An adjustable vacuum adsorption carrier device for wafer thinning

Abstract

This utility model discloses an adjustable vacuum adsorption carrier device for wafer thinning, including a carrier stage; an adsorption hole assembly, including a central adsorption hole at the center of the top surface of the carrier stage, an outer layer adsorption holes arranged in a ring around the outside of the central adsorption hole, and an outermost layer adsorption holes arranged in a ring around the outside of the outer layer adsorption holes; and an outer shielding assembly. By setting the outer shielding assembly and the outermost shielding assembly on the top of the adsorption hole assembly, when it is necessary to adsorb and fix a small wafer, the personnel can lower the outer shielding assembly and the outermost shielding assembly to cover the corresponding outer layer adsorption holes and the outermost adsorption holes. In this way, the distribution of adsorption holes can be adjusted so that open adsorption holes can be covered, thereby avoiding the problem of debris generated during the thinning process being sucked into the open adsorption holes, and providing a certain degree of protection for the entire vacuum adsorption carrier.

Description

Technical Field

[0001] This utility model belongs to the field of wafer adsorption carrier technology, specifically relating to an adjustable vacuum adsorption carrier device for wafer thinning. Background Technology

[0002] A wafer is the fundamental material in semiconductor manufacturing. It is typically a thin, circular sheet made of semiconductor materials such as silicon and serves as the carrier for chips. Wafer thinning is a process that reduces its thickness to a target value through methods such as grinding to meet packaging and performance requirements. During wafer thinning, positioning carriers are needed to hold and fix the wafer in place. Vacuum adsorption is a common method for fixing the wafer.

[0003] Existing vacuum adsorption carriers have certain shortcomings in use. The carrier surface has many adsorption holes, which are used in conjunction with a negative pressure pump to generate suction to adsorb and fix the wafer. However, the wafers are of different sizes. When a small wafer is placed on the carrier, it is inevitable that not all adsorption holes can be covered. At this time, some adsorption holes are open. When the wafer is thinned, the generated debris can easily be sucked into the open adsorption holes, thereby damaging the entire adsorption mechanism. Therefore, a new vacuum adsorption carrier needs to be designed to solve this problem. Utility Model Content

[0004] The purpose of this invention is to provide an adjustable vacuum adsorption carrier device for wafer thinning, in order to solve the problem mentioned in the background art that some adsorption holes may be open during use, and the open adsorption holes may easily suck in debris generated during thinning.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an adjustable vacuum adsorption carrier device for wafer thinning, comprising...

[0006] Vehicle platform;

[0007] The adsorption hole assembly includes a central adsorption hole at the center of the top surface of the carrier platform, an outer layer of adsorption holes arranged in a ring around the outside of the central adsorption hole, and an outermost layer of adsorption holes arranged in a ring around the outside of the outer layer of adsorption holes.

[0008] The outer shielding assembly includes a damping shaft A disposed on the top surface of the vehicle platform and a shielding ring A rotatably connected to the top surface of the vehicle platform via the damping shaft A. The shielding ring A is adapted to the annularly distributed outer adsorption holes.

[0009] The outermost shielding assembly includes a shielding ring B rotatably connected to the top surface of the carrier platform, the shielding ring B being adapted to the annularly distributed outermost adsorption holes;

[0010] The pipeline assembly includes a main pipeline located at one end of the carrier platform and three branch pipelines connecting the main pipeline and the carrier platform. The three branch pipelines are respectively connected to the central adsorption hole, the outer adsorption hole and the outermost adsorption hole.

[0011] Preferably, the outer shielding component further includes a sealing plug A distributed in a ring on one side of the shielding ring A, and the sealing plug A corresponds one-to-one with the outer adsorption hole.

[0012] Preferably, the outermost shielding component further includes a damping shaft B and a sealing plug B that are identical to the damping shaft A and the sealing plug A, and the sealing plug B corresponds one-to-one with the outermost adsorption hole.

[0013] Preferably, the outer shielding component further includes a fastener, which is fixed to one end of the shielding ring A.

[0014] Preferably, the platform has an internal groove structure, which includes a central cavity, an outer cavity, and an outermost cavity arranged from top to bottom. A connecting groove is provided between the central cavity and the central adsorption hole, between the outer cavity and the outer adsorption hole, and between the outermost cavity and the outermost adsorption hole. A circular groove is provided on one side of the central cavity, the outer cavity, and the outermost cavity, and the circular groove is connected to three branch pipes respectively.

[0015] Preferably, the pipeline assembly further includes a gas valve A, which is disposed on the main pipeline.

[0016] Preferably, the pipeline assembly further includes an auxiliary pipeline and a gas valve B, wherein the auxiliary pipeline is connected to the surface of the main pipeline and the gas valve B is disposed on the auxiliary pipeline.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] By setting an outer shielding component and an outermost shielding component on top of the adsorption hole assembly, when smaller wafers need to be adsorbed and fixed, personnel can lower the outer shielding component and the outermost shielding component to cover the corresponding outer and outermost adsorption holes. In this way, the distribution of adsorption holes can be adjusted, allowing open adsorption holes to be covered, thereby avoiding the problem of debris generated during the thinning process being sucked into the open adsorption holes, and providing a certain degree of protection for the entire vacuum adsorption carrier. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0020] Figure 2 This is a top view of the adsorption pore assembly of this utility model;

[0021] Figure 3 This utility model Figure 1 Enlarged view of area A in the middle;

[0022] Figure 4 This is a side sectional view of the inner groove structure of this utility model;

[0023] Figure 5 This utility model Figure 1 Enlarged diagram of area B in the middle;

[0024] Figure 6 This is a three-dimensional schematic diagram of the pipe assembly of this utility model;

[0025] In the diagram: 100, platform; 200, adsorption hole assembly; 201, central adsorption hole; 202, outer adsorption hole; 203, outermost adsorption hole; 300, outer shielding assembly; 301, damping shaft A; 302, shielding ring A; 303, sealing plug A; 304, fastener; 400, outermost shielding assembly; 500, inner groove structure; 501, central cavity; 502, outer cavity; 503, outermost cavity; 504, connecting groove; 505, circular groove; 600, pipe assembly; 601, main pipe; 602, branch pipe; 603, air valve A; 604, auxiliary pipe; 605, air valve B. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example

[0028] Please see Figures 1 to 6 This embodiment provides a technical solution: an adjustable vacuum adsorption carrier device for wafer thinning, comprising...

[0029] Carrier stage 100 is used to hold wafers;

[0030] The adsorption hole assembly 200 includes a central adsorption hole 201 formed at the center of the top surface of the carrier stage 100, an outer layer adsorption hole 202 arranged in a ring around the outside of the central adsorption hole 201, and an outermost layer adsorption hole 203 arranged in a ring around the outside of the outer layer adsorption hole 202. The wafer is adsorbed and fixed through the three layers of adsorption holes from the inside to the outside.

[0031] The outer shielding assembly 300 includes a damping shaft A301 disposed on the top surface of the carrier platform 100 and a shielding ring A302 rotatably connected to the top surface of the carrier platform 100 via the damping shaft A301. The shielding ring A302 is adapted to the annularly distributed outer adsorption holes 202. When the outer adsorption holes 202 are open, the shielding ring A302 is flipped to completely seal and cover the outer adsorption holes 202.

[0032] The outermost shielding component 400 includes a shielding ring B rotatably connected to the top surface of the carrier platform 100. The shielding ring B is adapted to the outermost adsorption holes 203 distributed in an annular pattern. When the outermost adsorption holes 203 are open, the shielding ring B can be flipped to completely seal and cover the outermost adsorption holes 203.

[0033] The pipe assembly 600 includes a main pipe 601 disposed at one end of the carrier platform 100 and three branch pipes 602 connected between the main pipe 601 and the carrier platform 100. The three branch pipes 602 are respectively connected to the central adsorption hole 201, the outer adsorption hole 202 and the outermost adsorption hole 203. The outer end of the main pipe 601 is connected to a negative pressure pump, which generates negative pressure to make the adsorption hole assembly 200 generate adsorption force.

[0034] In this embodiment, preferably, the outer shielding component 300 further includes a sealing plug A303 distributed in a ring on one side of the shielding ring A302. The sealing plug A303 corresponds one-to-one with the outer adsorption hole 202. When the outer shielding component 300 is closed, the sealing plug A303 can be inserted into the outer adsorption hole 202 to further improve the sealing effect of the outer adsorption hole 202.

[0035] In this embodiment, preferably, the outermost shielding component 400 also includes a damping shaft B and a sealing plug B that are the same as the damping shaft A301 and the sealing plug A303. The sealing plug B corresponds one-to-one with the outermost adsorption hole 203. When the outermost shielding component 400 is closed, the sealing plug B can be inserted into the outermost adsorption hole 203 to further improve the sealing effect of the outermost adsorption hole 203.

[0036] In this embodiment, preferably, the outer shielding component 300 further includes a fastener 304, which is fixed to one end of the shielding ring A302 and the same fastener 304 is fixed to one end of the shielding ring B, so as to facilitate the flipping of the shielding ring A302 and the shielding ring B.

[0037] In this embodiment, preferably, the carrier platform 100 is provided with an inner groove structure 500. The inner groove structure 500 includes a central cavity 501, an outer cavity 502, and an outermost cavity 503, which are opened from top to bottom. A connecting groove 504 is provided between the central cavity 501 and the central adsorption hole 201, between the outer cavity 502 and the outer adsorption hole 202, and between the outermost cavity 503 and the outermost adsorption hole 203. A circular groove 505 is provided on one side of the central cavity 501, the outer cavity 502, and the outermost cavity 503. The circular groove 505 is connected to three branch pipes 602 respectively. The negative pressure generated by the negative pressure pump can act on the adsorption hole assembly 200 through the main pipe 601, the branch pipes 602, and the inner groove structure 500 in sequence, thereby generating an adsorption force.

[0038] In this embodiment, preferably, the pipeline assembly 600 further includes a gas valve A603, which is disposed on the main pipeline 601. Closing the gas valve A603 can close the main pipeline 601.

[0039] In this embodiment, preferably, the pipe assembly 600 further includes an auxiliary pipe 604 and an air valve B605. The auxiliary pipe 604 is connected to the surface of the main pipe 601, and the air valve B605 is installed on the auxiliary pipe 604. The auxiliary pipe 604 is connected to a high-pressure blower, which can open the air valve B605 and close the air valve A603. The high-pressure blower can generate a high-pressure airflow, which is sprayed out from the adsorption hole assembly 200 through the auxiliary pipe 604, the branch pipe 602 and the inner groove structure 500, which facilitates the cleaning of debris and the function of dust removal and unblocking.

[0040] Working principle: When wafer thinning is required, the outer shielding component 300 and the outermost shielding component 400 are first flipped open to expose the entire adsorption hole component 200. The wafer is then placed in the center of the carrier stage 100. Depending on the wafer size, if the wafer covers the central adsorption hole 201 and the outermost adsorption hole 202, while the outermost adsorption hole 203 remains open, the outermost shielding component 400 needs to be closed to cover the outermost adsorption hole 203. If both the outermost adsorption hole 202 and the outermost adsorption hole 203 are open, the outer shielding component 300 is closed. Both the outermost shielding component 400 and the outermost suction hole 202 are closed, thus covering the outermost suction hole 203. After the above operations are completed, check the gas valves A603 and B605 to ensure that gas valve A603 is open and gas valve B605 is closed. Then start the negative pressure pump. The negative pressure pump can generate negative pressure, which, through the branch pipe 602 and the inner tank structure 500, can use the suction hole component 200 to vacuum-adsorb the placed wafer, ensuring its stability, so that subsequent thinning processing can be performed. During the processing, debris will be generated and distributed on the carrier stage 100. At this time, some of the suction holes of the suction hole component 200 are covered. During wafer masking, some adsorption holes are covered by the outer masking component 300 or the outermost masking component 400, thus all adsorption holes are in a closed state, preventing debris from falling into the adsorption hole component 200. After the thinning operation is completed, the negative pressure pump is turned off, and then the debris on the surface of the carrier stage 100 needs to be cleaned. Personnel also need to regularly clean and unclog the adsorption hole component 200 and the inner tank structure 500 to prevent dust accumulation inside the adsorption hole component 200 and the inner tank structure 500 over time, which would affect the adsorption effect. At this time, personnel first flip the outer masking component 300 and the outermost masking component 400. Turn on the valve and close the air valve A603, open the air valve B605, and then start the high-pressure blower connected to the auxiliary pipe 604. Use the high-pressure blower to blow high-speed airflow towards the branch pipe 602, the inner tank structure 500 and the adsorption hole assembly 200. At the same time, it can clean the debris on the surface of the carrier platform 100. This design can facilitate the cleaning of debris on the surface of the carrier platform 100 and prevent debris from falling into the adsorption hole assembly 200 during the cleaning process. On the other hand, it can also clean and unclog the branch pipe 602, the inner tank structure 500 and the adsorption hole assembly 200, ensuring the adsorption stability of the vacuum adsorption carrier.

[0041] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An adjustable vacuum chucking device for wafer thinning, characterized by: include Vehicle platform (100); The adsorption hole assembly (200) includes a central adsorption hole (201) opened at the center of the top surface of the carrier platform (100), an outer layer adsorption hole (202) arranged in a ring around the outside of the central adsorption hole (201), and an outermost layer adsorption hole (203) arranged in a ring around the outside of the outer layer adsorption hole (202). The outer shielding assembly (300) includes a damping shaft A (301) disposed on the top surface of the vehicle platform (100) and a shielding ring A (302) rotatably connected to the top surface of the vehicle platform (100) via the damping shaft A (301). The shielding ring A (302) is adapted to the annularly distributed outer adsorption holes (202). The outermost shielding assembly (400) includes a shielding ring B rotatably connected to the top surface of the carrier platform (100), the shielding ring B being adapted to the annularly distributed outermost adsorption holes (203); The pipeline assembly (600) includes a main pipeline (601) disposed at one end of the carrier platform (100) and three branch pipelines (602) connected between the main pipeline (601) and the carrier platform (100). The three branch pipelines (602) are respectively connected to the central adsorption hole (201), the outer adsorption hole (202) and the outermost adsorption hole (203).

2. The adjustable vacuum adsorption carrier device for wafer thinning according to claim 1, characterized in that: The outer shielding component (300) also includes a sealing plug A (303) that is annularly distributed on one side of the shielding ring A (302), and the sealing plug A (303) corresponds one-to-one with the outer adsorption hole (202).

3. The adjustable vacuum adsorption carrier device for wafer thinning according to claim 2, characterized in that: The outermost shielding assembly (400) also includes a damping shaft B and a sealing plug B that are the same as the damping shaft A (301) and the sealing plug A (303), and the sealing plug B corresponds one-to-one with the outermost adsorption hole (203).

4. The adjustable vacuum adsorption carrier device for wafer thinning according to claim 3, characterized in that: The outer shielding assembly (300) also includes a fastener (304) which is fixed to one end of the shielding ring A (302).

5. The adjustable vacuum adsorption carrier device for wafer thinning according to claim 4, characterized in that: The platform (100) is provided with an inner groove structure (500). The inner groove structure (500) includes a central cavity (501), an outer cavity (502), and an outermost cavity (503) from top to bottom. A connecting groove (504) is provided between the central cavity (501) and the central adsorption hole (201), between the outer cavity (502) and the outer adsorption hole (202), and between the outermost cavity (503) and the outermost adsorption hole (203). A circular groove (505) is provided on one side of the central cavity (501), the outer cavity (502), and the outermost cavity (503). The circular groove (505) is connected to three branch pipes (602) respectively.

6. The adjustable vacuum adsorption carrier device for wafer thinning according to claim 5, characterized in that: The pipeline assembly (600) also includes a gas valve A (603), which is disposed on the main pipeline (601).

7. The adjustable vacuum adsorption carrier device for wafer thinning according to claim 6, characterized in that: The pipe assembly (600) further includes an auxiliary pipe (604) and a valve B (605), the auxiliary pipe (604) being connected to the surface of the main pipe (601), and the valve B (605) being disposed on the auxiliary pipe (604).

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