Equipment for electrical performance testing and high-temperature aging testing of high power density module products

Abstract

This utility model provides a device for electrical performance testing and high-temperature aging testing of high-power-density module products, relating to the fields of electronic product testing and aging technology. It features a high-current clamping structure to meet the reliability requirements of repeated clamping of high-current pins during electrical performance testing and high-temperature aging tests; a vertical pressing structure and a double-sided heat dissipation structure to meet the heat dissipation requirements of high-power-density modules operating under high-heat conditions during electrical performance testing and high-temperature aging tests; and a double-sided temperature measurement structure to perform real-time temperature measurement and monitoring of the upper and lower surfaces of the high-power-density module product during electrical performance testing and high-temperature aging tests.

Description

Technical Field

[0001] This application relates to the fields of electronic product testing and aging technology, and in particular to an apparatus for electrical performance testing and high-temperature aging testing of high power density module products. Background Technology

[0002] Modular products typically undergo electrical performance testing and high-temperature aging tests before leaving the factory. For high-power-density modular products, due to their large output current and high power density, heat dissipation is usually required during electrical performance testing and high-temperature aging tests. In existing technology, this is mainly achieved by mounting a heatsink on the top of the product (the non-pin-exit surface) and connecting a test board to the bottom (the pin-exit surface). Figure 1 As shown, Figure 1 This diagram illustrates a typical electrical performance testing and high-temperature aging test setup for existing modular products. A heatsink 01 is fixed to the top of the module product 02, and the module product pins 03 on the bottom are inserted into pin sleeves 04 on the test board 05. In existing heat dissipation methods, because the bottom of the product is not in contact with the heatsink, the bottom of the product has relatively poor heat dissipation performance during electrical performance testing, resulting in a higher temperature at the bottom than at the top. Furthermore, since the bottom and top of the product are respectively shielded by the bottom test fixture and the top heatsink, only the sides are exposed, making it difficult to monitor the surface temperature. Therefore, existing setups for electrical performance testing and high-temperature aging tests of high-power-density modular products typically suffer from limited bottom heat dissipation capacity, making it difficult to measure and monitor the actual temperature rise of the upper and lower surfaces of the product.

[0003] With the trend towards high performance and miniaturization in electronic products, their power density is becoming increasingly higher. With the emergence of new-generation high-power-density modules, these products generate even more heat, and existing electrical performance testing and high-temperature aging tests are no longer sufficient to meet their heat dissipation and precise temperature control requirements. If the load is too high or the ambient temperature changes during full-power testing or high-temperature aging, the product is prone to over-temperature failure or introduces over-temperature quality risks.

[0004] Furthermore, since the pin sleeve 04 in existing technologies typically uses a spring-loaded structure, prolonged insertion and removal can reduce the spring's resilience, leading to poor contact between the module product's pin 03 and the spring inside the pin sleeve 04, resulting in a loose connection between the pin and the tooling. Moreover, because these products require high current flow through their pins, a loose connection between the pin and the tooling could cause the product to burn out or be damaged by current. Additionally, the pin sleeve 04 is prone to deformation after repeated insertion and removal over extended periods, which in turn can cause deformation of the product's pins. Therefore, existing electrical performance testing and high-temperature aging tests suffer from the problem of loose connections and deformation of the pin sleeve 04 after prolonged use.

[0005] In summary, due to the significant increase in heat generation of the new generation of high power density module products, the existing electrical performance testing and high-temperature aging test equipment can no longer meet the actual needs. It is necessary to improve the capabilities in heat dissipation, temperature measurement and control, and the reliability of high-current pins that are repeatedly clamped for a long time. Utility Model Content

[0006] In view of the above problems, this application provides a device for electrical performance testing and high-temperature aging testing of high-power-density module products, meeting the needs of high-current pin clamping, heat dissipation, and temperature measurement and control during electrical performance testing and high-temperature aging testing of next-generation high-power-density module products. The specific solution is as follows:

[0007] The first aspect of this application provides an apparatus for testing the electrical performance and high-temperature aging of high power density module products. The apparatus includes: a high power density module, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit.

[0008] The high-current clamping structure includes a movable clamping structure seat, a fixed clamping structure seat, a clamping structure slide rail, and a clamping structure pull rod. The movable clamping structure seat and the fixed clamping structure seat are respectively provided with elastic components for the movable seat and the fixed seat. After the clamping structure pull rod is pulled together, the module lead-out pins of the high power density module are elastically clamped.

[0009] The vertical pressing structure includes a device base, a pressing structure column, a pressing structure pull rod, a pressing structure pressure plate, an upper heat sink, a clamping structure fixing seat, a lower heat sink, a pressing structure elastic component, and a device support column. The upper heat sink is suspended from the pressing structure pressure plate by the pressing structure elastic component. The pressing structure pressure plate is fixed to the pressing structure column, the pressing structure column is fixed to the device base, and the lower heat sink is fixed to the clamping structure fixing seat. The clamping structure fixing seat is fixed to the device base by the device support column. After the pressing structure pull rod is pulled down, the upper and lower heat sinks respectively form elastic compression contact with the upper and lower surfaces of the high power density module.

[0010] The double-sided heat dissipation structure includes an upper heat sink, a lower heat sink, an upper cooling fan, a lower cooling fan, and fan fixing screws; the upper cooling fan and the lower cooling fan are respectively fixed to the upper heat sink and the lower heat sink by the fan fixing screws; the lower heat sink is provided with a lower heat sink boss, the upper heat sink contacts the upper surface of the high power density module, and the lower heat sink boss contacts the lower surface of the high power density module;

[0011] The dual-sided temperature measurement structure includes an upper temperature measuring component, a lower temperature measuring component, an upper temperature measuring wire, a lower temperature measuring wire, an upper temperature controller, a lower temperature controller, a temperature controller fixing screw, a device base, an upper heat sink, and a lower heat sink. The upper temperature controller and the lower temperature controller are respectively fixed to the upper heat sink and the device base by the temperature controller fixing screw. The upper temperature measuring component and the lower temperature measuring component form elastic contact with the upper and lower surfaces of the high power density module, and are then connected to the upper temperature controller and the lower temperature controller via the upper temperature measuring wire and the lower temperature measuring wire, respectively.

[0012] The product testing unit includes module lead-out pins, movable seat holding copper plates, fixed seat holding copper plates, a test board, and test board terminals. The module lead-out pins are connected to the test board by being clamped and connected by the movable seat holding copper plates and the fixed seat holding copper plates, and are led out by the test board terminals.

[0013] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging test of high power density module products, the movable seat elastic component includes a movable seat clamping copper sheet, the fixed seat elastic component includes a fixed seat clamping copper sheet, and the movable seat elastic component and the fixed seat elastic component further include: a spring, a clamping structure front baffle and a clamping structure rear baffle;

[0014] After the front baffle and the rear baffle of the clamping structure are fixed by screws, they limit and fix the copper sheet clamped by the movable seat and the copper sheet clamped by the fixed seat; the spring is located between the copper sheet clamped by the movable seat and the rear baffle of the clamping structure in the elastic component of the movable seat, and also between the copper sheet clamped by the fixed seat and the rear baffle of the clamping structure in the elastic component of the fixed seat.

[0015] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging test of high power density module products, the elastic component of the clamping structure includes a spring and an elastic component screw;

[0016] The elastic component screw passes through the elastic component screw through hole of the pressing structure plate and is fixedly connected to the upper heat sink; the spring is located between the pressing structure plate and the upper heat sink.

[0017] Preferably, in the above-mentioned device for electrical performance testing and high-temperature aging test of high power density module products, the upper temperature measuring component and the lower temperature measuring component include a temperature measuring structure limiting stage, a temperature measuring structure through hole, a temperature measuring probe, a spring, a temperature measuring structure pressure plate, and temperature measuring structure pressure plate fixing screws.

[0018] The temperature probe is located inside the through hole of the temperature measuring structure. One end used for temperature testing is limited by the limiting platform of the temperature measuring structure. The other end of the temperature probe in the upper temperature measuring component is connected to the upper temperature measuring line, and the other end of the temperature probe in the lower temperature measuring component is connected to the lower temperature measuring line.

[0019] The spring is provided between the temperature probe and the temperature measuring structure pressure plate;

[0020] The temperature measuring structure pressure plate is fixed by the temperature measuring structure pressure plate fixing screws.

[0021] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging testing of high power density module products, the upper temperature measuring line and the lower temperature measuring line are flexible test lines.

[0022] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging test of high power density module products, the lower temperature measuring line is an L-shaped temperature measuring line, and the lower temperature controller is located in an area other than below the lower heat sink through the bending connection of the L-shaped temperature measuring line.

[0023] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging test of high power density module products, the pressure plate of the pressing structure is provided with a pressure plate opening, through which data is read from the upper temperature controller located below.

[0024] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging test of high power density module products, the lower heat sink is provided with a lower heat sink slot, and the copper sheet held by the fixing seat passes through the lower heat sink slot.

[0025] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging testing of high power density module products, a copper sheet insulating sleeve is provided on the outside of the copper sheet held by the fixing seat.

[0026] Preferably, in the above-mentioned apparatus for electrical performance testing and high-temperature aging test of high power density module products, the test board is fixed on the base of the apparatus, and a test board limiting post is provided between the test board and the base of the apparatus.

[0027] By means of the above technical solution, this application provides a device for electrical performance testing and high-temperature aging testing of high power density module products, including a high power density module, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit; it can meet the reliability requirements of the new generation of high power density module products under long-term repeated high-current clamping during electrical performance testing and high-temperature aging testing, and at the same time meet the requirements of product heat dissipation, temperature measurement and control during electrical performance testing and high-temperature aging testing of the new generation of high power density module products.

[0028] The device for electrical performance testing and high-temperature aging testing of high-power-density module products provided in this application incorporates a high-current clamping structure to meet the reliability requirements of repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of the new generation of high-power-density module products. The high-current clamping structure comprises a movable base and a fixed base, both containing clamping elastic components (elastic components in the movable base and fixed base, respectively). In the clamping state, a large-area elastic compression contact is formed between the module leads of the high-power-density module (specifically, the clamping copper sheet in the elastic component forms a large-area elastic compression contact with the pin), meeting the high-current overcurrent requirements of the high-power-density module products. The clamping force of the elastic component is generated by an internal spring. Since the spring operates in the linear elastic region, the clamping force generated by the spring is controllable and stable, and can be repeatedly clamped for a long time without significant attenuation, meeting the reliability requirements of repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of the new generation of high-power-density module products.

[0029] The device for electrical performance testing and high-temperature aging testing of high-power-density module products provided in this application incorporates a vertical clamping structure and a double-sided heat dissipation structure. This structure meets the heat dissipation requirements of next-generation high-power-density module products operating under high-heat conditions during electrical performance testing and high-temperature aging testing, thus stabilizing the product's casing temperature. In the double-sided heat dissipation structure of this application, the upper and lower heat dissipation blocks form contact heat dissipation structures with the upper and lower surfaces of the high-power-density module, respectively. During electrical performance testing or high-temperature aging testing, the double-sided heat dissipation structure can promptly transfer the heat released by the product to the heat dissipation blocks, stabilizing the product's casing temperature. Simultaneously, the vertical clamping structure of this application is equipped with an elastic clamping component. When the clamping structure lever is pulled down, the elastic force of the elastic component ensures a tight elastic contact between the high-power-density module and the upper and lower heat dissipation blocks. Based on the elastic force of the spring inside the elastic component, the pressure applied to the module by the vertical pressing structure is controllable. This ensures that the heat sink and the module surface form a tight heat dissipation contact, while preventing damage to the module squeezed between the upper and lower heat sinks due to excessive pressure.

[0030] The device for electrical performance testing and high-temperature aging testing of high-power-density module products provided in this application incorporates a double-sided temperature measurement structure. This structure allows for real-time temperature measurement and monitoring of the upper and lower surfaces of the new generation of high-power-density module products during electrical performance testing and high-temperature aging testing. Based on the test data, the product's casing temperature can be precisely adjusted and set. In this double-sided temperature measurement structure, the upper and lower temperature measuring components form tight elastic contact with the upper and lower surfaces of the high-power-density module, respectively, and are then connected to the upper and lower temperature controllers via upper and lower temperature measuring wires, respectively. The spring structure inside the temperature measuring components, after being pressed by the vertical clamping structure of this device, ensures that the temperature probe forms a tight elastic compression contact with the module surface, achieving accurate acquisition of the temperature of the upper and lower surfaces of the module. It also ensures that the vertical clamping process does not damage the module or the probe, meeting the reliability requirements for long-term repeated use of the temperature measuring structure. Attached Figure Description

[0031] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0032] Figure 1 This is a schematic diagram of a typical electrical performance testing and high-temperature aging test device for existing technology module products.

[0033] Figure 2 A schematic diagram of a device for testing the electrical performance and high-temperature aging of a high-power-density module product, provided for an embodiment of this utility model;

[0034] Figure 3 A schematic diagram of the structure of a high power density module product provided in this embodiment of the utility model;

[0035] Figure 4 A schematic diagram of a high-current clamping structure provided in an embodiment of this utility model;

[0036] Figure 5 This is a cross-sectional schematic diagram of the elastic component in a clamping structure in an unclamped state, provided as an embodiment of the present utility model.

[0037] Figure 6 This is a cross-sectional schematic diagram of the elastic component in the clamping state of a clamping structure provided in an embodiment of the present utility model;

[0038] Figure 7 This is a schematic diagram of the vertical pressing structure in an unpressed state, provided by an embodiment of the present invention.

[0039] Figure 8This is a schematic diagram of the vertical pressing structure in a pressed state, provided by an embodiment of the present invention.

[0040] Figure 9 This is a schematic diagram of the structure of the elastic component of the clamping structure in an unpressed state, provided by an embodiment of the present utility model.

[0041] Figure 10 A schematic diagram of the structure of the elastic component of the pressing structure in the pressed state provided by an embodiment of this utility model;

[0042] Figure 11 A schematic diagram of a double-sided heat dissipation structure provided in an embodiment of this utility model;

[0043] Figure 12 This is a schematic diagram of the structure of an upper heat sink provided in an embodiment of the present utility model;

[0044] Figure 13 This is a schematic diagram of the structure of a lower heat sink provided in an embodiment of the present utility model;

[0045] Figure 14 A schematic diagram of a double-sided temperature measurement structure provided in an embodiment of this utility model;

[0046] Figure 15 A schematic diagram of the structure of a temperature measuring component provided in an embodiment of this utility model;

[0047] Figure 16 This is a schematic diagram of the structure of a product testing unit provided in an embodiment of the present utility model. Detailed Implementation

[0048] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is only for explaining specific embodiments and is not intended to limit the application. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0049] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] It should be noted that the directional terms appearing in this utility model are based on the relative positional relationships shown in the accompanying drawings and should not be taken as absolute limitations on this application.

[0051] refer to Figure 2 , Figure 2 A schematic diagram of a device for electrical performance testing and high-temperature aging testing of a high-power-density module product provided in this embodiment of the present invention is shown below. Figure 3 , Figure 3 This is a structural schematic diagram of a high power density module product provided in an embodiment of the present invention. The apparatus for electrical performance testing and high-temperature aging testing of the high power density module product provided in this embodiment of the present invention includes: a high power density module 30, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit.

[0052] like Figure 3 As shown, in this embodiment of the application, the high power density module 30 is a module product with a dual in-line package (DIP) pin structure. The high power density module 30 includes module lead-out pins 31, which are located on opposite edges of the bottom surface of the product.

[0053] refer to Figure 4 , Figure 4 This is a schematic diagram of a high-current clamping structure provided in an embodiment of the present invention. The high-current clamping structure includes a movable clamping structure seat 22, a fixed clamping structure seat 23, a clamping structure slide rail 21, and a clamping structure pull rod 20. The movable clamping structure seat 22 and the fixed clamping structure seat 23 are respectively provided with a movable seat elastic component 32 and a fixed seat elastic component 33. After the clamping structure pull rod 20 is pulled closed, it elastically clamps the module lead-out pins 31 of the high power density module 30.

[0054] like Figure 4 As shown, the clamping structure slide rail 21 is fixed to the clamping structure fixed seat 23. One end of the clamping structure movable seat 22 is fixed to the clamping structure pull rod 20, and the other end is fixed to the slider on the clamping structure slide rail 21. As the clamping structure pull rod 20 is pushed or pulled, it drives the clamping structure movable seat 22 to move, thus completing the clamping between the clamping structure movable seat 22 and the clamping structure fixed seat 23.

[0055] in, Figure 4 The number 34 indicates the fixing screw for the movable seat.

[0056] refer to Figure 5 , Figure 5 This is a cross-sectional schematic diagram of the elastic component in a clamping structure in an unclamped state, provided by an embodiment of the present invention. (Refer to...) Figure 6 , Figure 6 This is a cross-sectional schematic diagram of the clamping state of the elastic component in a clamping structure provided by an embodiment of the present utility model. The movable seat elastic component 32 includes a movable seat clamping a copper sheet 37, and the fixed seat elastic component 33 includes a fixed seat clamping a copper sheet 38. The movable seat elastic component 32 and the fixed seat elastic component 33 also include: a spring 42, a front baffle 40 of the clamping structure, and a rear baffle 41 of the clamping structure.

[0057] After the front baffle 40 and the rear baffle 41 of the clamping structure are fixed by screws, they limit and fix the copper sheet 37 of the movable seat and the copper sheet 38 of the fixed seat. The spring 42 is located between the copper sheet 37 of the movable seat and the rear baffle 41 of the clamping structure in the elastic component 32 of the movable seat, and also between the copper sheet 38 of the fixed seat and the rear baffle 41 of the clamping structure in the elastic component 33 of the fixed seat, so that the copper sheet 37 of the movable seat or the copper sheet 38 of the fixed seat has elastic force when it is squeezed.

[0058] like Figure 5 and Figure 6 As shown, the front baffle 40 and rear baffle 41 of the clamping structure are fixed with screws, thereby limiting and fixing the copper sheet (including the movable seat clamping copper sheet 37 and the fixed seat clamping copper sheet 38) and the spring 42 structure in the area between the front and rear baffles. When the clamping elastic component is used to clamp the module lead-out pin 31, the copper sheet of the clamping elastic component is squeezed to a position flush with the surface of the front baffle 40 of the clamping structure. At this time, under the elastic thrust of the internal spring 42, the clamping copper sheet forms a tight elastic compression contact with the module lead-out pin 31, realizing the elastic compression clamping of the module lead-out pin 31 in the high power density module product of this application.

[0059] Furthermore, in this embodiment, both clamping copper plates (movable seat clamping copper plate 37 and fixed seat clamping copper plate 38) of the high current clamping structure are planar, and can form a large area of ​​contact with the module lead-out pin 31 after clamping the module lead-out pin 31, thus meeting the high current transmission requirements of the module lead-out pin 31.

[0060] refer to Figure 7 , Figure 7 This is a schematic diagram of a vertical pressing structure in its unpressed state, provided as an embodiment of the present invention. (Refer to...) Figure 8 , Figure 8This is a schematic diagram of a vertical pressing structure in a pressed state, provided by an embodiment of the present invention. The vertical pressing structure includes a device base 11, a pressing structure column 12, a pressing structure pull rod 13, a pressing structure pressure plate 14, an upper heat sink 17, a clamping structure fixing seat 23, a lower heat sink 24, a pressing structure elastic component 15, and a device support column 29. The upper heat sink 17 is suspended from the pressing structure pressure plate 14 by the pressing structure elastic component 15. The pressing structure pressure plate 14 is fixed to the pressing structure column 12, and the pressing structure column 12 is fixed to the device base 11. The lower heat sink 24 is fixed to the clamping structure fixing seat 23, and the clamping structure fixing seat 23 is fixed to the device base 11 by the device support column 29. After the pressing structure pull rod 13 is pulled down, the upper heat sink 17 and the lower heat sink 24 form a tight elastic compression contact with the upper and lower surfaces of the high power density module 30, respectively.

[0061] like Figure 7 and Figure 8 As shown, the lower heat sink 24 is fixed to the clamping structure fixing seat 23 by the lower heat sink fixing screw 35. The clamping structure fixing seat 23 is fixed to the device support column 29 by the fixing seat screw 36, and then the device support column 29 is fixed to the device base 11. The pressing structure pressure plate 14 is fixed to the slider on the pressing structure column 12. When the pressing structure pull rod 13 is pressed and pulled open, the pressing structure pressure plate 14 can move up and down along the slide rail on the pressing structure column 12.

[0062] refer to Figure 9 , Figure 9 This is a schematic diagram of the structure of the elastic component of the clamping structure in an unpressed state, provided by an embodiment of the present invention. (Refer to...) Figure 10 , Figure 10 This is a schematic diagram of the structure of a pressing structure elastic component in a pressed state, provided by an embodiment of the present invention. The pressing structure elastic component 15 includes a spring 42 and an elastic component screw 43; the elastic component screw 43 passes through the elastic component screw through hole 44 of the pressing structure pressure plate 14 and is fixedly connected to the upper heat sink 17; the spring 42 is located between the pressing structure pressure plate 14 and the upper heat sink 17, and plays an elastic support role.

[0063] like Figure 9 and Figure 10As shown, the elastic component screw 43 has a nut structure at its top. In the unpressed state, the upper heat sink 17 is suspended from the pressing structure plate 14 by the nut structure at the top of the elastic component screw 43. In this state, the spring 42 between the pressing structure plate 14 and the upper heat sink 17 is in a slightly compressed state, and its elastic force is only used to stabilize the structure and suppress the swaying of the suspended upper heat sink 17. During the pressing process, the upper heat sink 17 moves downward under the control of the pressing structure pull rod 13. After contacting the upper surface of the high power density module 30, the upper heat sink 17 stops moving downward, while the pressing structure plate 14 continues to move downward for a distance. After the pressing is completed, the spring 42 is in a significant elastic compression state. At this time, the elastic force of the spring 42 is applied downward to the upper heat sink 17, which can ensure that a tight elastic contact is formed between the high power density module 30 and the upper heat sink 17 and the lower heat sink boss 25. Meanwhile, based on the elastic force of the spring 42 inside the elastic component 15 of the pressing structure, the pressure applied to the high power density module 30 by the vertical pressing structure is controllable. This ensures that the heat sink and the surface of the high power density module 30 form a tight heat dissipation contact, while preventing damage to the high power density module 30 squeezed between the upper and lower heat sinks due to excessive pressure.

[0064] refer to Figure 11 , Figure 11 This is a schematic diagram of a double-sided heat dissipation structure provided in an embodiment of the present invention, with reference to... Figure 12 , Figure 12 This is a schematic diagram of the structure of an upper heat sink provided in an embodiment of the present invention, with reference to... Figure 13 , Figure 13 This is a schematic diagram of a lower heat sink provided in an embodiment of the present invention. The double-sided heat dissipation structure includes an upper heat sink 17, a lower heat sink 24, an upper cooling fan 18, a lower cooling fan 26, and fan fixing screws 46. The upper cooling fan 18 and the lower cooling fan 26 are respectively fixed to the upper heat sink 17 and the lower heat sink 24 by the fan fixing screws 46. The lower heat sink 24 is provided with a lower heat sink boss 25. The upper heat sink 17 contacts the upper surface of the high power density module 30, and the lower heat sink boss 25 contacts the lower surface of the high power density module 30, together forming a heat dissipation structure.

[0065] in, Figure 12 Number 45 indicates the fixing screw hole for the elastic component, number 49 indicates the fixing screw hole for the temperature controller, and number 50 indicates the fixing screw hole for the pressure plate of the temperature measuring structure.

[0066] Figure 13 The number 51 indicates the mounting screw hole for the lower heat sink.

[0067] like Figures 11-13As shown, the lower heat sink 24 is provided with a lower heat sink protrusion 25. When the vertical clamping structure is clamped, the lower heat sink 24 contacts the lower surface of the high power density module 30 (i.e., the lead-out surface of the module lead-out pin 31) through the lower heat sink protrusion 25 for heat dissipation. In this embodiment, the protrusion design of the lower heat sink 24 avoids the high current clamping area of ​​the device, so that the device of this application can simultaneously complete the power-on operation and heat dissipation operation of the high power density module product at the bottom of the product.

[0068] In specific application examples, in order to achieve better heat dissipation performance, thermal grease can be applied between the contact surface of the heat sink and the high power density module 30. The thermal grease can fill the tiny gaps between the high power density module product and the heat sink, further reducing the interface thermal resistance and improving the heat dissipation performance of the high power density module product in this embodiment.

[0069] To improve the heat dissipation performance of the heat sink, the heat sink (including the upper heat sink 17 and the lower heat sink 24) in this embodiment of the application is provided with a heat dissipation tooth 47 structure, and a cooling fan is also provided at one end of the heat sink. When the heat generated by the high power density module product is transferred to the heat sink, the forced convection air formed by the cooling fan can promptly transfer the heat on the heat sink to the surrounding air, thereby improving the heat dissipation capacity of the entire device.

[0070] It should be noted that the larger the heat sink, the better the heat dissipation performance. In practical applications, different sized heat sinks can be configured according to the varying heat output of high-power-density modules. By configuring heat sinks of different sizes for different product models to adjust the heat dissipation capacity, precise control of the product casing temperature can be achieved during product electrical performance testing and high-temperature aging tests.

[0071] refer to Figure 14 , Figure 14This is a schematic diagram of a double-sided temperature measurement structure provided in an embodiment of the present invention. The double-sided temperature measurement structure includes an upper temperature measuring component 53, a lower temperature measuring component 54, an upper temperature measuring line 56, a lower temperature measuring line 57, an upper temperature controller 19, a lower temperature controller 27, a temperature controller fixing screw 55, a device base 11, an upper heat sink 17, and a lower heat sink 24. The upper temperature controller 19 and the lower temperature controller 27 are respectively fixed to the upper heat sink 17 and the device base 11 by the temperature controller fixing screw 55. The upper temperature measuring component 53 and the lower temperature measuring component 54 form tight elastic contact with the upper and lower surfaces of the high power density module 30, and are then connected to the upper temperature controller 19 and the lower temperature controller 27 via the upper temperature measuring line 56 and the lower temperature measuring line 57, respectively. The temperature probes 58 in the upper temperature measuring component 53 and the lower temperature measuring component 54 respectively form tight elastic contact with the upper and lower surfaces of the high power density module 30, and are then connected to the upper temperature controller 19 and the lower temperature controller 27 via the upper temperature measuring line 56 and the lower temperature measuring line 57 respectively.

[0072] like Figure 14 As shown, combined with Figure 2 As shown in the device structure, in order to directly observe and read data from the temperature controller in the double-sided temperature measurement structure, this embodiment adopts a targeted structural design. First, a pressure plate opening 16 is provided on the pressure plate 14 of the pressing structure, exposing the upper temperature controller 19 located directly below it. This allows for convenient observation and reading of the test data on the surface of the upper temperature controller 19 through the pressure plate opening 16. The lower temperature measuring line 57 is designed as an L-shaped temperature measuring line. The lower temperature controller 27 is connected and positioned outside the area below the lower heat sink 24 via the bending of the L-shaped temperature measuring line. This allows for convenient observation and reading of the test data on the surface of the lower temperature controller 27. In other words, by bending the L-shaped temperature measuring line, the lower temperature controller 27 connected to it is positioned outside the obstructed area below the lower heat sink 24, thus facilitating convenient observation and reading of the test data on the surface of the lower temperature controller 27.

[0073] It should be noted that the pressure plate opening 16 on the pressure plate 14 of the pressing structure and the design of the lower temperature measuring line 57 as an L-shaped temperature measuring line are both to set the upper and lower temperature controllers in an area that can be directly observed, so as to facilitate direct observation and data reading of the temperature controllers.

[0074] The dual-sided temperature measurement structure provided in this application embodiment can perform real-time temperature measurement and monitoring of the upper and lower surfaces of a new generation of high-power-density module products during electrical performance testing and high-temperature aging tests. Based on the test data, the product's casing temperature can be precisely adjusted and set. More specifically, based on the real-time temperature data collected by the dual-sided temperature measurement structure, different sizes of heat sinks can be configured to adjust the heat dissipation capacity for different product models. By adjusting the configuration of the heat sink's heat dissipation capacity, precise control of the product casing temperature can be achieved during product electrical performance testing and high-temperature aging tests.

[0075] In this embodiment, an upper temperature measuring component 53 is provided below the upper temperature controller 19. To avoid interference between the two, two protrusions are provided below the upper temperature controller 19, so that a certain safety gap is formed between the fixed upper temperature controller 19 and the upper temperature measuring component 53.

[0076] refer to Figure 15 , Figure 15 This is a schematic diagram of the structure of a temperature measuring component provided in an embodiment of the present utility model. The upper temperature measuring component 53 and the lower temperature measuring component 54 include a temperature measuring structure limiting platform 61, a temperature measuring structure through hole 48, a temperature measuring probe 58, a spring 42, a temperature measuring structure pressure plate 59, a temperature measuring structure pressure plate fixing screw 60, an upper temperature measuring wire 56, and a lower temperature measuring wire 57.

[0077] The temperature probe 58 is located inside the through hole 48 of the temperature measuring structure. One end of the probe used for temperature testing is limited by the limiting platform 61 of the temperature measuring structure. The other end of the temperature probe 58 in the upper temperature measuring component 53 is connected to the upper temperature measuring line 56, and the other end of the temperature probe 58 in the lower temperature measuring component 54 is connected to the lower temperature measuring line 57.

[0078] The spring is provided between the temperature probe 58 and the temperature measuring structure pressure plate 59, so that the temperature probe 58 can maintain a certain elasticity when subjected to compressive force.

[0079] The temperature measuring structure pressure plate 59 is fixed by the temperature measuring structure pressure plate fixing screw 60.

[0080] like Figure 15As shown, the temperature sensing component contains a spring 42 structure. After the vertical pressing structure of this device is engaged, the temperature probe 58 is pressed to a position flush with the surface of the heat sink (including the upper heat sink 17 and the lower heat sink protrusion 25). At this time, under the outward elastic thrust of the internal spring 42, the temperature probe 58 can ensure a tight elastic compression contact between the temperature probe 58 and the surface of the high power density module 30, completing the accurate acquisition of the temperature of the upper and lower surfaces of the high power density module 30, while also ensuring that the vertical pressing process will not damage the temperature probe 58, meeting the reliability requirements of the temperature sensing component for long-term repeated use. When the vertical pressing structure is disengaged, the temperature probe 58 will return to its original initial position due to the elastic force of the spring 42.

[0081] Optionally, the upper temperature measuring line 56 and the lower temperature measuring line 57 are flexible test lines.

[0082] As can be seen from the working process of the aforementioned temperature measuring component, during the pressing process of the vertical pressing structure of this device, the temperature measuring probe 58 will be subjected to squeezing and move up and down. Selecting a flexible test line can ensure that the temperature measuring probe 58 can move up and down without restriction.

[0083] refer to Figure 16 , Figure 16 This is a schematic diagram of a product testing unit provided in an embodiment of the present invention. The product testing unit includes a module lead-out pin 31, a movable seat holding copper plate 37, a fixed seat holding copper plate 38, a test board 28, and test board terminals 62. The module lead-out pin 31 is connected to the test board 28 by being clamped and connected by the movable seat holding copper plate 37 and the fixed seat holding copper plate 38, and is led out by the test board terminals 62.

[0084] like Figure 16 As shown, since the device structure in this embodiment adopts a double-sided heat dissipation structure, heat dissipation blocks are provided on both the front and back sides of the high power density module product. The copper plate 38 of the product test unit's fixing seat needs to pass through the lower heat dissipation block 24 located at the bottom of the product. Therefore, this application provides a lower heat dissipation block slot 52 on the lower heat dissipation block 24. After the module lead-out pin 31 is clamped and connected by the copper plate 37 of the movable seat and the copper plate 38 of the fixed seat, it passes through the lower heat dissipation block slot 52 provided on the lower heat dissipation block 24 and is welded to the test board 28 located at the bottom of the lower heat dissipation block 24 through solder joint 66. In addition, in order to ensure the electrical isolation and insulation performance of the test unit, a copper plate insulating sleeve 39 is provided on the outside of the section of the fixing seat clamping copper plate 38 that passes through the lower heat dissipation block slot 52.

[0085] The test board 28 also includes test circuit components 65 and test board terminals 62 for further connection to external devices. Since the copper sheet 38 held by the mounting base and the test board terminals 62 are soldered to the test board 28 via through-hole insertion, a certain gap needs to be maintained between the test board 28 and the device base 11 when fixing it. Therefore, in the test board 28 fixing structure of this application, a test board limiting post 64 is provided between the test board 28 and the device base 11, forming a gap with a height equal to that of the test board limiting post 64 after fixing.

[0086] in, Figure 16 The number 63 indicates the test board fixing screw.

[0087] In summary, this application provides an apparatus for electrical performance testing and high-temperature aging testing of high power density module products, including a high power density module 30, a high-current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit; it can meet the reliability requirements of long-term repeated high-current clamping of new generation high power density module products during electrical performance testing and high-temperature aging testing, while also meeting the requirements of heat dissipation, temperature measurement, and control of new generation high power density module products during electrical performance testing and high-temperature aging testing.

[0088] The device for electrical performance testing and high-temperature aging testing of high-power-density module products provided in this application includes a high-current clamping structure to meet the reliability requirements of repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of the new generation of high-power-density module products. The high-current clamping structure comprises a movable base and a fixed base, both of which include clamping elastic components (elastic component 32 in the movable base and elastic component 33 in the fixed base). In the clamping state, a large-area elastic compression contact can be formed between the module lead-out pins 31 of the high-power-density module 30 of this application (specifically, the clamping copper sheet in the elastic component forms a large-area elastic compression contact with the pin), meeting the high-current overcurrent requirements of the high-power-density module products of this application. The clamping force of the elastic component is generated by an internally installed spring 42. Since the spring 42 operates in the linear elastic region, the clamping force generated by the spring 42 is controllable and stable, and can be repeatedly clamped for a long time without significant attenuation, meeting the reliability requirements of repeated clamping of high-current pins during electrical performance testing and high-temperature aging testing of the new generation of high-power-density module products.

[0089] The device for electrical performance testing and high-temperature aging testing of high-power density module products provided in this application incorporates a vertical clamping structure and a double-sided heat dissipation structure. This structure meets the heat dissipation requirements of next-generation high-power density module products operating under high-heat conditions during electrical performance testing and high-temperature aging testing, thus stabilizing the product's casing temperature. In the double-sided heat dissipation structure of this application, the upper heat sink 17 and the lower heat sink protrusion 25 form contact heat dissipation structures with the upper and lower surfaces of the high-power density module 30, respectively. During electrical performance testing or high-temperature aging testing, the double-sided heat dissipation structure can promptly transfer the heat released by the product to the heat sink, stabilizing the product's casing temperature. Simultaneously, the vertical clamping structure of this application is equipped with a clamping structure elastic component 15. When the clamping structure pull rod 13 is pulled down, the elastic force of the clamping structure elastic component 15 ensures a tight elastic contact between the high-power density module 30 and the upper heat sink 17 and the lower heat sink protrusion 25. Based on the elastic force of the spring 42 inside the elastic component, the pressure applied to the module by the vertical pressing structure is controllable. This ensures that the heat sink and the module surface form a tight heat dissipation contact, while preventing damage to the module squeezed between the upper and lower heat sinks due to excessive pressure.

[0090] The device for electrical performance testing and high-temperature aging testing of high-power-density module products provided in this application incorporates a double-sided temperature measurement structure. This structure allows for real-time temperature measurement and monitoring of the upper and lower surfaces of the new generation of high-power-density module products during electrical performance testing and high-temperature aging testing. Based on the test data, the product's casing temperature can be precisely adjusted and set. In the double-sided temperature measurement structure of this application, the upper temperature measuring component 53 and the lower temperature measuring component 54 form tight elastic contact with the upper and lower surfaces of the high-power-density module 30, respectively. They are then connected to the upper temperature controller 19 and the lower temperature controller 27 via the upper temperature measuring line 56 and the lower temperature measuring line 57, respectively. The spring structure inside the temperature measuring component, after being pressed by the vertical clamping structure of this device, ensures that the temperature probe 58 forms a tight elastic compression contact with the module surface, achieving accurate acquisition of the temperature of the upper and lower surfaces of the module. It also ensures that the vertical clamping process will not damage the module or the temperature probe 58, meeting the reliability requirements for long-term repeated use of the temperature measuring structure.

[0091] The above provides a detailed description of the device for electrical performance testing and high-temperature aging testing of high power density module products provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

[0092] It should be noted that each embodiment in this specification focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0093] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that elements inherent in a process, method, article, or apparatus that includes a list of elements, or elements inherent to such processes, methods, articles, or apparatus, are also included. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0094] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for high power density module product electrical performance testing and high temperature burn-in testing, characterized in that, The device for electrical performance testing and high-temperature aging test of the high power density module product includes: a high power density module, a high current clamping structure, a vertical pressing structure, a double-sided heat dissipation structure, a double-sided temperature measurement structure, and a product testing unit. The high-current clamping structure includes a movable clamping structure seat, a fixed clamping structure seat, a clamping structure slide rail, and a clamping structure pull rod. The movable clamping structure seat and the fixed clamping structure seat are respectively provided with elastic components for the movable seat and the fixed seat. After the clamping structure pull rod is pulled together, the module lead-out pins of the high power density module are elastically clamped. The vertical pressing structure includes a device base, a pressing structure column, a pressing structure pull rod, a pressing structure pressure plate, an upper heat sink, a clamping structure fixing seat, a lower heat sink, a pressing structure elastic component, and a device support column. The upper heat sink is suspended from the pressing structure pressure plate by the pressing structure elastic component. The pressing structure pressure plate is fixed to the pressing structure column, the pressing structure column is fixed to the device base, and the lower heat sink is fixed to the clamping structure fixing seat. The clamping structure fixing seat is fixed to the device base by the device support column. After the pressing structure pull rod is pulled down, the upper and lower heat sinks respectively form elastic compression contact with the upper and lower surfaces of the high power density module. The double-sided heat dissipation structure includes an upper heat sink, a lower heat sink, an upper cooling fan, a lower cooling fan, and fan fixing screws; the upper cooling fan and the lower cooling fan are respectively fixed to the upper heat sink and the lower heat sink by the fan fixing screws; the lower heat sink is provided with a lower heat sink boss, the upper heat sink contacts the upper surface of the high power density module, and the lower heat sink boss contacts the lower surface of the high power density module; The dual-sided temperature measurement structure includes an upper temperature measuring component, a lower temperature measuring component, an upper temperature measuring wire, a lower temperature measuring wire, an upper temperature controller, a lower temperature controller, a temperature controller fixing screw, a device base, an upper heat sink, and a lower heat sink. The upper temperature controller and the lower temperature controller are respectively fixed to the upper heat sink and the device base by the temperature controller fixing screw. The upper temperature measuring component and the lower temperature measuring component form elastic contact with the upper and lower surfaces of the high power density module, and are then connected to the upper temperature controller and the lower temperature controller via the upper temperature measuring wire and the lower temperature measuring wire, respectively. The product testing unit includes module lead-out pins, movable seat holding copper plates, fixed seat holding copper plates, a test board, and test board terminals. The module lead-out pins are connected to the test board by being clamped and connected by the movable seat holding copper plates and the fixed seat holding copper plates, and are led out by the test board terminals.

2. The apparatus for testing electrical performance and high temperature burn-in of high power density module products according to claim 1, wherein, The movable seat elastic component includes a movable seat clamping copper sheet, and the fixed seat elastic component includes a fixed seat clamping copper sheet. The movable seat elastic component and the fixed seat elastic component further include: a spring, a clamping structure front baffle, and a clamping structure rear baffle. After the front baffle and the rear baffle of the clamping structure are fixed by screws, they limit and fix the copper sheet clamped by the movable seat and the copper sheet clamped by the fixed seat; the spring is located between the copper sheet clamped by the movable seat and the rear baffle of the clamping structure in the elastic component of the movable seat, and also between the copper sheet clamped by the fixed seat and the rear baffle of the clamping structure in the elastic component of the fixed seat.

3. The apparatus for testing electrical performance and high temperature burn-in of high power density module products according to claim 1, wherein, The elastic component of the clamping structure includes a spring and an elastic component screw. The elastic component screw passes through the elastic component screw through hole of the pressing structure plate and is fixedly connected to the upper heat sink; the spring is located between the pressing structure plate and the upper heat sink.

4. The apparatus for testing electrical performance and high temperature burn-in of high power density module products of claim 1, wherein, The upper temperature measuring component and the lower temperature measuring component include a temperature measuring structure limiting platform, a temperature measuring structure through hole, a temperature measuring probe, a spring, a temperature measuring structure pressure plate, and temperature measuring structure pressure plate fixing screws; The temperature probe is located inside the through hole of the temperature measuring structure. One end used for temperature testing is limited by the limiting platform of the temperature measuring structure. The other end of the temperature probe in the upper temperature measuring component is connected to the upper temperature measuring line, and the other end of the temperature probe in the lower temperature measuring component is connected to the lower temperature measuring line. The spring is provided between the temperature probe and the temperature measuring structure pressure plate; The temperature measuring structure pressure plate is fixed by the temperature measuring structure pressure plate fixing screws.

5. The apparatus for testing electrical performance and high temperature burn-in of high power density module products of claim 1, wherein, The upper and lower temperature measuring lines are flexible test lines.

6. The apparatus for testing electrical performance and high temperature burn-in of high power density module products of claim 1, wherein, The lower temperature measuring line is an L-shaped temperature measuring line, and the lower temperature controller is located in an area other than below the lower heat sink by bending the L-shaped temperature measuring line.

7. The apparatus for testing electrical performance and high temperature burn-in of high power density module products of claim 1, wherein, The pressing structure has an opening on its pressure plate, through which data is read from the upper temperature controller located below.

8. The apparatus for electrical performance testing and high-temperature aging testing of high power density module products according to claim 1, characterized in that, The lower heat sink has a slot, and the fixing seat holds the copper sheet through the slot.

9. The apparatus for electrical performance testing and high-temperature aging testing of high power density module products according to claim 1, characterized in that, The copper sheet held by the fixing seat is provided with a copper sheet insulating sleeve.

10. The apparatus for testing electrical performance and high temperature burn-in of high power density module products of claim 1, wherein, The test plate is fixed on the device base, and a test plate limiting post is provided between the test plate and the device base.

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