A silicon wafer screen printing device and silicon wafer processing equipment

Abstract

This application provides a silicon wafer screen printing device and a silicon wafer processing equipment. The silicon wafer screen printing device includes: a conveying unit, including a conveying drive module and a carrier mechanism, wherein the conveying drive module is connected to the carrier mechanism to drive the carrier mechanism to move, and a silicon wafer receiving position and a screen printing position are sequentially arranged along the movement trajectory of the carrier mechanism; and a screen printing unit, including a screen printing drive module and a screen printing assembly, wherein the screen printing drive module is connected to the screen printing assembly so that when the carrier mechanism moves to the screen printing position, the screen printing drive module drives the screen printing assembly to complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism. With this setting, the screen printing assembly can directly complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism. Compared with the prior art, there is no need to transfer the silicon wafer to be processed, saving a transfer process and improving screen printing efficiency.

Description

Technical Field

[0001] This application relates to the field of silicon wafer processing technology, specifically to a silicon wafer screen printing device and silicon wafer processing equipment. Background Technology

[0002] In the silicon wafer processing, screen printing is an important process that involves using a squeegee to transfer patterns from a stencil onto the silicon wafer. For example, it is used to screen print circuit patterns onto the silicon wafer to form fine circuits.

[0003] In existing technologies, silicon wafers are typically received first via a conveyor platform, and after the wafers are conveyed to a predetermined position, they are transferred to a screen printing device, where the screen printing operation is then completed. This method results in low screen printing efficiency because the wafers must first be transferred to the screen printing device before the screen printing operation can be performed. Utility Model Content

[0004] This application mainly provides a silicon wafer screen printing device and silicon wafer processing equipment, which can improve screen printing efficiency.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a silicon wafer screen printing device, the silicon wafer screen printing device comprising: a conveying unit, including a conveying drive module and a carrier mechanism, the conveying drive module being connected to the carrier mechanism to drive the carrier mechanism to move, and a silicon wafer receiving position and a screen printing position being sequentially arranged along the movement trajectory of the carrier mechanism; and a screen printing unit, including a screen printing drive module and a screen printing assembly, the screen printing drive module being connected to the screen printing assembly, such that when the carrier mechanism moves to the screen printing position, the screen printing drive module drives the screen printing assembly to complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism.

[0006] In one specific embodiment, the screen printing drive module includes a first screen printing drive mechanism and a second screen printing drive mechanism. The second screen printing drive mechanism is connected to the first screen printing drive mechanism and the screen printing component, respectively, so that the first screen printing drive mechanism drives the screen printing component to move from a first initial position to the screen printing position, and the second screen printing drive mechanism drives the screen printing component to complete the screen printing operation on the silicon wafer to be processed at the screen printing position.

[0007] In one specific embodiment, the conveying drive module includes a first conveying drive mechanism, which is connected to the carrier mechanism to drive the carrier mechanism to move from the silicon wafer receiving position to the silkscreen position in a first direction. The first silkscreen drive mechanism is used to drive the silkscreen component to move from the first initial position to the silkscreen position in a third direction.

[0008] In one specific embodiment, the conveying drive module further includes a second conveying drive mechanism, which is connected to the first conveying drive mechanism and the carrier mechanism respectively. The second conveying drive mechanism is used to drive the carrier mechanism to move from the screen printing position to a preset screen printing position in a second direction. The first screen printing drive mechanism is used to drive the screen printing component to move from the first initial position to the preset screen printing position in a third direction. The second screen printing drive mechanism is used to drive the screen printing component to complete the screen printing operation on the silicon wafer to be processed at the preset screen printing position.

[0009] In one specific embodiment, the conveying drive module further includes a third conveying drive mechanism, which is connected to the second conveying drive mechanism and the carrying mechanism respectively. The third conveying drive mechanism is used to drive the carrying mechanism to rotate to a preset screen printing angle.

[0010] In one specific embodiment, any two of the first direction, the second direction, and the third direction are perpendicular to each other.

[0011] In one specific embodiment, the screen printing assembly includes a screen printing main frame, a squeegee, and a screen plate. The screen printing main frame is connected to the first screen printing drive mechanism, the screen plate is mounted on the screen printing main frame, and the squeegee is mounted on the second screen printing drive mechanism.

[0012] In one specific embodiment, the screen printing drive module further includes a third screen printing drive mechanism, which is connected to the second screen printing drive mechanism. The squeegee is mounted on the third screen printing drive mechanism, and the third screen printing drive mechanism is used to drive the squeegee away from or towards the screen.

[0013] In one specific embodiment, the screen printing assembly further includes a cover, which is connected to the screen printing main frame and together with the screen plate to form a screen printing space, and the third screen printing drive mechanism and the squeegee are disposed within the screen printing space.

[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a silicon wafer processing equipment, the silicon wafer processing equipment including a feeding device and the silicon wafer screen printing device, the feeding device being used to feed the silicon wafer to be processed to the silicon wafer receiving position, so that the carrier mechanism receives the silicon wafer to be processed at the silicon wafer receiving position.

[0015] The beneficial effects of this application are as follows: Unlike existing technologies, the silicon wafer screen printing apparatus provided in this application includes: a conveying unit comprising a conveying drive module and a carrier mechanism, wherein the conveying drive module is connected to the carrier mechanism to drive the carrier mechanism to move, and a silicon wafer receiving position and a screen printing position are sequentially arranged along the movement trajectory of the carrier mechanism; and a screen printing unit comprising a screen printing drive module and a screen printing assembly, wherein the screen printing drive module is connected to the screen printing assembly so that when the carrier mechanism moves to the screen printing position, the screen printing drive module drives the screen printing assembly to complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism. Through this configuration, the screen printing assembly can directly complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism. Compared with existing technologies, there is no need to transfer the silicon wafer to be processed, saving a transfer process and improving screen printing efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the silicon wafer processing equipment provided in this application;

[0018] Figure 2 yes Figure 1 A schematic diagram of the assembly structure of a silicon wafer processing equipment after the housing has been removed;

[0019] Figure 3 yes Figure 2 Schematic diagram of the assembly structure of the silicon wafer screen printing device;

[0020] Figure 4 yes Figure 3 A schematic diagram of the assembly structure of the conveyor unit and the workbench;

[0021] Figure 5 yes Figure 4 Exploded view of the conveyor unit and workbench;

[0022] Figure 6 yes Figure 5 A schematic diagram of the exploded structure of the conveyor unit;

[0023] Figure 7 yes Figure 6 Schematic diagram of the motion trajectory of the load-bearing mechanism;

[0024] Figure 8 yes Figure 3 Schematic diagram of the assembly structure of the screen printing unit;

[0025] Figure 9 yes Figure 3 A schematic diagram of the exploded structure of the screen printing unit;

[0026] Figure 10 yes Figure 2 Schematic diagram of the assembly structure of the silicon wafer exposure device;

[0027] Figure 11 yes Figure 2 Exploded view of the silicon wafer exposure apparatus;

[0028] Figure 12 yes Figure 2 Schematic diagram of the assembly structure of the positioning device;

[0029] Figure 13 yes Figure 6 A schematic diagram of the material loading status of the load-bearing mechanism;

[0030] Figure 14 yes Figure 6 A schematic diagram of the material feeding state of the load-bearing mechanism. Detailed Implementation

[0031] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0032] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. A process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0033] In this document, the term "implementation" means that a specific feature, structure, or characteristic described in connection with an implementation may be included in at least one implementation of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same implementation, nor is it a separate or alternative implementation mutually exclusive with other implementations. It will be explicitly and implicitly understood by those skilled in the art that the implementations described herein can be combined with other implementations.

[0034] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the silicon wafer processing equipment 100 provided in this application. Figure 2 yes Figure 1 A schematic diagram of the assembly structure of the silicon wafer processing equipment 100 after removing the housing. In this embodiment, the silicon wafer processing equipment 100 includes a silicon wafer screen printing device 20 and a silicon wafer exposure device 30.

[0035] Please refer to the following: Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 , Figure 3 yes Figure 2 A schematic diagram of the assembly structure of the silicon wafer screen printing device 20. Figure 4 yes Figure 3 A schematic diagram of the assembly structure of the middle conveyor unit 21 and the worktable 21a. Figure 5 yes Figure 4 An exploded view of the conveyor unit 21 and the worktable 21a. Figure 6 yes Figure 5 An exploded view of the conveying unit 21. Figure 7 yes Figure 6 A schematic diagram of the movement trajectory of the carrier mechanism 212 is shown. The silicon wafer screen printing device 20 includes a conveying unit 21 and a screen printing unit 22. The conveying unit 21 includes a conveying drive module 211 and a carrier mechanism 212. The conveying drive module 211 is connected to the carrier mechanism 212 to drive the carrier mechanism 212 to move. Along the movement trajectory of the carrier mechanism 212, there are sequentially arranged silicon wafer receiving position P1, screen printing position P2 and exposure position P3. That is, in actual application, the conveying drive module 211 first drives the carrier mechanism 212 to move to the silicon wafer receiving position P1, so that the carrier mechanism 212 receives the silicon wafer 110 to be processed, and then drives the carrier mechanism 212 to move the silicon wafer 110 to be processed to the screen printing position P2 and the exposure position P3 in sequence.

[0036] Specifically, the conveying drive module 211 includes a first conveying drive mechanism (not shown in the figure), which is connected to the carrier mechanism 212 to drive the carrier mechanism 212 to move in the first direction X. The aforementioned silicon wafer receiving position P1, silkscreen position P2 and exposure position P3 are provided along the movement trajectory of the carrier mechanism 212 in the first direction X.

[0037] Please refer to the following: Figure 3 , Figure 8 and Figure 9 , Figure 8 yes Figure 3 A schematic diagram of the assembly structure of the screen printing unit 22. Figure 9 yes Figure 3 The exploded view of the screen printing unit 22 shows that the screen printing unit 22 includes a screen printing drive module 221 and a screen printing assembly 222. The screen printing drive module 221 is connected to the screen printing assembly 222 so that when the carrier mechanism 212 moves to the screen printing position P2, the screen printing drive module 221 drives the screen printing assembly 222 to complete the screen printing operation on the silicon wafer 110 to be processed on the carrier mechanism 212. With this setting, the screen printing assembly 222 can directly complete the screen printing operation on the silicon wafer 110 to be processed on the carrier mechanism 212. Compared with the prior art, there is no need to transfer the silicon wafer 110 to be processed, saving a transfer process and improving screen printing efficiency.

[0038] The screen printing drive module 221 includes a first screen printing drive mechanism 2211 and a second screen printing drive mechanism 2212. The second screen printing drive mechanism 2212 is connected to the first screen printing drive mechanism 2211 and the screen printing component 222, respectively, so that the first screen printing drive mechanism 2211 drives the screen printing component 222 to move from the first initial position to the screen printing position P2, and the second screen printing drive mechanism 2212 drives the screen printing component 222 to complete the screen printing operation on the silicon wafer 110 to be processed at the screen printing position P2.

[0039] Specifically, the first screen printing drive mechanism 2211 is used to drive the screen printing component 222 to move from the first initial position to the screen printing position P2 in the third direction Y.

[0040] Further reading Figure 6 and Figure 7 The conveying drive module 211 also includes a second conveying drive mechanism 2112, which is connected to the first conveying drive mechanism and the carrier mechanism 212 respectively. The second conveying drive mechanism 2112 is used to drive the carrier mechanism 212 to move from the screen printing position P2 to the preset screen printing position P4 in the second direction Z. The first screen printing drive mechanism 2211 is used to drive the screen printing component 222 to move from the first initial position to the preset screen printing position P4 in the third direction Y. The second screen printing drive mechanism 2212 is used to drive the screen printing component 222 to complete the screen printing operation on the silicon wafer 110 to be processed at the preset screen printing position P4.

[0041] Specifically, in practical applications, the first conveying drive mechanism first drives the carrier mechanism 212 to move from the silicon wafer receiving position P1 to the silkscreen position P2 in the first direction X. Then, the second conveying drive mechanism 2112 drives the carrier mechanism 212 to move from the silkscreen position P2 to the preset silkscreen position P4 in the second direction Z. Finally, the first silkscreen drive mechanism 2211 drives the silkscreen component 222 to move from the first initial position to the preset silkscreen position P4 in the third direction Y. This allows the silkscreen component to complete the silkscreen operation at the preset silkscreen position P4. Through this setting, the first conveying drive mechanism, the second conveying drive mechanism 2112, and the first silkscreen drive mechanism 2211 cooperate to achieve the positioning of the silicon wafer 110 to be processed in the first direction X, the second direction Z, and the third direction Y, thereby improving the accuracy of the silkscreen position of the silicon wafer 110 to be processed.

[0042] Among them, any two of the first direction X, the second direction Z, and the third direction Y are perpendicular to each other.

[0043] Furthermore, the conveying drive module 211 also includes a third conveying drive mechanism 2113, which is connected to the second conveying drive mechanism 2112 and the carrying mechanism 212 respectively. The third conveying drive mechanism 2113 is used to drive the carrying mechanism 212 in such a way as... Figure 6 The θ shown is rotated upwards to the preset silkscreen angle, improving the accuracy of the silkscreen angle on the silicon wafer 110 to be processed.

[0044] Please refer to the following: Figure 8 and Figure 9 The screen printing assembly 222 includes a screen printing main frame 2221, a squeegee 2222, and a stencil 2223. The screen printing main frame 2221 is connected to the first screen printing drive mechanism 2211. The stencil 2223 is mounted on the screen printing main frame 2221. The squeegee 2222 is mounted on the second screen printing drive mechanism 2212, so that the second screen printing drive mechanism 2212 drives the squeegee 2222 to screen print the pattern on the stencil 2223 onto the silicon wafer 110 to be processed, thereby completing the screen printing operation. In this embodiment, the second screen printing drive mechanism 2212 drives the squeegee 2222 in the first direction X to screen print the pattern on the stencil 2223 onto the silicon wafer 110 to be processed.

[0045] Furthermore, the screen printing drive module 221 also includes a third screen printing drive mechanism 2213, which is connected to the second screen printing drive mechanism 2212. A squeegee 2222 is mounted on the third screen printing drive mechanism 2213. The third screen printing drive mechanism 2213 is used to drive the squeegee 2222 away from or near the stencil 2223. That is, after the first screen printing drive mechanism 2211 drives the stencil 2223 to move to the preset screen printing position P4 in the third direction Y, the third screen printing drive mechanism 2213... The third screen printing drive mechanism 2213 drives the squeegee 2222 to approach the stencil 2223, and then the second screen printing drive mechanism 2212 drives the squeegee 2222 to screen print the pattern on the stencil 2223 onto the silicon wafer 110 to be processed. After the screen printing operation is completed, the third screen printing drive mechanism 2213 drives the squeegee 2222 to move away from the stencil 2223. In this embodiment, the third screen printing drive mechanism 2213 drives the squeegee 2222 to move away from or approach the stencil 2223 in the second direction Z.

[0046] The screen printing assembly 222 also includes a cover 2224, which is connected to the screen printing main frame 2221 and together with the screen plate 2223 forms a screen printing space (not shown in the figure). The third screen printing drive mechanism 2213 and the squeegee 2222 are disposed in the screen printing space 101.

[0047] Please refer to the following: Figure 2 , Figure 7 , Figure 10 and Figure 11 , Figure 10 yes Figure 2 A schematic diagram of the assembly structure of the silicon wafer exposure device 30. Figure 11 yes Figure 2 The exploded view of the silicon wafer exposure device 30 shows that the silicon wafer exposure device 30 is used to complete the exposure operation on the silicon wafer 110 to be processed on the carrier mechanism 212 at the exposure position P3. With this setting, the silicon wafer exposure device 30 can directly complete the exposure operation on the silicon wafer 110 to be processed on the carrier mechanism 212. Compared with the prior art, there is no need to transfer the silicon wafer 110 to be processed, saving a transfer process and improving the exposure efficiency.

[0048] The silicon wafer exposure apparatus 30 includes an exposure driving mechanism 31 and an exposure component 32. The exposure driving mechanism 31 is connected to the exposure component 32 to drive the exposure component 32 to move from the second initial position to the exposure position P3, so that the exposure component 32 completes the exposure operation on the silicon wafer 110 to be processed on the carrier mechanism 212 at the exposure position P3.

[0049] Specifically, the first conveying drive mechanism drives the carrier mechanism 212 to move from the silicon wafer receiving position P1 to the exposure position P3 in the first direction X. In this embodiment, that is, after the silicon wafer 110 to be processed completes the screen printing operation, the first conveying drive mechanism drives the carrier mechanism 212 to move from the screen printing position P2 to the exposure position P3. The exposure drive mechanism 31 is used to drive the exposure component 32 to move from the second initial position to the exposure position P3 in the third direction Y.

[0050] Furthermore, the second conveying drive mechanism 2112 is used to drive the carrier mechanism 212 to move from the exposure position P3 to the preset exposure position P5 in the second direction Z, and the exposure drive mechanism 31 is used to drive the exposure component 32 to move from the second initial position to the preset exposure position P5 in the third direction Y, so that the exposure component 32 completes the exposure operation on the silicon wafer 110 to be processed on the carrier mechanism 212 at the preset exposure position P5.

[0051] Specifically, in practical applications, the first conveying drive mechanism first drives the carrier mechanism 212 to move to the exposure position P3 in the first direction X. Then, the second conveying drive mechanism 2112 drives the carrier mechanism 212 to move from the exposure position P3 to the preset exposure position P5 in the second direction Z. Finally, the exposure drive mechanism 31 drives the exposure component 32 to move from the second initial position to the preset exposure position P5 in the third direction Y. This allows the exposure component 32 to complete the exposure operation at the preset exposure position P5. Through this setting, the first conveying drive mechanism, the second conveying drive mechanism 2112, and the exposure drive mechanism 31 cooperate to position the silicon wafer 110 to be processed in the first direction X, the second direction Z, and the third direction Y, thereby improving the accuracy of the exposure position of the silicon wafer 110 to be processed.

[0052] Furthermore, the third conveying drive mechanism 2113 is also used to drive the bearing mechanism 212 in such a way as Figure 6 The angle θ shown is rotated upwards to the preset exposure angle, thereby improving the accuracy of the exposure angle of the silicon wafer 110 to be processed.

[0053] The exposure assembly 32 includes an exposure frame 321, a light source (not shown in the figure), and an exposure plate 323. The exposure frame 321 is connected to the exposure drive mechanism 31. The exposure plate 323 is mounted on the exposure frame 321 and together with the exposure frame 321, forms an exposure space 102. The light source is set in the exposure space 102, so that the pattern on the exposure plate 323 is exposed to the silicon wafer 110 to be processed by the light source, thus completing the exposure operation.

[0054] The exposure frame 321 includes a connecting frame 3211, an upper cover 3212, and a lower cover 3213. The connecting frame 3211 is connected to the exposure drive mechanism 31. The upper cover 3212 and the lower cover 3213 are respectively connected to the connecting frame 3211. The exposure plate 323 is installed on the lower cover 3213 and together with the upper cover 3212, it forms an exposure space 102. The light source is connected to the upper cover 3212.

[0055] Furthermore, the exposure assembly 32 also includes an adjustment mechanism 324, which is connected to the upper cover 3212 to adjust the distance between the light source and the exposure plate 323. In this embodiment, the adjustment mechanism 324 adopts a manual wheel, and the distance between the light source and the exposure plate 323 is adjusted by manually rotating the manual wheel.

[0056] Further reading Figure 7 Along the movement trajectory of the carrier mechanism 212, there are also a feeding position P6, a first retraction position P7, and a second retraction position P8. The silicon wafer receiving position P1, silkscreen position P2, exposure position P3, feeding position P6, first retraction position P7, and second retraction position P8 are sequentially arranged along the movement direction of the carrier mechanism 212. In this embodiment, that is, along the movement trajectory of the carrier mechanism 212 in the first direction X, there are silicon wafer receiving position P1, silkscreen position P2, exposure position P3, feeding position P6, first retraction position P7, and second retraction position P8. The first conveyor... The driving mechanism is used to drive the carrier mechanism 212 to move sequentially from the silicon wafer receiving position P1 to the screen printing position P2, the exposure position P3 and the unloading position P6, and from the first retraction position P7 to the second retraction position P8. The unloading position P6, the first retraction position P7, the second retraction position P8 and the silicon wafer receiving position P1 are provided along the movement trajectory of the carrier mechanism 212 in the second direction Z. The second conveying driving mechanism 2112 is used to drive the carrier mechanism 212 to move from the unloading position P6 to the first retraction position P7, and from the second retraction position P8 to the silicon wafer receiving position P1.

[0057] The movement trajectory of the carrier mechanism 212 is at least partially arranged in a ring. In this embodiment, the movement trajectory of the carrier mechanism 212 along the silicon wafer receiving position P1, the silk screen position P2, the exposure position P3, the unloading position P6, the first retraction position P7 and the second retraction position P8 is arranged in a square ring.

[0058] Further reading Figure 4 , Figure 5 and Figure 6 The silicon wafer processing equipment 100 also includes a worktable 21a, and a conveying drive module 211 is installed on the worktable 21a. In this embodiment, the first conveying drive mechanism is also installed on the worktable 21a.

[0059] In this embodiment, there are multiple conveying units 21. Each conveying unit 21 includes the aforementioned conveying drive module 211 and a carrier mechanism 212. The movement trajectories of the multiple carrier mechanisms 212 are arranged in an overlapping manner. The aforementioned silicon wafer receiving position P1, screen printing position P2, and exposure position P3 are provided along the movement trajectory of each carrier mechanism 212, so that the multiple carrier mechanisms 212 move alternately from the silicon wafer receiving position P1 to the screen printing position P2 and the exposure position P3 in sequence. This allows the multiple silicon wafers 110 to be processed to complete the screen printing and exposure operations alternately in sequence. With this arrangement, on the one hand, by conveying the silicon wafers 110 to be processed through multiple conveying units 21, the conveying efficiency of the silicon wafers 110 to be processed is improved, thereby improving the screen printing efficiency and exposure efficiency. On the other hand, since the movement trajectories of the multiple carrier mechanisms 212 are arranged in an overlapping manner, that is, the movement space of the carrier mechanisms 212 is the same. The movement space of the carrier mechanisms 212 will not increase due to the increase in the number of conveying units 21, thus not increasing the footprint of the carrier mechanisms 212.

[0060] Optionally, in this embodiment, there are two conveying units 21. The worktable 21a includes a top surface 211a and two oppositely arranged side surfaces 211b. One of the two conveying drive modules 211 is connected to the worktable 21a on one of the two side surfaces 211b, and the other of the two conveying drive modules 211 is connected to the worktable 21a on the other of the two side surfaces 211b. Two supporting mechanisms 212 are respectively connected to the two conveying drive modules 211 on the side facing the top surface 211a.

[0061] Each conveying unit 21 further includes a connecting mechanism 213, which includes a first connecting part 2131 and a second connecting part 2132. The first connecting part 2131 is installed on the conveying drive module 211, and the second connecting part 2132 is bent and connected to the first connecting part 2131. The bearing mechanism 212 is installed on the second connecting part 2132.

[0062] Please refer to the following: Figure 2 and Figure 12 , Figure 12 yes Figure 2 The schematic diagram of the assembly structure of the positioning device 40 shows that the silicon wafer processing equipment 100 in this embodiment also includes a positioning device 40. The positioning device 40 is used to obtain the positioning information of the silicon wafer P1 to be processed on the carrier mechanism at the silicon wafer receiving position, so that the conveying drive module 211 drives the carrier mechanism 212 to move sequentially to the screen printing position P2 and the exposure position P3 in the first direction X according to the positioning information. In this embodiment, that is, the first conveying drive mechanism drives the carrier mechanism 212 to move sequentially to the screen printing position P2 and the exposure position P3 in the first direction X according to the positioning information.

[0063] The first screen printing drive mechanism 2211 drives the screen printing component 222 to move from the first initial position to the screen printing position P2 in the third direction Y according to the positioning information.

[0064] Furthermore, in this embodiment, the conveying drive module 211 is also used to drive the carrier mechanism 212 to move from the screen printing position P2 to the preset screen printing position P4 in the second direction Z according to the positioning information. That is, the second conveying drive mechanism 2112 drives the carrier mechanism 212 to move from the screen printing position P2 to the preset screen printing position P4 in the second direction Z according to the positioning information. The first screen printing drive mechanism 2211 is used to drive the screen printing component 222 to move from the first initial position to the preset screen printing position P4 in the third direction Y according to the positioning information.

[0065] Optionally, the conveying drive module 211 is also used to drive the carrier mechanism 212 to rotate to a preset silkscreen angle according to the positioning information, that is, the third conveying drive mechanism 2113 drives the carrier mechanism 212 to rotate to the preset silkscreen angle according to the positioning information.

[0066] Furthermore, in this embodiment, the exposure driving mechanism 31 is used to drive the exposure component 32 from the second initial position to the exposure position P3 in the third direction Y according to the positioning information, so that the exposure component 32 completes the exposure operation on the silicon wafer 110 to be processed on the carrier mechanism 32 at the exposure position.

[0067] The conveying drive module 211 is also used to drive the carrier mechanism 212 to move from the exposure position P3 to the preset exposure position P5 in the second direction Z according to the positioning information. That is, the second conveying drive mechanism 2112 drives the carrier mechanism 212 to move from the exposure position P3 to the preset exposure position P5 in the second direction Z according to the positioning information. The exposure drive mechanism 31 is used to drive the exposure component 32 to move from the second initial position to the preset exposure position P5 in the third direction Y according to the positioning information.

[0068] Optionally, the conveying drive module 211 is also used to drive the carrier mechanism 212 to rotate to a preset exposure angle according to the positioning information, that is, the third conveying drive mechanism 2113 drives the carrier mechanism 212 to rotate to a preset exposure angle according to the positioning information.

[0069] Furthermore, the positioning device 40 includes a support frame 41 and a positioning mechanism 42. The positioning mechanism 42 is mounted on the support frame 41 to obtain the positioning information of the silicon wafer 110 to be processed on the carrier mechanism 212 at the silicon wafer receiving position P1.

[0070] Optionally, there may be multiple positioning mechanisms 42, which are arranged in a circular array. For example, in this embodiment, the positioning mechanism 42 is a positioning camera, and there are four of them, which are respectively set at the four corners of the support frame 41 to obtain the positioning information of the silicon wafer 110 to be processed by the "four-corner positioning" method.

[0071] Please refer to the following: Figure 2 and Figure 13 , Figure 13 yes Figure 6 The schematic diagram of the loading state of the middle support mechanism 212 shows that the silicon wafer processing equipment 100 in this embodiment also includes a loading device 50, which is used to provide the silicon wafer to be processed 110 and transport the silicon wafer to be processed 110 to the silicon wafer receiving position P1.

[0072] The carrier mechanism 212 includes a carrier surface 212a for carrying the silicon wafer 110 to be processed. The carrier mechanism 212a is provided with a tape-passing groove 103 and an opening 104 communicating with the tape-passing groove 103. The tape-passing groove 103 passes through the carrier mechanism 212 in the first direction X, and the opening direction of the opening 104 is towards the carrier surface 212a.

[0073] Specifically, the second conveying drive mechanism 2112 is used to drive the carrier mechanism 212 to move in the second direction Z, so that the feeding conveyor belt 51 moves into the tape threading groove 103 through the opening 104 and the silicon wafer 110 to be processed falls onto the carrier mechanism 212. That is, when the carrier mechanism 212 moves from the first retraction position P7 to the second retraction position P8, the second conveying drive mechanism 2112 drives the carrier mechanism 212 to move from the second retraction position P8 toward the silicon wafer receiving position P1. During this process, the feeding conveyor belt 51 of the feeding device 50 moves into the tape threading groove 103 through the opening 104, and the height of the carrier surface 212a is greater than the height of the feeding conveyor belt 51, so that the silicon wafer 110 to be processed on the feeding conveyor belt 51 falls onto the carrier mechanism 212, completing the receiving of the silicon wafer 110 to be processed.

[0074] Optionally, the threading groove 103 includes a first groove 1031 and a second groove 1032. The first groove 1031 is connected to the opening 104 and the second groove 1032 respectively, and the width of the first groove 1031 is smaller than the width of the second groove 1032.

[0075] Optionally, there may be multiple threading slots 103, which may be arranged side by side. For example, there are two threading slots 103 in this embodiment.

[0076] Please refer to the following: Figure 2 and Figure 14 , Figure 14 yes Figure 6The schematic diagram of the unloading state of the carrier mechanism 212 is shown. The silicon wafer processing equipment 100 in this embodiment also includes an unloading device 60, which is used to receive the silicon wafer 110 to be processed after being processed on the carrier mechanism 212 at the unloading position P6.

[0077] Specifically, the first conveying drive mechanism is used to drive the carrier mechanism 212 to move to the unloading position P6, which in this embodiment means moving from the exposure position P3 to the unloading position P6, so that the unloading conveyor belt passes through the threading groove 103. The second conveying drive mechanism 2112 is used to drive the carrier mechanism 212 to move in the second direction Z, so that the unloading conveyor belt moves out of the threading groove 103 through the opening 104 and receives the silicon wafer 110 to be processed. That is, during the process of the carrier mechanism 212 moving to the unloading position P6, the unloading conveyor belt gradually passes through the threading groove 103 in the first direction X. When the carrier mechanism 212 moves to the unloading position P6, the second conveying drive mechanism 2112 drives the carrier mechanism 212 to move from the unloading position P6 toward the first retraction position P7. During this process, the unloading conveyor belt moves out of the threading groove 103 and receives the silicon wafer 110 to be processed, thereby completing the unloading operation of the silicon wafer 110 to be processed.

[0078] Further reading Figure 1 The silicon wafer processing equipment 100 in this embodiment also includes a housing 70, and a feeding device 50, a silicon wafer screen printing device 20, a silicon wafer exposure device 30, a positioning device 40 and a unloading device 60 are respectively disposed inside the housing 70.

[0079] The beneficial effects of this application are as follows: Unlike existing technologies, the silicon wafer screen printing apparatus provided in this application includes: a conveying unit comprising a conveying drive module and a carrier mechanism, wherein the conveying drive module is connected to the carrier mechanism to drive the carrier mechanism to move, and a silicon wafer receiving position and a screen printing position are sequentially arranged along the movement trajectory of the carrier mechanism; and a screen printing unit comprising a screen printing drive module and a screen printing assembly, wherein the screen printing drive module is connected to the screen printing assembly so that when the carrier mechanism moves to the screen printing position, the screen printing drive module drives the screen printing assembly to complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism. Through this configuration, the screen printing assembly can directly complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism. Compared with existing technologies, there is no need to transfer the silicon wafer to be processed, saving a transfer process and improving screen printing efficiency.

[0080] The above description is only a partial embodiment of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A silicon wafer screen printing device, characterized in that, The silicon wafer screen printing device includes: The conveying unit includes a conveying drive module and a carrier mechanism. The conveying drive module is connected to the carrier mechanism to drive the carrier mechanism to move. A silicon wafer receiving position and a silkscreen position are sequentially arranged along the movement trajectory of the carrier mechanism. The screen printing unit includes a screen printing drive module and a screen printing assembly. The screen printing drive module is connected to the screen printing assembly so that when the carrier mechanism moves to the screen printing position, the screen printing drive module drives the screen printing assembly to complete the screen printing operation on the silicon wafer to be processed on the carrier mechanism.

2. The apparatus according to claim 1, wherein The screen printing drive module includes a first screen printing drive mechanism and a second screen printing drive mechanism. The second screen printing drive mechanism is connected to the first screen printing drive mechanism and the screen printing component, respectively, so that the first screen printing drive mechanism drives the screen printing component to move from a first initial position to the screen printing position, and the second screen printing drive mechanism drives the screen printing component to complete the screen printing operation on the silicon wafer to be processed at the screen printing position.

3. The apparatus according to claim 2, wherein The conveying drive module includes a first conveying drive mechanism, which is connected to the carrier mechanism to drive the carrier mechanism to move from the silicon wafer receiving position to the silkscreen position in a first direction. The first silkscreen drive mechanism is used to drive the silkscreen component to move from the first initial position to the silkscreen position in a third direction.

4. The apparatus according to claim 3, wherein The conveying drive module further includes a second conveying drive mechanism, which is connected to the first conveying drive mechanism and the carrier mechanism respectively. The second conveying drive mechanism is used to drive the carrier mechanism to move from the screen printing position to the preset screen printing position in a second direction. The first screen printing drive mechanism is used to drive the screen printing component to move from the first initial position to the preset screen printing position in a third direction. The second screen printing drive mechanism is used to drive the screen printing component to complete the screen printing operation on the silicon wafer to be processed at the preset screen printing position.

5. The apparatus according to claim 4, wherein The conveying drive module further includes a third conveying drive mechanism, which is connected to the second conveying drive mechanism and the carrying mechanism respectively. The third conveying drive mechanism is used to drive the carrying mechanism to rotate to a preset screen printing angle.

6. The apparatus according to claim 4, wherein Any two of the first direction, the second direction, and the third direction are perpendicular to each other.

7. The apparatus according to claim 4, wherein The screen printing assembly includes a screen printing main frame, a squeegee, and a screen plate. The screen printing main frame is connected to the first screen printing drive mechanism, the screen plate is mounted on the screen printing main frame, and the squeegee is mounted on the second screen printing drive mechanism.

8. The apparatus according to claim 7, wherein The screen printing drive module further includes a third screen printing drive mechanism, which is connected to the second screen printing drive mechanism. The squeegee is mounted on the third screen printing drive mechanism, which is used to drive the squeegee away from or towards the screen.

9. The apparatus according to claim 8, wherein The screen printing assembly also includes a cover, which is connected to the screen printing main frame and together with the screen plate to form a screen printing space. The third screen printing drive mechanism and the squeegee are disposed within the screen printing space.

10. A silicon wafer processing apparatus characterized by comprising: The silicon wafer processing equipment includes a feeding device and a silicon wafer screen printing device according to any one of claims 1 to 9. The feeding device is used to feed the silicon wafer to be processed to the silicon wafer receiving position, so that the carrier mechanism receives the silicon wafer to be processed at the silicon wafer receiving position.

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