Processing mechanism and processing equipment

Abstract

This application relates to a processing mechanism and processing equipment. The processing mechanism is used to adjust the height of the processing head to ensure that the processing head and the workpiece to be processed maintain a vertical distance. Specifically, it includes: a processing head; and a follower assembly located on one side of the processing head, including a follower structure body, a cooling unit, and a nozzle. The cooling unit is connected to the follower structure body and the nozzle. The end of the follower structure body near the nozzle is a long, straight cylinder. The above-mentioned processing mechanism can perform cutting processing at different positions of the workpiece to be processed. At the same time, in conjunction with the cooling unit in the follower assembly, it absorbs the heat generated by the processing head from different positions to cool the processing head, reducing the overall operating temperature of the processing mechanism. This ensures the feasibility of processing workpieces with limited processing space, while also improving the processing stability. Furthermore, it satisfies the follower adjustment function of the processing mechanism for the processing head, effectively ensuring cutting quality and efficiency.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a processing mechanism and processing equipment. Background Technology

[0002] With the continuous development of laser processing technology and the increasing variety of laser product applications, the operational requirements for each stage of the laser processing process are becoming increasingly stringent.

[0003] As the thickness of sheet metal and the cutting dimensions of materials such as structural steel vary greatly, the requirements for the structural space of the processing head are strict. There are problems that standard processing heads cannot meet the material processing needs due to size limitations, or even cannot work properly. Utility Model Content

[0004] Therefore, it is necessary to provide a processing mechanism and processing equipment to address the aforementioned technical problems.

[0005] A processing mechanism, comprising:

[0006] Processing head;

[0007] The follower assembly located on one side of the processing head includes a follower structure body, a cooling unit and a nozzle. The cooling unit is connected to the follower structure body and the nozzle. The end of the follower structure body near the nozzle is a long straight cylinder.

[0008] In one embodiment, the cooling unit includes a cooling chamber and a cooling fluid connector, the cooling fluid connector being connected to a cooling fluid source, one end of the cooling chamber being connected to the cooling fluid connector, and the other end of the cooling chamber being connected to the nozzle.

[0009] In one embodiment, a sealing component is provided on the outer side of the main body of the follower structure, and the sealing component and the cooling cavity form a sealed space for the cooling fluid.

[0010] In one embodiment, a cooling connection component is provided at one end of the cooling cavity, the cooling connection component is connected to the nozzle, and a fastening component is provided around the side wall of the cooling connection component.

[0011] In one embodiment, the cooling connection component is provided with a plurality of cooling through holes, which are spaced apart and can discharge cooling fluid.

[0012] In one embodiment, the cooling connection component is a ceramic ring, which includes an upper ceramic body and a lower ceramic body, both of which are arranged around the central axis of the processing mechanism.

[0013] In one embodiment, the processing mechanism further includes:

[0014] A receiving component is disposed between the processing head and the follower component, which can drive the processing head and the follower component to move synchronously.

[0015] In one embodiment, the cooling unit includes a cooling cavity and a cooling fluid connector, the receiving assembly includes a connector mounting base and a mounting plate, the connector mounting base is disposed on the mounting plate, the cooling fluid connector is disposed on the side wall of the connector mounting base, and the cooling cavity is placed inside the follower structure body.

[0016] In one embodiment, the mounting plate includes a plurality of anti-collision limiting components, which are spaced apart, and any one of the anti-collision limiting components can be securely connected to the bottom of the processing head.

[0017] A processing device, comprising:

[0018] As described above, this is a processing mechanism.

[0019] The technical effects of the embodiments provided in this application are as follows:

[0020] In the aforementioned processing mechanism, during the operation of the processing head, the follower component located on one side of the processing head synchronously approaches the workpiece to be processed (such as steel profiles with large thickness and large variations in cutting dimensions). The main body of the follower structure in the follower component is long and straight cylindrical at the end near the nozzle, which can realize cutting processing at different positions of the workpiece to be processed. At the same time, in conjunction with the cooling unit in the follower component, it absorbs the heat generated by the processing head from different positions to cool down the processing head, reducing the overall operating temperature of the processing mechanism. This ensures that the processing mechanism is not affected by high temperature and can operate normally. This ensures the feasibility of processing workpieces with limited processing space, while also improving the processing stability. In addition, it satisfies the follower adjustment function of the processing mechanism to the processing head, effectively ensuring cutting quality and efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the processing mechanism in one embodiment;

[0023] Figure 2 This is a schematic diagram of the processing mechanism in one embodiment;

[0024] Figure 3 This is a partial structural diagram of the processing mechanism in one embodiment. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] Figure 1 and Figure 2 This is a schematic diagram of the processing mechanism in one embodiment.

[0030] In this embodiment, as Figure 1 and Figure 2 As shown, the processing mechanism includes a processing head 10, a follower component 20, and a receiving component 30.

[0031] The follower assembly 20 located on one side of the processing head 10 includes a follower structure body 210, a cooling unit 220 and a nozzle 230. The cooling unit 220 is connected to the follower structure body 210 and the nozzle 230. The end of the follower structure body 210 near the nozzle 230 is a long straight cylinder.

[0032] The follower component 20 can be connected to the processing head 10 via the receiving component 30, and can sense and adjust the height of the processing head 10 to ensure that the processing head 10 and the workpiece to be processed maintain a vertical distance. The follower structure body 210 can be a functional structure connected to the cooling unit 220 and the nozzle 230, and can provide support for the cooling unit 220 and the nozzle 230. The cooling unit 220 can be a functional structure connected to the cooling fluid source and the nozzle 230, and can receive the cooling fluid output from the cooling fluid source and transmit the cooling fluid close to the nozzle 230 to absorb the heat generated by the nozzle 230. The nozzle 230 can be a functional structure that can receive the laser beam output from the processing head 10 and apply the laser beam to the workpiece to be processed.

[0033] like Figure 3 As shown, the cooling unit 220 includes a cooling chamber 2210 and a cooling fluid connector 2220. The cooling fluid connector 2220 is connected to a cooling fluid source. One end of the cooling chamber 2210 is connected to the cooling fluid connector 2220, and the other end of the cooling chamber 2210 is connected to a nozzle 230.

[0034] A sealing component 240 is provided on the outer side of the main body 210 of the follower structure. The sealing component 240 and the cooling chamber 2210 form a sealed space for the cooling fluid, thereby improving the rapid and efficient transmission of the cooling fluid to the nozzle 230, and thus ensuring the cooling efficiency of the nozzle 230.

[0035] Alternatively, the sealing component 240 may be a sealing cover.

[0036] A cooling connection component 250 is provided at one end of the cooling chamber 2210. The cooling connection component 250 is connected to the nozzle 230, and a fastening component 260 is provided around the side wall of the cooling connection component 250. The cooling connection component 250 is provided with multiple cooling through holes, which are spaced apart and can discharge cooling fluid.

[0037] The cooling connection component 250 is a ceramic ring, which includes an upper ceramic body and a lower ceramic body. Both the upper and lower ceramic bodies are arranged around the central axis of the processing mechanism.

[0038] The ceramic ring can be an integrated design of an upper ceramic body and a lower ceramic body, with the upper and lower ceramic bodies respectively surrounding the central axis of the processing mechanism at different heights between the nozzle 230 and the cooling unit 220, forming an insulating ceramic rotating structure. The upper ceramic body can be closer to the cooling unit 220. The lower ceramic body can be closer to the nozzle 230. The fastening component 260 can be a functional structure capable of locking the ceramic ring and surrounding it around the central axis of the processing mechanism.

[0039] It should be noted that by increasing the size of the ceramic ring and the spacing between the upper and lower ceramic bodies, the installation contact area of ​​the ceramic ring is increased, effectively mitigating the risk of electrical conductivity between the upper and lower layers of the ceramic ring caused by the accumulation of iron slag at the ceramic ring due to long-term cutting. Furthermore, by increasing the diameter of the ceramic ring locking ring, the locking strength is enhanced, thereby improving the heat dissipation efficiency of the processing mechanism and enhancing its operational stability.

[0040] Optionally, the fastening component 260 can be a locking ring. The cooling fluid can be a cooling liquid or a cooling gas, depending on the cooling requirements and usage scenario. Generally, cooling liquids have a better cooling effect than cooling gases.

[0041] The cooling connection component 250 enables the cooling chamber 2210 and the nozzle 230 to be connected, ensuring that heat generated at different locations on the nozzle 230 is quickly transferred to the cooling chamber 2210, which carries the cooling fluid, thus guaranteeing the cooling effect of the cooling chamber 2210 on the nozzle 230. Furthermore, multiple cooling through-holes allow for rapid flow of the cooling fluid, efficiently dissipating the heat generated by the nozzle 230 and further ensuring stable and efficient operation of the nozzle 230 during processing.

[0042] The receiving component 30 is disposed between the processing head 10 and the follower component 20, and can drive the processing head 10 and the follower component 20 to move synchronously.

[0043] The receiving component 30 can be a functional component connected to the processing head 10 and the follower component 20, which can provide support and load-bearing function for the processing head 10 and the follower component 20 and fasten the processing head 10 and the follower component 20.

[0044] like Figure 3 As shown, the receiving component 30 includes a connector mounting base 310 and a mounting plate 320. The connector mounting base 310 is disposed on the mounting plate 320, the cooling fluid connector 2220 is disposed on the side wall of the connector mounting base 310, and the cooling cavity 2210 is built into the follower structure body 210. The mounting plate 320 includes multiple anti-collision limiting components 330, which are spaced apart, and any one of the anti-collision limiting components 330 can be securely connected to the bottom of the processing head 10.

[0045] Optionally, the anti-collision limiting component 330 may be an anti-collision limiting screw.

[0046] During the operation of the processing head 10, the follower component 20 located on one side of the processing head 10 approaches the workpiece to be processed (such as a thick steel section with large cutting size variation) synchronously with the processing head 10. The follower structure body 210 in the follower component 20 has a long straight cylindrical shape at the end near the nozzle 230, which can realize cutting processing at different positions of the workpiece to be processed. At the same time, in conjunction with the cooling unit 220 in the follower component 20, external cooling fluid is introduced through the cooling fluid connector 2220 and the cooling fluid flows through the cooling cavity 2210 set in the follower structure body 210. The cooling fluid absorbs the heat generated by the nozzle 230 from different positions, thereby reducing the overall working temperature of the nozzle 230 and the processing mechanism, and thus ensuring that the nozzle 230 and the processing mechanism are not affected by high temperature and can ensure normal and stable operation.

[0047] As described above, by reducing the diameter of the main body 210 of the follower structure, the structure becomes more compact, facilitating cutting operations of the processing head 10 in complex environments. The cooling unit 220 cools the cutting nozzle during high-temperature cutting operations, preventing excessive nozzle temperature from reducing cutting efficiency. Furthermore, the addition of the anti-collision limiting component 330 effectively mitigates the problem of increased costs caused by loosening or damage to the cutting head due to collisions in complex working conditions. In short, by optimizing the structure mechanically to adapt to different working conditions, rapidly cooling the cutting nozzle, and preventing collisions with the cutting head, the traditional standard processing head 10 method is unable to cut in complex cutting scenarios such as structural steel due to limited processing space, effectively improving the environmental adaptability of the processing mechanism.

[0048] This application also provides a laser processing head, which includes the processing mechanism as described in the above embodiments.

[0049] This application also provides a processing apparatus, which includes the processing mechanism as described in the above embodiments.

[0050] The division of the various modules in the above processing mechanism is only for illustrative purposes. In other embodiments, the processing mechanism can be divided into different modules as needed to complete all or part of the functions of the above processing mechanism.

[0051] The processing mechanism and equipment provided in the above embodiments, during the operation of the processing head, have a follower component located on one side of the processing head synchronously approaching the workpiece to be processed (such as a thick steel section with large cutting size variations). The follower structure in the follower component has a long, straight cylindrical shape at the end near the nozzle, which can realize cutting processing at different positions of the workpiece to be processed. At the same time, in conjunction with the cooling unit in the follower component, it absorbs the heat generated by the processing head from different positions to cool down the processing head, reducing the overall working temperature of the processing mechanism. This ensures that the processing mechanism is not affected by high temperature and can work normally, thus ensuring the feasibility of processing workpieces with limited processing space, improving the processing stability of the processing process, and satisfying the follower adjustment function of the processing mechanism to the processing head. This effectively ensures cutting quality and efficiency, and has important economic value and practical application value.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A processing mechanism, characterized in that, include: Processing head; The follower assembly located on one side of the processing head includes a follower structure body, a cooling unit and a nozzle. The cooling unit is connected to the follower structure body and the nozzle. The end of the follower structure body near the nozzle is a long straight cylinder.

2. The processing mechanism of claim 1, wherein, The cooling unit includes a cooling chamber and a cooling fluid connector. The cooling fluid connector is connected to a cooling fluid source. One end of the cooling chamber is connected to the cooling fluid connector, and the other end of the cooling chamber is connected to the nozzle.

3. The processing mechanism of claim 2, wherein, A sealing component is provided on the outer side of the main body of the follower structure, and the sealing component and the cooling cavity form a sealed space for the cooling fluid.

4. The machine according to claim 2, characterized in that, A cooling connection component is provided at one end of the cooling cavity, the cooling connection component is connected to the nozzle, and a fastening component is provided around the side wall of the cooling connection component.

5. The machine according to claim 4, characterized in that, The cooling connection component is provided with multiple cooling through holes, which are spaced apart and can discharge cooling fluid.

6. The machine according to claim 4, characterized in that, The cooling connection component is a ceramic ring, which includes an upper ceramic body and a lower ceramic body, both of which are arranged around the central axis of the processing mechanism.

7. The machine according to claim 1, characterized in that, The processing mechanism also includes: A receiving component is disposed between the processing head and the follower component, which can drive the processing head and the follower component to move synchronously.

8. The machine according to claim 7, characterized in that, The cooling unit includes a cooling cavity and a cooling fluid connector. The receiving component includes a connector mounting base and a mounting plate. The connector mounting base is disposed on the mounting plate, and the cooling fluid connector is disposed on the side wall of the connector mounting base. The cooling cavity is placed inside the follower structure body.

9. The machine according to claim 8, characterized in that, The mounting plate includes multiple anti-collision limiting components, which are spaced apart, and any one of the anti-collision limiting components can be securely connected to the bottom of the processing head.

10. A processing apparatus characterized by comprising: include: The processing mechanism as described in any one of claims 1 to 9.

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