A 3D heat spreader with a highly efficient capillary structure
By employing a combination structure of grooved copper tubes and braided wires in the 3D vapor chamber, the problem of unstable connection between the copper tubes and the vapor chamber is solved, achieving efficient and reliable capillary connection, improving heat dissipation performance and stability, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GAO YU ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-06-30
AI Technical Summary
In existing 3D vapor chambers, the capillary connection between the copper tubes and the vapor chamber is prone to loosening and falling off under high vibration and complex environments, resulting in unstable heat dissipation performance and difficulty in meeting the heat dissipation requirements of high-power electronic devices.
The system employs a combination structure of grooved copper tubes and braided wires. The braided wires are tightly connected to the copper mesh of the lower cover, forming a continuous capillary structure. This enhances the bonding strength between the copper tubes and the heat spreader, and achieves uniform distribution and circulation of the working fluid through capillary force.
It improves the heat dissipation performance and stability of 3D vapor chambers, reduces the risk of loosening of connection parts, lowers material and process costs, simplifies the production process, and improves product consistency and market competitiveness.
Smart Images
Figure CN224439457U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for various electronic consumer products, and in particular to a 3D heat spreader with a highly efficient capillary connection structure. Background Technology
[0002] As modern electronic devices evolve towards higher performance, miniaturization, and integration, the power of devices such as cloud computing, AI models, data centers, servers, and base stations continues to rise, making thermal management increasingly critical. Existing heat dissipation technologies for electronic devices have many limitations. Traditional air cooling relies on fans to accelerate airflow and remove heat, resulting in limited efficiency. When device power is high, such as a thermal design power (TDP) exceeding 500 watts, air cooling is insufficient to meet cooling demands, easily leading to overheating, affecting performance and stability, and even shortening lifespan. While heat pipe cooling can improve efficiency to some extent, it is limited by product shape, resulting in unidirectional, one-dimensional linear uniform heat dissipation with a single heat dissipation path, unable to handle complex heat flow distributions. Conventional vapor chambers and heat spreaders can be designed with evaporation and condensation sections in a two-dimensional plane, offering relatively diverse heat dissipation path options and improved efficiency in two-dimensional heat transfer. However, the heat dissipation path is still limited to a single plane, making it difficult to meet the three-dimensional heat dissipation requirements of modern high-power electronic devices. Liquid cooling technology, while highly efficient and capable of handling high-power device heat dissipation, is complex, costly, and difficult to maintain. Liquid cooling systems require specialized liquid circulation devices, cooling pipes, etc., which increases the size and weight of the equipment and raises construction and operating costs.
[0003] 3D vapor chamber cooling technology is a highly efficient thermal management solution. Through its unique structural design and working principle, it effectively improves heat transfer efficiency, meeting the heat dissipation requirements of high-power electronic devices. In 3D vapor chamber cooling technology, the capillary connection between the copper pipe and the vapor chamber is a crucial element. Existing technologies employ a copper powder sintering structure, where copper powder is sintered onto the heat pipe, and then the powder ring, heat pipe copper powder, and lower cover copper mesh are bonded together. This method has several drawbacks. Firstly, during the sintering process, it is difficult to ensure consistent sintering quality across different parts, easily leading to loose bonding between the powder ring and the heat pipe copper powder, or poor connection with the lower cover copper mesh, resulting in poor continuity and stability of the capillary structure. Secondly, in practical applications, such as under complex environments with high vibration or alternating high and low temperatures, this connection method is prone to loosening and detachment, causing capillary connection failure, rendering the 3D vapor chamber unusable, and consequently affecting the performance of the entire cooling system.
[0004] Existing heat dissipation technologies and the capillary connection between copper pipes and the heat dissipation plate in 3D vapor chambers have many shortcomings in meeting the ever-increasing heat dissipation requirements of electronic devices. There is an urgent need for a more reliable and efficient connection technology to improve the performance and stability of 3D vapor chambers. Utility Model Content
[0005] In view of the above situation, it is necessary to propose a reliable and stable 3D heat spreader with an efficient capillary connection structure.
[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a 3D heat spreader with a high-efficiency capillary connection structure, comprising:
[0007] Bottom cover;
[0008] The upper cover is sealed to the lower cover, and there is a sealed cavity between the upper cover and the lower cover, which is filled with working fluid;
[0009] A grooved copper tube, at least one of the grooved copper tube assemblies is connected to the top cover and extends upward, the upper end of the grooved copper tube is closed and the lower end is connected to the top cover, the top cover is provided with a connection hole corresponding to the grooved copper tube so that the sealed cavity communicates with the grooved copper tube;
[0010] The capillary structure assembly comprises at least one upper cover copper mesh, at least one lower cover copper mesh, at least one braided wire, and at least one powder ring sintered together within the sealed cavity. The upper cover copper mesh is attached to the upper cover, the lower cover copper mesh is attached to the lower cover, and the braided wire is connected to the lower cover copper mesh and extends into the grooved copper tube through the connecting hole.
[0011] Furthermore, the sealed cavity is also equipped with several copper pillars.
[0012] Furthermore, the lower cover has a stepped groove consisting of a central groove and a surrounding groove, and the upper cover closes the stepped groove to form the sealed cavity, with the central groove forming a bulge on the side of the lower cover facing away from the upper cover.
[0013] Furthermore, the copper pillars are distributed throughout the central groove and the surrounding groove, and the powder ring surrounds the copper pillars located in the central groove.
[0014] Furthermore, the upper end of the copper pillar abuts against the copper mesh of the upper cover.
[0015] Furthermore, one grooved copper tube is provided at the center of the central groove, and several are provided at the center of the surrounding groove, forming a circular array of grooved copper tubes in the surrounding groove with the grooved copper tube located at the center of the central groove as the center.
[0016] Furthermore, a support cylinder extends upward along the connection hole on the side of the upper cover facing away from the lower cover.
[0017] Furthermore, each of the grooved copper tubes contains at least two braided wires arranged in a symmetrical or circular array.
[0018] Furthermore, the braided wire and the grooved copper tube are sintered together as a single unit.
[0019] Furthermore, the grooved copper tube has spiral or axial straight grooves inside.
[0020] The beneficial effects of this invention are as follows: When the 3D vapor chamber is working, the evaporation end of the vapor chamber absorbs the heat generated by the electronic equipment, causing the working fluid (usually a liquid) inside the vapor chamber to evaporate into steam. Due to the pressure difference of the steam, the steam flows along the steam channel inside the vapor chamber to the grooved copper tube connected to the vapor chamber.
[0021] Braided wires are incorporated into the grooved copper tube. Firstly, the braided wires possess excellent thermal conductivity, enabling rapid heat transfer from the steam to all parts of the grooved copper tube, resulting in a more uniform and efficient condensation process. Secondly, the capillary structure of the braided wires allows the liquid to be guided along the braided wires by capillary forces after the steam condenses.
[0022] Meanwhile, the braided lines extending to the copper mesh under the vapor chamber are tightly connected to the bottom copper mesh, forming a continuous capillary structure. The copper mesh under the vapor chamber has a large surface area and good capillary properties, which helps to evenly distribute the liquid returning from the trench copper tubes near the evaporation end of the vapor chamber, providing sufficient working fluid for the next evaporation process.
[0023] In this way, through the continuous capillary channels constructed by the braided wire between the grooved copper tubes and the copper mesh under the vapor chamber, the working fluid continuously undergoes evaporation-condensation-reflux circulation within the 3D vapor chamber, thereby achieving efficient heat transfer and dissipation. Throughout the process, the grooved copper tubes increase the contact area and bonding strength between the copper tubes and the braided wires, ensuring the stability of the braided wires, and thus ensuring the reliability and stability of the working fluid circulation, thereby improving the heat dissipation performance of the 3D vapor chamber.
[0024] Through the above specific implementation methods and working principles, efficient and reliable capillary connections are achieved between the copper tubes and the vapor chamber of the 3D vapor chamber, ensuring stable operation and good heat dissipation performance of the 3D vapor chamber.
[0025] The grooved copper tubes provide a stable foundation for the braided wires, which are tightly bonded to the tubes and extend to the copper mesh under the vapor chamber, forming a continuous and stable structure. This structure effectively resists external forces such as vibration and thermal stress during the operation of the 3D vapor chamber, reduces the risk of loosening or detachment at the connection points, and ensures long-term stability of the capillary connections.
[0026] The uniform and stable capillary structure of the braided wire ensures stable transfer of the working fluid between the grooved copper tube and the heat spreader. In contrast, traditional copper powder sintered structures may experience powder shedding and agglomeration over long-term use, clogging or narrowing the capillary channels and affecting the stability of working fluid transfer. This technology avoids such problems and maintains good heat dissipation.
[0027] The processing precision of grooved copper tubes and braided wires is easy to control, and dimensional accuracy and quality stability are guaranteed through precise equipment and process parameters. The connection between the braided wires and the copper mesh on the lower cover is also easier to control. Compared with the uncertainty of copper powder sintering, it can achieve a better bond more accurately, improving product consistency and yield.
[0028] Compared to traditional methods that heavily utilize copper powder, this technology offers lower material costs for braided wires and grooved copper tubes. Furthermore, due to its stable performance, it eliminates the need for excessive auxiliary materials to ensure bonding and capillary action, further reducing material costs. It also simplifies the process, reduces equipment usage, energy consumption, and labor input, shortens the production cycle, improves production efficiency, and lowers process costs. Simultaneously, the increased yield reduces waste from defective products, enhancing the product's market competitiveness. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the structure of a 3D heat spreader with a high-efficiency capillary connection structure according to an embodiment of the present invention;
[0030] Figure 2 This is a schematic diagram of another direction of a 3D heat spreader with a highly efficient capillary connection structure according to an embodiment of this utility model;
[0031] Figure 3 This is an exploded structural diagram of a 3D heat spreader with a highly efficient capillary connection structure according to an embodiment of the present invention.
[0032] Figure 4 This is a cross-sectional structural diagram of a 3D heat spreader with a highly efficient capillary connection structure according to an embodiment of the present invention.
[0033] Figure 5 This is a schematic diagram of the structure inside the sealed cavity of a 3D heat spreader with a highly efficient capillary connection structure according to an embodiment of this utility model.
[0034] Figure 6 This is a partially enlarged structural diagram of the grooved copper tube of a 3D heat spreader with a highly efficient capillary connection structure according to an embodiment of this utility model.
[0035] Label Explanation:
[0036] 100. Bottom cover; 110. Central groove; 120. Surrounding groove; 130. Sealed cavity; 140. Protrusion;
[0037] 200, Top cover; 210, Connecting hole; 220, Support cylinder; 300, Grooved copper tube; 310, Groove;
[0038] 400. Capillary structure component; 410. Upper cover copper mesh; 420. Lower cover copper mesh; 430. Braided wire;
[0039] 440, pink ring; 450, copper pillar. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description of a 3D heat spreader with a highly efficient capillary connection structure, in conjunction with the accompanying drawings and embodiments, provides a further detailed explanation of this utility model. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit its scope.
[0041] Please refer to Figures 1-6 A 3D heat spreader with a highly efficient capillary connection structure, comprising:
[0042] Bottom cover 100;
[0043] The upper cover 200 is sealed to the lower cover 100, and there is a sealed cavity 130 between the upper cover 200 and the lower cover 100, which is filled with working fluid.
[0044] The grooved copper tube 300, at least one grooved copper tube 300 assembly is connected to the upper cover 200 and extends upward. The upper end of the grooved copper tube 300 is closed and the lower end is connected to the upper cover 200. The upper cover 200 is provided with a connection hole 210 corresponding to the grooved copper tube 300 so that the sealed cavity 130 communicates with the grooved copper tube 300.
[0045] The capillary structure assembly 400 comprises at least one upper cover copper mesh 410, at least one lower cover copper mesh 420, at least one braided wire 430, and at least one powder ring 440 sintered together within a sealed cavity 130. The upper cover copper mesh 410 is attached to the upper cover 200, the lower cover copper mesh 420 is attached to the lower cover 100, and the braided wire 430 is connected to the lower cover copper mesh 420 and extends into the grooved copper tube 300 through the connecting hole 210.
[0046] When the 3D vapor chamber is working, the evaporation end of the vapor chamber absorbs the heat generated by the electronic equipment, causing the working fluid (usually a liquid) inside the vapor chamber to evaporate into steam. Due to the pressure difference of the steam, the steam flows along the steam channel inside the vapor chamber to the grooved copper tube 300 section connected to the vapor chamber.
[0047] Braided wires 430 are incorporated into the grooved copper tube 300. Firstly, the braided wires 430 possess excellent thermal conductivity, enabling them to quickly transfer heat from the steam to all parts of the grooved copper tube 300, resulting in a more uniform and efficient condensation process within the tube. Secondly, the capillary structure of the braided wires 430 allows the liquid to be guided along the braided wires 430 by capillary force after the steam condenses.
[0048] Meanwhile, the braided wires 430 extending to the copper mesh 420 under the vapor chamber are tightly connected to the copper mesh 420, forming a continuous capillary structure. The copper mesh 420 under the vapor chamber has a large surface area and good capillary properties, which helps to evenly distribute the liquid returning from the trench copper tube 300 near the evaporation end of the vapor chamber, providing sufficient working fluid for the next evaporation process.
[0049] In this way, through the continuous capillary channels constructed by the braided wire 430 between the grooved copper tube 300 and the copper mesh 420 under the vapor chamber, the working fluid continuously undergoes evaporation-condensation-reflux circulation within the 3D vapor chamber, thereby achieving efficient heat transfer and dissipation. Throughout the process, the grooved copper tube 300 increases the contact area and bonding strength between the copper tube and the braided wire 430, ensuring the stability of the braided wire 430, and thus ensuring the reliability and stability of the working fluid circulation, thereby improving the heat dissipation performance of the 3D vapor chamber.
[0050] Through the above specific implementation methods and working principles, efficient and reliable capillary connections are achieved between the copper tubes and the vapor chamber of the 3D vapor chamber, ensuring stable operation and good heat dissipation performance of the 3D vapor chamber.
[0051] The grooved copper tube 300 provides a stable base for the braided wire 430 to attach. The braided wire 430 is tightly bonded to the grooved copper tube 300 and extends to the copper mesh 420 under the heat spreader to form a continuous and stable structure. This structure can effectively resist external forces such as vibration and thermal stress during the operation of the 3D heat spreader, reduce the risk of loosening and falling off of the connection parts, and ensure the long-term stability of the capillary connection.
[0052] The 430 braided wire has a uniform and stable capillary structure, ensuring stable transfer of the working fluid between the 300 grooved copper tube and the heat spreader. In contrast, traditional copper powder sintered structures may experience powder shedding and agglomeration after long-term use, which can block or narrow the capillary channels and affect the stability of working fluid transfer. This technology avoids such problems and maintains good heat dissipation.
[0053] The processing precision of the grooved copper tube 300 and braided wire 430 is easy to control, and dimensional accuracy and quality stability are guaranteed through precise equipment and process parameters. The connection between the braided wire 430 and the lower cover copper mesh 420 is also easier to control. Compared with the uncertainty of copper powder sintering, it can achieve a better bond more accurately, thereby improving product consistency and yield.
[0054] Compared to traditional methods that heavily utilize copper powder, this technology offers lower material costs for the braided wire 430 and grooved copper tube 300. Furthermore, due to their stable performance, they require fewer auxiliary materials to ensure bonding and capillary properties, further reducing material costs. The technology also simplifies the process, reduces equipment usage, energy consumption, and labor input, shortens the production cycle, improves production efficiency, and lowers process costs. Simultaneously, the increased yield reduces waste from defective products, enhancing the product's market competitiveness.
[0055] Please refer to Figures 3-5 Several copper pillars 450 are also installed inside the sealed cavity 130. The copper pillars 450 are installed to improve heat dissipation performance.
[0056] Please refer to Figure 4 and Figure 5 The lower cover 100 has a stepped groove consisting of a central groove 110 and a surrounding groove 120. The upper cover 200 closes the stepped groove to form a sealed cavity 130. The central groove 110 forms a protrusion 140 on the side of the lower cover 100 that faces away from the upper cover 200. The stepped groove can increase the volume of the sealed cavity 130, and the protrusion 140 can increase the contact area with electronic devices. The combination of the two can provide a three-dimensional thermal conductivity dimension.
[0057] Please refer to Figure 4 and Figure 5 Copper pillars 450 are distributed throughout the central groove 110 and the surrounding groove 120, and powder rings 440 surround the copper pillars 450 located in the central groove 110. Preferably, the lower cover 100 is welded together with the lower cover copper mesh 420, copper pillars 450, and powder rings 440.
[0058] Please refer to Figure 4 and Figure 5 The upper end of the copper pillar 450 abuts against the copper mesh 410 of the upper cover. Preferably, the upper end of the copper pillar 450 is diffusely welded to the upper cover 200 and the lower end is diffusely welded to the lower cover 100, that is, the copper pillar 450 provides support and ensures the bonding strength.
[0059] Please refer to Figure 4 and Figure 5 One grooved copper tube 300 is provided at the center of the central groove 110, and several are provided at the center of the surrounding groove 120. The grooved copper tubes 300 in the surrounding groove 120 are arranged in a ring array with the grooved copper tube 300 located at the center of the central groove 110 as the center. This ensures uniform heat conduction.
[0060] Please refer to Figure 1 and Figure 3 A support cylinder 220 extends upward along the connection hole 210 on the side of the upper cover 200 opposite to the lower cover 100. This improves the connection strength between the grooved copper tube 300 and the upper cover 200. Preferably, the grooved copper tube 300 is welded or sintered to the upper cover 200.
[0061] Please refer to Figure 3 and Figure 5 Each grooved copper tube 300 has at least two braided wires 430 arranged symmetrically or in a ring array.
[0062] Preferably, the braided wire 430 and the grooved copper tube 300 are sintered together. After sintering, the grooved copper tube 300 can provide strong adhesion for the braided wire 430.
[0063] Preferably, the grooved copper tube 300 has a spiral (not shown) or axial straight groove 310 (see reference). Figure 6 For example, in scenarios requiring rapid axial flow of the working fluid, a straight axial groove 310 can be selected; if a spiral flow of the working fluid within the copper tube is desired to enhance heat exchange, a spiral groove 310 is used. Preferably, when laying the braided wire 430 into the groove 310 on the inner wall of the copper tube, a specialized winding device is used to ensure that the braided wire 430 is spirally wound or axially arranged along the groove 310 with uniform tension, allowing the braided wire 430 to fully adhere to the inner wall of the groove 310 without gaps. The depth of the groove 310 is generally controlled between 0.1-0.5 mm, and the width is in the range of 0.2-0.8 mm. These dimensions need to be adjusted according to the diameter of the copper tube and the characteristics of the working fluid. When the tube diameter is large, the depth and width of the groove 310 should be appropriately increased to ensure sufficient space for working fluid flow and capillary action area. The spacing of the grooves 310 is also crucial; a reasonable spacing ensures that the braided wires 430 are evenly distributed on the inner wall of the copper tube and do not interfere with each other. Typically, the spacing of the grooves 310 is set between 0.3 and 1 mm. The optimal combination of groove 310 parameters is determined by combining numerical simulation and experimental testing to achieve a balance between working fluid transmission efficiency and copper tube structural strength.
[0064] The braided wire 430 is generally made of high-purity, ductile copper or copper alloy to ensure good thermal conductivity and capillary properties. For example, oxygen-free copper can be used, with a purity of over 99.95%, effectively reducing the impact of impurities on thermal conductivity and capillary properties. The braided wire 430 is braided using a tight braiding method, with each strand closely arranged to form a uniform and continuous capillary channel. The diameter of the braided wire 430 is customized according to the size of the groove 310, generally controlled between 0.05-0.2 mm, to ensure it can be tightly embedded in the groove 310 without affecting the flow of the working fluid.
[0065] The braided wire 430 is typically sintered and connected to the lower cover copper mesh 420. The lower cover copper mesh 420 uses a mesh size of 100-300. The choice of mesh size depends on the size of the heat spreader, heat dissipation requirements, and compatibility with the braided wire 430. Higher mesh sizes provide a larger surface area and better capillary performance, but may also increase flow resistance, requiring comprehensive consideration.
[0066] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0067] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0068] In summary, the 3D vapor chamber with a highly efficient capillary connection structure provided by this utility model has strong structural stability, stable capillary performance, simple processing technology, and convenient quality control, which reduces production costs and realizes efficient and reliable capillary connection between the grooved copper tubes and the vapor chamber, ensuring stable operation and good heat dissipation performance of the 3D vapor chamber.
[0069] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.
Claims
1. A 3D vapor chamber having a high-efficiency capillary connection structure, characterized by, include: Bottom cover; The upper cover is sealed to the lower cover, and there is a sealed cavity between the upper cover and the lower cover, which is filled with working fluid; A grooved copper tube, at least one of the grooved copper tube assemblies is connected to the top cover and extends upward, the upper end of the grooved copper tube is closed and the lower end is connected to the top cover, the top cover is provided with a connection hole corresponding to the grooved copper tube so that the sealed cavity communicates with the grooved copper tube; The capillary structure assembly comprises at least one upper cover copper mesh, at least one lower cover copper mesh, at least one braided wire, and at least one powder ring sintered together within the sealed cavity. The upper cover copper mesh is attached to the upper cover, the lower cover copper mesh is attached to the lower cover, and the braided wire is connected to the lower cover copper mesh and extends into the grooved copper tube through the connecting hole.
2. The 3D vapor chamber with high-efficiency capillary connection structure according to claim 1, characterized in that, Several copper pillars are also installed inside the sealed cavity.
3. The 3D vapor chamber with high-efficiency capillary connection structure according to claim 2, characterized in that, The lower cover has a stepped groove consisting of a central groove and a surrounding groove. The upper cover closes the stepped groove to form the sealed cavity. The central groove forms a bulge on the side of the lower cover facing away from the upper cover.
4. The 3D vapor chamber with high-efficiency capillary connection structure according to claim 3, characterized in that, The copper pillars are distributed throughout the central groove and the surrounding groove, and the powder ring surrounds the copper pillars located in the central groove.
5. The 3D vapor chamber with high-efficiency capillary connection structure according to claim 4, characterized in that, The upper end of the copper pillar abuts against the copper mesh of the upper cover.
6. The 3D vapor chamber with high-efficiency capillary connection structure according to claim 3, characterized in that, The grooved copper tubes are arranged in a circular array with the grooved copper tube located at the center of the central groove as the center of the central groove.
7. A 3D heat spreader with a high-efficiency capillary connection structure according to claim 1, characterized in that, A support cylinder extends upward along the connection hole on the side of the upper cover facing away from the lower cover.
8. A 3D heat spreader with a high-efficiency capillary connection structure according to claim 1, characterized in that, Each of the grooved copper tubes contains at least two braided wires arranged in a symmetrical or circular array.
9. A 3D heat spreader with a high-efficiency capillary connection structure according to claim 1, characterized in that, The braided wire and the grooved copper tube are sintered together as one piece.
10. A 3D heat spreader with a high-efficiency capillary connection structure according to claim 1, characterized in that, The grooved copper tube has spiral or axial straight grooves inside.