Composite diamond wafer automated processing equipment

Abstract

This utility model belongs to the field of diamond processing technology, specifically relating to a composite automated diamond wafer processing equipment. This composite automated diamond wafer processing equipment includes: an XY moving module with a wafer adsorption platform mounted on it; a robotic arm for loading wafers onto or unloading wafers from the wafer adsorption platform; and a laser processing system including: a laser mounting frame; a vertical laser processing module for frontal processing of wafers on the wafer adsorption platform; and a horizontal laser processing module for lateral processing of wafers on the wafer adsorption platform. This processing equipment integrates horizontal and vertical laser processing modules, achieving multi-process integrated operation, significantly reducing the need for multiple displacements of the diamond wafer during processing, thereby improving system stability and processing accuracy. Furthermore, this structure simplifies the overall equipment layout, helps reduce equipment size and automation control difficulty, further enhancing system compactness and production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of diamond processing technology, specifically relating to a composite diamond wafer automated processing equipment. Background Technology

[0002] Diamond, hailed as a fourth-generation semiconductor material, possesses a range of superior properties, including a wide bandgap, high thermal conductivity, high breakdown electric field strength, and high carrier mobility, demonstrating immense potential in high-power, high-frequency, and high-temperature electronic device applications. With the development of carbon-based electronic devices and wide-bandgap semiconductor technology, diamond wafers, as a core material, directly determine device performance and reliability through their processing quality. However, diamond's extremely high hardness and chemical inertness also present significant processing challenges. Therefore, developing high-precision, high-efficiency diamond wafer processing technology is of strategic importance for promoting the practical application of fourth-generation semiconductor devices.

[0003] Laser processing offers advantages such as non-contact operation, high precision, and minimal heat-affected zone, enabling efficient core extraction, grooving, and surface finishing of diamond wafers. It is a key technology for solving current challenges in diamond wafer processing. However, traditional laser processing techniques for diamond wafers often require numerous cumbersome steps, complex equipment coordination, and significant space requirements. These techniques also suffer from low process changeover efficiency, susceptibility to contamination and disturbance during wafer handling, and low system integration. Utility Model Content

[0004] The purpose of this invention is to provide a composite automated diamond wafer processing equipment that organically integrates key processes such as core taking, surface finishing, and grooving, solving the problems of cumbersome processing steps, scattered equipment, and large space occupation in existing technologies, and achieving efficient and integrated processing of diamond wafers.

[0005] This application provides a composite diamond wafer automated processing equipment, comprising:

[0006] The XY moving module is equipped with a wafer adsorption platform.

[0007] A robotic arm, positioned on one side of the XY moving module, is used for loading and unloading wafers onto the wafer adsorption platform.

[0008] Laser processing system, which includes:

[0009] The laser mounting bracket is installed above the XY moving module;

[0010] A vertical laser processing module, mounted on the top plate of the laser mounting bracket, is used for front-side processing of wafers on the wafer adsorption platform; and

[0011] The horizontal laser processing module is mounted on the side plate of the laser mounting bracket and is used to perform side processing on the wafers on the wafer adsorption platform.

[0012] In one embodiment of this application, a loading crystal boat and a unloading crystal boat are provided on one side of the robotic arm.

[0013] In one embodiment of this application, the vertical laser processing module includes:

[0014] The first Z-axis moving module is mounted on the top plate of the laser mounting bracket;

[0015] The upper galvanometer field mirror module is installed on the first Z-axis moving module.

[0016] In one embodiment of this application, the horizontal laser processing module includes:

[0017] The second Z-axis moving module is mounted on the side plate of the laser mounting bracket;

[0018] The side-end galvanometer field mirror module is mounted on the second Z-axis moving module.

[0019] In one embodiment of this application, a laser optical path module is provided on the top plate of the laser mounting bracket for delivering laser light to the upper end galvanometer field lens module and the side end galvanometer field lens module.

[0020] In one embodiment of this application, the laser optical path module includes:

[0021] A first laser, a first beam expander, and several first reflectors are used to transmit the laser light emitted by the first laser to the upper galvanometer field mirror module; and

[0022] A second laser, a second beam expander, and several second reflectors are used to transmit the laser emitted by the second laser to the side-end galvanometer field mirror module.

[0023] In one embodiment of this application, the laser optical path module includes: a third laser, a third beam expander, a third reflector, a third reflector moving device, an upper reflector, and a side reflector; wherein the third reflector moving device is used to move the third reflector to the upper reflection position or the side reflection position to reflect the laser emitted by the third laser to the upper reflector or the side reflector, and to deliver the laser to the upper galvanometer field lens module or the side galvanometer field lens module.

[0024] In one embodiment of this application, a dust suction port is also provided below the upper galvanometer field lens module.

[0025] In one embodiment of this application, a spectral confocal sensor is also provided on the laser mounting bracket.

[0026] In one embodiment of this application, the composite diamond wafer automated processing equipment further includes:

[0027] Electrical cabinet;

[0028] A marble platform is installed on top of the electrical cabinet; among which...

[0029] The XY moving module, robotic arm, and laser mounting bracket are mounted on the top surface of the marble platform.

[0030] The beneficial effects of this utility model are:

[0031] Unlike existing technologies, this application provides a composite automated diamond wafer processing equipment, comprising: an XY moving module with a wafer adsorption platform mounted thereon; a robotic arm, positioned on one side of the XY moving module, for loading wafers onto or unloading wafers from the wafer adsorption platform; and a laser processing system comprising: a laser mounting frame mounted above the XY moving module; a vertical laser processing module mounted on the top plate of the laser mounting frame for front-side processing of wafers on the wafer adsorption platform; and a horizontal laser processing module mounted on the side plate of the laser mounting frame for side-side processing of wafers on the wafer adsorption platform. This composite automated diamond wafer processing equipment integrates horizontal and vertical laser processing modules, enabling multi-process integrated operation, significantly reducing the need for multiple displacements of the diamond wafer during processing, thereby improving system stability and processing accuracy. Furthermore, this structure simplifies the overall equipment layout, helps reduce equipment size and automation control complexity, further enhancing system compactness and production efficiency.

[0032] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0033] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0034] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1This is a front perspective view of a preferred embodiment of the composite diamond wafer automated processing equipment of this utility model;

[0036] Figure 2 This is a reverse perspective view of a preferred embodiment of the composite diamond wafer automated processing equipment of this utility model;

[0037] Figure 3 This is a top view of a laser optical path module according to a preferred embodiment of the present invention;

[0038] Figure 4 This is a top view of a laser optical path module according to another preferred embodiment of the present invention.

[0039] In the picture:

[0040] XY moving module 1, wafer adsorption platform 11, robotic arm 2, loading wafer boat 21, unloading wafer boat 22, laser processing system 3, laser mounting frame 31, vertical laser processing module 32, first Z-axis moving module 321, upper galvanometer / field mirror module 322, coaxial vision module 323, horizontal laser processing module 33, second Z-axis moving module 331, side galvanometer / field mirror module 332, laser optical path module 34, first laser 3411, second laser 3 412, Third laser 3413, First beam expander 3421, Second beam expander 3422, Third beam expander 3423, First reflector 3431, Second reflector 3432, Third reflector 3433, Third reflector moving device 3435, Upper reflector 3436, Side reflector 3437, Upper reflection position 3441, Side reflection position 3442, Dust extraction port 35, Spectral confocal sensor 36, Electrical cabinet 4, Marble platform 5. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0042] This application provides a composite diamond wafer automated processing equipment, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0043] See Figure 1 and Figure 2 In one embodiment, the composite diamond wafer automated processing equipment includes: an XY moving module 1 on which a wafer adsorption platform 11 is mounted; a robotic arm 2 disposed on one side of the XY moving module 1 for loading wafers onto the wafer adsorption platform 11 or unloading wafers from the wafer adsorption platform 11; and a laser processing system 3 including: a laser mounting frame 31 mounted above the XY moving module 1; a vertical laser processing module 32 disposed on the top plate of the laser mounting frame 31 for front-side processing of the wafers on the wafer adsorption platform 11; and a horizontal laser processing module 33 disposed on the side plate of the laser mounting frame 31 for lateral processing of the wafers on the wafer adsorption platform 11.

[0044] In this embodiment, the robotic arm 2 can load diamond wafers onto the wafer adsorption platform 11 for fixation, and the XY movement module 1 can drive the wafer adsorption platform 11 to move. After the vertical laser processing module 32 performs frontal processing on the wafer on the wafer adsorption platform 11, the horizontal laser processing module 33 can perform lateral processing on the wafer on the wafer adsorption platform 11. By integrating horizontal and vertical laser processing modules, multi-process integrated operation is achieved, significantly reducing the need for multiple displacements of the diamond wafer during processing, thereby improving system stability and processing accuracy; at the same time, it effectively reduces the risk of wafer breakage caused by multiple gripping and transfer, improving yield; in addition, this structure simplifies the overall equipment layout, helps to reduce equipment size, reduces the difficulty of automation control, and further enhances the system's compactness and production efficiency.

[0045] See Figure 2 Optionally, the robotic arm 2 is provided with a loading crystal boat 21 and a unloading crystal boat 22 on one side, which are used to store diamond wafers to be processed and processed, respectively.

[0046] Optionally, the vertical laser processing module 32 includes: a first Z-axis moving module 321, mounted on the top plate of the laser mounting bracket 31; and an upper galvanometer field lens module 322, mounted on the first Z-axis moving module 321.

[0047] In this embodiment, the first Z-axis moving module 321 can drive the upper galvanometer field lens module 322 to move up and down to adjust the height.

[0048] Optionally, the horizontal laser processing module 33 includes: a second Z-axis moving module 331, mounted on the side plate of the laser mounting bracket 31; and a side-end galvanometer field lens module 332, mounted on the second Z-axis moving module 331.

[0049] In this embodiment, the second Z-axis moving module 331 can drive the side end galvanometer field mirror module 332 to move up and down to adjust the height.

[0050] Optionally, the aforementioned galvanometer field lens module can be a module from the prior art or one that is commercially available.

[0051] In one embodiment, see Figure 1 A coaxial vision module 323 can also be provided on one side of the upper galvanometer field lens module 322. In one application scenario, by setting the coaxial vision module 323 in the optical path and making it coaxial with the laser beam, the mapping relationship between the camera image coordinates and the actual position can be used to reflect the focal position in real time, making it convenient to observe the cutting effect and avoiding the problem of insufficient processing accuracy caused by the material loading position deviation or laser drift.

[0052] Furthermore, a laser optical path module 34 is provided on the top plate of the laser mounting bracket 31 for delivering laser light to the upper end galvanometer field lens module 322 and the side end galvanometer field lens module 332.

[0053] See Figure 3 As an optional implementation of the laser optical path module 34, two lasers can be used to deliver laser light to the upper galvanometer field lens module 322 and the side galvanometer field lens module 332, respectively. Specifically, the laser optical path module 34 includes: a first laser 3411, a first beam expander 3421, and a plurality of first reflectors 3431, for delivering the laser light emitted by the first laser 3411 to the upper galvanometer field lens module 322; and a second laser 3412, a second beam expander 3422, and a plurality of second reflectors 3432, for delivering the laser light emitted by the second laser 3412 to the side galvanometer field lens module 332.

[0054] In this embodiment, the laser emitted by the first laser 3411 is first magnified by the first beam expander 3421, then sequentially passes through several first reflectors 3431 into the upper galvanometer field lens module 322, and is finally focused on the upper surface of the wafer. Through multiple scans by the galvanometer and with appropriate feed rates, the laser precisely cuts the wafer to form core material with a specific geometry. The laser emitted by the second laser 3412 is first magnified by the second beam expander 3422, then sequentially passes through several second reflectors 3432 into the side galvanometer field lens module 332, and is laterally focused on the wafer surface, which may include the side edge and the side surface of the front three-dimensional shape of the wafer. Through the scanning and feed rates of the side galvanometer field lens module 332, efficient polishing and grooving of the wafer are achieved.

[0055] See Figure 4As another optional implementation of the laser optical path module 34, a single laser can be used to deliver laser light to the upper galvanometer field mirror module 322 and the side galvanometer field mirror module 332. Specifically, the laser optical path module 34 includes: a third laser 3413, a third beam expander 3423, a third reflector 3433, a third reflector moving device 3435, an upper reflector 3436, and a side reflector 3437; wherein the third reflector moving device 3435 is used to move the third reflector 3433 to the upper reflection position 3441 or the side reflection position 3442, so as to reflect the laser light emitted by the third laser 3413 to the upper reflector 3436 or the side reflector 3437, for delivering the laser light to the upper galvanometer field mirror module 322 or the side galvanometer field mirror module 332.

[0056] In this embodiment, the third reflector 3433 can be switched between the upper reflection position 3441 and the side reflection position 3442 as needed by the third reflector moving device 3435 to reflect the laser into the upper galvanometer field lens module 322 or the side galvanometer field lens module 332. This method can save the use of lasers and other devices.

[0057] Furthermore, a dust extraction port 35 is also provided below the upper galvanometer field lens module 322. Throughout the entire processing, the dust extraction port 35 can continuously and efficiently remove particles and debris generated during laser processing, thereby effectively ensuring the cleanliness of the processing area and the stability of the system's processing accuracy.

[0058] Optionally, the laser mounting bracket 31 is also provided with a spectral confocal sensor 36, which can be used to acquire clear images of the wafer surface.

[0059] In some applications, the spectral confocal sensor 36 acquires clear images of the wafer surface before processing, which can be used by the processor to generate a three-dimensional topography map and extract key parameters such as the wafer's shape, size, surface roughness, and thickness. A matching laser processing scheme is then selected based on these parameters. Post-processing scanning can also be performed to check for processing defects. It should be noted that the above application scenarios are merely examples illustrating the applicable scenarios of the composite diamond wafer automated processing equipment of this application and do not constitute a technical solution of this application, nor do they involve program improvements.

[0060] In addition, the composite diamond wafer automated processing equipment also includes: an electrical cabinet 4; a marble platform 5, installed on the top surface of the electrical cabinet 4; wherein the XY moving module 1, the robotic arm 2 and the laser mounting bracket 31 are arranged on the top surface of the marble platform 5.

[0061] In this embodiment, optionally, the field lenses in the horizontal and vertical laser processing modules can be replaced according to the wafer size to optimize laser focusing accuracy and processing efficiency. For small wafers, using a short-focal-length field lens can reduce the spot size and improve processing accuracy; for large wafers, using a long-focal-length field lens helps to increase the depth of focus and improve processing efficiency. The laser can be an ultrafast laser, whose short-pulse characteristics result in higher peak power and a very small heat-affected zone, making it suitable for higher-precision material processing and effectively reducing material loss during processing.

[0062] It should be noted that all the devices (parts whose specific structures are not specified) selected in this application are general standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0063] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0064] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0065] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification.

Claims

1. A composite diamond wafer automated processing equipment, characterized in that, include: XY moving module (1), on which a wafer adsorption platform (11) is provided. The robotic arm (2) is set on one side of the XY moving module (1) and is used to load wafers onto the wafer adsorption platform (11) or unload wafers from the wafer adsorption platform (11). Laser processing system (3), comprising: A laser mounting bracket (31) is mounted above the XY moving module (1); A vertical laser processing module (32) is mounted on the top plate of the laser mounting bracket (31) and is used to perform front-side processing on the wafers on the wafer adsorption platform (11); and A horizontal laser processing module (33) is set on the side plate of the laser mounting bracket (31) and is used to perform lateral processing on the wafers on the wafer adsorption platform (11).

2. The composite diamond wafer automated processing equipment according to claim 1, characterized in that, The robotic arm (2) is provided with a loading crystal boat (21) and a unloading crystal boat (22) on one side.

3. The composite diamond wafer automated processing equipment according to claim 1, characterized in that, The vertical laser processing module (32) includes: The first Z-axis moving module (321) is mounted on the top plate of the laser mounting bracket (31); The upper galvanometer field lens module (322) is mounted on the first Z-axis moving module (321).

4. The composite diamond wafer automated processing equipment according to claim 3, characterized in that, The horizontal laser processing module (33) includes: The second Z-axis moving module (331) is mounted on the side plate of the laser mounting bracket (31); The side-end galvanometer field mirror module (332) is mounted on the second Z-axis moving module (331).

5. The composite diamond wafer automated processing equipment according to claim 4, characterized in that, The top plate of the laser mounting bracket (31) is provided with a laser optical path module (34) for delivering laser to the upper end galvanometer field lens module (322) and the side end galvanometer field lens module (332).

6. The composite diamond wafer automated processing equipment according to claim 5, characterized in that, The laser optical path module (34) includes: A first laser (3411), a first beam expander (3421), and a plurality of first reflectors (3431) are used to transmit the laser emitted by the first laser (3411) to the upper galvanometer field mirror module (322); and A second laser (3412), a second beam expander (3422), and several second reflectors (3432) are used to deliver the laser emitted by the second laser (3412) to the side-end galvanometer field mirror module (332).

7. The composite diamond wafer automated processing equipment according to claim 5, characterized in that, The laser optical path module (34) includes: a third laser (3413), a third beam expander (3423), a third reflector (3433), a third reflector moving device (3435), an upper reflector (3436), and a side reflector (3437); wherein The third reflector moving device (3435) is used to move the third reflector (3433) to the upper reflection position (3441) or the side reflection position (3442) to reflect the laser emitted by the third laser (3413) to the upper reflector (3436) or the side reflector (3437) to deliver the laser to the upper galvanometer field lens module (322) or the side galvanometer field lens module (332).

8. The composite diamond wafer automated processing equipment according to claim 3, characterized in that, A dust extraction port (35) is also provided below the upper galvanometer field lens module (322).

9. The composite diamond wafer automated processing equipment according to claim 1, characterized in that, The laser mounting bracket (31) is also equipped with a spectral confocal sensor (36).

10. The composite diamond wafer automated processing equipment according to claim 1, characterized in that, The composite diamond wafer automated processing equipment also includes: Electrical cabinet (4); A marble platform (5) is installed on the top surface of an electrical cabinet (4); wherein the XY moving module (1), the robotic arm (2) and the laser mounting bracket (31) are located on the top surface of the marble platform (5).

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