Shielding structure

Abstract

This application discloses a shielding structure belonging to the field of controller shielding technology. The shielding structure includes a housing, a printed circuit board, a connector, and a conductor. The housing has a shielding cavity for accommodating the tail of the connector, i.e., the part of the connector with a metal shell. The printed circuit board is housed within the housing, and a portion of the printed circuit board forms the shielding cavity. A portion of the connector passes through the shielding cavity and connects to the printed circuit board to ensure signal and power transmission. The conductor fills the shielding cavity and abuts against the housing, the printed circuit board, and the connector portion, respectively. This application increases the contact area between the connector's metal shell and the housing by using the conductor. The increased contact area directly leads to an increase in the connector's grounding path, effectively improving the grounding impedance problem caused by the small number of contact points and small contact area in existing designs, thereby preventing excessively high grounding impedance when the connector's metal shell is grounded.

Description

Technical Field

[0001] This application belongs to the field of controller shielding technology, and specifically relates to a shielding structure. Background Technology

[0002] High-frequency signals typically require relatively low voltages for high-frequency transmission, and lower voltages are more susceptible to external electromagnetic interference. To avoid interference, high-frequency signals are often transmitted using shielded cables. These cables have a complete metal shielding layer that is directly grounded, conducting electromagnetic interference directly to the ground plane and preventing it from coupling to the signal lines and interfering with the internal signals.

[0003] When connector pins are actually grounded, parasitic parameters such as resistance, capacitance, and inductance result in high grounding impedance when the connector shell is grounded. This high grounding impedance causes interference voltage to be generated on the metal shielding layer. This interference voltage couples to the signal line through the parasitic capacitance between the metal shielding layer and the signal line, leading to signal interference. Severe interference can cause signal errors or even disconnection. Utility Model Content

[0004] Purpose of this utility model: This application provides a shielding structure to solve the technical problem of high grounding impedance when the connector shell is grounded.

[0005] Technical solution: This application provides a shielding structure, including:

[0006] A housing having a shielding cavity;

[0007] A printed circuit board is housed within the housing, a portion of which forms the shielding cavity;

[0008] A connector, a portion of which passes through the shielding cavity and is connected to the printed circuit board;

[0009] A conductor is filled in the shielding cavity and abuts against the housing, the printed circuit board and the connector portion respectively.

[0010] In some embodiments, the housing includes:

[0011] A first outer shell and a second outer shell, wherein the first outer shell and the second outer shell are connected in a closed manner;

[0012] The first rib has one end connected to the first outer shell and the other end overlapped with the printed circuit board;

[0013] The second rib has one end connected to the second housing and the other end overlapping the side of the printed circuit board away from the first rib.

[0014] The first partition rib, the printed circuit board, and the first outer shell together form the shielding cavity;

[0015] The printed circuit board has metal conductors on both sides in the second direction. The metal conductors are electrically connected to the first partition, the second partition and the connector respectively, and the conductor abuts against the metal conductor.

[0016] In some embodiments, the conductor includes:

[0017] A first conductive portion, at least a portion of which is located between the first partition and the connector;

[0018] A second conductive part is connected to the first conductive part, and at least a portion of the second conductive part is located between the first housing and the connector;

[0019] The side of the first conductive part away from the second conductive part abuts against the metal conductor, and the side of the second conductive part away from the first conductive part abuts against the inner wall of the first outer casing.

[0020] In some embodiments, the side of the first conductive portion facing the second conductive portion is a first overlapping surface, the side of the second conductive portion facing the first conductive portion is a second overlapping surface, and the minimum included angle between the first overlapping surface and the second overlapping surface is 90°.

[0021] When the conductor is filled in the shielding cavity, the first overlapping surface overlaps with the second overlapping surface.

[0022] In some embodiments, the shielding structure further includes an adhesive backing that is attached to the side of the second conductive portion that abuts against the first housing in the second direction, so as to connect the second conductive portion to the first housing.

[0023] In some embodiments, the adhesive backing is a conductive adhesive.

[0024] In some embodiments, the orthogonal projection of the conductor in a first direction completely covers the connector.

[0025] In some embodiments, in the first direction, the distance between the first housing and the first partition is L1, and the distance between the connector and the first partition is H1;

[0026] In the second direction, the distance between the first housing and the printed circuit board is L2, and the distance between the connector and the first housing is H2;

[0027] The length of the side of the second conductive part that abuts against the first outer shell in the second direction is L3, the length of the side of the first conductive part that abuts against the first partition is L4, the width of the side of the first conductive part that abuts against the metal conductor is H3, and the width of the side of the second conductive part that abuts against the first outer shell in the first direction is H4.

[0028] Among them, L1, L2, L3, L4, H1, H2, H3, and H4 satisfy: L3≥L1, 1.1≤L4 / L2≤1.15, H3 / H1=1.3, and H4 / H2=1.3.

[0029] In some embodiments, in the first direction, the distance H1 between the connector and the first rib satisfies: H1 is less than or equal to 10 mm;

[0030] In the second direction, the distance H2 between the connector and the first housing satisfies the condition that H2 is less than or equal to 10 mm.

[0031] In some embodiments, the side of the first conductive portion away from the first overlapping surface is an arc-shaped surface, and the arc-shaped surface is bent in a direction away from the first overlapping surface.

[0032] Beneficial Effects: Compared with the prior art, the shielding structure provided in this application includes a housing, a printed circuit board, a connector, and a conductor. The housing serves as the basic structure and has a shielding cavity for accommodating the tail of the connector, i.e., the part of the connector with a metal shell. The printed circuit board is housed within the housing, and a portion of the printed circuit board forms the shielding cavity. A portion of the connector passes through the shielding cavity and connects to the printed circuit board to ensure signal and power transmission. The conductor fills the shielding cavity and abuts against the housing, the printed circuit board, and the connector portion, respectively. This application increases the contact area between the connector's metal shell and the housing by using the conductor. The increased contact area directly leads to an increase in the connector's grounding path, effectively improving the grounding impedance problem caused by the small number of contact points and small contact area in the prior art, thereby preventing excessively high grounding impedance when the connector's metal shell is grounded. Attached Figure Description

[0033] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0034] Figure 1 This is a schematic diagram of a shielding structure provided in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of another shielding structure provided in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of another shielding structure provided in an embodiment of this application;

[0037] Figure 4 A schematic diagram of parameter markings for the outer casing is provided for embodiments of this application;

[0038] Figure 5 This is a schematic diagram of parameter markings for a conductor provided in an embodiment of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] X - First direction; Y - Second direction;

[0041] 100 - Housing; 110 - Shielding cavity; 120 - First outer shell; 130 - Second outer shell; 140 - First rib; 150 - Second rib;

[0042] 200 - Printed circuit board; 210 - Metal conductor;

[0043] 300-Connector;

[0044] 400 - Conductor; 410 - First conductive part; 411 - First overlapping surface; 412 - Arc-shaped surface; 420 - Second conductive part; 421 - Second overlapping surface;

[0045] 500-Adhesive backing. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] In the description of this application, it should be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements or an interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances. Furthermore, although the terms "first," "second," etc., may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one component from another. Therefore, the first component discussed below may be referred to as the second component without departing from the teachings of this application. As used herein, the term "and / or" includes all combinations of any one and more of the associated listed items.

[0048] In the description of this application, "multiple" means two or more, and "at least one" means one, two, or more, unless otherwise explicitly specified. In the description of this application, "perpendicular" means completely perpendicular to 90° or almost completely perpendicular, for example, an angle of 80° to 100° is considered perpendicular. Similarly, "parallel" means completely parallel or almost completely parallel, for example, a completely parallel angle of 10° is considered parallel.

[0049] It should also be noted that in the accompanying drawings of the embodiments of this application, the arrow marked with X represents the first direction X, and the arrow marked with Y represents the second direction Y. The description of this application introduces the first direction X and the second direction Y to more clearly illustrate the structure and relative positional relationship of the electrical box. In practical applications, the first direction X and the second direction Y can point to any direction in space. For ease of understanding, this application uses the first direction X as the length direction of the shielding structure and the second direction Y as the height direction of the shielding structure as an example for explanation. In practical applications, the first direction X and the second direction Y are perpendicular to each other.

[0050] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure of this application, the components and arrangements of specific examples are described below. Of course, these are merely examples and are not intended to limit this application.

[0051] In high-frequency signal transmission, low-voltage designs are typically used to adapt to high-frequency characteristics, but low-voltage signals are more sensitive to external electromagnetic interference. This type of equipment malfunction caused by external electromagnetic interference is called EMS (Electromagnetic Susceptibility): an immunity issue. EMS is part of EMC (Electromagnetic Compatibility) performance.

[0052] To reduce the risk of high-frequency signal interference, the industry generally uses shielded transmission cables: the outer, complete metal shielding layer is directly grounded, which directs electromagnetic interference to the ground plane, preventing interference from coupling to the signal line. Ideally, the grounding resistance of the metal shielding layer is zero, so no interference voltage is generated when interference current flows through it, and naturally, the signal will not be affected by the parasitic capacitance between the shielding layer and the signal line.

[0053] However, in practical applications, parasitic resistance, capacitance, and inductance are unavoidable when connector pins are grounded, which creates a grounding impedance on the connector housing. The presence of this impedance causes interference voltage to be generated in the metal shielding layer, which can then couple to the signal lines through parasitic capacitance, potentially causing signal errors or even disconnection.

[0054] Furthermore, most controllers on the market employ a shielding solution combining copper-exposed printed circuit boards (PCBs) with overlapping copper-exposed structural components. However, manufacturing tolerances between the PCB and structural components are unavoidable, and the planes cannot be perfectly aligned, resulting in gaps during assembly. The location and length of these gaps are difficult to control, which can lead to leakage of internal electromagnetic noise, worsening electromagnetic interference (EMI) levels (another aspect of EMC performance), and can also allow external electromagnetic interference to intrude through the gaps, affecting the normal operation of internal circuits.

[0055] In view of this, embodiments of this application provide a shielding structure to solve at least part of the above-mentioned technical problems.

[0056] Please see Figure 1In this embodiment, the shielding structure includes a housing 100, a printed circuit board 200, a connector 300, and a conductor 400. The housing 100 serves as the basic structure and has a shielding cavity 110 for accommodating the tail portion of the connector 300, i.e., the part of the connector 300 with its metal outer shell. The printed circuit board 200 is housed within the housing 100, and a portion of the printed circuit board 200 forms the shielding cavity 110. A portion of the connector 300 passes through the shielding cavity 110 and connects to the printed circuit board 200, ensuring signal and power transmission. The conductor 400 fills the shielding cavity 110 and abuts against the housing 100, the printed circuit board 200, and a portion of the connector 300. This embodiment increases the contact area between the metal outer shell of the connector 300 and the housing 100 by using the conductor 400. The increased contact area directly increases the grounding path of the connector 300, effectively improving the grounding impedance problem caused by the limited number of contact points and small contact area in existing designs, thereby preventing excessively high grounding impedance when the metal outer shell of the connector 300 is grounded.

[0057] It should be noted that both the housing 100 and the connector 300 can be made of metal, which gives them good conductivity. When the conductor 400 comes into contact with the metal housings of the housing 100 and connector 300 respectively, the current can be transmitted smoothly due to the conductivity of metal, further enhancing the grounding effect. This allows electromagnetic interference to be more efficiently conducted to the ground plane through the housing 100, reducing the impact of interference on internal signals. Simultaneously, the metal housings of the housing 100 and connector 300 also provide a certain degree of shielding.

[0058] It should be noted that the conductor 400 can be conductive foam with conductive cloth wrapped around it. This type of foam uses foam as the base material and is covered with conductive cloth, combining elasticity and conductivity. It is low-cost and can meet the basic conductivity and shielding requirements of common consumer electronics and other typical applications. For applications with higher EMC performance requirements, omnidirectional conductive foam can be used. This type of foam is composed of conductive materials and foam, conducting electricity both internally and externally, offering superior shielding effectiveness and stability, but at a relatively higher cost.

[0059] In some examples, please refer to Figure 2The aforementioned housing 100 includes a first outer shell 120, a second outer shell 130, and a first partition 140. The first outer shell 120 and the second outer shell 130 are closed together, forming a receiving cavity, and the shielding cavity 110 is a part of the receiving cavity. The first partition 140 is housed within the receiving cavity. One end of the first partition 140 is connected to the first outer shell 120, and the other end of the first partition 140 overlaps with the printed circuit board 200. Furthermore, the end of the first outer shell 120 after it is closed with the second outer shell 130 has an opening communicating with the receiving cavity. This opening is used for the insertion of the connector 300, so that the connector 300 can be connected to the printed circuit board 200 to form an electrical connection. At the same time, the first partition 140, a portion of the printed circuit board 200, and a portion of the first outer shell 120 enclose the shielding cavity 110, that is, the first partition 140, a portion of the printed circuit board 200, and a portion of the first outer shell 120 form a first shielding layer. The printed circuit board 200 is housed within the housing 100, and as described above, part of its structure is used to enclose the shielding cavity 110, forming a relatively enclosed space in conjunction with the housing 100; a portion of the connector 300 passes through the shielding cavity 110 and connects with the printed circuit board 200 to ensure the transmission of signals and power; while the conductor 400 fills the shielding cavity 110 and is in close contact with the corresponding portions of the housing 100, the printed circuit board 200, and the connector 300.

[0060] In some embodiments, please refer to Figure 2The aforementioned housing 100 also includes a second partition 150, which is disposed opposite to the first partition 140 on both sides of the printed circuit board 200 in the second direction Y, forming a symmetrical limiting and connection for the printed circuit board 200. Specifically, one end of the second partition 150 is connected to the second outer shell 130, and the other end of the second partition 150 overlaps with the side of the printed circuit board 200 away from the first partition 140. This makes the installation of the printed circuit board 200 within the housing 100 more stable, and the cooperation of the first partition 140 and the second partition 150 strengthens the overall structural integrity. Meanwhile, metal conductors 210 are provided on both sides of the printed circuit board 200 in the second direction Y, and the metal conductors 210 are electrically connected to the first partition 140, the second partition 150, and the connector 300, respectively, forming a multi-path conductive channel. Furthermore, the conductor 400 abuts against the metal conductor 210, further opening up the conductive path between the housing 100 (through the first partition 140 and the second partition 150), the printed circuit board 200, and the connector 300. Since there are tolerances between the first partition 140 and the second partition 150 and the metal conductor 210, there will be gaps between the first partition 140 and the metal conductor 210 and / or between the second partition 150 and the metal conductor 210. As a result, the shielding effect of the first shielding layer will be poor. Due to the presence of the conductor 400, a second shielding layer is formed, thereby compensating for the deficiencies of the first shielding layer and improving the overall shielding performance.

[0061] As can be seen from the above technical solution, the metal conductor 210 can, on the one hand, connect the conductivity of the first partition 140, the second partition 150 and the connector 300 in series, improving the overall grounding reliability; on the other hand, combined with the contacting effect of the conductor 400, it can effectively reduce the contact impedance between the components, allowing electromagnetic interference to be conducted more smoothly through the metal conductor 210, the first partition 140, and the second partition 150 to the first housing 120 and the second housing 130, and finally grounded. This enhances immunity to interference (EMS) while reducing the leakage of internal electromagnetic noise (optimizing EMI). In addition, the presence of the conductor 400 effectively solves the problem of unavoidable tolerances between the first partition 140 and the printed circuit board 200, and between the second partition 150 and the printed circuit board 200, causing internal electromagnetic noise to leak to the outside and affecting the radiated emission level of electronic equipment, thus improving the overall shielding performance.

[0062] In some embodiments, please refer to Figure 2To better adapt to the internal spatial structure of the shielding cavity 110 and enhance conductivity and shielding effects, the conductor 400 includes a first conductive portion 410 and a second conductive portion 420. The first conductive portion 410 and the second conductive portion 420 are an integral structure, meaning they are surface-connected. At least a portion of the first conductive portion 410 is located between the first partition 140 and the connector 300, filling the space between them. The second conductive portion 420 is connected to the first conductive portion 410, and at least a portion of it is located between the first outer shell 120 and the connector 300. The side of the first conductive portion 410 away from the second conductive portion 420 abuts against the metal conductor 210, and the side of the second conductive portion 420 away from the first conductive portion 410 abuts against the inner wall of the first outer shell 120. Utilizing the metallic conductivity of the first outer shell 120, interference signals received by the conductor 400 are smoothly guided into the housing 100, ultimately achieving grounding.

[0063] It should be noted that the first conductive part 410 and the second conductive part 420 form an L-shaped structure. This structure can fit the spatial layout between the first partition 140, the connector 300 and the first housing 120, allowing the first conductive part 410 and the second conductive part 420 to fill the corresponding gaps respectively. This not only ensures full utilization of space, but also establishes a conductive path more efficiently, further enhancing the conductivity and shielding effectiveness of the conductor 400 in the shielding cavity 110. This results in tighter connections between components and better conduction and shielding effects against electromagnetic interference.

[0064] In some embodiments, please refer to Figure 3 When the first conductive part 410 and the second conductive part 420 are an integral structure, and the conductor 400 needs to be compressed along the second direction Y, the upward compression of the second conductive part 420 will cause the first conductive part 410 to move upward as a whole (specifically...). Figure 3 If the direction is upward, then there is a possibility that the first conductive part 410 is not in contact with the metal conductor 210. To solve this problem, the first conductive part 410 and the second conductive part 420 are configured as a line connection. The first conductive part 410 can move closer to or further away from the second conductive part 420 based on the line connection point. Similarly, the second conductive part 420 can move closer to or further away from the first conductive part 410 based on the line connection point.

[0065] Specifically, at least a portion of the first conductive part 410 is located between the first partition 140 and the connector 300, filling the space between the first partition 140 and the connector 300. The second conductive part 420 is connected to the first conductive part 410, and at least a portion of the second conductive part 420 is located between the first housing 120 and the connector 300. The side of the first conductive part 410 away from the second conductive part 420 abuts against the metal conductor 210, and the side of the second conductive part 420 away from the first conductive part 410 abuts against the inner wall of the first housing 120. Furthermore, the side of the first conductive part 410 facing the second conductive part 420 is a first overlapping surface 411, and the side of the second conductive part 420 facing the first conductive part 410 is a second overlapping surface 421. The minimum included angle between the first overlapping surface 411 and the second overlapping surface 421 is 90°. With the conductor 400 filling the shielding cavity 110, the first overlapping surface 411 and the second overlapping surface 421 overlap. This design retains the spatial adaptability of the L-shaped structure and avoids the problem of unstable contact that may occur when the integrated structure is compressed through the mobility of the wire connection. It ensures that the first conductive part 410 and the metal conductor 210, and the second conductive part 420 and the inner wall of the first outer shell 120 always maintain reliable contact under different working conditions, thus ensuring the stability of conductivity and shielding effect.

[0066] It should be noted that, Figure 5 This is an unfolded view of the first overlapping surface 411 and the second overlapping surface 421 when they are not overlapping. At this time, the minimum included angle between the first overlapping surface 411 and the second overlapping surface 421 is 90°. At the same time, the maximum included angle between the first overlapping surface 411 and the side of the first conductive part 410 that abuts against the first partition 140 is 45°, and the maximum included angle between the second overlapping surface 421 and the side of the second conductive part 420 that abuts against the first outer shell 120 is 45°.

[0067] In some embodiments, please refer to Figure 3 and Figure 5 The shielding structure also includes an adhesive backing 500, which is attached to the side of the second conductive part 420 that abuts against the first outer shell 120 in the second direction Y, thereby connecting the second conductive part 420 and the first outer shell 120. Specifically, the adhesive backing 500 is attached to the contact surface between the second conductive part 420 and the first outer shell 120 in the second direction Y. The adhesive backing 500 enhances the connection strength between the second conductive part 420 and the first outer shell 120, prevents relative displacement due to vibration, ensures contact stability and unobstructed conductive paths, and guarantees efficient conduction of electromagnetic interference.

[0068] In some examples, the adhesive 500 can be a conductive adhesive. In addition to securing the connection through adhesion, the good conductivity of the conductive adhesive can also reduce the contact surface impedance, improve the transmission efficiency of interference signals from the second conductive part 420 to the first housing 120, reduce losses, further enhance the electromagnetic shielding and conduction capabilities of the shielding structure, and optimize the EMC performance of the device.

[0069] In some examples, please refer to Figure 5 The adhesive 500 is positioned at the midpoint of the side of the second conductive part 420 that contacts the first outer shell 120 in the second direction Y. This allows for a more even adhesion between the adhesive 500 and the second conductive part 420, preventing misalignment between the second conductive part 420 and the first outer shell 120 due to uneven force. Simultaneously, the area of ​​the adhesive 500 is one-third the size of the first conductive part 410 in the first direction X. This provides sufficient adhesion to prevent displacement while avoiding an excessively large area that would increase costs.

[0070] In some embodiments, the orthogonal projection of the conductor 400 in the first direction X completely covers the connector 300. That is, the conductor 400 fully encloses the connector 300, ensuring that the gaps between the connector 300 and surrounding components (such as the housing 100 and the printed circuit board 200) are adequately filled, further reducing electromagnetic interference leakage paths. Simultaneously, the complete coverage also increases the contact area between the conductor 400 and the connector 300, improving the stability of conductive transmission between them, allowing interference signals to be more efficiently conducted through the conductor 400 to other components and ultimately to the ground plane, enhancing the overall shielding effectiveness.

[0071] In some embodiments, please refer to Figure 3 , Figure 4 and Figure 5 In the first direction X, the distance between the first housing 120 and the first partition 140 is L1, and the distance between the connector 300 and the first partition 140 is H1. In the second direction Y, the distance between the first housing 120 and the printed circuit board 200 is L2, and the distance between the connector 300 and the first housing 120 is H2. The length of the side of the second conductive part 420 that abuts against the first housing 120 in the second direction Y is L3, the length of the side of the first conductive part 410 that abuts against the first partition 140 is L4, the width of the side of the first conductive part 410 that abuts against the metal conductor 210 is H3, and the width of the side of the second conductive part 420 that abuts against the first housing 120 in the first direction X is H4.

[0072] Simply having the conductor 400 in contact with the housing 100 and the connector 300 is insufficient to guarantee a lower grounding impedance. The conductor 400 needs to apply a certain pressure to both the housing 100 and the connector 300 to bring the grounding impedance close to zero. In other words, the conductor 400 needs a certain amount of compression within the shielding cavity 110. Therefore, L1, L2, L3, L4, H1, H2, H3, and H4 must satisfy the following conditions:

[0073] L3≥L1, this setting ensures that the second conductive part 420 has a sufficient length base to abut against the first housing 120 in the second direction Y, thereby applying pressure to the first housing 120 through its own extension or compression;

[0074] 1.1≤L4 / L2≤1.15, so that the length of the first conductive part 410 abutting against the first partition 140 is slightly greater than the distance between the first outer shell 120 and the printed circuit board 200 in the second direction Y, thereby generating appropriate pressure;

[0075] H3 / H1 = 1.3, H4 / H2 = 1.3, indicating that the width of the first conductive part 410 abutting against the metal conductor 210 and the width of the second conductive part 420 abutting against the first outer shell 120 in the first direction X are 1.3 times the corresponding spacing, so that the conductor 400 can form effective pressure when it abuts against the relevant components in the first direction X.

[0076] As can be seen from the above technical solution, by reasonably matching these parameters, the conductor 400 can apply stable and appropriate pressure to the housing 100 and the connector 300, thereby ensuring that the grounding impedance is close to 0 and improving the conductivity and shielding effect of the shielding structure.

[0077] In some examples, the side of the first conductive portion 410 away from the first overlapping surface 411 is an arc-shaped surface 412, which is bent away from the first overlapping surface 411. It should be noted that L4, the length of the side of the first conductive portion 410 that abuts against the first partition 140, must satisfy 1.1 ≤ L4 / L2 ≤ 1.15 (where L2 is the distance between the first housing 120 and the printed circuit board 200 in the second direction Y) to ensure that the first conductive portion 410 can apply appropriate pressure to the first partition 140. The bending shape of the arc-shaped surface 412 provides more reasonable deformation space for the first conductive portion 410 when it experiences compressive force due to the size design of L4. When the first conductive portion 410 is compressed, the bending structure of the arc-shaped surface 412 can buffer the pressure through its own elastic deformation. In addition, the curved surface 412 bends away from the first lap surface 411, which can reduce the dead angle of contact when the first conductive part 410 comes into contact with the metal conductor 210, so that the contact area corresponding to H3 (the width of the side where the first conductive part 410 comes into contact with the metal conductor 210) fits more closely to the surface of the metal conductor 210, further improving the reliability of conductive transmission.

[0078] In some embodiments, please refer to Figure 4 In the first direction X, the distance H1 between the connector 300 and the first partition 140 satisfies: H1 is less than or equal to 10mm. In the second direction Y, the distance H2 between the connector 300 and the first housing 120 satisfies: H2 is less than or equal to 10mm. It should be noted that this limitation has two main effects. First, the distance directly affects the compression of the conductor 400. If H1 or H2 is too large, the conductor 400 will not achieve sufficient compression. The compression of the conductor 400 is closely related to its impedance; generally, the greater the compression, the lower the impedance, and the closer it is to an ideal grounding state (impedance close to 0). If the distance is too large and the compression is insufficient, the impedance of the conductor 400 will increase, thereby affecting the transmission efficiency of electromagnetic interference signals and weakening the overall performance of the shielding structure.

[0079] On the other hand, from a cost perspective, excessive spacing means that more material is needed for the conductor 400. Excessive material usage directly increases production costs. Therefore, limiting H1 and H2 to 10mm or less ensures that the conductor 400 receives sufficient compression to reduce impedance and guarantee shielding effectiveness, while also avoiding increased costs due to excessive material usage.

[0080] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0081] The shielding structure provided in the embodiments of this application has been described in detail above. Specific examples have been used in this application to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A shielding structure, characterized by, include: A housing (100) having a shielding cavity (110); A printed circuit board (200) is housed within the housing (100), and a portion of the printed circuit board (200) is used to form the shielding cavity (110); A connector (300) is provided, a portion of which passes through the shielding cavity (110) and is connected to the printed circuit board (200); A conductor (400) is filled in the shielding cavity (110) and abuts against the housing (100), the printed circuit board (200) and the connector (300) respectively.

2. The shielding structure of claim 1, wherein The housing (100) includes: A first outer shell (120) and a second outer shell (130), wherein the first outer shell (120) and the second outer shell (130) are connected and covered together; The first partition rib (140) has one end connected to the first outer shell (120) and the other end overlapped with the printed circuit board (200); The second partition (150) has one end connected to the second housing (130) and the other end overlapped with the side of the printed circuit board (200) away from the first partition (140). The first partition rib (140), the printed circuit board (200), and the first outer shell (120) together form the shielding cavity (110); The printed circuit board (200) has metal conductors (210) on both sides in the second direction (Y). The metal conductors (210) are electrically connected to the first partition (140), the second partition (150) and the connector (300) respectively, and the conductor (400) abuts against the metal conductors (210).

3. The shielding structure of claim 2, wherein, The conductor (400) includes: A first conductive part (410) is located at least a portion of which is located between the first partition (140) and the connector (300); A second conductive part (420) is connected to the first conductive part (410), and at least a portion of the second conductive part (420) is located between the first housing (120) and the connector (300); The side of the first conductive part (410) away from the second conductive part (420) abuts against the metal conductor (210), and the side of the second conductive part (420) away from the first conductive part (410) abuts against the inner wall of the first outer shell (120).

4. The shielding structure of claim 3, wherein The side of the first conductive part (410) facing the second conductive part (420) is the first overlapping surface (411), and the side of the second conductive part (420) facing the first conductive part (410) is the second overlapping surface (421). The minimum included angle between the first overlapping surface (411) and the second overlapping surface (421) is 90°. When the conductor (400) is filled in the shielding cavity (110), the first overlapping surface (411) overlaps with the second overlapping surface (421).

5. The shielding structure of claim 3, wherein The shielding structure further includes an adhesive backing (500) which is attached to the side of the second conductive part (420) that abuts against the first housing (120) in the second direction (Y) so that the second conductive part (420) is connected to the first housing (120).

6. The shielding structure of claim 5, wherein, The adhesive (500) is a conductive adhesive.

7. The shielding structure of claim 3, wherein The orthogonal projection of the conductor (400) in the first direction (X) completely covers the connector (300).

8. The shielding structure according to claim 7, characterized in that, In the first direction (X), the distance between the first housing (120) and the first partition (140) is L1, and the distance between the connector (300) and the first partition (140) is H1; In the second direction (Y), the distance between the first housing (120) and the printed circuit board (200) is L2, and the distance between the connector (300) and the first housing (120) is H2; The length of the side of the second conductive part (420) that abuts against the first outer shell (120) in the second direction (Y) is L3, the length of the side of the first conductive part (410) that abuts against the first partition (140) is L4, the width of the side of the first conductive part (410) that abuts against the metal conductor (210) is H3, and the width of the side of the second conductive part (420) that abuts against the first outer shell (120) in the first direction (X) is H4. Among them, L1, L2, L3, L4, H1, H2, H3, and H4 satisfy: L3≥L1, 1.1≤L4 / L2≤1.15, H3 / H1=1.3, and H4 / H2=1.

3.

9. The shielding structure of claim 8, wherein, In the first direction (X), the distance H1 between the connector (300) and the first partition (140) satisfies: H1 is less than or equal to 10 mm; In the second direction (Y), the distance H2 between the connector (300) and the first housing (120) satisfies that H2 is less than or equal to 10 mm.

10. The shielding structure of claim 4, wherein, The side of the first conductive part (410) away from the first overlapping surface (411) is an arc-shaped surface (412), and the arc-shaped surface (412) is bent in a direction away from the first overlapping surface (411).

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