Single photon detector module

Abstract

The utility model provides a kind of single photon detector module, single photon detector module includes quenching circuit board, control circuit board, power supply circuit board, single photon detector and heat conducting component, the size of quenching circuit board is less than the size of control circuit board, to form the installation area of uncovered control circuit board, heat conducting component part is located in installation area, heat conducting component has gap, and quenching circuit board is located in gap. Heat conducting component part is located in installation area, can reduce the additional space of heat conducting component, that is, heat conducting component and integrated circuit board are highly integrated, to achieve the effect that single photon detector module volume is bloated is prevented;Quenching circuit board is located in gap, further makes heat conducting component and integrated circuit board highly integrated, saves the additional space of quenching circuit board.

Description

Technical Field

[0001] This utility model relates to the field of photoelectric detection equipment, and in particular to a single-photon detector module. Background Technology

[0002] In recent years, the growth of InGaAs materials and near-infrared single-photon detection technology have developed rapidly. Near-infrared single-photon detection technology based on InGaAs single-photon avalanche diodes (SPADs) is increasingly widely used in systems such as long-range lidar, demonstrating its advantages such as low power consumption and low noise.

[0003] However, traditional InGaAs(P) single-photon detector modules have a low degree of integration and are bulky, making it difficult to use the detector in a space with limited space. For example, the single-photon detector module produced by IDQ in Switzerland has a size of 95mm×95mm×95mm, while similar products in China generally exceed 100mm×150mm×60mm, which makes system integration difficult.

[0004] To solve this problem, the circuit needs to be miniaturized first. There is a related solution disclosed in the patent application with patent number ZL202010199338.X and authorization number CN111351586B. Secondly, based on the design of this circuit and the structural characteristics of SPAD (that is, the single photon detector in this application), the appearance design and improvement of the integrated single photon detector module are carried out. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of low integration and bulky size of existing single-photon detector modules, and to provide a single-photon detector module.

[0006] The present invention solves the above-mentioned technical problems through the following technical solution:

[0007] A single-photon detector module, comprising:

[0008] An integrated circuit board includes a quenching circuit board, a control circuit board, and a power supply circuit board, with the control circuit board connected between the quenching circuit board and the power supply circuit board.

[0009] A single-photon detector is connected to a quenching circuit board; the single-photon detector module also includes heat-conducting components.

[0010] The size of the quenching circuit board is smaller than that of the control circuit board to form a mounting area that does not cover the control circuit board. The heat-conducting component is located in the mounting area and abuts against the single-photon detector to conduct heat from the single-photon detector.

[0011] The heat-conducting component has a notch, and the quenching circuit board is located in the notch.

[0012] In this solution, the size of the quenching circuit board is smaller than that of the control circuit board, thus reducing the space occupied by the integrated circuit board. In addition, the formation of the aforementioned mounting area and the location of the heat-conducting component within the mounting area can reduce the additional space occupied by the heat-conducting component. In other words, the heat-conducting component is highly integrated with the integrated circuit board, thereby preventing the single-photon detector module from becoming bulky. The quenching circuit board is located in the notch, further enhancing the high integration between the heat-conducting component and the integrated circuit board, saving additional space occupied by the quenching circuit board. Moreover, based on the above high integration, the heat-conducting component can also effectively conduct the heat from the single-photon detector.

[0013] Preferably, the power circuit board is provided with an integrated interface, which has the functions of both a power interface and an optical fiber interface.

[0014] In this solution, the fiber optic interface and power interface are integrated into one integrated interface, which can reduce the space occupied by different interfaces on the power circuit board, so as to accommodate as many electronic components on the power circuit board as possible. In other words, it can reduce the size of the power circuit board, thereby reducing the overall volume of the single-photon detector module.

[0015] Preferably, the quenching circuit board includes a first connecting part and a second connecting part, which are connected at 90°. The first connecting part is used to connect to the control circuit board, and the second connecting part is used to connect to the single-photon detector.

[0016] In this solution, the design of the aforementioned quenching circuit board is irregular, retaining only two areas with connection functions. This minimizes the space occupied by the quenching circuit board and maximizes the installation area for the heat-conducting components. In other words, the above arrangement can increase the integration area of ​​the heat-conducting components and minimize the overall volume of the single-photon detector module.

[0017] Preferably, the heat-conducting component includes a main board and two side plates, the two side plates being connected to opposite ends of the main board and extending outward at an angle to the main board; the integrated circuit board is mounted in the receiving space formed by the main board and the two side plates.

[0018] The quenching circuit board is the circuit board located near the motherboard in an integrated circuit board.

[0019] In this design, the space formed by the motherboard and the two side plates can stably limit the circumferential direction of the integrated circuit board, thus fixing the integrated circuit board stably in the heat-conducting component. In addition, the two side plates can increase the heat-conducting area of ​​the heat-conducting component and improve its heat conduction effect.

[0020] Preferably, the notch is located on the motherboard corresponding to the position of the quenching circuit board.

[0021] The notch is used to accommodate the quenched circuit board, and the edge of the notch is located in the mounting area.

[0022] In this design, the notch is positioned to accommodate the quenching circuit board; furthermore, the edge of the notch is located in the mounting area, meaning that the quenching circuit board and the heat-conducting component are very compactly arranged to improve their integration.

[0023] Preferably, the surface of the quenched circuit board exposed from the notch is covered with an insulating pad.

[0024] In this solution, the aforementioned isolation pad has the effects of physical isolation and insulation isolation, preventing the electrical conduction of the quenching circuit board from causing accidents, and also preventing the quenching circuit board from being damaged by the external environment. In other words, the isolation pad plays a protective role for the quenching circuit board.

[0025] Preferably, the motherboard further has a first mounting portion adjacent to the notch and located on the outer surface of the motherboard, and the single-photon detector has a second mounting portion;

[0026] The second mounting part is adapted to the shape of the first mounting part and is mounted on the first mounting part.

[0027] In this design, the shape of the second mounting part is adapted to that of the first mounting part, so that the second mounting part can be stably installed on the first mounting part, and it is also more aesthetically pleasing.

[0028] Preferably, the first mounting portion is a groove, and the second mounting portion is mounted in the groove; the space between the second mounting portion and the groove is filled with silicone grease, and / or...

[0029] The inner peripheral wall of the groove extends outward along the edge of the groove and protrudes beyond the plane where the motherboard is located.

[0030] In this design, the first mounting part is a groove, which allows the second mounting part to be mounted more stably on the heat-conducting component. In addition, the filling with silicone grease can prevent air from existing between the second mounting part and the groove, which would affect the heat conduction effect. The inner peripheral wall of the groove extends outward along the edge of the groove and extends out of the plane where the motherboard is located. The above configuration can increase the heat conduction area of ​​the heat-conducting component and also increase the mounting area of ​​the second mounting part, so as to further improve the heat conduction effect and installation effect of the heat-conducting component.

[0031] Preferably, the single-photon detector module further includes a housing with heat dissipation holes on the top and sides, and heat dissipation fins on the front. The integrated circuit board, the single-photon detector, and the heat-conducting components are all located within the housing.

[0032] In this solution, the housing can prevent components such as integrated circuit boards from being affected by the external environment, and the heat dissipation fins and heat dissipation holes of the housing can improve the heat dissipation effect of the single-photon detector module.

[0033] Preferably, the single-photon detector module has a size of 115,560 cubic millimeters, the quenching circuit board has a size of 471.88 cubic millimeters, and the power supply circuit board and control circuit board each have a size of 2,176 cubic millimeters.

[0034] In this solution, the dimensions of the single-photon detector module, quenching circuit board, power supply circuit board, and control circuit board are all smaller than those of the corresponding components in the prior art, occupying less space and having a higher degree of integration.

[0035] The positive and progressive effects of this utility model are as follows: the size of the quenching circuit board is smaller than that of the control circuit board, thus reducing the space occupied by the integrated circuit board; in addition, the formation of the above-mentioned mounting area and the location of the heat-conducting component in the mounting area can reduce the additional space occupied by the heat-conducting component, that is, the heat-conducting component is highly integrated with the integrated circuit board, so as to prevent the single-photon detector module from becoming bulky; the quenching circuit board is located in the notch, which further makes the heat-conducting component highly integrated with the integrated circuit board, saving the additional space occupied by the quenching circuit board; and on the basis of the above-mentioned high integration, the heat-conducting component can also effectively conduct away the heat of the single-photon detector. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a single-photon detector module according to an embodiment of the present invention.

[0037] Figure 2 This is a schematic diagram of the internal structure of a single-photon detector module according to an embodiment of the present invention.

[0038] Figure 3 This is a schematic diagram of the structure of an integrated circuit board according to an embodiment of the present invention.

[0039] Figure 4 This is a schematic diagram of the structure of a heat-conducting component according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures:

[0041] Single-photon detector module 100

[0042] Quenching circuit board 1

[0043] First connecting part 11

[0044] Second connecting part 12

[0045] Isolation pad 13

[0046] Control circuit board 2

[0047] Power circuit board 3

[0048] Integrated Interface 31

[0049] SMA signal interface 32

[0050] Single-photon detector 4

[0051] Second installation section 41

[0052] Thermal conductive component 5

[0053] Gap 51

[0054] Motherboard 52

[0055] Side panel 53

[0056] First Installation Section 54

[0057] Casing 6

[0058] 61 heat dissipation holes

[0059] Through hole 62 Detailed Implementation

[0060] The present invention will be further described below with reference to the accompanying drawings and by way of embodiments, but the present invention is not limited to the scope of the embodiments thereon.

[0061] like Figure 1-4 As shown, this embodiment provides a single-photon detector module 100, which includes: an integrated circuit board, which includes a quenching circuit board 1, a control circuit board 2, and a power circuit board 3, with the control circuit board 2 connected between the quenching circuit board 1 and the power circuit board 3; a single-photon detector 4, which is connected to the quenching circuit board 1; the single-photon detector module 100 also includes a heat-conducting component 5, the size of the quenching circuit board 1 being smaller than the size of the control circuit board 2 to form an installation area that does not cover the control circuit board 2, the heat-conducting component 5 being partially located in the installation area and abutting against the single-photon detector 4 to conduct heat from the single-photon detector 4; the heat-conducting component 5 having a notch 51, with the quenching circuit board 1 located in the notch 51.

[0062] In this embodiment, the size of the quenching circuit board 1 is smaller than that of the control circuit board 2, thereby reducing the space occupied by the integrated circuit board. In addition, the formation of the above-mentioned mounting area and the partial location of the heat-conducting component 5 in the mounting area can reduce the additional space occupied by the heat-conducting component 5. That is to say, the heat-conducting component 5 is highly integrated with the integrated circuit board, so as to prevent the single-photon detector module 100 from becoming bulky. The quenching circuit board 1 is located in the notch 51, which further makes the heat-conducting component 5 highly integrated with the integrated circuit board, saving the additional space occupied by the quenching circuit board 1. Moreover, on the basis of the above-mentioned high integration, the heat-conducting component 5 can also effectively conduct away the heat of the single-photon detector 4.

[0063] It should be noted that the quenching circuit board 1, the control circuit board 2, and the power circuit board 3 are connected by stainless steel pillars, and are mounted on the heat-conducting component 5 in the mounting area via stainless steel pillars.

[0064] like Figure 3 As shown, the power circuit board 3 is equipped with an integrated interface 31, which has the functions of both a power interface and an optical fiber interface.

[0065] In this embodiment, the fiber optic interface and the power interface are integrated into one interface, which can reduce the space occupied by different interfaces on the power circuit board 3, so as to accommodate as many pad components on the power circuit board 3 as possible. In other words, the size of the power circuit board 3 can be reduced, thereby reducing the overall volume of the single-photon detector module 100.

[0066] It should be noted that the integrated interface 31 supports direct insertion of single-mode / multimode fiber optic cables without the need for an adapter flange; the power circuit board 3 also includes an SMA signal interface (SubMiniature version A, a connector for transmitting signals) for signal transmission.

[0067] like Figure 3 As shown, the quenching circuit board 1 includes a first connecting part 11 and a second connecting part 12, which are connected at 90°. The first connecting part 11 is used to connect to the control circuit board 2, and the second connecting part 12 is used to connect to the single-photon detector 4.

[0068] In this embodiment, the design of the quenching circuit board 1 is irregular, and only two areas with connection functions are retained. This can minimize the space occupied by the quenching circuit board 1 and maximize the installation area for the heat-conducting component 5. In other words, the above-mentioned arrangement can increase the integration area of ​​the heat-conducting component 5 and minimize the overall volume of the single-photon detector module 100.

[0069] It should be noted that the reason why the size of the quenching circuit board 1 is small is that the electronic components are arranged relatively compactly on the quenching circuit board 1.

[0070] like Figure 2 and Figure 4 As shown, the heat-conducting component 5 includes a main board 52 and two side plates 53. The two side plates 53 are respectively connected to opposite ends of the main board 52 and extend outward at an angle to the main board 52. The integrated circuit board is installed in the receiving space formed by the main board 52 and the two side plates 53.

[0071] The quenching circuit board 1 is the circuit board located near the motherboard 52 in the integrated circuit board.

[0072] In this embodiment, the accommodating space formed by the main board 52 and the two side plates 53 can stably limit the circumferential direction of the integrated circuit board, so that the integrated circuit board is stably fixed in the heat-conducting member 5; in addition, the two side plates 53 can increase the heat-conducting area of ​​the heat-conducting member 5 and improve its heat conduction effect.

[0073] It should be noted that the connection between the main board 52 and the two side plates 53 adopts a "U"-shaped design. In addition, the heat-conducting component 5 may also include a base plate, which is connected to the bottom of the main board 52 and connected to the two side plates 53. The base plate is used to support the integrated circuit board so that the integrated circuit board can be more stably mounted on the heat-conducting component 5. Furthermore, the main board 52 is the part of the heat-conducting component 5 that contacts the SPAD, and the two side plates 53 are heat sinks. The above design maximizes the contact area between the SPAD device shell and the heat-conducting component 5 while ensuring a safe distance from electrical components such as pins. According to calculations, the contact area between the SPAD and the heat-conducting component 5 accounts for 73.2% of the SPAD device shell.

[0074] like Figure 2 and Figure 4 As shown, notch 51 is provided on the main board 52 corresponding to the position of quenching circuit board 1.

[0075] Notch 51 is used to accommodate quenched circuit board 1, and the edge of notch 51 is located in the mounting area.

[0076] In this embodiment, the notch 51 is positioned to accommodate the quenching circuit board 1; furthermore, the edge of the notch 51 is located in the mounting area, meaning that the quenching circuit board 1 and the heat-conducting component 5 are arranged very compactly to improve their integration level.

[0077] It should be noted that the size of the notch 51 is sufficient to accommodate the quenched circuit board.

[0078] like Figure 2 and Figure 3 As shown, the surface of the quenching circuit board 1 exposed from the notch 51 is covered with an isolation pad 13.

[0079] In this embodiment, the isolation pad 13 has the effects of physical isolation and insulation isolation, preventing the electrical conduction of the quenching circuit board 1 from causing an accident, and also preventing the quenching circuit board 1 from being damaged by the external environment. In other words, the isolation pad 13 plays a protective role for the quenching circuit board 1.

[0080] It should be noted that the quenching circuit board 1 is engaged in the notch 51 and connected to the SMA signal interface through the elastic pin.

[0081] like Figure 4 As shown, the motherboard 52 also has a first mounting portion 54, which is adjacent to the notch 51 and is located on the outer surface of the motherboard 52. The single-photon detector 4 has a second mounting portion 41.

[0082] The second mounting part 41 is adapted to the shape of the first mounting part 54 and is mounted on the first mounting part 54.

[0083] In this embodiment, the shape of the second mounting part 41 is adapted to that of the first mounting part 54 so that the second mounting part 41 can be stably mounted on the first mounting part 54 and is more aesthetically pleasing.

[0084] It should be noted that both the first mounting part 54 and the second mounting part 41 are rhomboid in shape.

[0085] like Figure 4 As shown, the first mounting part 54 is a groove, and the second mounting part 41 is mounted in the groove; the space between the second mounting part 41 and the groove is filled with silicone grease, and / or, the inner peripheral wall of the groove extends outward along the edge of the groove and extends out of the plane where the motherboard 52 is located.

[0086] In this embodiment, the first mounting part 54 is a groove, which allows the second mounting part 41 to be mounted more stably on the heat-conducting member 5. In addition, the filling of silicone grease can prevent air from existing between the second mounting part 41 and the groove, which would affect the heat conduction effect. The inner peripheral wall of the groove extends outward along the edge of the groove and extends out of the plane where the main board 52 is located. The above-mentioned configuration can increase the heat conduction area of ​​the heat-conducting member 5 and also increase the mounting area of ​​the second mounting part 41, so as to further improve the heat conduction effect and the mounting effect of the heat-conducting member 5.

[0087] It should be noted that the second mounting part 41 is a protrusion to fit the first mounting part 54; in addition, the integrated circuit board is fixed to the heat-conducting component 5 by thermal grease, screws, etc.

[0088] like Figure 1As shown, the single-photon detector module 100 also includes a housing 6, with heat dissipation holes 61 on the top and sides of the housing 6, and heat dissipation fins on the front of the housing 6. The integrated circuit board, the single-photon detector 4, and the heat-conducting component 5 are all located in the housing 6.

[0089] In this embodiment, the housing 6 can prevent components such as integrated circuit boards from being affected by the external environment, and the heat dissipation fins and heat dissipation holes 61 of the housing 6 can improve the heat dissipation effect of the single photon detector module 100.

[0090] It should be noted that the heat-conducting component 5 is connected to the outer shell 6 via a heat-conducting pad with high thermal conductivity and is tightened by screws, thereby enhancing the heat conduction and heat dissipation capabilities of the heat-conducting component 5. In addition, the heat dissipation fins have a depth of 2.5 mm, increasing their heat dissipation area under the condition of a compact structure. The bottom of the outer shell 6 has connection holes, which can be connected to other structures in the detection system, or directly fixed to the optical platform or optical breadboard. The back of the outer shell 6 is the back plate of the outer shell 6, which has an SMA signal interface 32 (SubMiniature version A, a connector for transmitting signals) and an integrated interface 31 adapted to the power circuit board 3, solving the problem of too many interfaces in the single-photon detector module 100. The single-photon detector module 100 in this embodiment is a free-running detector.

[0091] It should also be noted that the outer shell 6 is formed by CNC machining of 6061 aluminum alloy blank and the surface is hard anodized; the outer shell 6 also has a through hole 62 for the single photon detector 4 to extend out.

[0092] like Figure 1-4 As shown, the single-photon detector module 100 has a size of 115,560 cubic millimeters, the quenching circuit board 1 has a size of 471.88 cubic millimeters, and the power supply circuit board 3 and the control circuit board 2 each have a size of 2,176 cubic millimeters.

[0093] In this embodiment, the dimensions of the single-photon detector module 100, the quenching circuit board 1, the power supply circuit board 3, and the control circuit board 2 are all smaller than the corresponding components in the prior art, occupying less space and having a higher degree of integration.

[0094] It should be noted that the single-photon detector module 100 of this application achieves a breakthrough in volume and compatibility, with its volume reduced to approximately 50% of that of traditional products; the overall thermal management efficiency is improved, and the bidirectional thermal conduction structure of the two side plates 53 significantly reduces thermal resistance; in addition, the dimensions of the single-photon detector module 100 are specifically 54mm × 42.8mm × 50mm, the dimensions of the quenching circuit board 1 are specifically 20.2mm × 14.6mm × 1.6mm cubic millimeters, and the dimensions of the power circuit board 3 and the control circuit board 2 are specifically 40mm × 34mm × 1.6mm.

[0095] The reason why the dimensions of the quenching circuit board 1, the power supply circuit board 3, and the control circuit board 2 are all smaller than the corresponding components in the prior art is that the electronic components are arranged more compactly and the number of interfaces is reduced, saving space for accommodating the electronic components.

[0096] Finally, the whole machine was tested: the single-photon detector module 100 was installed into the matching test base to verify the dark count rate (10%@1kHz) and dead time (25ns).

[0097] The implementation process of the single-photon detector module 100 is summarized below.

[0098] 1. The outer shell 6 of the single-photon detector module 100 is formed by CNC machining of 6061 aluminum alloy blanks and surface hard anodizing treatment.

[0099] II. Optical layer assembly: The InGaAs SPAD components (i.e., integrated circuit boards and SPAD components) are fixed to the thermally conductive component 5 using thermal grease, screws, etc.

[0100] 3. Circuit packaging: The quenched circuit board 1 is embedded in the notch 51 and connected to the SMA signal interface through the elastic pin;

[0101] IV. Whole machine test: Install the matching test base to verify the dark count rate (10%@1kHz) and dead time (25ns).

[0102] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0103] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.

Claims

1. A single photon detector module, the single photon detector module comprising: An integrated circuit board, comprising a quenching circuit board, a control circuit board, and a power circuit board, wherein the control circuit board is connected between the quenching circuit board and the power circuit board; A single-photon detector, the single-photon detector being connected to the quenching circuit board; characterized in that the single-photon detector module further includes a heat-conducting component. The size of the quenching circuit board is smaller than that of the control circuit board to form a mounting area that does not cover the control circuit board. The heat-conducting component is located in the mounting area and abuts against the single-photon detector to conduct heat from the single-photon detector. The heat-conducting component has a notch, and the quenching circuit board is located in the notch.

2. The single photon detector module of claim 1, wherein, The power circuit board is equipped with an integrated interface that functions as both a power interface and an optical fiber interface.

3. The single photon detector module of claim 1, wherein, The quenching circuit board includes a first connecting part and a second connecting part, which are connected at a 90° angle. The first connecting part is used to connect to the control circuit board, and the second connecting part is used to connect to the single-photon detector.

4. The single photon detector module of claim 1, wherein, The heat-conducting component includes a main board and two side plates. The two side plates are respectively connected to opposite ends of the main board and extend outward from opposite ends of the main board at an angle to the main board. The integrated circuit board is mounted in the receiving space formed by the main board and the two side plates. The quenching circuit board is the circuit board located near the motherboard in the integrated circuit board.

5. The single photon detector module of claim 4, wherein, The notch is located on the motherboard corresponding to the position of the quenching circuit board. The notch is used to accommodate the quenched circuit board, and the edge of the notch is located in the mounting area.

6. The single photon detector module of claim 5, wherein, The surface of the quenched circuit board exposed from the notch is covered with an insulating pad.

7. The single photon detector module of claim 5, wherein, The motherboard also has a first mounting portion adjacent to the notch, the first mounting portion being located on the outer surface of the motherboard, and the single-photon detector having a second mounting portion; The second mounting part is adapted to the shape of the first mounting part and is mounted on the first mounting part.

8. The single-photon detector module as described in claim 7, characterized in that, The first mounting part is a groove, and the second mounting part is mounted in the groove; Wherein, the space between the second mounting portion and the groove is filled with silicone grease, and / or, The inner peripheral wall of the groove extends outward along the edge of the groove and extends beyond the plane where the motherboard is located.

9. The single photon detector module of claim 1, wherein, The single-photon detector module also includes a housing, the top and sides of which have heat dissipation holes, and the front of which has heat dissipation fins. The integrated circuit board, the single-photon detector, and the heat-conducting component are all located within the housing.

10. The single photon detector module of claim 9, wherein, The single-photon detector module has a size of 115,560 cubic millimeters, the quenching circuit board has a size of 471.88 cubic millimeters, and the power supply circuit board and the control circuit board both have a size of 2,176 cubic millimeters.

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