A lightweight, high-precision, high-torque bonding head
By designing a lightweight, high-precision, and high-torque bonding head, and utilizing a rotary adjustment block and a motor synchronous belt to achieve angle adjustment, the problem of difficult bonding head angle adjustment was solved, improving chip mounting accuracy and equipment stability, and extending service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINYIBANG SEMICON (JIANGSU) CO LTD
- Filing Date
- 2025-08-25
- Publication Date
- 2026-06-30
AI Technical Summary
The existing bonding head cannot adjust the placement angle, which easily leads to deviations during chip placement, affecting placement accuracy and quality.
A lightweight, high-precision bonding head with a large torque range was designed. The angle of the mounting base can be adjusted by rotating vertical and horizontal adjustment blocks. The precise angle adjustment of the chip can be achieved by combining a rotary motor and a synchronous belt. Stable adsorption force is provided by vacuum air circuit and spring sheet.
It improves the accuracy and quality of chip mounting, reduces wear, extends equipment life, and ensures the stability and firmness of adsorption.
Smart Images
Figure CN224439581U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip mounting technology, and in particular to a lightweight, high-precision, high-torque bonding head. Background Technology
[0002] Chip mounting is a critical step in semiconductor packaging. Its core objective is to establish a strong mechanical and electrical connection between the chip and the substrate or package structure, while simultaneously creating an efficient heat conduction path. This process directly affects the performance, reliability, and lifespan of electronic devices, and its importance is particularly prominent in scenarios such as power devices and high-frequency communications. The bonding head, as a device for adsorbing the chip, is an indispensable part of the chip mounting process. However, the bonding head in the current technology cannot adjust the mounting angle, which easily leads to deviations during mounting and poor mounting accuracy, affecting the quality of the mounting process. Therefore, it needs to be improved. Utility Model Content
[0003] To improve the problem of deviation during placement and enhance placement accuracy and product quality, this application provides a lightweight, high-precision, high-torque bonding head.
[0004] The bonding head provided in this application, which is lightweight, high-precision, and has a large torque range, adopts the following technical solution:
[0005] A lightweight, high-precision, high-torque bonding head includes a mounting plate, a first mounting base, a second mounting base, a third mounting base, and a bonding assembly. The mounting plate has a first cylindrical pin, and the first mounting base is rotatably connected to the mounting plate via the first cylindrical pin. Vertical adjustment blocks are provided on both side walls of the first mounting base. The mounting plate has clearance grooves for the vertical adjustment blocks. A mounting groove for the second mounting base is provided on the side wall of the first mounting base away from the mounting plate, and a second cylindrical pin is provided within the mounting groove. The second mounting base is rotatably connected to the first mounting base via the second cylindrical pin. A planar adjustment block for adjusting the angle of the second mounting base is provided on the bottom wall of the second mounting base. The third mounting base is located on the side of the second mounting base away from the first mounting base, and the bonding assembly is mounted on the third mounting base.
[0006] By adopting the above technical solution, rotating the vertical adjustment block causes the first mounting base to move left and right via the thread, thereby creating a yaw around the X-axis with the first cylindrical pin as the rotation axis, thus adjusting the angle of the first mounting base and the bonding component; rotating the horizontal adjustment block causes the second mounting base to move back and forth via the thread, thereby creating a yaw around the Y-axis with the second cylindrical pin as the rotation axis, thus adjusting the angle of the second mounting base and the bonding component, thereby improving the problem of deviation during placement, and improving placement accuracy and product quality.
[0007] Preferably, the bonding assembly includes a rotating shaft, a nozzle handle, a nozzle head, and a vacuum passage. The rotating shaft is rotatably mounted in a third mounting base. The nozzle handle is connected to the lower end of the rotating shaft. The nozzle head is located at the end of the nozzle handle away from the rotating shaft. The rotating shaft, nozzle handle, and nozzle head are all hollow components. The vacuum passage is connected to the upper end of the rotating shaft.
[0008] By adopting the above technical solution, the air inside the rotating shaft, the nozzle handle, and the nozzle head is extracted by the vacuum circuit, so that the interior of the three parts becomes a negative pressure state. Thus, the nozzle head can be adsorbed onto the chip under the drive of the external moving parts. The structure is simple and easy to implement.
[0009] Preferably, a rotary motor is provided on the second mounting base, the output shaft of the rotary motor passes through the second mounting base, a synchronous pulley is provided on the peripheral wall of the third mounting base extending from the rotary shaft, and a miniature synchronous belt is provided between the output shaft of the rotary motor and the synchronous pulley.
[0010] By adopting the above technical solution, a rotary motor and a miniature synchronous belt are set to drive the rotating shaft to rotate, thereby adjusting the angle of the chip it adsorbs, so as to improve the accuracy of chip mounting.
[0011] Preferably, the third mounting base is provided with a plurality of ball bearings, which are distributed in a vertical direction, and the rotating shaft is connected to the inner ring of the ball bearings.
[0012] By adopting the above technical solution, the use of ball bearings can effectively reduce wear during the rotation of the rotating shaft, improve the smoothness of rotation, ensure the structural safety of the rotating shaft, reduce the maintenance frequency, and extend the service life of the key head of this application.
[0013] Preferably, the top of the second mounting base is provided with a fixing seat, and the fixing seat is provided with a downward pressure spring, which abuts against the top wall of the rotating shaft.
[0014] By adopting the above technical solution, the downward pressure spring can provide downward pressure on the rotating shaft, enabling the nozzle head to more firmly adsorb the chip.
[0015] Preferably, the second mounting base is provided with two balance limiting members, and the third mounting base is located between the two balance limiting members. The side wall of the third mounting base is provided with an adjustment groove for the end of the balance limiting member to abut. One of the balance limiting members is provided with an adjustment bolt, which passes through the third mounting base and is connected to the balance limiting member. The other balance limiting member is fixedly connected to the inner wall of the adjustment groove.
[0016] By adopting the above technical solution, the balance limiter can restrict the movement of the third mounting base in the left and right directions, thereby improving the stability of the third mounting base relative to the second mounting base. At the same time, the adjusting bolt can cooperate with the downward pressure spring to adjust the downward pressure on the rotating shaft.
[0017] Preferably, the side wall of the second mounting base is provided with a displacement sensor for detecting the displacement of the third mounting base.
[0018] By adopting the above technical solution, the displacement of the third mounting base during operation can be known in a timely manner, which facilitates the staff to adjust the tightness between the components in a timely manner.
[0019] Preferably, the upper and lower surfaces of the third mounting base are provided with a plurality of spring plates, and both ends of the spring plates are provided with fastening bolts. One end of the fastening bolt is used to connect the spring plate to the third mounting base, and the other end of the fastening bolt is used to connect the spring plate to the second mounting base.
[0020] By adopting the above technical solution, when the spring sheet adsorbs the product at the nozzle head, the deformation of the spring sheet causes the rotating shaft, nozzle handle, and nozzle head to move slightly in the Z direction, thereby providing downward pressure and enabling the nozzle head to adsorb the chip more firmly.
[0021] In summary, this application includes at least one of the following beneficial technical effects:
[0022] 1. Rotating the vertical adjustment block causes the first mounting base to move left and right via the thread, thereby creating an oscillation around the X-axis with the first cylindrical pin as the rotation axis, thus adjusting the angle of the first mounting base and the bonding component; rotating the horizontal adjustment block causes the second mounting base to move back and forth via the thread, thereby creating an oscillation around the Y-axis with the second cylindrical pin as the rotation axis, thus adjusting the angle of the second mounting base and the bonding component, thereby improving the problem of deviation during placement, and improving placement accuracy and product quality;
[0023] 2. When the spring sheet adsorbs the product at the nozzle head, the deformation of the spring sheet causes the rotating shaft, nozzle handle, and nozzle head to move slightly in the Z direction, thereby providing downward pressure and enabling the nozzle head to adsorb the chip more firmly. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of a lightweight, high-precision, high-torque bonding head according to an embodiment of this application.
[0025] Figure 2 This is a schematic diagram of the mounting structure of the bonding head according to an embodiment of this application.
[0026] Figure 3 This is a schematic diagram of the bonding component according to an embodiment of this application.
[0027] Figure 4 This is a schematic diagram of the bottom structure of the bonding head according to an embodiment of this application.
[0028] Figure 5 This is an exploded structural diagram of the bonding head according to an embodiment of this application.
[0029] Explanation of reference numerals in the attached drawings: 1. Mounting plate; 11. First cylindrical pin; 12. Clearance groove; 2. First mounting base; 21. Vertical adjustment block; 22. Mounting groove; 23. Second cylindrical pin; 3. Second mounting base; 31. Horizontal adjustment block; 32. Rotary motor; 33. Fixed base; 34. Downward spring; 35. Balance limit component; 36. Adjusting bolt; 37. Displacement sensor; 4. Third mounting base; 41. Adjustment groove; 42. Spring plate; 43. Fastening bolt; 5. Keying assembly; 51. Rotating shaft; 511. Synchronous pulley; 512. Miniature synchronous belt; 513. Ball bearing; 52. Nozzle handle; 53. Nozzle head; 54. Vacuum air path. Detailed Implementation
[0030] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.
[0031] This application discloses a lightweight, high-precision, high-torque bonding head. (Refer to...) Figure 1 and Figure 2 The assembly includes a mounting plate 1, a first mounting base 2, a second mounting base 3, a third mounting base 4, and a bonding assembly 5. The mounting plate 1 is mounted on the moving mechanism of the bonding equipment. The moving mechanism drives the mounting plate 1 to move along the XYZ three-axis directions. In this embodiment, the XYZ three-axis directions are as follows: Figure 1 As shown in the image.
[0032] Reference Figure 1 and Figure 2 The first mounting base 2 is disposed on the surface of the mounting plate 1. The surface of the mounting plate 1 is provided with a first cylindrical pin 11. The first mounting base 2 is sleeved on the periphery of the first cylindrical pin 11 and forms a rotatable connection with the mounting plate 1 through the first cylindrical pin 11. The length direction of the first cylindrical pin 11 is set along the X-axis direction. Vertical adjustment blocks 21 are provided on both side walls of the first mounting base 2. The mounting plate 1 is provided with a clearance groove 12 for the vertical adjustment blocks 21. In this embodiment, the vertical adjustment blocks 21 are screws. By rotating the screws, the first mounting base 2 can move left and right, and then tilt relative to the mounting plate 1 with the first cylindrical pin 11 as the rotation axis 51 to adjust the angle of the bonding assembly 5.
[0033] Reference Figure 1and Figure 2 The first mounting base 2 has a mounting groove 22 on its side wall away from the mounting plate 1 for the second mounting base 3 to be mounted. The inner wall of the mounting groove 22 is provided with a second cylindrical pin 23. The length direction of the second cylindrical pin 23 is set along the Y-axis. The second mounting base 3 is sleeved on the periphery of the second cylindrical pin 23 and forms a rotatable connection with the first mounting base 2 through the second cylindrical pin 23. The bottom wall of the second mounting base 3 is provided with a horizontal adjustment block 31. In this embodiment, the horizontal adjustment block 31 is a screw. By rotating the screw, the second mounting base 3 can move back and forth, and then swing relative to the first mounting base 2 with the second cylindrical pin 23 as the rotation axis 51 to adjust the angle of the bonding assembly 5.
[0034] Reference Figure 1 and Figure 3 The third mounting base 4 is located on the side of the second mounting base 3 away from the first mounting base 2. The bonding assembly 5 is located on the third mounting base 4. The bonding assembly 5 includes a rotating shaft 51, a nozzle handle 52, a nozzle head 53, and a vacuum passage 54. The rotating shaft 51 passes through the third mounting base 4 and is rotatably connected to it. The third mounting base 4 has two ball bearings 513 inside, which are distributed along the Z direction. The rotating shaft 51 passes through the inner rings of the two ball bearings 513 in sequence and is connected to them to reduce wear during rotation. The nozzle handle 52 is connected to the end of the rotating shaft 51 that extends out of the third mounting base 4, and the nozzle head 53 is connected to the end of the nozzle handle 52 that is away from the rotating shaft 51. In this embodiment, the rotating shaft 51, the nozzle handle 52, and the nozzle head 53 are all hollow parts. The vacuum passage 54 is connected to the end of the rotating shaft 51 that extends out from the top of the third mounting base 4 to remove internal air and adsorb the chip.
[0035] Reference Figure 1 , Figure 3 and Figure 4 A rotary motor 32 is provided on the top wall of the second mounting base 3. The output shaft of the rotary motor 32 passes through the second mounting base 3 and extends to the bottom. A synchronous wheel 511 is provided on the peripheral wall of one end of the rotary shaft 51 extending out of the third mounting base 4. A miniature synchronous belt 512 is provided between the synchronous wheel 511 and the output shaft of the rotary motor 32 so that the rotary motor 32 drives the rotary shaft 51 to rotate, thereby adjusting the angle of the adsorbed chip.
[0036] Reference Figure 1 and Figure 5The second mounting base 3 has a fixed base 33 on its top wall, and a downward pressure spring 34 on its top wall. The downward pressure spring 34 is coaxially arranged with the rotating shaft 51 and abuts against the top of the rotating shaft 51. Balance limiters 35 are provided on both sides of the second mounting base 3. The third mounting base 4 is located between the two balance limiters 35. The side wall of the third mounting base 4 has an adjustment groove 41 for the end of the balance limiter 35 to abut. One balance limiter 35 is fixed inside the adjustment groove 41, and an adjustment bolt 36 is provided on the other balance limiter 35. The adjustment bolt 36 passes through the third mounting base 4 and is connected to the balance limiter 35 on that side. On the one hand, it is used to fix the third mounting base 4, and on the other hand, it can adjust the third mounting base 4, thereby changing the downward pressure applied by the downward pressure spring 34 to the rotating shaft 51. The side wall of the second mounting base 3 is also provided with a displacement sensor 37 to monitor the displacement of the third mounting base 4 in real time, so as to calculate and output a stable and controllable downward pressure.
[0037] Reference Figure 1 and Figure 5 The top and bottom walls of the third mounting base 4 are provided with a number of spring plates 42. In this embodiment, the number of spring plates 42 on both the upper and lower sides of the third mounting base 4 is 2. Both ends of the spring plates 42 are provided with fastening bolts 43. One fastening bolt 43 is used to connect the third mounting base 4, and the other fastening bolt 43 is used to connect the second mounting base 3. When the suction head 53 adsorbs the product, the spring plates 42 deform, thereby causing the rotating shaft 51, the suction handle 52 and the suction head 53 to move slightly in the Z direction, thereby providing downward pressure, so that the suction head 53 can adsorb the chip more firmly.
[0038] The implementation principle of a lightweight, high-precision, high-torque bonding head according to an embodiment of this application is as follows: Rotating the vertical adjustment block 21 causes the first mounting base 2 to move left and right via a thread, thereby creating a yaw about the X-axis with the first cylindrical pin 11 as the rotation axis 51, thus adjusting the angles of the first mounting base 2 and the bonding assembly 5; rotating the horizontal adjustment block 31 causes the second mounting base 3 to move back and forth via a thread, thereby creating a yaw about the Y-axis with the second cylindrical pin 23 as the rotation axis 51, thus adjusting the angles of the second mounting base 3 and the bonding assembly 5, thereby improving the problem of deviations during mounting, and enhancing mounting accuracy and product quality.
[0039] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A lightweight high-precision large-torque-range bonding head, characterized by: The device includes a mounting plate, a first mounting base, a second mounting base, a third mounting base, and a bonding assembly. The mounting plate has a first cylindrical pin, and the first mounting base is rotatably connected to the mounting plate via the first cylindrical pin. Vertical adjustment blocks are provided on both side walls of the first mounting base. The mounting plate has clearance grooves for the vertical adjustment blocks. A mounting groove for the second mounting base is provided on the side wall of the first mounting base away from the mounting plate, and a second cylindrical pin is provided within the mounting groove. The second mounting base is rotatably connected to the first mounting base via the second cylindrical pin. A planar adjustment block for adjusting the angle of the second mounting base is provided on the bottom wall of the second mounting base. The third mounting base is located on the side of the second mounting base away from the first mounting base, and the bonding assembly is mounted on the third mounting base.
2. The bonding head of claim 1, wherein: The bonding assembly includes a rotating shaft, a nozzle handle, a nozzle head, and a vacuum passage. The rotating shaft is rotatably mounted in a third mounting base. The nozzle handle is connected to the lower end of the rotating shaft. The nozzle head is located at the end of the nozzle handle away from the rotating shaft. The rotating shaft, nozzle handle, and nozzle head are all hollow components. The vacuum passage is connected to the upper end of the rotating shaft.
3. The bonding head of claim 2, wherein: A rotary motor is provided on the second mounting base. The output shaft of the rotary motor passes through the second mounting base. A synchronous pulley is provided on the peripheral wall of the third mounting base, and a miniature synchronous belt is provided between the output shaft of the rotary motor and the synchronous pulley.
4. The bonding head of claim 2, wherein: The third mounting base is provided with a plurality of ball bearings, which are distributed vertically, and the rotating shaft is connected to the inner ring of the ball bearings.
5. The bonding head of claim 2, wherein: The second mounting base is provided with a fixed seat on its top, and a downward pressure spring is provided on the fixed seat, which abuts against the top wall of the rotating shaft.
6. The bonding head of claim 5, wherein: The second mounting base is provided with two balance limiting members. The third mounting base is located between the two balance limiting members. The side wall of the third mounting base is provided with an adjustment groove for the end of the balance limiting member to abut. One of the balance limiting members is provided with an adjustment bolt. The adjustment bolt passes through the third mounting base and is connected to the balance limiting member. The other balance limiting member is fixedly connected to the inner wall of the adjustment groove.
7. The bonding head of claim 6, wherein: The second mounting base has a displacement sensor on its side wall for detecting the displacement of the third mounting base.
8. The bonding head of claim 1, wherein: The upper and lower surfaces of the third mounting base are provided with a plurality of spring plates. Each spring plate has a fastening bolt at both ends. One fastening bolt is used to connect the spring plate to the third mounting base, and the other fastening bolt is used to connect the spring plate to the second mounting base.