A liquid cooling plate heat dissipation device

Abstract

This utility model discloses a liquid-cooled plate heat dissipation device, including a liquid-cooled plate for dissipating heat from a heat source; the liquid-cooled plate has a liquid-cooled cavity inside, and the liquid-cooled plate has a heat source contact surface for contacting the heat source. A diamond layer is disposed on the heat source contact surface, and the diamond layer is used to contact the heat source and rapidly diffuse the heat from the heat source to the liquid-cooled plate; thereby, it can rapidly diffuse the heat from the heat source to the entire liquid-cooled plate, thereby increasing the effective heat exchange area and reducing the temperature of the heat source.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a liquid cooling plate heat dissipation device. Background Technology

[0002] With the rapid development of computer technology, data center servers are being deployed in high-density and even ultra-high-density configurations to meet the demands of high-performance computing services. During server operation, the increasing power of electronic chips leads to a continuous increase in heat flux density, causing heat to concentrate on the CPU surface. Traditional air cooling systems risk being unable to meet these cooling requirements, while liquid cooling technology is gaining widespread application due to its advantages such as fast heat dissipation, low noise, and stable cooling performance. The liquid cooling plate, as the core component of liquid cooling technology, works by using external distribution pipes and nozzles to introduce coolant into the plate. Within the plate, the coolant removes the heat concentrated on the CPU surface through forced convection.

[0003] As the power density of electronic devices continues to increase, traditional heat dissipation methods (such as air cooling and ordinary liquid cooling) are no longer sufficient to meet the heat dissipation requirements in high heat flux density scenarios. In particular, small-area high-power chips (such as CPUs and GPUs) are prone to forming localized hot spots, leading to performance degradation or even failure. Although existing liquid cooling plate technology removes heat through liquid flow, the limited thermal conductivity of the contact surface between the heat source and the liquid cooling plate prevents heat from quickly dissipating to the entire liquid cooling plate, resulting in low utilization of the local heat exchange area.

[0004] Therefore, a new technology needs to be developed to solve the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide a liquid cooling plate heat dissipation device that can rapidly diffuse heat from the heat source to the entire liquid cooling plate, thereby expanding the effective heat exchange area and reducing the temperature of the heat source.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A liquid cooling plate heat dissipation device includes a liquid cooling plate for dissipating heat from a heat source; the liquid cooling plate has a liquid cooling cavity inside, and the liquid cooling plate has a heat source contact surface for contacting the heat source. A diamond layer is disposed on the heat source contact surface, and the diamond layer is used to contact the heat source and rapidly diffuse the heat from the heat source to the liquid cooling plate.

[0008] As a preferred embodiment, the diamond layer is formed on the heat source contact surface by sintering, chemical vapor deposition (CVD), or physical vapor deposition (PVD).

[0009] As a preferred embodiment, the thickness of the diamond layer is 10-500 μm.

[0010] As a preferred embodiment, a transition layer is provided between the diamond layer and the heat source contact surface, the transition layer being used to enhance the bonding strength between the diamond layer and the liquid cooling plate.

[0011] As a preferred embodiment, the transition layer is a metal layer or a carbide layer.

[0012] As a preferred embodiment, the liquid cooling plate is made of metal.

[0013] As a preferred embodiment, the liquid cooling plate is provided with a first interface end and a second interface end for liquid conduction, and both the first interface end and the second interface end are connected to the liquid cooling cavity.

[0014] As a preferred embodiment, the first interface end and the second interface end are spaced apart, and the first interface end and the second interface end are respectively connected to a first connector and a second connector.

[0015] As a preferred embodiment, the liquid cooling plate is provided with a plurality of connecting lock holes, the plurality of connecting lock holes being arranged at intervals, and the connecting lock holes penetrating both sides of the liquid cooling plate.

[0016] As a preferred embodiment, the liquid cooling plate includes a substrate and a contact plate connected to the bottom of the substrate. The substrate and the contact plate form the liquid cooling cavity. The heat source contact surface is the side of the contact plate away from the substrate. The diamond layer is disposed on the side of the contact plate away from the substrate. A fin module is disposed on the side of the contact plate facing the substrate. The fin module is located inside the liquid cooling cavity.

[0017] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly involves setting a diamond layer on the heat source contact surface of the liquid cooling plate, so as to rapidly diffuse the heat source heat to the whole liquid cooling plate through the ultra-high thermal conductivity of diamond, thereby expanding the effective heat exchange area, reducing the heat source temperature, and significantly improving the heat diffusion efficiency. The diffused heat can be carried away by the coolant in the liquid cooling cavity of the liquid cooling plate, avoiding local heat accumulation.

[0018] To more clearly illustrate the structural features, technical means, and specific objectives and functions of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the overall structure of an embodiment of this utility model;

[0020] Figure 2 This is a three-dimensional schematic diagram of the overall structure of an embodiment of this utility model from another angle;

[0021] Figure 3 This is a cross-sectional schematic diagram of an embodiment of the present utility model;

[0022] Figure 4 This is an exploded view of an embodiment of the present utility model;

[0023] Figure 5 This is another exploded view of an embodiment of the present utility model;

[0024] Figure 6 This is another exploded view of an embodiment of the present utility model;

[0025] Figure 7 This is a three-dimensional schematic diagram of an embodiment of the present invention applied to a chip.

[0026] Explanation of reference numerals in the attached diagram:

[0027] 10. Liquid cooling plate 11. Liquid cooling cavity

[0028] 12. Heat source contact surface; 13. First interface end

[0029] 14. Second interface end; 15. Connecting lock hole

[0030] 16. Relief groove 17. Connecting part

[0031] 18. Substrate 181. Cavity

[0032] 182. Positioning cavity; 19. Contact plate

[0033] 101. Fin module; 20. Diamond layer

[0034] 30, First connector; 40, Second connector

[0035] 50. Chip. Detailed Implementation

[0036] In the description of this utility model, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inner", and "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0037] Please refer to Figures 1 to 7As shown, it illustrates the specific structure of the liquid cooling plate heat dissipation device provided in the embodiment of this utility model. It is mainly used for heat dissipation of high power density chips, but is not limited to them. It can be applied to scenarios such as 5G base stations and high-performance computing.

[0038] This liquid-cooled plate heat dissipation device includes a liquid-cooled plate 10 for dissipating heat from a heat source. The liquid-cooled plate 10 is preferably made of a metal, such as copper or aluminum. A liquid-cooled cavity 11 is provided within the liquid-cooled plate 10. The liquid-cooled plate 10 has a heat source contact surface 12 for contacting the heat source. A diamond layer 20 is disposed on the heat source contact surface 12. The diamond layer 20 is used to contact the heat source and rapidly diffuse heat from the heat source to the liquid-cooled plate 10. Diamond, as the material with the highest known thermal conductivity (>2000 W / m·K), when applied to the heat source contact surface 12 of the liquid-cooled plate 10, can significantly improve heat diffusion efficiency. Combining the diamond layer 20 with the liquid-cooled plate 10 enables rapid heat diffusion from a point heat source to a surface area. Figure 7 As shown, the heat from the chip 50 is rapidly diffused laterally through the diamond layer 20 to a larger area of ​​the liquid cooling plate 10. The diffused heat is carried away by the coolant in the flow channel of the liquid cooling cavity 11 of the liquid cooling plate 10, thus avoiding local heat accumulation.

[0039] The thickness of the diamond layer 20 is preferably 10-500 μm; the diamond layer 20 can be formed on the heat source contact surface 12 by sintering, chemical vapor deposition (CVD) or physical vapor deposition (PVD) or other methods; preferably, the diamond layer 20 is formed by growing a diamond film on the heat source contact surface 12 of the liquid cooling plate 10 using chemical vapor deposition (CVD), or by embedding diamond particles into the heat source contact surface 12 of the liquid cooling plate 10 by high-temperature sintering.

[0040] The liquid cooling plate 10 is provided with a first interface end 13 and a second interface end 14 for liquid conduction. The first interface end 13 and the second interface end 14 are both connected to the liquid cooling cavity 11. The first interface end 13 and the second interface end 14 are arranged at a distance. The first interface end 13 and the second interface end 14 are respectively connected to a first connector 30 and a second connector 40. Preferably, in this embodiment, the first connector 30 and the second connector 40 are both right-angle connectors. Of course, the first connector 30 and the second connector 40 can also be other connectors, which can be set according to actual production needs.

[0041] The liquid cooling plate 10 is provided with a plurality of connecting lock holes 15, which are arranged at intervals and penetrate the upper and lower sides of the liquid cooling plate 10.

[0042] The liquid cooling plate 10 is provided with a plurality of clearance grooves 16, which are arranged at intervals. The clearance grooves 16 penetrate the upper and lower sides of the liquid cooling plate 10 and the side surface of the liquid cooling plate 10. A transversely extending connecting part 17 is integrally formed in the clearance groove 16. A connecting locking hole 15 is formed on the connecting part 17 and penetrates the upper and lower sides of the connecting part 17. In this way, by setting the connecting locking hole 15, the liquid cooling plate 10 can be assembled and connected to the external structure by screws or other connecting devices through the connecting locking hole 15. The combination design of the clearance groove 16 and the connecting part 17 can play a clearance role when assembling screws or other connecting devices, and can realize a recessed hidden design.

[0043] like Figures 3 to 6 As shown, the liquid cooling plate 10 includes a substrate 18 and a contact plate 19 connected to the bottom of the substrate 18. The substrate 18 and the contact plate 19 enclose the liquid cooling cavity 11. The heat source contact surface 12 is the side of the contact plate 19 away from the substrate 18. The diamond layer 20 is disposed on the side of the contact plate 19 away from the substrate 18. A fin module 101 is disposed on the side of the contact plate 19 facing the substrate 18. The fin module 101 is located inside the liquid cooling cavity 11. 101 includes a plurality of fins, which are arranged at uniform intervals along the width direction of the contact plate 19. The fins extend along the length direction of the contact plate 19 and are integrally formed on the upper surface of the contact plate 19. The first interface end 13, the second interface end 14, the connecting lock hole 15, the clearance groove 16, and the connecting part 17 are all formed on the substrate 18. The first connector 30 and the second connector 40 are exposed on the upper surface of the substrate 18. The clearance groove 16 penetrates the upper and lower sides of the substrate 18 and penetrates the side of the substrate 18.

[0044] like Figure 6 As shown, the bottom of the substrate 18 is recessed upwards to form a cavity 181. The periphery of the lower opening of the cavity 181 extends outwards to form a positioning cavity 182. The contact plate 19 is assembled in the positioning cavity 182. The fin module 101 is located in the cavity 181. The contact plate 19 covers the cavity 181 to form the liquid cooling cavity 11. The lower surface of the diamond layer 20 is flush with the lower surface of the substrate 18.

[0045] Its general production process is as follows:

[0046] Step 1: Prepare the copper substrate for the liquid cooling plate 10 and process the microchannels of the internal liquid cooling cavity 11;

[0047] Step 2: Deposit a diamond thin film coating with a thickness of 100 μm on the heat source contact surface 12 by CVD at a deposition temperature of 800℃;

[0048] Step 3: Polish the surface of the diamond film coating to Ra < 1μm to ensure good contact with the chip;

[0049] Step 4: Test results show that compared with the traditional liquid cooling plate 10, the chip center temperature drops by more than 15°C, which can reduce the temperature of high heat flux density chips by 10-30%, avoid local overheating, and extend the device life.

[0050] Preferably, a transition layer may be provided between the diamond layer 20 and the heat source contact surface 12. The transition layer is used to enhance the bonding strength between the diamond layer 20 and the liquid cooling plate 10. The transition layer is preferably a metal layer or a carbide layer.

[0051] In summary, the key design feature of this utility model is that it mainly involves setting a diamond layer on the heat source contact surface of the liquid cooling plate. The ultra-high thermal conductivity of diamond allows the heat from the heat source to be rapidly diffused to the entire liquid cooling plate, thereby expanding the effective heat exchange area, reducing the heat source temperature, and significantly improving the heat diffusion efficiency. The diffused heat can be carried away by the coolant in the liquid cooling cavity of the liquid cooling plate, avoiding local heat accumulation.

[0052] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A liquid-cooled plate heat dissipation device, comprising a liquid-cooled plate for dissipating heat from a heat source; characterized in that: The liquid cooling plate has a liquid cooling cavity inside and a heat source contact surface for contacting a heat source. A diamond layer is disposed on the heat source contact surface, and the diamond layer is used to contact the heat source and rapidly diffuse the heat from the heat source to the liquid cooling plate.

2. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: The diamond layer is formed on the heat source contact surface by sintering, chemical vapor deposition (CVD), or physical vapor deposition (PVD).

3. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: The thickness of the diamond layer is 10-500 μm.

4. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: A transition layer is provided between the diamond layer and the heat source contact surface, and the transition layer is used to enhance the bonding strength between the diamond layer and the liquid cooling plate.

5. The liquid-cooled plate heat dissipation device according to claim 4, characterized in that: The transition layer is a metal layer or a carbide layer.

6. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: The liquid cooling plate is made of metal.

7. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: The liquid cooling plate is provided with a first interface end and a second interface end for liquid conduction, and both the first interface end and the second interface end are connected to the liquid cooling cavity.

8. The liquid-cooled plate heat dissipation device according to claim 7, characterized in that: The first interface end and the second interface end are arranged at a distance, and the first interface end and the second interface end are respectively connected to the first connector and the second connector.

9. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: The liquid cooling plate is provided with a plurality of connection lock holes, which are arranged at intervals and extend through both sides of the liquid cooling plate.

10. The liquid-cooled plate heat dissipation device according to claim 1, characterized in that: The liquid cooling plate includes a substrate and a contact plate connected to the bottom of the substrate. The substrate and the contact plate form the liquid cooling cavity. The heat source contact surface is the side of the contact plate away from the substrate. The diamond layer is disposed on the side of the contact plate away from the substrate. A fin module is disposed on the side of the contact plate facing the substrate. The fin module is located inside the liquid cooling cavity.

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