A high-efficiency heat spreader with built-in water cooling

By combining built-in water-cooling channels with capillary structures, the problem of heat dissipation efficiency and uneven heat distribution of traditional heat vapor chambers in high heat flux density scenarios is solved, achieving faster heat transfer and more uniform temperature distribution, thus improving the heat dissipation performance and stability of the equipment.

CN224439482UActive Publication Date: 2026-06-30SHENZHEN GAO YU ELECTRONIC TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN GAO YU ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2025-07-10
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Traditional heat spreaders are inefficient at dissipating heat in high heat flux density scenarios, resulting in uneven heat distribution and the formation of localized hot spots. This can lead to excessively high operating temperatures, reducing equipment performance and lifespan.

Method used

The system combines built-in water-cooling channels with capillary structures within a sealed cavity to form a dual heat dissipation mechanism of phase change heat transfer and forced convection. Heat exchange area is enhanced by heat-conducting fins, and the cavity is stabilized by copper pillars and powder ring structures to ensure smooth circulation of the working fluid.

Benefits of technology

It significantly improves heat transfer speed and temperature uniformity, reduces local hot spots, enhances the heat dissipation capacity and stability of the equipment, avoids equipment frequency reduction, and improves the equipment's computing efficiency.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

This utility model provides a high-efficiency heat spreader with built-in water cooling, relating to the field of heat spreader technology. It includes a lower heat spreader cover and an upper heat spreader cover. Several heat-conducting fins are fixedly connected to the inner wall of the lower heat spreader cover. A cold plate cover is located inside the lower heat spreader cover. A capillary structure is located at the end of the cold plate cover away from the lower heat spreader cover. Two first connecting holes are opened on the cold plate cover. A water-cooling channel is located inside the first connecting holes. The capillary structure includes a copper mesh covering the cold plate cover. Several first embedding holes are opened on the copper mesh. A mounting groove is opened in the middle of the copper mesh. A second embedding hole is opened inside the mounting groove. The water-cooling channel, the capillary structure in the sealed cavity, and the working fluid work together to form a dual heat dissipation mechanism of "phase change heat transfer + forced convection". The heat-conducting fins increase the heat exchange area between the water-cooling channel and the interior of the heat spreader, improving heat transfer efficiency and making the surface temperature distribution of the heat spreader more uniform.
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Description

Technical Field

[0001] This utility model relates to the field of temperature distribution plate technology, and in particular to a high-efficiency temperature distribution plate with built-in water cooling. Background Technology

[0002] As a common heat dissipation component, vapor chambers are widely used in electronic equipment, new energy batteries, and other fields. Currently, traditional vapor chambers mainly rely on the phase change heat transfer of the internal working fluid to achieve rapid heat transfer and uniform distribution. During operation, heat is transferred from the heat source to the evaporation section of the vapor chamber, where the liquid working fluid evaporates. The vapor diffuses into the condensation section inside the vapor chamber, where it liquefies again upon cooling. The liquefied working fluid then flows back to the evaporation section through the capillary structure, thus completing the heat transfer cycle. The efficient heat dissipation performance allows the equipment to operate at lower temperatures, reducing the energy consumption caused by high temperatures and extending the service life of the equipment. However, with the continuous improvement of the integration and power density of electronic equipment, traditional vapor chambers have gradually revealed some problems in practical applications.

[0003] Shortcomings of existing technologies: The heat dissipation efficiency of traditional vapor chambers is insufficient to meet the needs of high heat flux density scenarios. When the heat generated by the heat source is too high, the phase change heat transfer capacity of the working fluid inside the vapor chamber is limited, resulting in an increase in the surface temperature of the vapor chamber and failure to achieve efficient heat dissipation. At the same time, the temperature uniformity of the vapor chamber needs to be improved. In some complex heat dissipation scenarios, uneven heat distribution can easily lead to local hot spots, affecting the performance and lifespan of the equipment. Traditional vapor chambers are unable to dissipate heat quickly and effectively, causing the equipment to run at excessively high temperatures, resulting in frequency reduction and reducing the computing efficiency of the server. Utility Model Content

[0004] The problem this invention aims to solve is that the heat dissipation efficiency of traditional heat vapor chambers is insufficient to meet the needs of high heat flux density scenarios. At the same time, in some complex heat dissipation scenarios, the heat distribution is uneven, and local hot spots are prone to appear. Traditional heat vapor chambers are unable to dissipate heat quickly and effectively, resulting in excessively high operating temperatures and frequency reduction phenomena.

[0005] To solve the above-mentioned technical problems, this utility model provides a high-efficiency heat exchange plate with built-in water cooling, including a heat exchange plate lower cover and a heat exchange plate upper cover fixedly connected to one end thereto. The inner cavity of the heat exchange plate lower cover is provided with a cold plate upper cover. The end of the cold plate upper cover away from the heat exchange plate lower cover is provided with a capillary structure. A water cooling channel is provided between the cold plate upper cover and the heat exchange plate lower cover. Two first connection holes are opened on the cold plate upper cover.

[0006] The edges of the lower cover and the upper cover of the heat exchanger are connected by welding, and the inner cavity between the lower cover and the upper cover forms a sealed cavity, with the capillary structure located in the inner cavity of the sealed cavity.

[0007] Preferably, a plurality of heat-conducting fins are fixedly connected to the inner wall of the lower cover of the heat spreader. The heat-conducting fins are perpendicular to the lower cover of the heat spreader, and the end of the heat-conducting fin away from the lower cover of the heat spreader abuts against the upper cover of the cold plate.

[0008] Preferably, one end of the lower cover of the heat spreader is provided with a contact protrusion, the inner cavity of the contact protrusion is configured as a stepped groove, and the water cooling channel is configured in a U-shape.

[0009] Preferably, the capillary structure includes a copper mesh covering the cold plate cover, the copper mesh having a plurality of first embedding holes, the copper mesh having a mounting groove in the middle, the mounting groove having a second embedding hole in the inner cavity, the inner cavity of the first embedding hole having a copper pillar inserted therein, and the inner cavity of the second embedding hole having a powder ring inserted therein.

[0010] Preferably, the water-cooling channel is provided with an inlet and an outlet at both ends, the water-cooling channel is connected to the output end of the external water-cooling system through the inlet, and the water-cooling channel is connected to the input end of the external water-cooling system through the outlet.

[0011] Preferably, the cover of the temperature equalizer plate has two mounting holes, and the inner cavity of the two mounting holes is respectively fitted with a water inlet and a water outlet.

[0012] Preferably, the copper mesh has two second connecting holes, which correspond to and are connected to the mounting holes.

[0013] Preferably, one end of the inlet and outlet nozzles respectively passes through two second connecting holes and is connected to the outlet of the inlet. A sealing ring is provided at the connection between the inlet and outlet nozzles and the inlet and outlet.

[0014] The technical effects and advantages of this utility model are as follows:

[0015] 1. This utility model utilizes a water-cooling channel and a capillary structure within a sealed cavity, along with the synergistic effect of the working fluid, to form a dual heat dissipation mechanism of "phase change heat transfer + forced convection," significantly improving the heat transfer speed. The working fluid fills the sealed cavity and the capillary structure. The water-cooling channel structure consists of a lower cover of a heat spreader plate and a upper cover of a cold plate, which are interconnected to form a continuous U-shaped channel. The two ends of the channel are respectively provided with an inlet and an outlet. External cooling water continuously flows into the water-cooling channel through the inlet nozzle. During its flow within the channel, it absorbs the heat transferred from the lower cover of the heat spreader plate and the copper mesh on the outer surface of the cold plate, and then flows out through the outlet nozzle, carrying away a large amount of heat and accelerating the heat dissipation speed of the heat spreader plate.

[0016] 2. This utility model provides heat-conducting fins between the water-cooling channel and the sealed cavity, and these fins are perpendicular to the lower cover of the heat spreader and the upper cover of the cold plate, and are evenly distributed on the inner wall of the water-cooling channel. The heat-conducting fins increase the heat exchange area between the water-cooling channel and the heat spreader, enabling the water-cooling channel to more effectively remove heat from various parts of the heat spreader, effectively reducing the generation of local hot spots, further improving heat transfer efficiency, and making the surface temperature distribution of the heat spreader more uniform.

[0017] 3. This utility model uses a first embedded hole to fix the position of the copper pillar. The copper pillar supports the upper and lower covers of the heat spreader, ensuring the spatial stability of the internal cavity of the heat spreader and preventing the cover from deforming under pressure, which would affect the phase change heat transfer of the internal working fluid and the heat dissipation effect of the water cooling channel. At the same time, the porous structure of the powder ring generates a strong capillary effect, accelerating the return of the working fluid from the condenser end to the heat source area. The evaporation rate at the heat source is high, requiring rapid replenishment of liquid to avoid dry burning. The powder ring maintains liquid circulation through capillary force, and the microporous structure of the powder ring increases the evaporation surface area, enabling the working fluid to absorb heat and evaporate more efficiently at the heat source, thus enhancing the heat transfer performance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the overall exploded structure of this utility model.

[0020] Figure 3 This is a schematic diagram of the rear structure of this utility model.

[0021] Figure 4 This is a schematic diagram of the capillary structure of this utility model.

[0022] Figure 5 This is a schematic diagram of the overall cross-sectional structure of the present invention. Figure 1 .

[0023] Figure 6 This is a schematic diagram of the overall cross-sectional structure of the present invention. Figure 2 .

[0024] Figure 7 For the present utility model Figure 5 Enlarged schematic diagram of the structure at point A in the middle.

[0025] The attached diagram is labeled as follows: 1. Lower cover of the heat exchanger plate; 2. Upper cover of the heat exchanger plate; 3. Upper cover of the cold plate plate; 4. Capillary structure; 41. Copper mesh; 42. First recessed hole; 43. Mounting groove; 44. Second recessed hole; 45. Copper pillar; 46. Powder ring; 47. Second connecting hole; 5. Water cooling channel; 6. First connecting hole; 7. Heat-conducting fins; 8. Contact protrusion; 9. Water inlet; 10. Water outlet; 11. Mounting hole; 12. Water inlet nozzle; 13. Water outlet nozzle; 14. Sealing ring. Detailed Implementation

[0026] This utility model provides a high-efficiency heat spreader with built-in water cooling, such as... Figure 1 - Figure 7 As shown, it includes a lower cover of a heat spreader plate 1 and an upper cover of a heat spreader plate 2 fixedly connected to one end of the heat spreader plate 1. A cold upper cover 3 is provided in the inner cavity of the lower cover of the heat spreader plate 1. A capillary structure 4 is provided at the end of the cold upper cover 3 away from the lower cover of the heat spreader plate 1. A water cooling channel 5 is provided between the cold upper cover 3 and the lower cover of the heat spreader plate 1. Two first connecting holes 6 are opened on the cold upper cover 3.

[0027] Furthermore, such as Figure 1 and Figure 2 As shown, the edges of the lower cover 1 and the upper cover 2 of the heat spreader are connected by welding. The inner cavity between the lower cover 1 and the upper cover 2 forms a sealed cavity. The capillary structure 4 is located in the inner cavity of the sealed cavity. The edges of the lower cover 1 and the upper cover 2 of the heat spreader are sealed by welding to ensure the sealing performance of the sealed cavity. The working fluid is filled in the sealed cavity, and heat dissipation is achieved through phase change heat transfer of the working fluid. The working fluid is water or coolant.

[0028] Furthermore, such as Figure 2 and Figure 5 As shown, several heat-conducting fins 7 are fixedly connected to the inner wall of the lower cover 1 of the heat spreader plate. The heat-conducting fins 7 are perpendicular to the lower cover 1 of the heat spreader plate. The end of the heat-conducting fin 7 away from the lower cover 1 of the heat spreader plate abuts against the upper cover 3 of the cold plate. The heat-conducting fins 7 effectively enhance the heat transfer between the water cooling channel 5 and the heat spreader plate body. The setting of the heat-conducting fins 7 increases the heat exchange area, so that the water cooling channel 5 can more effectively remove the heat from various parts of the heat spreader plate, effectively reducing the generation of local hot spots. The surface temperature uniformity of the heat spreader plate is improved by 25% to 35%, ensuring the stable operation of the equipment.

[0029] Furthermore, such as Figure 3 , Figure 4 and Figure 6 As shown, one end of the lower cover 1 of the heat spreader is provided with a contact protrusion 8. The inner cavity of the contact protrusion 8 is set as a stepped groove. The water cooling channel 5 is arranged in a U-shape. The heat spreader contacts the components that need to be cooled through the contact protrusion 8. The stepped groove formed inside effectively improves the heat dissipation effect.

[0030] Furthermore, such as Figure 4 , Figure 5 and Figure 6 As shown, the capillary structure 4 includes a copper mesh 41 covering the cold plate cover 3. The copper mesh 41 has several first insertion holes 42. A mounting groove 43 is formed in the middle of the copper mesh 41. A second insertion hole 44 is formed inside the mounting groove 43. A copper pillar 45 is inserted into the inner cavity of the first insertion hole 42, and a powder ring 46 is inserted into the inner cavity of the second insertion hole 44. The positions of the copper pillar 45 and the powder ring 46 are fixed through the first insertion holes 42 and the second insertion holes 44, respectively, ensuring the accuracy and stability of the installation positions of the copper pillar 45 and the powder ring 46. 45 ensures stable support for the lower cover 1 and upper cover 2 of the heat spreader, ensuring the spatial stability of the internal cavity of the heat spreader and preventing deformation of the lower cover 1 and upper cover 2 under pressure, which would affect the phase change heat transfer of the internal working fluid and the heat dissipation effect of the water cooling channel 5. The powder ring 46 is composed of sintered metal powder such as copper powder. Its porous structure can generate strong capillary action, accelerating the return of the working fluid from the condensation end to the heat source area. The microporous structure of the powder ring 46 increases the evaporation surface area, enabling the working liquid to absorb heat and evaporate more efficiently at the heat source, thus enhancing the heat transfer performance.

[0031] Furthermore, such as Figure 5 and Figure 7 As shown, the water-cooling channel 5 is provided with an inlet 9 and an outlet 10 at both ends. The water-cooling channel 5 is connected to the output end of the external water-cooling system through the inlet 9 and to the input end of the external water-cooling system through the outlet 10. The structure of the water-cooling channel 5 consists of a lower cover 1 of the heat spreader plate and a upper cover 3 of the cold plate plate. The inside is connected to each other through the inlet 9 and the outlet 10 to form a continuous U-shaped channel, ensuring that the working fluid circulates inside the heat spreader plate.

[0032] Furthermore, such as Figure 1 and Figure 2 As shown, two mounting holes 11 are provided on the top cover 2 of the heat exchange plate. The inner cavity of the two mounting holes 11 is respectively inserted with a water inlet 12 and a water outlet 13. The positions of the water inlet 12 and the water outlet 13 are installed and fixed through the mounting holes 11. The water inlet 12 connects the water cooling channel 5 to the external water cooling circulation system. After the cooling water in the inner cavity of the water cooling channel 5 circulates, it is discharged through the water outlet 13 to form a circulating flow system.

[0033] Furthermore, such as Figure 4 and Figure 7 As shown, two second connecting holes 47 are provided on the copper mesh 41. The second connecting holes 47 correspond to and are connected to the mounting holes 11. The stability and firmness of the connection between the water inlet 12 and the water outlet 13 are ensured through the second connecting holes 47.

[0034] Furthermore, such as Figure 4 and Figure 7As shown, one end of the inlet nozzle 12 and the outlet nozzle 13 respectively passes through two second connecting holes 47 and is connected to the outlet 10 of the inlet 9. A sealing ring 14 is provided at the connection between the inlet nozzle 12 and the outlet nozzle 13 and the inlet 9 and the outlet 10. The sealing ring 14 ensures the tightness of the connection between the inlet nozzle 12 and the outlet nozzle 13 and ensures the sealing of the inner cavity of the heat exchange plate.

[0035] To provide full disclosure, this utility model also discloses a method for manufacturing a high-efficiency temperature distribution plate with built-in water cooling, comprising the following steps:

[0036] Step 1: First, prepare the copper mesh 41. Select copper material of appropriate specifications and use precision cutting equipment to cut the copper material into the required shape of the copper mesh 41, ensuring that the dimensional accuracy of the copper mesh 41 is within ±0.05mm. Place the cut copper mesh 41 in a conforming fixture and put it into a high-temperature sintering furnace for sintering. The sintering temperature is controlled at 850-950℃, and the holding time is 2.5-3.5 hours. Through the sintering process, it is shaped into a specific shape. Through sintering, the copper mesh 41 forms a capillary structure 4 with a specific pore structure and shape. The copper mesh 41 will subsequently serve as a key part of the capillary structure 4, undertaking the important function of liquid working fluid reflux. Its porosity reaches 45%-55%, so that it can effectively promote the reflux of liquid working fluid in the homogenizing plate.

[0037] Step 2: Next, assemble the cold plate cover 3 with the copper mesh 41. Prepare the cold plate cover 3 by cleaning and pre-treating its surface to remove impurities such as oil and oxide layers, improving its surface flatness and adhesion to the copper mesh 41. The cold plate cover 3 is an important component in contact between the heat spreader and the external water cooling system, corresponding to the water cooling channel 5. The water cooling channel 5 is formed by the cold plate cover 3 and the heat spreader cover 1. The heat-conducting fins 7 are perpendicular to the surface of the heat spreader cover 1 and are evenly distributed on the inner wall of the water cooling channel 5 to increase the heat exchange area. The heat spreader cover 2 is the top shell of the entire heat spreader, which protects the internal structure and defines the space of the water cooling channel 5. The sintered copper mesh 41 is carefully covered on the cold plate cover 3 to ensure that the copper mesh 41 is completely attached to the cold plate cover 3 without gaps or wrinkles, creating good conditions for subsequent heat transfer and working fluid reflux.

[0038] Step 3: Select a plate material to fabricate the upper cover 2 of the heat spreader. Perform fine machining inside to ensure dimensional accuracy of the internal space. Then, place the upper cover 3 of the cold plate, covered with copper mesh 41, into the upper cover 2 of the heat spreader, ensuring accurate positioning. Simultaneously, create a first recess 42 and a second recess 44 on the copper mesh 41. Place copper pillars 45 one by one into the predetermined positions within the first recess 42. Control the height error of the copper pillars 45 within ±0.03mm to ensure stable support for the lower cover 1 and the upper cover 2 of the heat spreader, guaranteeing the stability of the internal cavity of the heat spreader and preventing deformation of the cover under pressure, which would affect the phase change heat transfer of the internal working fluid and the heat dissipation effect of the water-cooling channel 5. Subsequently, place the powder ring 46 into the second recess 44. The powder ring 46 is made of... The powder material selected has good welding compatibility with the material of the top cover 2 of the heat spreader plate, and its thickness uniformity is controlled within ±0.02mm. The powder ring 46 plays an important role in the operation of the heat spreader plate. The powder ring 46 is composed of sintered metal powder (such as copper powder). Its porous structure can generate strong capillary action, which accelerates the return of the working fluid from the condenser end to the heat source area. The evaporation rate at the heat source is high, and the liquid needs to be replenished quickly to avoid dry burning. The powder ring 46 maintains the liquid circulation through capillary force. The microporous structure of the powder ring 46 increases the evaporation surface area, so that the working liquid absorbs heat and evaporates more efficiently at the heat source, which enhances the heat transfer performance. The positional relationship of the copper mesh 41, copper column 45 and powder ring 46 in the sealed cavity, and the cooperation of each component, together realize the efficient heat dissipation function of the heat spreader plate.

[0039] Step 4: Finally, select inlet nozzles 12 and 13 with good corrosion resistance and sealing performance. Install inlet nozzles 12 and 13 into the corresponding positions of the two mounting holes 11 on the top cover 2 of the heat spreader plate. Secure inlet nozzles 12 and 13 through inlet port 9 and outlet port 10. Inlet nozzles 12 and 13 are key components connecting the heat spreader plate water cooling channel 5 to the external water cooling circulation system. After installation, assemble the bottom cover 1 and top cover 2 of the heat spreader plate. Seal the edges of the bottom cover 1 and top cover 2 of the heat spreader plate using welding. The connection forms a complete and sealed cavity structure to prevent leakage of the internal working fluid and ensure that the phase change heat transfer process of the working fluid inside the vapor chamber and the heat dissipation process of the water cooling channel 5 can proceed stably and efficiently. Inside the vapor chamber, heat-conducting fins 7 are set between the water cooling channel 5 and the sealed cavity. These heat-conducting fins 7 are perpendicular to the surface of the cover plate and are evenly distributed on the inner wall of the water cooling channel 5. They greatly increase the heat exchange area between the water cooling channel 5 and the vapor chamber, so that the cooling water in the water cooling channel 5 can absorb the heat transferred from the vapor chamber more efficiently, further improving the heat dissipation efficiency and temperature uniformity of the vapor chamber.

[0040] The working principle of this utility model is as follows: When the heat exchanger is working, heat is transferred from the heat source to the evaporation section of the heat exchanger. The liquid working fluid in the sealed cavity is heated and evaporates. The vapor diffuses into the condensation section (copper mesh 41 on the outer surface of the cold plate cover 3) and liquefies upon cooling, completing the phase change heat transfer process. At the same time, external cooling water continuously flows into the water cooling channel 5 through the inlet 12 from the inlet 9. It enters the sealed cavity through the water cooling channel 5 and circulates. During the flow in the channel, it absorbs the heat transferred from the lower cover 1 of the heat exchanger and the copper mesh 41 on the outer surface of the cold plate cover 3. Then, it flows out through the outlet 10 and the outlet 13, taking away a large amount of heat and accelerating the heat dissipation speed of the heat exchanger. The heat-conducting fins 7 increase the heat exchange area between the water cooling channel 5 and the inside of the heat exchanger, further improving the heat transfer efficiency and making the surface temperature distribution of the heat exchanger more uniform.

[0041] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this utility model.

Claims

1. A high-efficiency vapor chamber with built-in water cooling, comprising a vapor chamber lower cover (1) and a vapor chamber upper cover (2) fixedly connected to one end of the vapor chamber lower cover (1), characterized in that: The inner cavity of the lower cover of the heat exchange plate (1) is provided with a cold plate cover (3). The end of the cold plate cover (3) away from the lower cover of the heat exchange plate (1) is provided with a capillary structure (4). A water cooling channel (5) is provided between the cold plate cover (3) and the lower cover of the heat exchange plate (1). Two first connection holes (6) are opened on the cold plate cover (3). The edges of the lower cover (1) and the upper cover (2) of the heat exchange plate are connected by welding, and the inner cavity between the lower cover (1) and the upper cover (2) of the heat exchange plate forms a sealed cavity. The capillary structure (4) is located in the inner cavity of the sealed cavity.

2. The high-efficiency heat exchanger with built-in water cooling according to claim 1, characterized in that: The inner wall of the lower cover of the heat exchange plate (1) is fixedly connected with several heat-conducting fins (7). The heat-conducting fins (7) are perpendicular to the lower cover of the heat exchange plate (1), and the end of the heat-conducting fin (7) away from the lower cover of the heat exchange plate (1) abuts against the upper cover of the cold plate (3).

3. The high-efficiency heat exchanger with built-in water cooling according to claim 1, characterized in that: One end of the lower cover (1) of the heat exchange plate is provided with a contact protrusion (8), the inner cavity of the contact protrusion (8) is set as a stepped groove, and the water cooling channel (5) is arranged in a U-shape.

4. The high-efficiency heat exchanger with built-in water cooling according to claim 1, characterized in that: The capillary structure (4) includes a copper mesh (41) covering the cold plate cover (3). The copper mesh (41) has a plurality of first embedding holes (42). The copper mesh (41) has a mounting groove (43) in the middle. The mounting groove (43) has a second embedding hole (44) in its inner cavity. A copper pillar (45) is inserted into the inner cavity of the first embedding hole (42). A powder ring (46) is inserted into the inner cavity of the second embedding hole (44).

5. A high-efficiency heat exchanger with built-in water cooling according to claim 4, characterized in that: The water cooling channel (5) is provided with an inlet (9) and an outlet (10) at both ends. The water cooling channel (5) is connected to the output end of the external water cooling system through the inlet (9) and to the input end of the external water cooling system through the outlet (10).

6. The high-efficiency heat exchanger with built-in water cooling according to claim 5, characterized in that: The temperature equalizer plate cover (2) has two mounting holes (11), and the inner cavity of the two mounting holes (11) is respectively fitted with a water inlet (12) and a water outlet (13).

7. A high-efficiency heat exchanger with built-in water cooling according to claim 6, characterized in that: The copper mesh (41) has two second connecting holes (47), which correspond to and are connected to the mounting holes (11).

8. The high-efficiency heat exchanger with built-in water cooling according to claim 7, characterized in that: One end of the inlet nozzle (12) and the outlet nozzle (13) respectively passes through two second connecting holes (47) and is connected to the outlet (10) of the inlet (9). A sealing ring (14) is provided at the connection between the inlet nozzle (12) and the outlet nozzle (13) and the inlet (9) and the outlet (10).