An electrostatic chuck cleaning apparatus within a chamber

By designing an automated cleaning device on the electrostatic chuck, and utilizing the coordinated movement of the lifting column and the rotating brush, electrostatic chuck cleaning without downtime is achieved. This solves the problems of long equipment downtime and high safety risks in traditional cleaning methods, and improves cleaning efficiency and equipment utilization.

CN224443843UActive Publication Date: 2026-07-03GUANGZHOU ZENGXIN TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU ZENGXIN TECH CO LTD
Filing Date
2025-07-04
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In existing technologies, electrostatic chuck cleaning requires manual cleaning by stopping the machine and opening the cavity, which results in long downtime, loss of production capacity, high safety risks, and inconsistent cleaning effects, making it difficult to fully cover the edge area of ​​ESC.

Method used

An electrostatic suction cup cleaning device for an internal cavity was designed. It uses multiple lifting columns and lifting motors in conjunction with a rotating brush and a collection box to achieve automated cleaning. Through the precise positioning of the lifting columns and electrostatic suction cups, and the rotation and revolution of the rotating brush, the polymer is cleaned and collected simultaneously.

Benefits of technology

It reduces equipment downtime, improves equipment utilization, ensures consistent and safe cleaning results, avoids secondary contamination of polymers within the cavity, and guarantees the continuity and stability of semiconductor manufacturing processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a cavity electrostatic chuck cleaning device, comprising: a device body with multiple lifting columns and an annular motion track; a driving mechanism arranged inside the device body, comprising a lifting motor for controlling the lifting of the lifting columns; a track carrier embedded in the motion track; a cleaning assembly arranged on the track carrier, the cleaning assembly comprising a rotating brush and a collection box, a part of the bristles of the rotating brush being exposed to contact the surface of the electrostatic chuck, and the other part of the bristles being located in the collection box; and a track driving motor arranged above the track carrier and driving the track carrier to move. During work, the device is accurately positioned through the lifting columns. The edge area of the surface of the electrostatic chuck is cleaned through the combination of the rotation of the rotating brush and the revolution of the cleaning assembly along the track, and the bristles located in the collection box are matched with a V-shaped guide plate to collect the polymer into the collection box.
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Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and specifically to an electrostatic chuck cleaning device for a cavity. Background Technology

[0002] In semiconductor manufacturing processes, electrostatic chucks (ESCs) are critical wafer holding devices. As the RF power supply operates over time, polymer deposits gradually form at the edges of the ESC and near the silicon ring during plasma-assisted etching processes. These polymers adhere to the ESC surface and accumulate.

[0003] Traditional cleaning methods require downtime for preventative maintenance (PM), including opening the chamber for manual cleaning, followed by restarting the equipment. This maintenance cycle is time-consuming, and downtime directly leads to lost productivity, reducing wafer per hour (WPH) and increasing operating costs. Secondly, personnel need to enter the chamber for work, potentially exposing them to special gases, posing safety risks. Finally, frequent chamber opening can affect the stability of the internal environment.

[0004] Therefore, solutions need to be proposed for the problems in the relevant technologies. Utility Model Content

[0005] The purpose of this application is to provide an electrostatic chuck cleaning device for a cavity, so as to solve the problem that traditional methods require stopping the machine and opening the cavity for cleaning.

[0006] To address the aforementioned problems, this application provides an internal electrostatic chuck cleaning device, comprising: a device body having multiple lifting columns and an internal motion track; a drive mechanism disposed within the device body, the drive mechanism including multiple lifting motors, each lifting motor connected to one of the lifting columns to control the lifting movement of the lifting columns; a track carrier embedded within the motion track and capable of sliding along the motion track; a cleaning component disposed on the track carrier for cleaning the surface edge of the electrostatic chuck; and a track drive motor disposed above the track carrier for driving the track carrier to move along the motion track; wherein, in the working state, the electrostatic chuck is located below the device body.

[0007] In some possible implementations, the cleaning assembly includes a rotating brush and a collection box, a portion of the rotating brush being exposed for contact with the surface of the electrostatic chuck, and another portion of the rotating brush being located within the collection box, wherein the rotating brush and the collection box move synchronously along the motion track via the track carrier.

[0008] In some possible implementations, the cleaning device further includes: a first pressure sensor disposed at the connection between the lifting column and the device body; and a second pressure sensor disposed between the track carrier and the rotating brush.

[0009] In some possible implementations, the motion track is a ring structure, disposed in the peripheral area of ​​the device body to cover the surface edge of the electrostatic chuck.

[0010] In some possible implementations, the lifting column is distributed on the device body and located inside the motion track.

[0011] In some possible implementations, there are three lifting columns, evenly distributed on the device body, and the drive mechanism includes three lifting motors that control the three lifting columns respectively.

[0012] In some possible implementations, the track drive motor is connected to the track carrier via gear transmission, driving the track carrier to move along the motion track.

[0013] In some possible implementations, the cleaning assembly further includes a rotary motor disposed above the track carrier, the rotary motor being connected to the rotary brush for driving the rotary brush to perform self-rotation cleaning.

[0014] In some possible implementations, the collection box has an opening with two opposing guide plates arranged in a V-shape. The portion of the rotating brush inside the collection box contacts the guide plates, and an arc-shaped baffle is provided on the outer side of the exposed portion of the rotating brush.

[0015] In some possible implementations, the thickness of the device body is 15-20 mm.

[0016] The electrostatic chuck cleaning device provided in this embodiment utilizes multiple lifting columns and corresponding lifting motors within the device body to adjust its height and establish stable contact with the electrostatic chucks inside the cavity. This avoids the need for manual cleaning by stopping the machine and opening the cavity, as required in traditional methods. This reduces equipment downtime, minimizes the impact on production capacity, and improves equipment utilization. Simultaneously, the cleaning components are mounted on a track carrier, which is driven by a track drive motor to move along a circular track, thus moving the cleaning components. This effectively removes polymer deposits from the edges of the electrostatic chucks, covering areas difficult to reach manually. The combination of the rotating brush's self-rotation and the cleaning components' revolution achieves dual-motion cleaning, enabling both localized fine cleaning and comprehensive coverage of edge areas.

[0017] During the cleaning process, some bristles of the rotating brush are exposed and contact the surface of the electrostatic suction cup for cleaning, while the other part of the bristles are located inside the collection box, achieving simultaneous cleaning and collection. At the same time, the V-shaped guide plate at the opening of the collection box works in conjunction with the rotating brush to directly collect the cleaned polymer through friction, ensuring reliable polymer collection.

[0018] Through the above design, the rotating brush and the collection box work together to achieve integrated cleaning and collection, avoiding secondary pollution of the removed polymer in the cavity, and improving the system's working efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the device's transmission and positioning in this embodiment.

[0021] Figure 2 This is a schematic diagram of the structure of the electrostatic chuck cleaning device inside the cavity in one embodiment of this application.

[0022] Figure 3 This is a schematic diagram of the rotating brush and collection box in one embodiment of this application.

[0023] Figure 4 This is a schematic diagram of the working state of the electrostatic chuck cleaning device in the cavity of one embodiment of this application during cleaning operations. Detailed Implementation

[0024] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. It should be particularly noted that the following embodiments are only used to illustrate the embodiments of this application and do not limit the scope of the embodiments of this application. Similarly, the following embodiments are only some embodiments of the embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the embodiments of this application.

[0025] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0026] Furthermore, the directional terms mentioned in the embodiments of this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. In the various drawings, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the drawings are not drawn to scale. In addition, some related parts may not be shown in the drawings.

[0027] Existing electrostatic chuck (ESC) cleaning operations typically require stopping the equipment and opening the cavity. Operators then enter the cavity to manually remove polymer buildup from the edges of the ESC surface. After cleaning, the cavity is closed again, and the equipment is restarted to resume production. The researchers in this application found that this method suffers from problems such as long equipment downtime, high personnel safety risks, and inconsistent cleaning results. Specifically, frequent shutdowns and cavity openings during preventative maintenance directly lead to decreased equipment utilization and reduced hourly wafer throughput. Furthermore, personnel entering the cavity may be exposed to specific gas environments, posing health risks. In addition, manual cleaning methods struggle to ensure consistent cleaning intensity and coverage. Traditional cleaning methods, limited by manual operation, cannot fully cover the ESC edge area and contaminated areas near the silicon ring, thus affecting the stability of subsequent processes and product quality.

[0028] To address the aforementioned issues, this application provides an intracavity electrostatic chuck cleaning device (hereinafter referred to as the cleaning device), which integrates lifting and positioning, motion cleaning, and polymer collection into a single structure. Specifically, multiple lifting columns of the device body, in conjunction with a lifting motor, achieve precise positioning of the cleaning device within the cavity; a cleaning component mounted on a track carrier cleans the edges of the electrostatic chuck surface; a track drive motor enables the cleaning component to move along the track and fully cover the cleaning area; and a rotating brush and collection box within the cleaning component work together to achieve simultaneous cleaning and collection.

[0029] See Figure 1 The schematic diagram of the device conveying and positioning in this embodiment shows that the cleaning device 1 enters various process modules within the cavity via the conveying path of the robotic arm 510. The LLM module represents the vacuum atmosphere exchange module, and PM1 to PM4 represent different process modules. The cleaning device 1 is first conveyed to the LLM module, and then moves along a predetermined path (e.g., ...) via the conveying mechanism within the device. Figure 1 The solid arrow shown transmits the signal to the target PM module (e.g., as indicated by the solid arrow). Figure 1 Perform ESC cleaning on PM2.5 (as shown), and after the operation is completed, proceed along another predetermined path (such as PM2). Figure 1The dashed arrow (as shown) transmits the device from the target PM module and ultimately returns to the LLM module, completing the entire device movement process. This transmission path ensures that the cleaning device 1 can be accurately positioned to the electrostatic chuck within the target PM module, while avoiding any impact on other process modules.

[0030] Based on the above structure, the cleaning device 1 of this application embodiment can automatically remove the polymer 300 on the surface of the electrostatic chuck 100 without opening the cavity, reducing the impact of equipment downtime on production capacity and improving equipment utilization. The circular motion track covers the edge area of ​​the electrostatic chuck surface, providing technical assurance for the continuity and stability of semiconductor manufacturing processes.

[0031] The cleaning apparatus of this application will be further described below with reference to the accompanying drawings.

[0032] like Figures 1 to 4 As shown, this application embodiment provides an internal electrostatic chuck cleaning device 1, which includes: a device body 10 having multiple lifting columns 11 and a motion track 12 disposed inside; a drive mechanism disposed inside the device body 10, including: multiple lifting motors 21, each connected to the lifting columns 11 to control the lifting movement of the lifting columns 11; a track carrier 13, embedded in the motion track 12 and capable of sliding along the motion track 12; a cleaning component 40 disposed on the track carrier 13 for cleaning the surface edge of the electrostatic chuck 100; and a track drive motor 22 disposed above the track carrier 13 for driving the track carrier 13 to move along the motion track 12. The cleaning device 1 moves along a predetermined path (e.g., via a conveying mechanism within the device) through a conveying mechanism. Figure 1 The solid arrow shown transmits the signal to the target PM module (e.g., as indicated by the solid arrow). Figure 1 After PM2.5 is displayed, the device enters the working state and begins cleaning. During operation, the electrostatic chuck 100 is located below the device body 10. The cleaning device 1 can automatically remove the polymer 300 on the surface of the electrostatic chuck 100 without opening the cavity, avoiding equipment downtime losses caused by the need to stop the machine and open the cavity for manual cleaning in traditional methods. This cleaning device 1 is particularly suitable for cleaning polymer 300 deposits on the edge areas of the electrostatic chuck 100 surface and near the silicon ring 200.

[0033] Specifically, the device body 10 can be a circular structure. Considering that the cleaning device 1 needs to be grasped by the robotic arm 510 and enter the cavity along a fixed conveying path, in this embodiment, the thickness of the device body 10 is 15-20mm to ensure that the cleaning device 1 can pass smoothly through the conveying system without interference. The diameter of the device body 10 is set to 300mm, but its size is not limited to this, as long as it matches the size of the electrostatic chuck 100. The material of the device body 10 can be corrosion-resistant stainless steel or aluminum alloy to ensure stability and durability in the semiconductor manufacturing environment.

[0034] Furthermore, in this embodiment, the device body 10 has three lifting columns 11, evenly distributed along the circumference of the device body 10, forming a stable triangular support structure. In other embodiments, the number of lifting columns 11 can also be four or six, evenly distributed along the device body 10, forming a stable support structure. In this embodiment, each lifting column 11 has a diameter of 10mm and can extend 5mm from the bottom surface of the device body 10; the specific extension length can be adjusted according to different application requirements. After the lifting columns 11 are fully extended, they can ensure that the cleaning device 1 can be precisely adjusted in height inside the cavity and establish stable contact with the electrostatic suction cup 100 located below the device body 10.

[0035] Furthermore, the main body of the lifting column 11 can be made of high-strength stainless steel or aluminum alloy to ensure good positioning accuracy while bearing the weight of the cleaning device 1 itself. The bottom of the lifting column 11 is equipped with an elastic buffer structure (made of polytetrafluoroethylene, polyetheretherketone, etc.), which can provide appropriate buffering effect when in contact with the surface of the electrostatic chuck 100 to avoid impact or surface damage that may occur when in direct hard contact with the electrostatic chuck 100.

[0036] In this embodiment, the drive mechanism is located inside the device body 10. The drive mechanism includes three lifting motors 21, each controlling one of the three lifting columns 11. Each lifting motor 21 is an ultra-thin stepper motor with micro-step control function and a stepping accuracy of 0.01mm. Each lifting column 11 can be reliably positioned. When the three lifting motors 21 work in coordination, the cleaning device 1 can achieve overall lifting and micro-angle adjustment relative to the surface of the electrostatic suction cup 100. It should be noted that when the number of lifting columns 11 increases to four, six, or other numbers, the control method can be selected according to the accuracy requirements and cost considerations: an independent motor corresponding to the number of lifting columns 11 can be used to control each lifting column 11 separately to obtain higher control accuracy; or a single motor can be used in conjunction with a linkage mechanism to achieve coordinated control of multiple lifting columns 11, simplifying the structure while meeting accuracy requirements.

[0037] In this embodiment, the track drive motor 22 is fixedly installed inside the device body 10, located above the track carrier 13, and adopts a flat design. The track drive motor 22 has good control performance, which can ensure that the track carrier 13 runs stably along the motion track 12.

[0038] In this embodiment, the motion track 12 is an annular structure with a groove structure, and is set in the peripheral area of ​​the device body 10 to cover the surface edge of the electrostatic suction cup 100. Lifting columns 11 are distributed on the device body 10 and located inside the motion track 12. The track carrier 13 is embedded in the motion track 12 and can slide along it. The track carrier 13 includes an upper platform portion (not shown) and a downwardly extending mounting portion (not shown), which provides mounting space for the cleaning assembly 40. The side of the track carrier 13 has guide protrusions that cooperate with the groove of the motion track 12 to ensure stable movement of the track carrier 13 within the motion track 12. Furthermore, the output gear (not shown) of the track drive motor 22 extends into the motion track 12 and meshes with a rack (not shown) set on the track carrier 13, driving the track carrier 13 to move, causing the cleaning assembly 40 to move synchronously, enabling the cleaning assembly 40 to cover the surface edge area of ​​the electrostatic suction cup 100, thereby achieving comprehensive cleaning operations.

[0039] In this embodiment, the cleaning component 40 is mounted on the track carrier 13 and is used to clean the edge of the surface of the electrostatic chuck 100. The cleaning component 40 includes a rotating brush 41, a rotating motor 42 mounted on the track carrier 13, and a collection box 50. A portion of the bristles of the rotating brush 41 are exposed and in contact with the surface of the electrostatic chuck 100, while another portion of the bristles of the rotating brush 41 are located inside the collection box 50. The rotating brush 41 and the collection box 50 move synchronously along the motion track 12 via the track carrier 13.

[0040] The rotating brush 41 may include a brush body (not shown) and bristles disposed on the brush body, wherein a portion of the bristles 411 are exposed for contact with the surface of the electrostatic chuck 100 for cleaning, and another portion of the bristles 412 are located inside the collection box 50. The bristles of the rotating brush 41 are made of PVC material, which is relatively soft and evenly distributed to achieve the cleaning effect.

[0041] A rotary motor 42 is mounted on the upper surface of the track carrier 13, and its drive shaft passes through the track carrier 13 and is directly connected to the central shaft of the rotating brush 41 to drive the rotating brush 41 to perform self-rotation cleaning. The rotary motor 42 provides adjustable driving force to the rotating brush 41. The rotary motor 42 adopts a miniaturized design and can be a DC brushless motor, and the rotation speed of the rotating brush 41 can be adjusted according to different cleaning needs.

[0042] Dual-motion cleaning is achieved by combining the self-rotation cleaning of the rotating brush 41 with the revolution of the cleaning component 40 along the motion track 12. The exposed bristles 411 contact the surface of the electrostatic suction cup 100 for cleaning, while the bristles 412 located in the collection box 50 transfer the cleaned polymer 300 to the collection box 50 through frictional contact with the guide plate 52.

[0043] In this embodiment, an arc-shaped baffle 61 is provided on the outer side of the exposed portion of the rotating brush 41, and both ends of the arc-shaped baffle 61 are connected to the collection box 50. The arc-shaped baffle 61 does not directly contact the electrostatic suction cup 100 during the cleaning process, thus avoiding damage to the surface of the electrostatic suction cup 100, and at the same time preventing the polymer 300 from scattering to other locations due to centrifugal force during the cleaning process.

[0044] In this embodiment, the collection box 50 adopts an integrated structure with a volume of 50ml, and other dimensions are optimized according to the volume. To adapt to the overall spatial layout of the device, the collection box 50 adopts a flat design with a height of 5mm, and the volume requirements are met by reasonably configuring the bottom surface dimensions, which not only ensures the effective collection of polymers but also facilitates the operation of the device in the transport path. The collection box 50 is made of transparent polyetheretherketone (PEEK) material, which has chemical stability and temperature resistance, and can withstand various conditions in the semiconductor manufacturing environment.

[0045] The collection box 50 has an opening 51, through which another part of the rotating brush 412 is located inside the collection box 50. The opening 51 of the collection box 50 is provided with two opposing guide plates 52 arranged in a V-shape. The bristles 412 of the rotating brush 41 inside the collection box 50 contact the guide plates 52. When the rotating brush 41 rotates, the bristles 412 inside the collection box 50 rub against the V-shaped guide plates 52, and the cleaned polymer 300 is directly transferred into the collection box 50 through this frictional scraping principle. The converging structure of the V-shaped guide plates 52 provides a directional collection path for the polymer 300, allowing it to smoothly enter the bottom of the collection box 50.

[0046] Furthermore, the collection box 50 is connected to the track carrier 13 via a quick-connect mechanism. This mechanism employs a snap-fit ​​design, allowing for convenient installation and removal of the collection box 50, facilitating the cleaning of the polymer 300 after use and the replacement of the collection box 50. Through the coordinated operation of the collection box 50 and the rotating brush 41, an integrated process of simultaneous cleaning and collection is achieved, preventing secondary pollution from the polymer 300 generated during cleaning within the cavity.

[0047] In this embodiment, the cleaning device 1 also includes a first pressure sensor 31 disposed at the connection between the lifting column 11 and the device body 10, and a second pressure sensor 32 disposed between the track carrier 13 and the rotating brush 41.

[0048] The first pressure sensor 31 is a strain gauge type pressure sensor used to detect the contact pressure between the lifting column 11 and the surface of the electrostatic chuck 100. Furthermore, the first pressure sensor 31 has a ring structure and is located at the connection between the lifting column 11 and the device body 10. The center of the first pressure sensor 31 has an aperture to allow the drive shaft of the lifting motor 21 to pass through. Pressure detection points are also set around the first pressure sensor 31 to effectively detect the contact pressure between the lifting column 11 and the surface of the electrostatic chuck 100.

[0049] The second pressure sensor 32 is a thin piezoresistive pressure sensor used to detect the contact pressure between the rotating brush 41 and the electrostatic chuck 100. Furthermore, the second pressure sensor 32 has a ring structure and is positioned between the track carrier 13 and the rotating brush 41. The center of the second pressure sensor 32 has an aperture to allow the drive shaft of the rotating motor 42 to pass through. Pressure detection points are also set around the second pressure sensor 32 to effectively detect the contact pressure between the rotating brush 41 and the electrostatic chuck 100.

[0050] The first pressure sensor 31 detects the contact pressure between the lifting column 11 and the surface of the electrostatic suction cup 100. When a preset pressure value is detected, the lifting column 11 stops descending. The second pressure sensor 32 detects the contact pressure between the rotating brush 41 and the electrostatic suction cup 100, providing contact status feedback to the rotating brush 41 to ensure that the contact pressure remains within a suitable range during cleaning. These pressure sensors monitor the contact status and adjust the contact pressure accordingly, ensuring stable cleaning operations are completed without damaging the surface of the electrostatic suction cup 100.

[0051] In this embodiment, the cleaning device 1 is equipped with a power supply device 14, which provides power to the lifting motor 21, the track drive motor 22 and the rotary motor 42, realizing unified power supply management for each motor and ensuring the stable operation of the cleaning device 1.

[0052] See Figures 2-4 As shown, the cleaning device 1 in this embodiment operates in the following states during cleaning:

[0053] After the cleaning device 1 is transferred to the target PM module via a robotic arm, the lifting column 11 is first driven to descend by the lifting motor 21. When the first pressure sensor 31 detects that the lifting column 11 and the surface of the electrostatic suction cup 100 have reached a preset contact pressure, the lifting column 11 stops descending, thus achieving accurate positioning of the device body 10. Subsequently, the track drive motor 22 starts, driving the track carrier 13 to move along the motion track 12, which in turn drives the cleaning component 40 to move synchronously. At the same time, the rotary motor 42 drives the rotating brush 41 to rotate.

[0054] The cleaning component 40 moves in a circular motion according to the motion trajectory 111. The exposed part of the rotating brush 41 (i.e., the bristles 411) contacts the edge of the electrostatic suction cup 100 surface for cleaning. The second pressure sensor 32 continuously monitors the contact pressure and keeps it within an appropriate range. At the same time, the part of the rotating brush 41 located inside the collection box 50 (i.e., the bristles 412) rubs against the V-shaped guide plate 52, conveying the cleaned polymer 300 into the collection box 50 for synchronous collection. The arc-shaped baffle 61 prevents the polymer 300 from scattering due to centrifugal force, ensuring cleaning effectiveness.

[0055] After the cleaning operation is completed according to the preset time, each motor stops running, the lifting column 11 rises and the device body 10 is detached from the electrostatic suction cup 100, completing a complete automatic cleaning operation cycle.

[0056] Furthermore, the cleaning device 1 performs cleaning operations according to a preset working time. Once the working time is reached, the cleaning automatically stops and the device is removed from the target PM module, ensuring the controllability and standardization of the cleaning process.

[0057] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The features, structures, or characteristics described above can be combined in any suitable manner in one or more embodiments.

[0058] It is understood that those skilled in the art, guided by the above embodiments, can combine various implementation methods in the above embodiments to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electrostatic chuck cleaning apparatus within a chamber, comprising: include: The main body of the device has multiple lifting columns and an internal motion track; A drive mechanism is located inside the main body of the device. The drive mechanism includes multiple lifting motors, each of which is connected to the lifting column to control the lifting movement of the lifting column. A track carrier, which is embedded in the motion track and can slide along the motion track; A cleaning component, disposed on the track carrier, is used to clean the edge of the electrostatic chuck surface; A track drive motor is disposed above the track carrier and is used to drive the track carrier to move along the motion track; In operation, the electrostatic chuck is located below the main body of the device.

2. The in-cavity electrostatic chuck cleaning apparatus of claim 1, wherein, The cleaning assembly includes a rotating brush and a collection box. A portion of the rotating brush is exposed for contact with the surface of the electrostatic suction cup, and another portion of the rotating brush is located inside the collection box. The rotating brush and the collection box move synchronously along the motion track via the track carrier.

3. The in-cavity electrostatic chuck cleaning apparatus of claim 2, wherein, The cleaning device also includes: A first pressure sensor is installed at the connection between the lifting column and the device body; A second pressure sensor is disposed between the track carrier and the rotating brush.

4. The intracavity electrostatic chuck cleaning device as described in claim 1, characterized in that, The motion track is a ring structure and is set in the peripheral area of ​​the device body to cover the surface edge of the electrostatic chuck.

5. The in-cavity electrostatic chuck cleaning apparatus of claim 4, wherein, The lifting columns are distributed on the main body of the device and located inside the motion track.

6. The in-cavity electrostatic chuck cleaning apparatus of claim 5, wherein, There are three lifting columns, evenly distributed on the main body of the device, and the drive mechanism includes three lifting motors that control the three lifting columns respectively.

7. The in-cavity electrostatic chuck cleaning apparatus of claim 1, wherein, The track drive motor is connected to the track carrier via gear transmission, driving the track carrier to move along the motion track.

8. The in-cavity electrostatic chuck cleaning apparatus of claim 2, wherein, The cleaning assembly also includes a rotary motor disposed above the track carrier, the rotary motor being connected to the rotary brush for driving the rotary brush to perform self-rotation cleaning.

9. The in-cavity electrostatic chuck cleaning apparatus of claim 2, wherein, The collection box has an opening with two opposing guide plates arranged in a V-shape. The portion of the rotating brush inside the collection box contacts the guide plates, and an arc-shaped baffle is provided on the outer side of the exposed portion of the rotating brush.

10. The in-cavity electrostatic chuck cleaning apparatus of claim 1, wherein, The thickness of the device body is 15-20mm.