A cleaning device for the front and back sides of a wafer.

Abstract

This utility model discloses a cleaning device for the front and back sides of a wafer, relating to the field of wafer cleaning technology. It includes a carrier plate body and a clamping assembly. The outer side of the carrier plate body has a storage groove, and a fixing bracket is symmetrically arranged on the inner side of one end of the storage groove. One end of the fixing bracket has a positioning groove. Supports are symmetrically arranged on both sides of the inner side of the storage groove. This wafer cleaning device, through the arrangement of multiple storage grooves, allows for efficient cleaning during the process. After the product is fixed in the storage groove using the clamping assembly, the lower spindle sleeve is simply installed on the turntable output shaft. When the carrier plate body rotates, the surrounding cleaning mechanisms can perform washing, surface ion removal, two-fluid cleaning, megasonic cleaning, and nitrogen drying processes. After cleaning, the entire carrier plate body is manually flipped, connecting the upper spindle sleeve to the turntable output shaft, enabling rapid flipping of all wafers and improving the efficiency of the flipping cleaning process.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, specifically a cleaning device for the front and back sides of a wafer. Background Technology

[0002] Glass wafers are thin sheets made from glass materials, usually quartz, alkali-free glass, or glass-silicon composites. They are used as substrate materials in the semiconductor and microelectronics fields to support microelectronic or optoelectronic circuits. During wafer processing, the wafers need to be cleaned.

[0003] Currently, when cleaning glass wafers, the usual method is to use a wafer robot or manual handling to clean one wafer at a time, which is inefficient. At the same time, the use of a platform for adsorption during the double-sided cleaning and flipping process makes it easy for wafers to fall off, and the overall mechanism design is relatively complex. If a through-type cleaning method with horizontal rollers is used, the efficiency is higher, but the cleaning cleanliness is lower, and the equipment occupies a large space. Utility Model Content

[0004] The purpose of this invention is to provide a cleaning device for the front and back sides of a wafer, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a cleaning device for the front and back sides of a wafer, comprising a tray body and a clamping assembly. The outer side of the tray body is provided with a storage groove, and a fixed bracket is symmetrically arranged on the inner side of one end of the storage groove. A positioning groove is opened at one end of the fixed bracket. Supports are symmetrically arranged on both sides inside the storage groove. The clamping assembly is located at the other end of the storage groove and includes a movable bracket, a slot, a limiting groove, a compression spring, a lever, and a limiting bolt. A slot is opened at one end of the movable bracket, and a limiting groove is opened inside the movable bracket. A compression spring is arranged inside the limiting groove, and a lever is fixed on the outer side of the other end of the movable bracket. Limiting bolts are slidably connected to both sides of the movable bracket.

[0006] Furthermore, the front view of the support is n-shaped, and the side view of the support is z-shaped.

[0007] Furthermore, the storage slot is rectangular, and the center line of the storage slot coincides with the center line of the movable card seat.

[0008] Furthermore, the central cross-section of the movable card holder is U-shaped, and the movable card holder is slidably connected to the main body of the carrier plate.

[0009] Furthermore, the limiting groove is cylindrical, and the inner diameter of the limiting groove is equal to the outer diameter of the compression spring, and the compression spring abuts against the main body of the carrier plate.

[0010] Furthermore, the storage slots are equidistantly distributed circumferentially around the outer side of the tray body, and the tray body is threadedly connected to the limiting bolts.

[0011] Furthermore, an avoidance groove is provided on the outer side of the tray body, and the avoidance groove is connected to the storage groove.

[0012] Furthermore, an upper spindle sleeve is installed in the center of the top surface of the carrier body, and a lower spindle sleeve is fixed in the center of the bottom of the carrier body.

[0013] This invention provides a cleaning device for the front and back sides of a wafer, which has the following advantages:

[0014] 1. This utility model, through the setting of multiple storage slots, allows for the following cleaning processes: after the product is fixed in the storage slot using the clamping assembly, the lower spindle sleeve is simply installed on the turntable output shaft. When the tray body rotates, the surrounding cleaning mechanism can perform washing, surface ion removal, two-fluid cleaning, mega-sound cleaning, and nitrogen drying processes. After cleaning, the entire tray body can be manually flipped over to connect the upper spindle sleeve with the turntable output shaft, enabling rapid flipping of all wafers. This improves the efficiency of flipping and cleaning, avoids backside contamination, enhances cleanliness, and prevents workers from touching the wafer's central pattern. Simultaneously, the next tray body can be loaded during the cleaning process, thus making full use of cleaning time and improving the company's production efficiency.

[0015] 2. This utility model, through the setting of the clamping component, allows for quick clamping of the wafer by pushing open the movable holder with a lever, placing the wafer on the support in the storage slot, and then releasing the lever. The compression spring in the limiting slot will then push the movable holder under the limiting of the carrier body, pushing the other end of the wafer into the positioning slot on the storage slot, thereby quickly clamping the wafer. Similarly, during disassembly, simply moving the lever will quickly release the wafer from the restriction, and the clearance slot facilitates easy removal from the side of the glass wafer for unloading. Afterwards, when the compression spring pushes the movable holder back to its original position, the limiting bolt will limit it, preventing the movable holder from falling off directly. Attached Figure Description

[0016] Figure 1 This is a frontal perspective three-dimensional structural diagram of a cleaning device for the front and back sides of a wafer according to the present invention;

[0017] Figure 2 This is a schematic cross-sectional view of the clamping assembly of a cleaning device for the front and back sides of a wafer according to the present invention.

[0018] Figure 3 This is a bottom-view perspective view of a cleaning device for the front and back sides of a wafer according to the present invention.

[0019] In the diagram: 1. Carrier body; 2. Storage slot; 3. Fixed bracket; 4. Positioning slot; 5. Support; 6. Clamping assembly; 601. Movable bracket; 602. Slot; 603. Limiting slot; 604. Compression spring; 605. Pulley; 606. Limiting bolt; 7. Clearance slot; 8. Upper spindle sleeve; 9. Lower spindle sleeve. Detailed Implementation

[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0021] like Figures 1 to 2 As shown, a cleaning device for the front and back sides of a wafer includes a tray body 1 and a clamping assembly 6. A storage groove 2 is provided on the outer side of the tray body 1, and a fixing bracket 3 is symmetrically arranged on the inner side of one end of the storage groove 2. A positioning groove 4 is provided at one end of the fixing bracket 3. Supports 5 are symmetrically arranged on both sides inside the storage groove 2. The front view cross-section of the support 5 is n-shaped, and the side view cross-section of the support 5 is z-shaped. When the wafer is placed in the storage groove 2, the support 5 can support the product. The clamping assembly 6 is disposed on the storage groove 1. At the other end of the storage slot 2, the clamping assembly 6 includes a movable retainer 601, a slot 602, a limiting groove 603, a compression spring 604, a lever 605, and a limiting bolt 606. One end of the movable retainer 601 has a slot 602, and the interior of the movable retainer 601 has a limiting groove 603. The storage slot 2 is rectangular, and its centerline coincides with the centerline of the movable retainer 601. The middle section of the movable retainer 601 is U-shaped, and the movable retainer 601 slides against the tray body 1. The tray body 1 can limit the movable card holder 601. A compression spring 604 is provided inside the limiting groove 603, and a lever 605 is fixed to the outer side of the other end of the movable card holder 601. The lever 605 facilitates pushing the movable card holder 601 open. The limiting groove 603 is cylindrical, and the inner diameter of the limiting groove 603 is equal to the outer diameter of the compression spring 604. The compression spring 604 abuts against the tray body 1, and the compression spring 604 in the limiting groove 603 will be pushed down by the limiting position of the tray body 1. The movable retainer 601 pushes the other end of the wafer into the positioning groove 4 on the storage slot 2, thereby quickly clamping the wafer. During disassembly, the two sides of the movable retainer 601 are slidably connected with limit bolts 606. The storage slot 2 is equidistantly distributed circumferentially about the outer side of the tray body 1, and the tray body 1 is threadedly connected to the limit bolts 606. After unloading, when the compression spring 604 pushes the movable retainer 601 to reset, the limit bolts 606 will limit it to prevent the movable retainer 601 from falling off directly.

[0022] like Figure 1 and Figure 3As shown, a clearance groove 7 is provided on the outer side of the tray body 1, and the clearance groove 7 is connected to the placement groove 2. The clearance groove 7 facilitates the removal and unloading operation from the side of the glass wafer. An upper spindle sleeve 8 is installed in the middle of the top surface of the tray body 1, and a lower spindle sleeve 9 is fixed in the center of the bottom of the tray body 1. The lower spindle sleeve 9 is installed on the output shaft of the turntable. When the output motor of the turntable drives the tray body 1 to rotate, the surrounding cleaning mechanism can perform washing, surface ion removal, two-fluid cleaning, megohmmic cleaning, and nitrogen drying processes. Since this type of cleaning mechanism is a commonly used cleaning structure in existing cleaning devices, and this application is not an improvement on this part of the cleaning device, the specific structure of the cleaning mechanism will not be described in detail. After cleaning, the entire tray body 1 is manually flipped so that the upper spindle sleeve 8 is connected to the output shaft of the turntable, which can quickly flip all the wafers, thereby improving the efficiency of flipping cleaning.

[0023] In summary, the cleaning device for both sides of the wafer, when used, first according to... Figure 1 , Figure 2 and Figure 3 The structure shown first involves pushing open the movable retainer 601 using the lever 605, then placing the wafer on the support 5 in the storage slot 2 and releasing it. The compression spring 604 in the limiting slot 603 will then push the movable retainer 601 under the limiting of the tray body 1, pushing the other end of the wafer into the positioning slot 4 on the storage slot 2, thereby quickly clamping the wafer. Next, the lower spindle sleeve 9 is installed on the turntable output shaft. When the tray body 1 rotates, the surrounding cleaning mechanism can perform washing, surface ion removal, two-fluid cleaning, mega-sound cleaning, and nitrogen drying processes. After cleaning, the entire tray body 1 is manually removed. By flipping the upper spindle sleeve 8 to connect with the turntable output shaft, all wafers can be quickly flipped over. The cleaning operation described above can then be repeated. During the cleaning process, the next carrier body 1 can be loaded, making full use of the cleaning time. Finally, after cleaning, the carrier body 1 is replaced. Similarly, during disassembly, simply moving the lever 605 can quickly release the wafer from its restraints, and the wafer can be easily removed from the side of the glass wafer through the clearance groove 7 for unloading. Afterwards, when the compression spring 604 pushes the movable bracket 601 to reset, the limit bolt 606 will limit it to prevent the movable bracket 601 from falling off directly.

[0024] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A device for cleaning the front and back sides of a wafer, comprising a carrier disc body (1) and a clamping assembly (6), characterized in that, The outer side of the tray body (1) is provided with a storage slot (2), and a fixed bracket (3) is symmetrically arranged on the inner side of one end of the storage slot (2), and a positioning groove (4) is opened on one end of the fixed bracket (3). The two sides of the inside of the storage slot (2) are symmetrically arranged with support seats (5). The clamping assembly (6) is located at the other end of the storage slot (2), and the clamping assembly (6) includes a movable bracket (601), a slot (602), a limiting groove (603), and a compression spring. The movable card seat (601) includes a spring (604), a lever (605), and a limiting bolt (606). One end of the movable card seat (601) is provided with a slot (602), and the interior of the movable card seat (601) is provided with a limiting groove (603). The limiting groove (603) is provided with a compression spring (604), and the other end of the movable card seat (601) is fixed with a lever (605). The two sides of the movable card seat (601) are slidably connected with limiting bolts (606).

2. The wafer front and back surface cleaning apparatus according to claim 1, wherein The front view of the support (5) is n-shaped, and the side view of the support (5) is z-shaped.

3. The wafer front and back surface cleaning apparatus according to claim 1, wherein The storage slot (2) is rectangular, and the center line of the storage slot (2) coincides with the center line of the movable card seat (601).

4. The wafer front and back surface cleaning apparatus according to claim 1, wherein The movable card holder (601) has a U-shaped cross section in the middle, and the movable card holder (601) is slidably connected to the tray body (1).

5. The cleaning apparatus for the front and back sides of a wafer according to claim 1, characterized in that, The limiting groove (603) is cylindrical, and the inner diameter of the limiting groove (603) is equal to the outer diameter of the compression spring (604), and the compression spring (604) abuts against the carrier plate body (1).

6. The wafer front and back surface cleaning apparatus according to claim 1, wherein The storage slots (2) are equidistantly distributed around the outer side of the tray body (1), and the tray body (1) is threadedly connected to the limiting bolts (606).

7. The wafer front and back surface cleaning apparatus of claim 1, wherein The outer side of the tray body (1) is provided with a clearance groove (7), and the clearance groove (7) is connected to the storage groove (2).

8. The wafer front and back surface cleaning apparatus of claim 1, wherein The upper spindle sleeve (8) is installed in the middle of the top surface of the carrier body (1), and the lower spindle sleeve (9) is fixed in the center of the bottom of the carrier body (1).

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