Cooling device for liquid circulation system

Abstract

This utility model discloses a cooling device for a liquid circulation system, including a housing. Inside the housing are a water tank, a first cooling component, and a second cooling component. The surface of the housing has a liquid inlet and a liquid outlet. The liquid inlet is connected to the first cooling component. The first cooling component includes a water inlet tank and a thermoelectric cooler. The water inlet tank is in contact with the cold end of the thermoelectric cooler and is connected to the liquid inlet. The second cooling component is located on the side of the water inlet tank away from the thermoelectric cooler. The second cooling component includes a cooling copper tube and several heat sinks. The heat sinks are fixed at intervals on the surface of the cooling copper tube. One end of the cooling copper tube is connected to the water inlet tank, and the other end is connected to the water tank. This utility model provides a cooling device for a liquid circulation system that combines multiple methods to achieve rapid cooling of the liquid during reflux, thereby improving the cooling effect of the liquid circulation system.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling technology, and in particular to a cooling device for a liquid circulation system. Background Technology

[0002] The existing liquid cooling circulation method can quickly cool down the heat-generating components. The principle is to use liquid as a medium, and the heat is transferred from the heat-generating components to the heat-conducting components through contact between the liquid and the heat-generating components, or through contact between the heat-generating components and the heat-conducting components through the liquid circulation. The heat is then carried away by the liquid, and the final cooling purpose is achieved.

[0003] After the liquid circulation process, the liquid that has transferred heat to the heating element needs to be cooled down quickly to ensure a good cooling effect when it is recirculated to the heating element, so as to avoid the entire liquid circulation system remaining at a high temperature and affecting the cooling effect. Utility Model Content

[0004] The purpose of this invention is to provide a cooling device for a liquid circulation system, which combines multiple methods to achieve rapid cooling of the liquid during reflux, thereby improving the cooling effect of the liquid circulation system.

[0005] The technical solution adopted by the cooling device of the liquid circulation system disclosed in this utility model is:

[0006] A cooling device for a liquid circulation system includes a housing. Inside the housing are a water tank, a first cooling component, and a second cooling component. The surface of the housing has a liquid inlet and a liquid outlet. The liquid inlet is connected to the first cooling component. The first cooling component includes a water inlet tank and a thermoelectric cooler. The water inlet tank is in contact with the cold end of the thermoelectric cooler and is connected to the liquid inlet. The second cooling component is located on the side of the water inlet tank away from the thermoelectric cooler. The second cooling component includes a cooling copper tube and a plurality of heat sinks. The plurality of heat sinks are fixed at intervals on the surface of the cooling copper tube. One end of the cooling copper tube is connected to the water inlet tank, and the other end is connected to the water tank.

[0007] As a preferred embodiment, the first cooling assembly further includes a heat-conducting plate and a first cooling fan. The heat-conducting plate is in contact with the hot end of the semiconductor cooling chip. The heat-conducting plate is provided with a plurality of heat dissipation fins at intervals on the side away from the semiconductor cooling chip. A baffle is fixedly provided on the end of the heat dissipation fins away from the heat-conducting plate. The first cooling fan is fixed to the surface of the baffle, and the baffle is provided with a ventilation window corresponding to the first cooling fan. A duct is provided on one side of the plurality of heat dissipation fins.

[0008] As a preferred embodiment, the water inlet tank and the second cooling assembly are spaced apart.

[0009] As a preferred embodiment, the cooling copper pipes are arranged in a series of continuous S-shaped structures, with the middle of each cooling copper pipe embedded in a series of heat sinks, and the cooling copper pipes are connected to the water inlet tank via a water pump.

[0010] As a preferred embodiment, a second cooling fan is provided on the side of the heat sink away from the first cooling component. The second cooling fan is fixed by a mounting plate, and a ventilation window is provided on the mounting plate corresponding to the second cooling fan.

[0011] As a preferred embodiment, the water storage tank is provided with a filling port at the upper end, the filling port protrudes from the upper end of the shell, and the filling port is provided with a screw-fixed cap.

[0012] As a preferred embodiment, the housing is provided with heat dissipation holes at the positions corresponding to the first cooling component and the second cooling component.

[0013] As a preferred embodiment, the housing is provided with two handles on the top.

[0014] The beneficial effects of the cooling device of the liquid circulation system disclosed in this utility model are as follows: the liquid inlet is connected to the return end of the liquid circulation system, and the liquid outlet is connected to the liquid inlet of the liquid circulation system. When the liquid after heat exchange enters the cooling device through the liquid inlet, it first enters the water tank of the first cooling component. The liquid in the water tank is initially cooled by the cold end of the semiconductor refrigeration chip, and then flows into the cooling copper pipe of the second cooling component. It flows into the storage tank along the cooling copper pipe to facilitate subsequent cooling circulation. After the liquid flows through the cooling copper pipe, it transfers heat to the surface of the cooling copper pipe, and the cooling copper pipe then transfers heat to several heat sinks. The heat sinks increase the heat dissipation area, thereby accelerating the cooling of the liquid in the cooling copper pipe, achieving the purpose of secondary cooling, realizing rapid cooling, and improving the cooling effect of the liquid circulation system. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the cooling device of the liquid circulation system of this utility model.

[0016] Figure 2 This is a schematic diagram of the internal structure of the cooling device of the liquid circulation system of this utility model.

[0017] Figure 3 This is a schematic diagram of the first cooling component of the cooling device of the liquid circulation system of this utility model.

[0018] Figure 4 This is a schematic diagram of the second cooling component of the cooling device in the liquid circulation system of this utility model. Detailed Implementation

[0019] The present invention will be further described and illustrated below with reference to specific embodiments and the accompanying drawings:

[0020] Please refer to Figures 1 to 4 A cooling device for a liquid circulation system includes a housing 10. Inside the housing 10, there is a water tank 20, a first cooling component 30, and a second cooling component 40. The surface of the housing 10 is provided with a liquid inlet 11 and a liquid outlet 12. The liquid inlet 11 is connected to the first cooling component 30. The first cooling component 30 includes a water inlet tank 31 and a semiconductor cooling chip 32. The water inlet tank 31 is in contact with the cold end of the semiconductor cooling chip 32, and the water inlet tank 31 is connected to the liquid inlet 11. The second cooling component 40 is disposed on the side of the water inlet tank 31 away from the semiconductor cooling chip 32. The second cooling component 40 includes a cooling copper pipe 41 and a plurality of heat sinks 42. The plurality of heat sinks 42 are fixed at intervals on the surface of the cooling copper pipe 41. One end of the cooling copper pipe 41 is connected to the water inlet tank 31, and the other end is connected to the water tank 20.

[0021] The liquid is connected to the return end of the liquid circulation system through the inlet 11 and the outlet 12 is connected to the inlet end of the liquid circulation system. When the liquid after heat exchange enters the cooling device through the inlet 11, it first enters the water tank 31 of the first cooling component 30. The cold end of the semiconductor cooling chip 32 initially cools the liquid in the water tank 31, and then flows into the cooling copper pipe 41 of the second cooling component 40. It then flows into the water storage tank 20 along the cooling copper pipe 41 to facilitate subsequent cooling circulation. After flowing through the cooling copper pipe 41, the liquid transfers heat to the surface of the cooling copper pipe 41, and the cooling copper pipe 41 then transfers heat to several heat sinks 42. The heat sinks 42 increase the heat dissipation area, thereby accelerating the cooling of the liquid in the cooling copper pipe 41, achieving the purpose of secondary cooling, realizing rapid cooling, and improving the cooling effect of the liquid circulation system.

[0022] The first cooling assembly 30 also includes a heat-conducting plate 33 and a first cooling fan 34. The heat-conducting plate 33 is in contact with the hot end of the thermoelectric cooler 32. A plurality of heat dissipation fins 35 are spaced apart on the side of the heat-conducting plate 33 away from the thermoelectric cooler 32. A baffle 36 is fixedly provided on the end of the heat dissipation fins 35 away from the heat-conducting plate 33. The first cooling fan 34 is fixed to the surface of the baffle 36, and the baffle 36 has a ventilation window corresponding to the first cooling fan 34. A duct 37 is provided on one side of the plurality of heat dissipation fins 35.

[0023] The heat generated by the thermoelectric cooler 32 during cooling operation is transferred to the heat-conducting plate 33. The heat dissipation fins 35 on one side of the heat-conducting plate 33 are used to increase the heat dissipation area, thereby achieving the purpose of cooling the thermoelectric cooler 32. Furthermore, the first cooling fan 34, the baffle 36 and the air duct 37 work together to form an air circulation channel. The first cooling fan 34 drives the air between the heat dissipation fins 35 to flow from the ventilation window to the air duct 37, thereby improving the air circulation between the heat dissipation fins 35 and accelerating the heat dissipation efficiency.

[0024] The water inlet tank 31 and the second cooling component 40 are separated to prevent the heat from the second cooling component 40 from being directly transferred to the water inlet tank 31, which would affect the cooling effect of the liquid in the water inlet tank 31.

[0025] The cooling copper pipes 41 are arranged in a series of continuous S-shaped structures. The middle part of each cooling copper pipe 41 is embedded in a number of heat sinks 42. The S-shaped structure can increase the residence time of the liquid in the cooling copper pipes 41, thereby improving the heat exchange effect between the liquid and the cooling copper pipes 41 and thus improving the cooling effect of the liquid. Furthermore, the cooling copper pipes 41 are connected to the water inlet tank 31 by a water pump 13. The water pump 13 draws the liquid from the cooling copper pipes 41 to the water storage tank 20, thus preventing the liquid from not flowing in the cooling copper pipes 41.

[0026] A second cooling fan 43 is provided on the side of the heat sink 42 away from the first cooling component 30. The second cooling fan 43 is fixed by a mounting plate 44. A ventilation window is provided on the mounting plate 44 corresponding to the second cooling fan 43. The second cooling fan 43 accelerates the airflow between the heat sinks 42 and also accelerates the airflow on the surface of the cooling copper pipes 41 between the heat sinks 42, thereby improving the cooling effect of the first cooling component 30.

[0027] In the above scheme, the water storage tank 20 is provided with a filling port at the upper end, the filling port protrudes from the upper end of the shell 10, and the filling port is provided with a screw-fixed sealing cap 21. Cooling liquid can be added to the water storage tank 20 through the filling port, so as to add liquid to the entire liquid circulation system. The circulating liquid can also be extracted for replacement. Furthermore, the filling port protrudes from the upper end of the shell 10, making it more convenient for people to operate.

[0028] The housing 10 has heat dissipation holes 14 at the positions corresponding to the first cooling component 30 and the second cooling component 40, so as to provide the effect of air circulation between the first cooling component 30 and the second cooling component 40 and the outside air.

[0029] The connections between the liquid inlet 11, liquid outlet 12, water tank 20, first cooling component 30 and second cooling component 40 are all made using existing pipes, which are known technologies.

[0030] Two handles 15 are provided on the top of the housing 10 for easy carrying.

[0031] This invention provides a cooling device for a liquid circulation system. The device connects the inlet to the return end of the liquid circulation system and the outlet to the inlet. When the liquid, after heat exchange, enters the cooling device through the inlet, it first enters the inlet tank of the first cooling component. The cold end of the semiconductor cooling chip initially cools the liquid in the inlet tank, and then it flows into the cooling copper pipe of the second cooling component. The liquid then flows along the cooling copper pipe into a storage tank, facilitating subsequent cooling circulation. During the flow process in the cooling copper pipe, the liquid transfers heat to the surface of the cooling copper pipe, which in turn transfers the heat to several heat sinks. The heat sinks increase the heat dissipation area, thereby accelerating the cooling of the liquid inside the cooling copper pipe, achieving secondary cooling and improving the cooling effect of the liquid circulation system.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A cooling device for a liquid circulating system, characterized by The device includes a housing, inside which are a water tank, a first cooling component, and a second cooling component. The surface of the housing has a liquid inlet and a liquid outlet. The liquid inlet is connected to the first cooling component. The first cooling component includes a water inlet tank and a thermoelectric cooler. The water inlet tank is in contact with the cold end of the thermoelectric cooler and is connected to the liquid inlet. The second cooling component is located on the side of the water inlet tank away from the thermoelectric cooler. The second cooling component includes a cooling copper pipe and several heat sinks. The several heat sinks are fixed at intervals on the surface of the cooling copper pipe. One end of the cooling copper pipe is connected to the water inlet tank, and the other end is connected to the water tank.

2. The cooling device for a liquid circulating system according to claim 1, wherein The first cooling assembly further includes a heat-conducting plate and a first cooling fan. The heat-conducting plate is in contact with the hot end of the semiconductor cooling chip. The heat-conducting plate has a plurality of heat dissipation fins spaced apart on the side away from the semiconductor cooling chip. A baffle is fixedly provided on the end of the heat dissipation fins away from the heat-conducting plate. The first cooling fan is fixed to the surface of the baffle, and the baffle has a ventilation window corresponding to the first cooling fan. A duct is provided on one side of the plurality of heat dissipation fins.

3. The cooling device for a liquid circulating system according to claim 1, wherein The water inlet tank and the second cooling assembly are spaced apart.

4. The cooling device for a liquid circulating system according to claim 1, wherein The cooling copper pipes are arranged in a series of continuous S-shaped structures, with the middle of each cooling copper pipe embedded in a series of heat sinks, and the cooling copper pipes are connected to the water inlet tank via a water pump.

5. The cooling device for a liquid circulating system according to claim 1, wherein A second cooling fan is provided on the side of the heat sink away from the first cooling component. The second cooling fan is fixed by a mounting plate, and a ventilation window is provided on the mounting plate corresponding to the second cooling fan.

6. The cooling device for a liquid circulating system according to claim 1, wherein The water storage tank is provided with a filling port at the upper end, the filling port protrudes from the upper end of the shell, and the filling port is provided with a screw-fixed cap.

7. The cooling device for a liquid circulating system according to claim 6, wherein The housing has heat dissipation holes at positions corresponding to the first and second cooling components.

8. The cooling device for a liquid circulating system according to claim 6, wherein The housing has two handles on top.

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