through-holes 3 forming a heat dissipation path. Multiple heat dissipation substrates 2 are connected by a thermally conductive filling layer to form a three-dimensional heat dissipation architecture, integrating the heat dissipation substrates 2 into a single unit. A second thermally conductive filling layer 6 is positioned between the heat dissipation substrate 2 and the single-layer PCBA board 1, filling the through-holes 3. This provides a large heat exchange area between the second thermally conductive filling layer 6 and the heat dissipation substrate 2, thereby improving heat exchange and heat dissipation efficiency. Multiple inclined metal thermally conductive pillars 7 are installed between the top single-layer PCBA board 1 and the bottom PCBA board, further integrating the heat dissipation substrates 2 into a single unit, resulting in excellent heat dissipation performance.

[0031] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multi-layer PCBA substrate of rapid heat dissipation type, characterized in that, The system includes multiple single-layer PCBA boards (1), and a heat dissipation substrate (2) is provided between adjacent single-layer PCBA boards (1). Each heat dissipation substrate (2) is provided with an array of honeycomb-shaped through holes (3). The single-layer PCBA board (1) is provided with a connection hole (4), and the connection hole (4) is filled with a first thermally conductive filling layer (5) for connecting the upper heat dissipation substrate (2) and the lower heat dissipation substrate (2). The single-layer PCBA board (1) and the heat dissipation substrate (2) are stacked alternately to form a multi-layer PCBA substrate. Multiple heat dissipation substrates (2) are connected through the thermally conductive filling layer (5) to form a three-dimensional heat dissipation structure. A second thermally conductive filling layer (6) is provided between the heat dissipation substrate (2) and the single-layer PCBA board (1). Multiple metal heat-conducting pillars (7) are installed between the top single-layer PCBA board (1) and the bottom single-layer PCBA board (1).

2. The multi-layer PCBA substrate of claim 1, wherein, The single-layer PCBA board (1) at the top and the single-layer PCBA board (1) at the bottom are both signal layers, and a shielding layer (8) is provided between the single-layer PCBA board (1), the single-layer PCBA board (1) at the bottom and the heat dissipation substrate (2).

3. The multi-layer PCBA substrate of claim 1, wherein, The surface of the heat dissipation substrate (2) is provided with microgrooves (9).

4. The multi-layer PCBA substrate of claim 1, wherein, The surface of the single-layer PCBA board (1) is provided with a graphene-resin hybrid layer (10).

5. The multi-layer PCBA substrate of claim 1, wherein, The metal heat-conducting pillars (7) are in close contact with each heat dissipation substrate (2).

6. The multi-layer PCBA substrate of claim 5, wherein, The surface of the metal heat-conducting column (7) is fixed with a heat sink (11).

Images