Three-dimensional staggered flow channel heat dissipation structure of immersion liquid-cooled supercomputing battery cell array

Abstract

This utility model relates to the field of heat dissipation technology for supercomputing equipment, specifically a three-dimensional staggered flow channel heat dissipation structure for an immersion liquid-cooled supercomputing cell array. It includes a housing and cell units housed within it. The housing also contains a lower liquid channel and an upper liquid channel. The lower liquid channel includes a coolant inlet, an inlet connecting pipe connected to the coolant inlet, and multiple lower cooling flat tubes connected to the inlet connecting pipe. Each pair of adjacent lower cooling flat tubes is connected by multiple lower connecting pipes. The three-dimensional staggered flow channel, composed of lower cooling flat tubes, upper cooling flat tubes, and vertical flat tubes, combined with the lower and upper connecting pipes, achieves uniform multi-directional coolant flow. The heat-conducting fins on the cooling flat tubes expand the heat exchange area. Simultaneously, multiple sets of inlet and outlet connecting pipes optimize the distribution and collection of the coolant flow, effectively solving the problems of uneven coolant distribution and low heat exchange efficiency in traditional heat dissipation methods.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for supercomputing equipment, specifically to a three-dimensional staggered flow channel heat dissipation structure for an immersion liquid-cooled supercomputing battery cell array. Background Technology

[0002] As supercomputing technology rapidly advances towards high density and high computing power, its core battery cell array generates a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, it will not only cause the battery cell operating temperature to rise, affecting computational efficiency and stability, but may also shorten the battery cell's lifespan and even pose safety hazards. Therefore, efficient heat dissipation has become a critical requirement for the stable operation of supercomputing systems. In existing technologies, conventional liquid cooling structures are mostly single-planar flow channel designs, resulting in uneven distribution of coolant within the channels, easily leading to localized heat dissipation dead zones, and limited heat exchange contact area with the battery cell units. This cannot fully meet the comprehensive and efficient heat dissipation requirements of high-density battery cell arrays. Therefore, this invention proposes a three-dimensional staggered flow channel heat dissipation structure for immersion liquid-cooled supercomputing battery cell arrays to solve the above problems. Utility Model Content

[0003] The purpose of this invention is to provide a three-dimensional interlaced flow channel heat dissipation structure for an immersion liquid-cooled supercomputing battery cell array. By constructing an interlaced flow channel system on the upper and lower sides and in the vertical direction, the coolant is evenly distributed, the heat exchange area is expanded, and heat dissipation dead zones are eliminated, thereby solving the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a three-dimensional staggered flow channel heat dissipation structure for an immersion liquid-cooled supercomputing cell array, including a housing and cell units disposed therein, wherein the housing is further provided with a lower liquid channel and an upper liquid channel;

[0005] The lower liquid passage includes a coolant inlet, an inlet connecting pipe connected to the coolant inlet, and multiple lower cooling flat pipes connected to the inlet connecting pipe. Each pair of adjacent lower cooling flat pipes are connected by multiple lower connecting pipes.

[0006] The upper liquid path includes a coolant outlet, a liquid outlet connecting pipe connected to the coolant outlet, and multiple upper cooling flat pipes connected to the liquid outlet connecting pipe. Each pair of adjacent upper cooling flat pipes are connected by multiple upper connecting pipes.

[0007] The lower liquid passage and the upper liquid passage are connected by a vertical flat tube. The lower end of the vertical flat tube is connected to the lower cooling flat tube through a second connecting tube, and the upper end is connected to the upper cooling flat tube through a first connecting tube.

[0008] Preferably, both the lower and upper cooling flat tubes are provided with heat-conducting fins, and the heat-conducting fins are all located on the side of the cooling flat tubes closest to the battery cell unit.

[0009] Preferably, the lower connecting pipes are evenly spaced along the length of the lower cooling flat pipe, and the upper connecting pipes are evenly spaced along the length of the upper cooling flat pipe.

[0010] Preferably, the upper cooling flat tube and the lower cooling flat tube are symmetrically distributed about the horizontal center line inside the housing.

[0011] Preferably, among the plurality of lower cooling flat tubes, a plurality of second connecting tubes are connected to one of the lower cooling flat tubes furthest from the coolant inlet.

[0012] Preferably, among the plurality of upper cooling flat tubes, one upper cooling flat tube furthest from the coolant outlet is connected to a plurality of first connecting tubes.

[0013] Preferably, the plurality of first connecting pipes correspond to the plurality of second connecting pipes respectively, and each pair of corresponding first connecting pipes and second connecting pipes is connected by a vertical flat pipe.

[0014] Preferably, there are multiple inlet pipes and multiple outlet pipes. Multiple inlet pipes are used to evenly distribute coolant to each lower cooling flat pipe, and multiple outlet pipes are used to collect coolant flowing out from the upper cooling flat pipe.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] By setting up a three-dimensional staggered flow channel composed of lower cooling flat tubes, upper cooling flat tubes and vertical flat tubes, and with the lower connecting pipe and upper connecting pipe, the coolant can flow evenly in multiple directions. Combined with the heat-conducting fins on the cooling flat tubes to expand the heat exchange area, and by using multiple sets of liquid inlet connecting pipes and liquid outlet connecting pipes to optimize the distribution and collection of liquid flow, the problem of uneven coolant distribution, many heat dissipation dead zones and low heat exchange efficiency in traditional heat dissipation is effectively solved, thus improving the heat dissipation stability and efficiency of the supercomputing cell array. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the battery cell unit structure of this utility model.

[0019] Figure 3 This is a schematic diagram of the upper cooling flat tube structure of this utility model.

[0020] Figure 4 This is a schematic diagram of the lower cooling flat tube structure of this utility model.

[0021] Figure 5 This is a schematic diagram of the heat-conducting fin structure of this utility model.

[0022] In the diagram: 1. Housing; 2. Coolant outlet; 3. Outlet connecting pipe; 4. Upper cooling flat tube; 5. Upper connecting pipe; 6. First connecting pipe; 7. Vertical flat tube; 8. Second connecting pipe; 9. Lower cooling flat tube; 10. Lower connecting pipe; 11. Inlet connecting pipe; 12. Coolant inlet; 13. Heat-conducting fins; 14. Battery cell unit. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] Please see Figures 1 to 5 This utility model provides a technical solution: a three-dimensional staggered flow channel heat dissipation structure for an immersion liquid-cooled supercomputing cell array, including a housing 1 and cell units 14 disposed inside it. In the lower liquid channel, the coolant inlet 12 is connected to an external coolant supply system. The coolant inlet 12 is fixed to one side of the housing 1 and is connected to at least two liquid inlet pipes 11. The liquid inlet pipes 11 extend horizontally along the width direction of the housing 1, and the end of each liquid inlet pipe 11 away from the coolant inlet 12 is vertically connected to the corresponding lower cooling flat pipe 9.

[0026] like Figure 2 As shown, between every two adjacent lower cooling flat tubes 9, multiple lower connecting tubes 10 are welded perpendicularly along their length direction, and the side surface of the lower cooling flat tube 9 facing the battery cell unit 14 is processed with heat-conducting fins 13 with a height of 5-8mm by an integral molding process.

[0027] like Figure 3As shown, in the upper liquid path, the coolant outlet 2 is fixed on the housing 1 and connected to at least two outlet pipes 3. The outlet pipes 3 and the inlet pipes 11 are symmetrically distributed, and the end of each outlet pipe 3 away from the coolant outlet 2 is vertically connected to the corresponding upper cooling flat pipe 4. The number of upper cooling flat pipes 4 is the same as that of lower cooling flat pipes 9, and they are symmetrical about the horizontal center line inside the housing 1.

[0028] Between each two adjacent upper cooling flat tubes 4, multiple upper connecting tubes 5 are also welded vertically along the length direction. The surface of the upper cooling flat tube 4 facing the battery cell unit 14 is also integrally formed with heat-conducting fins 13 that are the same as the lower structure.

[0029] like Figure 4 As shown, five second connecting pipes 8 are evenly welded along the length of a lower cooling flat pipe 9 away from the coolant inlet 12. Five first connecting pipes 6 are welded to an upper cooling flat pipe 4 away from the coolant outlet 2, corresponding to the positions of the second connecting pipes 8. Each first connecting pipe 6 is connected to the corresponding second connecting pipe 8 through a vertical flat pipe 7. The two ends of the vertical flat pipe 7 are welded and fixed to the first connecting pipe 6 and the second connecting pipe 8, respectively, and the inner wall of the vertical flat pipe 7 is in communication with the inner walls of the first connecting pipe 6 and the second connecting pipe 8.

[0030] In addition, the inlet pipe 11, outlet pipe 3, lower cooling flat pipe 9, upper cooling flat pipe 4, and vertical flat pipe 7 are all made of 304 stainless steel, and the inner walls are polished to reduce the flow resistance of the coolant.

[0031] In use, the low-temperature coolant first enters the device through the coolant inlet 12, and then flows into the inlet pipe 11 connected to the coolant inlet 12. After being transported by the inlet pipe 11, the coolant enters the lower cooling flat tube 9. Since there are multiple lower connecting pipes 10 vertically connected between each two adjacent lower cooling flat tubes 9, and multiple heat-conducting fins 13 for enhancing heat exchange are connected to the lower cooling flat tubes 9, the coolant will absorb the heat transferred by the battery cell unit 14 during the flow through the lower cooling flat tubes 9. At the same time, it flows between adjacent lower cooling flat tubes 9 through the lower connecting pipes 10 to achieve comprehensive heat dissipation of the lower flow channel.

[0032] After the coolant completes its lower circulation, it flows into the second connecting pipe 8, which is connected to the lower cooling flat pipe 9. Then, it enters the vertical flat pipe 7, which is connected to the second connecting pipe 8. After being transported upward through the vertical flat pipe 7, the coolant enters the upper cooling flat pipe 4 on the upper side of the device through the first connecting pipe 6. Since there is an upper connecting pipe 5 connecting every two adjacent upper cooling flat pipes 4, the coolant will flow further in the upper flow channel formed by the upper cooling flat pipe 4 and the upper connecting pipe 5, continuously absorbing the remaining heat in the box 1. Finally, the coolant that has completed the heat exchange will collect in the outlet connecting pipe 3 and be discharged from the box 1 through the coolant outlet 2 connected to the outlet connecting pipe 3, thus realizing the heat dissipation circulation.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A three-dimensional staggered flow channel heat dissipation structure of an immersed liquid-cooled supercomputer battery cell array, comprising a box body (1) and a battery cell unit (14) arranged in the box body (1), characterized in that: The box (1) is also provided with a lower liquid passage and an upper liquid passage; The lower liquid path includes a coolant inlet (12), an inlet connecting pipe (11) connected to the coolant inlet (12), and a plurality of lower cooling flat pipes (9) connected to the inlet connecting pipe (11). Each pair of adjacent lower cooling flat pipes (9) are connected by a plurality of lower connecting pipes (10). The upper liquid path includes a coolant outlet (2), an outlet connecting pipe (3) connected to the coolant outlet (2), and multiple upper cooling flat pipes (4) connected to the outlet connecting pipe (3). Each pair of adjacent upper cooling flat pipes (4) are connected by multiple upper connecting pipes (5). The lower liquid passage and the upper liquid passage are connected by a vertical flat tube (7). The lower end of the vertical flat tube (7) is connected to the lower cooling flat tube (9) through a second connecting tube (8), and the upper end is connected to the upper cooling flat tube (4) through a first connecting tube (6).

2. The three-dimensional staggered flow channel heat sink structure of an immersed liquid-cooled supercomputing cell array according to claim 1, characterized in that: Both the lower cooling flat tube (9) and the upper cooling flat tube (4) are provided with heat-conducting fins (13), and the heat-conducting fins (13) are all located on the side of the cooling flat tube close to the battery cell unit (14).

3. The three-dimensional staggered flow channel heat sink structure of an immersed liquid-cooled supercomputing cell array according to claim 1, characterized in that: The lower connecting pipe (10) is evenly spaced along the length of the lower cooling flat pipe (9), and the upper connecting pipe (5) is evenly spaced along the length of the upper cooling flat pipe (4).

4. The three-dimensional staggered flow channel heat dissipation structure of the immersion liquid-cooled supercomputing cell array according to claim 1, characterized in that: The upper cooling flat tube (4) and the lower cooling flat tube (9) are symmetrically distributed about the horizontal center line inside the box (1).

5. The three-dimensional staggered flow channel heat sink structure of an immersed liquid-cooled supercomputing cell array according to claim 1, characterized in that: In one of the plurality of lower cooling flat tubes (9), a plurality of second connecting tubes (8) are connected to one of the lower cooling flat tubes (9) that is away from the coolant inlet (12).

6. The three-dimensional staggered flow channel heat sink structure of an immersed liquid-cooled supercomputing cell array according to claim 1, characterized in that: In the plurality of the upper cooling flat tubes (4), a plurality of first connecting tubes (6) are connected to one of the upper cooling flat tubes (4) that is far from the coolant outlet (2).

7. The three-dimensional staggered flow channel heat sink structure of an immersed liquid-cooled supercomputing cell array according to claim 1, characterized in that: Multiple first connecting pipes (6) correspond to multiple second connecting pipes (8), and each pair of corresponding first connecting pipes (6) and second connecting pipes (8) is connected by a vertical flat pipe (7).

8. The three-dimensional staggered flow channel heat dissipation structure of the immersion liquid-cooled supercomputing cell array according to claim 1, characterized in that: The number of inlet pipes (11) and outlet pipes (3) are both multiple. Multiple inlet pipes (11) are used to evenly distribute coolant to each lower cooling flat pipe (9), and multiple outlet pipes (3) are used to collect coolant flowing out from the upper cooling flat pipe (4).

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