Display device

Abstract

This application provides a display device, relating to the field of display technology. In the display module, the display panel includes opposing light-emitting and non-light-emitting surfaces. A backlight is disposed on the non-light-emitting surface. A flexible circuit board is electrically connected to the display panel, and the flexible circuit board includes a first connecting portion bent to the side of the backlight away from the display panel. A middle frame is disposed on the side of the backlight away from the display panel, and the middle frame includes a through-hole. The first connecting portion extends from the side of the middle frame near the display panel, through the first opening, to the side of the middle frame away from the display panel. A heat sink is disposed between the backlight and the first connecting portion. The orthographic projection of the heat sink on the display panel does not overlap with the orthographic projection of the first opening on the display panel. The heat sink avoids the first opening, creating a larger bending space, which can buffer the stress caused by bending through the hole, helping to avoid squeezing the backlight and thus improving white spot or white patch problems.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] Currently, with the trend towards lower costs in terminal devices, the deformation resistance of the frame is decreasing, reducing its protective performance for the display module. Furthermore, the width of flexible circuit boards is gradually increasing, leading to increased bending stress. During assembly and mechanical testing, the flexible circuit board releases stress, causing pressure on the display module at the perforated locations, which can result in white spots or patches, affecting product yield. Utility Model Content

[0003] This application proposes a display device designed to reduce stress on flexible circuit boards and improve the problem of white spots or white patches.

[0004] The display device includes a display module, a mid-frame, and a heat sink.

[0005] The display module includes a display panel, a backlight, and a flexible circuit board. The display panel includes opposing light-emitting and non-light-emitting surfaces. The backlight is disposed on the non-light-emitting surface. The flexible circuit board is electrically connected to the display panel and includes a first connecting portion bent to the side of the backlight away from the display panel.

[0006] The middle frame is located on the side of the backlight away from the display panel. The middle frame includes a through first opening. A first connecting portion extends from the side of the middle frame near the display panel, through the first opening, to the side of the middle frame away from the display panel.

[0007] The heat sink is positioned between the backlight and the first connecting part, and the orthographic projection of the heat sink on the display panel does not overlap with the orthographic projection of the first opening on the display panel.

[0008] In related technologies, the heat sink area is relatively large, and there is a situation where "the orthographic projection of the opening position of the flexible circuit board through the middle frame on the display panel is within the orthographic projection range of the heat sink on the display panel". That is, at the perforation position, the side of the flexible circuit board near the backlight is also provided with a heat sink. The presence of the heat sink restricts the bending space of the flexible circuit board through the perforation.

[0009] In this embodiment, the orthographic projection of the heat sink on the display panel does not overlap with the orthographic projection of the first opening on the display panel. That is, the heat sink avoids the first opening. At the corresponding position, there is a certain gap between the first connecting part and the backlight. This gap forms a larger bending space in the display device, which can buffer the stress formed by the bending of the perforation. This is conducive to the perforation of the first connecting part, avoiding the squeezing of the backlight, thereby improving the white spot or white spot problem.

[0010] In some embodiments, the flexible circuit board further includes a main body portion bent to the side of the backlight away from the display panel, and a first connecting portion connected to the main body portion. The orthographic projection of the heat sink on the display panel at least partially overlaps with the orthographic projection of the main body portion on the display panel, and also partially overlaps with the orthographic projection of the first connecting portion on the display panel.

[0011] In some embodiments, the distance between the heat sink and the first opening is greater than or equal to 0.5 mm along a first direction parallel to the non-light-emitting surface. The distance between the heat sink and the first opening is also greater than or equal to 0.5 mm along a second direction parallel to the non-light-emitting surface, and the second direction intersects the first direction.

[0012] In some embodiments, the flexible circuit board further includes a main body portion and a second connecting portion bent to the side of the backlight away from the display panel, wherein both the first connecting portion and the second connecting portion are connected to the main body portion.

[0013] The mid-frame also includes a through second opening, and a second connecting portion extends from the side of the mid-frame near the display panel, through the second opening, to the side of the mid-frame away from the display panel. The second connecting portion includes a perforated portion, the orthographic projection of which onto the display panel is within the orthographic projection range of the second opening onto the display panel.

[0014] The edge of the perforated part is provided with a stress relief groove, which extends from the edge into the perforated part.

[0015] In some embodiments, the width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connection. Along the width direction of the perforation, the perforation includes two opposing edges, each edge of which is provided with a stress-relieving groove.

[0016] In some embodiments, the stress relief groove includes a semi-circular groove with a radius greater than or equal to 0.1 mm. Along the extending direction of the second connection, the opening size of the second opening is A, and the distance between the center of the semi-circular groove and the boundary of the second opening is B, then 0 ≤ B ≤ A.

[0017] In some embodiments, the stress relief groove includes a V-shaped groove with an included angle C between its two sides, where 0° < C < 180°. The bottom of the V-shaped groove is a semi-circular arc with a radius greater than or equal to 0.1 mm. Along the extending direction of the second connection, the opening size of the second opening is A, and the distance between the center of the semi-circular arc and the boundary of the second opening is D, where 0 ≤ D ≤ A.

[0018] In some embodiments, the stress relief groove includes a wavy groove with a continuous arc, the width of which is greater than 0 along the width direction of the perforation portion. The length of the wavy groove is greater than 0 along the extension direction of the second connection portion. If the opening size of the second opening is A along the extension direction of the second connection portion, and the boundary distance between the wavy groove and the second opening is E, then 0 ≤ E < 0.5A. The arc radius of the wavy groove is greater than 0, and the center distance between two adjacent arcs in the wavy groove is greater than 0.

[0019] In some embodiments, the stress relief groove includes a serrated groove with continuous serrations. The width of the serrations is greater than 0 along the width direction of the perforation portion. The length of the serrations is greater than 0 along the extension direction of the second connection portion. If the opening size of the second opening is A along the extension direction of the second connection portion, and the distance between the serrations and the boundary of the second opening is F, then 0 ≤ F < 0.5A. The included angle between the two sides of the serrations is greater than 0°, and the distance between two adjacent serrations in the serrated groove is greater than 0.

[0020] In some embodiments, the flexible circuit board further includes a main body portion and a second connecting portion bent to the side of the backlight away from the display panel, wherein both the first connecting portion and the second connecting portion are connected to the main body portion.

[0021] The mid-frame also includes a through second opening, and a second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel; the second connecting portion includes a perforated portion, and the orthographic projection of the perforated portion on the display panel is located within the orthographic projection range of the second opening on the display panel.

[0022] The perforated part has a through stress relief hole inside.

[0023] In some embodiments, the stress relief hole is shaped as an extended strip along the extending direction of the second connection.

[0024] The width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting part. Along the width direction of the perforation, the width of the stress-relieving hole is greater than 0. Along the extension direction of the second connecting part, the length of the stress-relieving hole is greater than 0. Along the extension direction of the second connecting part, the opening size of the second opening is A, and the boundary distance between the stress-relieving hole and the second opening is G; therefore, 0 ≤ G < 0.5A.

[0025] In some embodiments, the interior of the perforated portion is provided with a plurality of stress relief holes, which are arranged sequentially along the width direction of the perforated portion.

[0026] In some embodiments, along the extending direction of the second connection, the stress relief hole includes two opposing ends, and the adjacent ends of two adjacent stress relief holes are staggered.

[0027] In some embodiments, the perforated portion is provided with a plurality of stress relief holes. The width direction of the perforated portion is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting portion. The plurality of stress relief holes are arranged sequentially along the width direction of the perforated portion.

[0028] The stress relief hole is circular in shape, with a radius greater than or equal to 0.1 mm. Along the extension direction of the second connection, the opening size of the second opening is A, and the boundary distance between the stress relief hole and the second opening is H, then 0 ≤ H ≤ A.

[0029] In some embodiments, the flexible circuit board further includes a main body portion and a second connecting portion bent to the side of the backlight away from the display panel, wherein both the first connecting portion and the second connecting portion are connected to the main body portion.

[0030] The mid-frame also includes a through-hole second opening, and a second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel. Along the extending direction of the second connecting portion, the second opening includes opposing first and second boundaries, with the first boundary being closer to the main body than the second boundary.

[0031] The display device further includes a first buffer structure located on the side of the backlight away from the display panel, and the orthographic projection of the first buffer structure on the display panel overlaps at least with the orthographic projection of the first boundary on the display panel.

[0032] In some embodiments, the second connection portion includes a perforated portion, the orthographic projection of the perforated portion on the display panel being located within the orthographic projection range of the second opening on the display panel.

[0033] The width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting part. Along the width direction of the perforation, the width of the first buffer structure is greater than the width of the perforation and less than the width of the second opening.

[0034] Along the extending direction of the second connection, the first buffer structure includes a first edge and a second edge opposite to each other, the first edge being located between the first boundary and the second boundary, and the second edge being located on the side of the first boundary away from the second boundary.

[0035] Along the extension direction of the second connection, the opening size of the second opening is A, and the distance between the first edge and the first boundary is I1. Then I1≥0.5A, and the distance between the second edge and the first boundary is greater than or equal to 0.5mm.

[0036] In some embodiments, the flexible circuit board further includes a main body portion and a second connecting portion bent to the side of the backlight away from the display panel, wherein both the first connecting portion and the second connecting portion are connected to the main body portion.

[0037] The mid-frame also includes a through-hole second opening, and a second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel. Along the extending direction of the second connecting portion, the second opening includes opposing first and second boundaries, with the first boundary being closer to the main body than the second boundary.

[0038] The display device further includes a second buffer structure located on the side of the second connection portion closer to the display panel. The orthographic projection of the second buffer structure onto the display panel overlaps at least with the orthographic projection of the first boundary onto the display panel.

[0039] In some embodiments, the second connection portion includes a perforated portion, the orthographic projection of the perforated portion on the display panel being located within the orthographic projection range of the second opening on the display panel.

[0040] The width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting portion. Along the width direction of the perforation, the width of the second buffer structure is equal to the width of the perforation.

[0041] Along the extending direction of the second connection, the second buffer structure includes a third edge and a fourth edge opposite to each other, the third edge being located between the first boundary and the second boundary, and the fourth edge being located on the side of the first boundary away from the second boundary.

[0042] Along the extension direction of the second connection, the opening size of the second opening is A, the distance between the third edge and the first boundary is I2, then I2≥0.5A, and the distance between the fourth edge and the first boundary is greater than or equal to 0.5mm.

[0043] In some embodiments, the flexible circuit board further includes a main body portion and a second connecting portion bent to the side of the backlight away from the display panel, wherein both the first connecting portion and the second connecting portion are connected to the main body portion.

[0044] The mid-frame also includes a through second opening, and a second connecting portion extends from the side of the mid-frame closer to the display panel through the second opening to the side of the mid-frame away from the display panel.

[0045] Along the extending direction of the second connecting portion, the second opening includes opposing first and second sidewalls, with the first sidewall closer to the main body than the second sidewall. The mid-frame also includes a first surface near the display panel and a second surface away from the display panel. The first surface is connected to the first sidewall via a first inclined plane, and the second surface is connected to the second sidewall via a second inclined plane. The second connecting portion includes a through-hole, the orthographic projection of which onto the display panel is located within the orthographic projection range of the second opening onto the display panel.

[0046] In some embodiments, along the extending direction of the second connecting portion, the length of the first inclined surface is greater than or equal to 0.5 mm, and the length of the second inclined surface is greater than or equal to 0.5 mm. The angle between the first inclined surface and the first surface is J1, where 0° < J1 ≤ 30°. The angle between the second inclined surface and the second surface is J2, where 0° < J2 ≤ 30°. Along the direction perpendicular to the first surface, the maximum thickness of the middle frame is R, the thickness of the first sidewall is 1 / 2R, and the thickness of the second sidewall is 1 / 2R. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not actual dimensions of the products or actual processes of the methods involved in the embodiments of this application.

[0048] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0049] Figure 2 for Figure 1 The shown display device is a partial cross-sectional view along AA'.

[0050] Figure 3 for Figure 1 The image shown is a partial enlarged view of the display device at the first opening.

[0051] Figure 4A for Figure 1 The image shown is a first enlarged view of the perforated portion of the display device;

[0052] Figure 4B for Figure 1 The image shown is a second enlarged view of the perforated portion of the display device;

[0053] Figure 4C for Figure 1 The image shown is a third enlarged view of the perforated portion of the display device;

[0054] Figure 4D for Figure 1 The image shown is a fourth enlarged view of the perforated portion of the display device;

[0055] Figure 5A for Figure 1 The image shown is a fifth enlarged view of the perforated portion of the display device;

[0056] Figure 5B for Figure 1The image shown is a sixth enlarged view of the perforated portion of the display device;

[0057] Figure 6A for Figure 1 The image shown is a seventh enlarged view of the perforated portion of the display device;

[0058] Figure 6B for Figure 1 The image shown is an eighth enlarged view of the perforated portion of the display device;

[0059] Figure 7 for Figure 1 The image shown is a magnified view of a portion of the display device at the opening in the middle frame. Detailed Implementation

[0060] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0061] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and encompassing, that is, "including, but not limited to".

[0062] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0063] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. For example, in describing some embodiments, the term "connection" may be used to indicate that two or more components have direct physical or electrical contact with each other.

[0064] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0065] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0066] This document describes exemplary embodiments with reference to cross-sectional views, which are intended as idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations caused, for example, by manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0067] Currently, with the trend of lower cost of terminal devices, the cost of secondary materials for display devices is being reduced. The cost reduction of the whole device has led to a decrease in the protection capability of the display module. Whether in mechanical testing or in the assembly process, defects such as white spots or white patches have increased significantly.

[0068] Research indicates that this problem is primarily caused by two factors: First, the increased proportion and reduced thickness of the plastic in the overall frame result in decreased resistance to deformation, flatness, and cushioning performance, thus reducing the protective performance for the display module. Second, the merging of multiple flexible circuit boards with different functions in related technologies leads to a gradual increase in the width of the flexible circuit boards. A larger width requires a greater torque to withstand during bending, resulting in increased bending stress.

[0069] The flexible circuit board passes through the through-holes in the mid-frame, creating a Z-shaped height difference. When the display device is subjected to external force, the mid-frame has poor resistance to deformation, causing it to deform and compress the flexible circuit board. This deformation generates stress that compresses the backlight, damaging the light guide plate and film material inside the backlight, resulting in white spots or white patches. The wider the flexible circuit board, the greater the compressive force on the backlight, and the more concentrated the stress on the flexible circuit board, the more pronounced the compressive effect.

[0070] During the assembly process, due to the large width of the flexible circuit board and the existence of assembly tolerances, the flexible circuit board is prone to uneven deformation at the perforation position. One side stretches and stretches, while the other side sinks redundantly. The redundantly sunken side exerts initial pressure on the backlight, which is further squeezed in the subsequent pressure holding process, causing white spots or white patches.

[0071] Based on this, this application provides a display device, such as... Figures 1-2 As shown, Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shows a partial cross-sectional view of the display device along AA'.

[0072] like Figures 1-2 As shown, the display device includes a display module 1, a middle frame 2, and a heat sink 3.

[0073] The display module 1 includes a display panel 11, a backlight 12, and a flexible circuit board 13. The display panel 11 includes opposing light-emitting surfaces P1 and non-light-emitting surfaces P2, and the backlight 12 is disposed on the non-light-emitting surface P2. The flexible circuit board 13 is electrically connected to the display panel 11, and the flexible circuit board 13 includes a first connecting portion 131, which is located on the side of the backlight 12 away from the display panel 11.

[0074] For example, the display panel 11 includes an array substrate 111 and a color filter substrate 112 disposed opposite to each other. The array substrate 111 is used to receive pixel driving signals, thereby controlling the grayscale of the light emitted by the color filter substrate 112 to achieve image display. One end of the flexible circuit board 13 is electrically connected to the array substrate 111, and the other end is bent to the side of the backlight 12 away from the display panel 11 for electrical connection with the motherboard. A lower polarizer 101 is also disposed between the array substrate 111 and the backlight 12, and an upper polarizer 102 is also disposed on the side of the color filter substrate 112 away from the array substrate 111, as well as an optical adhesive layer 103 and a cover plate 104. The light in the backlight 12 is polarized by the display panel 11 and the polarizer, and finally emitted through the cover plate 104.

[0075] Combination Figure 1 and Figure 2 As shown, the middle frame 2 is located on the side of the backlight 12 away from the display panel 11. The middle frame 2 includes a through first opening K1, and a first connecting portion 131 extends from the side of the middle frame 2 near the display panel 11, through the first opening K1, to the side of the middle frame 2 away from the display panel 11. (Comparison) Figure 1 and Figure 2 Understandable, Figure 1 The middle frame 2 is omitted, and only the position of the opening is indicated by a dashed line, which is the position where the flexible circuit board 13 passes through the middle frame 2.

[0076] Combination Figure 1 and Figure 2 The heat sink 3 is disposed between the backlight 12 and the first connecting part 131, and the orthographic projection of the heat sink 3 on the display panel 11 does not overlap with the orthographic projection of the first opening K1 on the display panel 11.

[0077] For example, the material of the heat sink 3 includes graphite. In related technologies, the flexible circuit board 13 is electrically connected to the display panel 11 near the bottom bezel of the display device and bent to the back of the backlight 12, then passes through the middle frame 2 and is electrically connected to the motherboard. Due to the large area of ​​the heat sink 3, there is a situation where "the orthographic projection of the opening of the flexible circuit board 13 through the middle frame 2 onto the display panel 11 is within the orthographic projection range of the heat sink 3 onto the display panel 11". That is, at the perforation location, a heat sink 3 is also provided on the side of the flexible circuit board 13 near the backlight 12. The presence of the heat sink 3 restricts the bending space of the flexible circuit board 13 through the perforation, resulting in greater stress on the flexible circuit board 13 and greater pressure on the backlight 12. The light guide plate, reflector, diffuser, and other structures inside the backlight 12 are compressed, which can cause white spots or white patches.

[0078] In this embodiment, taking the perforation position of the first connecting part 131 (i.e., the first opening K1) as an example, the orthographic projection of the heat sink 3 on the display panel 11 does not overlap with the orthographic projection of the first opening K1 on the display panel 11. That is, the heat sink 3 avoids the first opening K1 position. At this corresponding position, there is a certain gap between the first connecting part 131 and the backlight 12. (Refer to...) Figure 2 A cross-sectional view of the flexible circuit board 13 passing through the middle frame 2. This gap creates a larger bending space within the display device, which can buffer the stress caused by the bending of the flexible circuit board 13 through the hole. This facilitates the perforation of the first connection part 131 and prevents it from squeezing the backlight 12, thereby improving the problem of white spots or white patches.

[0079] For example, such as Figure 1 As shown, the flexible circuit board 13 also includes a main body portion 130 bent to the side of the backlight 12 away from the display panel 11, and a first connecting portion 131 is connected to the main body portion 130. The orthographic projection of the heat sink 3 on the display panel 11 at least partially overlaps with the orthographic projection of the main body portion 130 on the display panel 11, and also partially overlaps with the orthographic projection of the first connecting portion 131 on the display panel 11.

[0080] In related technologies, the first connecting part 131 is used for electrical connection with the first motherboard, which is mainly responsible for battery charging and discharging, voltage conversion, power consumption control, etc. The main body 130 is located near the lower bezel of the display device, and the first motherboard is also located near the lower bezel of the display device. The first connecting part 131 passes through the first opening K1 of the middle frame 2 and is electrically connected to the first motherboard. The orthographic projection of the first opening K1 on the display panel 11 usually overlaps with the orthographic projection of the heat sink 3 on the display panel 11.

[0081] In this embodiment, the heat sink 3 avoids the perforation position of the first connecting part 131. Along the thickness direction of the display device, the bending space of the perforation of the first connecting part 131 is increased, which can buffer the stress formed by the bending of the perforation. This is beneficial to realize the electrical connection between the first connecting part 131 and the first motherboard and avoids squeezing the backlight 12 when passing through the middle frame 2.

[0082] This application studies the problems of white spots in the assembled device and the mechanical testing of the device through finite element simulation and physical verification. Finite element simulation involves creating a model of the frame and the entire device using existing display equipment, calculating the maximum compressive force exerted on the backlight by the flexible circuit board in the perforated area, and determining the effectiveness of the proposed solution by comparing the maximum compressive force values. Physical verification involves assembling the device to form a physical entity to confirm the visual effect of white spots or patches, classifying them into Level 1 (Lv) grades and comparing their proportions, and determining the effectiveness of the proposed solution by comparing the differences in white spot grades.

[0083] For example, the finite element simulation and physical verification results for the embodiments of this application are shown in Table 1 below:

[0084] Table 1

[0085]

[0086] Based on the above results, the simulation data trend matches the physical verification results. At the location where the first connecting part 131 passes through the middle frame 2, the white spot problem is significantly improved without increasing costs. This solution can be achieved through standard sizing processes and has no impact on the customer's overall machine.

[0087] In some embodiments, such as Figure 3 As shown, Figure 3 for Figure 1 The diagram shows a partial enlarged view of the display device at the first opening. Along the first direction X, parallel to the non-light-emitting surface P2, the distance X1 between the heat sink 3 and the first opening K1 is greater than or equal to 0.5 mm. Along the second direction Y, parallel to the non-light-emitting surface P2, the distance Y1 between the heat sink 3 and the first opening K1 is greater than or equal to 0.5 mm. The second direction Y intersects the first direction X.

[0088] This dimensional design ensures that the heat sink 3 and the first opening K1 avoid each other within the manufacturing tolerances, so that the orthographic projection of the heat sink 3 on the display panel 11 does not overlap with the orthographic projection of the first opening K1 on the display panel 11. This creates a larger bending space for the perforation bending of the first connecting part 131, buffering the stress generated by the perforation bending and preventing it from compressing the backlight 12, thereby improving the white spot or white spot problem. Furthermore, it ensures a larger area for the heat sink 3, guaranteeing heat dissipation and preventing severe temperature rise during display device operation, which helps ensure product reliability.

[0089] In some embodiments, such as Figure 1 As shown, the flexible circuit board 13 also includes a main body portion 130 and a second connecting portion 132 that are bent to the side of the backlight 12 away from the display panel 11. Both the first connecting portion 131 and the second connecting portion 132 are connected to the main body portion 130.

[0090] It is understood that the first connecting part 131 and the second connecting part 132 are not specifically limited here. Both of them pass through the middle frame 2 and are then electrically connected to the corresponding motherboard to achieve the corresponding functions. It is understood that the technical solutions in this application are applicable to improving the white spot problem caused by the perforation and bending of the first connecting part 131, and also applicable to improving the white spot problem caused by the perforation and bending of the second connecting part 132.

[0091] Combination Figure 1 This application uses the example of "the first connection part 131 is used to electrically connect with the first motherboard, the first motherboard is mainly responsible for battery charging and discharging, voltage conversion, power consumption control, etc., and the second connection part 132 is used to electrically connect with the second motherboard, the second motherboard is mainly responsible for data processing, communication control, etc." for explanation and description.

[0092] like Figures 1-2 As shown, the middle frame 2 also includes a through second opening K2, and the second connecting portion 132 extends from the side of the middle frame 2 near the display panel 11 through the second opening K2 to the side of the middle frame 2 away from the display panel 11. The second connecting portion 132 includes a perforation portion 133, and the orthographic projection of the perforation portion 133 on the display panel 11 is located within the orthographic projection range of the second opening K2 on the display panel 11.

[0093] like Figures 4A to 4D As shown, Figure 4A for Figure 1 The image shown is a first enlarged view of the perforated portion of the display device. Figure 4B for Figure 1 The image shown is a second enlarged view of the perforated portion of the display device. Figure 4C for Figure 1 The image shown is a third enlarged view of the perforated portion of the display device. Figure 4D for Figure 1 The image shown is a fourth enlarged view of the perforated portion of the display device.

[0094] The edge of the perforated portion 133 is provided with a stress relief groove, which extends from the edge into the perforated portion 133.

[0095] At the location corresponding to the stress relief groove, the width of the perforation 133 is reduced, which decreases the torque required during bending and thus reduces bending stress. Furthermore, the groove structure of the stress relief groove disperses stress to the edge of the groove, alleviating stress concentration and helping to reduce the compressive force caused by bending.

[0096] For example, such as Figures 4A to 4D As shown, the width direction of the perforated portion 133 is parallel to the non-light-emitting surface P2 and intersects the extending direction of the second connecting portion 132. Along the width direction of the perforated portion 133, the perforated portion 133 includes two opposing edges, and stress relief grooves are provided on both edges of the perforated portion 133.

[0097] The stress relief grooves at the two edges are symmetrically arranged, which makes the stress distribution uniform and symmetrical, and helps to improve the uneven deformation during the installation process, and helps to avoid redundant sinking on one side of the flexible circuit board 13.

[0098] For example, such as Figure 4A As shown, the stress relief groove includes a semi-circular groove with a radius R1 greater than or equal to 0.1 mm. Theoretically, the larger the radius R1 of the semi-circular groove, the better the stress relief effect. That is, the larger the radius R1 of the semi-circular groove, the smaller the width of the perforation 133, the smaller the bending stress, and the less likely it is to undergo uneven deformation. However, a smaller width of the perforation 133 is not conducive to its internal wiring design. Preferably, the radius R1 of the semi-circular groove is 0.5 mm, which is beneficial to the process implementation and does not affect the internal wiring space.

[0099] Along the extending direction of the second connecting portion 132, the opening size of the second opening K2 is A, and the distance between the center of the semi-circular groove and the boundary of the second opening K2 is B, then 0 ≤ B ≤ A. Preferably, B = 0.5A, that is, along the extending direction of the second connecting portion 132, the stress relief groove is centrally located, which helps to avoid stress concentration near one of the bending lines in the "Z-shaped" bend. In other words, centrally located stress relief groove helps to ensure uniform stress distribution and better achieve the bending effect.

[0100] For example, such as Figure 4B As shown, the stress relief groove includes a V-shaped groove with an included angle C between the two sides, where 0° < C < 180°. Finite element simulation shows that the stress relief effect is best when C = 120°, meaning the pressure on the backlight 12 is minimized, which is most effective in improving the white spot problem.

[0101] The bottom of the V-groove is a semi-circular arc, which helps prevent stress concentration at the bottom of the V-groove, thus helping to avoid cracking along the width direction. The radius R2 of the semi-circular arc is greater than or equal to 0.1 mm. Preferably, considering process tolerances, the radius R2 of the semi-circular arc can be set to 0.2 mm.

[0102] Along the extending direction of the second connecting portion 132, the opening size of the second opening K2 is A, and the distance between the center of the semicircular arc and the boundary of the second opening K2 is D, then 0 ≤ D ≤ A. Preferably, D = 0.5A, that is, along the extending direction of the second connecting portion 132, the stress relief groove is centrally located, which helps to avoid stress concentration near one of the bending lines in the "Z-shaped" bend. In other words, centrally located stress relief groove helps to ensure uniform stress distribution and achieve a better bending effect.

[0103] For example, such as Figure 4C As shown, the stress relief groove includes a wavy groove with a continuous arc. Along the width direction of the perforation portion 133, the width L1 of the wavy groove is greater than 0. The larger the width L1 of the wavy groove, the smaller the width of the perforation portion 133, resulting in lower bending stress and less likelihood of uneven deformation. However, a smaller width of the perforation portion 133 is detrimental to its internal wiring design. Preferably, for example, L1 = 0.5 mm, which is beneficial for process implementation without affecting the internal wiring space.

[0104] Along the extending direction of the second connecting part 132, the opening size of the second opening K2 is A, the length L2 of the wavy groove is greater than 0, and the boundary distance between the wavy groove and the second opening K2 is E. Then, 0 ≤ E < 0.5A. The radius R3 of the wavy groove is greater than 0, and the center distance L3 between two adjacent arcs in the wavy groove is greater than 0.

[0105] The stress is distributed along the edge of the stress relief groove. The larger the length L2 of the corrugated groove, the more dispersed the stress, which helps to alleviate stress concentration. Preferably, L2 = A, that is, the length L2 of the corrugated groove is equal to the opening size, in which case E = 0. Along the extension direction of the second connecting part 132, the corrugated groove includes n periodically repeating waves. The center distance L3 between two adjacent arcs in the corrugated groove corresponds to one cycle of waves, that is, L3 = L2 / n. For example, L3 can be set to 0.5mm for process implementation.

[0106] The arc R3 of the wavy groove is matched with the width L1 of the wavy groove so that the edge of the wavy groove is smooth and even, thereby ensuring uniform stress distribution, achieving stress release effect, and reducing the squeezing force on the backlight 12.

[0107] For example, such as Figure 4D As shown, the stress relief groove includes a serrated groove with continuous serrations. Along the width direction of the perforation portion 133, the width L4 of the serrations is greater than 0. The larger the serration width L4, the smaller the width of the perforation portion 133, resulting in lower bending stress and less likelihood of uneven deformation. However, a smaller width of the perforation portion 133 is detrimental to its internal wiring design. Preferably, for example, L4 = 0.5 mm, which is beneficial for process implementation without affecting the internal wiring space.

[0108] Along the extending direction of the second connecting part 132, the opening size of the second opening K2 is A, the length L5 of the sawtooth is greater than 0, and the boundary distance between the sawtooth and the second opening K2 is F. Then, 0 ≤ F < 0.5A. The included angle C0 on both sides of the sawtooth is greater than 0°, and the distance L6 between two adjacent sawtooths in the sawtooth groove is greater than 0.

[0109] The stress is distributed along the edge of the serrated groove. The larger the length L5 of the serration, the more dispersed the stress, which helps to alleviate stress concentration. Preferably, L5 = A, that is, the length L5 of the serration is equal to the opening size, in which case F = 0. Along the extension direction of the second connecting part 132, the serrated groove includes n periodically repeating serrations. The distance between two adjacent serrations in the serrated groove is L6 = L5 / n. For example, L6 can be set to 0.5mm for process implementation. Through finite element simulation, the stress release effect is best when C0 = 120°, that is, the squeezing force on the backlight 12 is minimized, which is most effective in improving the white spot problem.

[0110] The finite element simulation and physical verification results for the four stress relief grooves described above are shown in Table 2 below:

[0111] Table 2

[0112]

[0113] Based on the above results, the simulation data trend is consistent with the physical verification results. The position where the flexible circuit board 13 passes through the middle frame 2 and the squeezing force of the flexible circuit board 13 on the backlight 12 are reduced, thus improving the white spot problem. Furthermore, the stress relief groove can be cut using existing conventional die-cutting processes, without affecting the production cost or the overall performance of the customer's machine.

[0114] Alternatively, in some embodiments, such as Figures 5A-5B As shown, Figure 5A for Figure 1 The image shown is a fifth enlarged view of the perforated portion of the display device. Figure 5B for Figure 1 The image shown is a sixth enlarged view of the perforated portion of the display device, where a stress relief hole is provided inside the perforated portion 133.

[0115] That is, stress relief holes are formed through the flexible circuit board 13 inside the perforated portion 133, in areas without trace design. On the one hand, along the width direction, due to the setting of stress relief holes, the effective width of the perforated portion 133 is reduced when bending, and the torque that needs to be borne during bending is reduced, thereby reducing bending stress. On the other hand, the setting of stress relief holes also disperses some stress to the hole wall, alleviating the problem of stress concentration and helping to reduce the compressive force caused by bending.

[0116] For example, such as Figure 5A As shown, along the extending direction of the second connecting portion 132, the stress relief hole is an extended strip shape.

[0117] The width direction of the perforation 133 is parallel to the non-light-emitting surface P2 and intersects the extension direction of the second connecting portion 132. Along the width direction of the perforation 133, the width L7 of the stress relief hole is greater than 0. Theoretically, the larger the width L7 of the stress relief hole, the smaller the effective width of the perforation 133 during bending, the smaller the torque required during bending, and the smaller the bending stress. Furthermore, on both sides of the stress relief hole, the flexible circuit board 13 can be considered as two separate parts, each with a small width, making uneven deformation less likely. However, to ensure the internal wiring design of the flexible circuit board 13, the width L7 of the stress relief hole should not be too large. Preferably, the width L7 of the stress relief hole is 0.5 mm, which is beneficial for process implementation and does not affect the internal wiring space.

[0118] Along the extending direction of the second connecting portion 132, the opening size of the second opening K2 is A, the length L8 of the stress relief hole is greater than 0, and the boundary distance between the stress relief hole and the second opening K2 is G, then 0 ≤ G < 0.5A. Preferably, L8 = A, at which point G = 0, that is, the length L8 of the stress relief hole is equal to the opening size of the second opening K2. Within the range corresponding to the second opening K2, the bending stress of the second connecting portion 132 is released by the stress relief hole, the stress is small, and the squeezing force on the backlight 12 is small.

[0119] Along the extension direction of the second connecting portion 132, the two ends of the stress relief hole are rounded, preferably with an arc radius R5 = 0.5L7. The rounded corner design can avoid stress concentration and help prevent cracks from forming in the flexible circuit board 13.

[0120] In some embodiments, such as Figure 5A As shown, when there is sufficient space for internal wiring in the flexible circuit board 13, multiple stress relief holes can also be provided inside the through hole 133, and the multiple stress relief holes are arranged sequentially along the width direction of the through hole 133.

[0121] The more stress relief holes there are, the smaller the bending stress, which is more conducive to reducing the squeezing force of the flexible circuit board 13 on the backlight 12, thereby improving the white spot problem.

[0122] For example, such as Figure 5A As shown, along the extending direction of the second connecting portion 132, the stress relief hole includes two opposing ends, and the adjacent ends of two adjacent stress relief holes are staggered.

[0123] For example, the perforated portion 133 is provided with two stress relief holes of different lengths. The two holes are arranged alternately at equal intervals along the width direction of the perforated portion 133. Both stress relief holes of different lengths are centered along the extension direction of the second connecting portion 132. Based on this, the staggered distance between the close ends of two adjacent stress relief holes is L9. The staggered distance L9 is greater than or equal to 0.2mm. Preferably, through finite element simulation, when L9 = 0.5mm, the stress relief effect is the best, that is, the squeezing force on the backlight 12 is the smallest, and the effect on improving the white spot problem is the best.

[0124] In some embodiments, such as Figure 5B As shown, the perforated portion 133 has multiple stress relief holes inside. The width direction of the perforated portion 133 is parallel to the non-light-emitting surface P2 and intersects the extension direction of the second connecting portion 132. The multiple stress relief holes are arranged sequentially along the width direction of the perforated portion 133.

[0125] The stress relief hole is circular in shape, with a radius R6 greater than or equal to 0.1 mm. Similar to the principle described earlier, theoretically, the larger the radius R6, the smaller the effective width of the through-hole 133 during bending, reducing the torque required during bending and thus the bending stress. Furthermore, the bending stress can be distributed along the sidewall of the hole, making the flexible circuit board 13 less prone to uneven deformation. However, to ensure the internal wiring design of the flexible circuit board 13, the radius R6 should not be too large. Preferably, the radius R6 is 0.5 mm, which is beneficial for process implementation without affecting the internal wiring space.

[0126] Along the extending direction of the second connecting portion 132, the opening size of the second opening K2 is A, and the distance between the center of the stress relief hole and the boundary of the second opening K2 is H, then 0≤H≤A. Preferably, H=0.5A, that is, the stress relief hole is centrally located, which helps to ensure a more uniform stress distribution and a better stress relief effect.

[0127] For the embodiments corresponding to the stress relief holes mentioned above, the finite element simulation and physical verification results are shown in Table 3 below:

[0128] Table 3

[0129]

[0130] Based on the above results, the simulation data trend is consistent with the physical verification results. The position where the flexible circuit board 13 passes through the middle frame 2 and the squeezing force of the flexible circuit board 13 on the backlight 12 are reduced, the white spot problem is improved, and the stress relief hole can be cut by existing conventional die-cutting process without affecting the production cost or the overall performance of the customer's machine.

[0131] In some embodiments, such as Figures 1-2 As shown, in order to buffer and disperse the extrusion force of the flexible circuit board 13 on the backlight 12, a buffer structure can also be provided between the two. Combining Figures 6A-6B as shown, Figure 6A is Figure 1 the seventh partial enlarged view of the display device shown at the perforation part, Figure 6B is Figure 1 the eighth partial enlarged view of the display device shown at the perforation part.

[0132] As Figure 6A shown, along the extension direction of the second connection part 132, the second opening K2 includes opposite first boundary M1 and second boundary M2, and the first boundary M1 is closer to the main body part 130 than the second boundary M2.

[0133] The display device further includes a first buffer structure 41. The first buffer structure 41 is located on the side of the backlight 12 away from the display panel 11. The orthographic projection of the first buffer structure 41 on the display panel 11 at least intersects with the orthographic projection of the first boundary M1 on the display panel 11.

[0134] It should be noted that here, the perforation part 133 of the second connection part 132 is taken as an example for illustration. Combining Figure 2 , that is, the first boundary M1 is located on the side of the second connection part 132 away from the backlight 12. At this position, when the whole machine is subjected to an external force, due to the poor anti-deformation ability of the middle frame 2, the middle frame 2 squeezes the flexible circuit board 13, and then squeezes the backlight 12. It can be understood that if the flexible circuit board 13 passes through the middle frame 2 such that the second boundary M2 is located on the side of the flexible circuit board 1322 away from the backlight 12, the orthographic projection of the buffer structure on the display panel 11 at least intersects with the orthographic projection of the second boundary M2 on the display panel 11.

[0135] In this application, by setting the first buffer structure 41 at the position corresponding to the first boundary M1, the extrusion force of the flexible circuit board 13 squeezing the backlight 12 is buffered and dispersed by using the first buffer structure 41, so that the extrusion force received by the backlight 12 can be reduced, and thus the white spot problem can be alleviated.

[0136] Exemplarily, as Figure 6A shown, along the width direction of the perforation part 133, the width L10 of the first buffer structure 41 is greater than the width L11 of the perforation part 133 and less than the width L12 of the second opening K2, that is, L11 < L10 < L12. Preferably, considering the assembly tolerance, L10 > L11 + 0.4 mm is set to ensure that within the tolerance range, the perforation part 133 is located on the first buffer structure 41 to avoid uneven buffering effect.

[0137] For example, along the extending direction of the second connecting portion 132, the first buffer structure 41 includes a first edge N1 and a second edge N2 opposite to each other. The first edge N1 is located between the first boundary M1 and the second boundary M2, and the second edge N2 is located on the side of the first boundary M1 away from the second boundary M2.

[0138] Along the extension direction of the second connecting part 132, the opening size of the second opening K2 is A, and the distance between the first edge N1 and the first boundary M1 is I1. Then I1≥0.5A, and the distance L13 between the second edge N2 and the first boundary M1 is greater than or equal to 0.5mm.

[0139] Preferably, along the width direction of the perforated portion 133, the first buffer structure 41, the perforated portion 133, and the second opening K2 are centrally aligned. The distance between the first edge N1 and the first boundary M1 is I1 = 0.5A. Along the thickness direction of the display device, the thickness of the first buffer structure 41 ranges from 0.1mm to 0.2mm, preferably 0.15mm. The rebound force is configured to be less than or equal to 0.06N / mm² at a compression ratio of 60%. 2 This ensures a good buffering effect.

[0140] Or, such as Figure 6B As shown, in some embodiments, the display device includes a second buffer structure 42 located on the side of the second connection portion 132 closer to the display panel 11. The orthographic projection of the second buffer structure 42 on the display panel 11 overlaps at least with the orthographic projection of the first boundary M1 on the display panel 11.

[0141] For example, such as Figure 6B As shown, along the width direction of the perforation portion 133, the width L14 of the second buffer structure 42 is equal to the width of the perforation portion 133. That is, in the process of setting the second buffer structure 42 on the flexible circuit board 13, setting the two widths to be equal is beneficial to the subsequent realization of perforation, and also beneficial to ensure the uniform buffering effect of the second buffer structure 42 after perforation is completed.

[0142] Along the extending direction of the second connecting portion 132, the second buffer structure 42 includes a third edge N3 and a fourth edge N4 opposite to each other. The third edge N3 is located between the first boundary M1 and the second boundary M2, and the fourth edge N4 is located on the side of the first boundary M1 away from the second boundary M2.

[0143] Along the extension direction of the second connecting part 132, the opening size of the second opening K2 is A, the distance between the third edge N3 and the first boundary M1 is I2, then I2≥0.5A, and the distance L15 between the fourth edge N4 and the first boundary M1 is greater than or equal to 0.5mm.

[0144] and Figure 6A Compared to the embodiments shown, Figure 6B The difference in the embodiment shown is that the buffer structure is set on the flexible circuit board 13 and is flush with the width of the through portion 133; the other configurations can adopt the same configuration conditions.

[0145] The materials used in the aforementioned cushioning structure may include foam, which can improve vitiligo problems by slightly increasing costs.

[0146] The finite element simulation and physical verification results for the buffer structures at different locations are shown in Table 4 below:

[0147] Table 4

[0148]

[0149] Based on the above results, the simulation data trends are consistent with the physical verification results. The pressure exerted by the flexible circuit board 13 on the backlight 12 at the location where it passes through the middle frame 2 is reduced, thus improving the white spot problem. This solution can be achieved using conventional film application processes and has no impact on the customer's overall device.

[0150] In some embodiments, such as Figure 7 As shown, Figure 7 for Figure 1 The image shown is a magnified view of a portion of the display device at the opening in the middle frame. (Combined with...) Figure 2 As shown, taking the second connecting portion 132 passing through the middle frame 2 as an example, along the extending direction of the second connecting portion 132, the second opening K2 includes a first sidewall T1 and a second sidewall T2, which are opposite each other. The first sidewall T1 is closer to the main body 130 than the second sidewall T2. That is, the first sidewall T1 is located on the side of the flexible circuit board 13 away from the backlight 12.

[0151] like Figure 7 As shown, the middle frame 2 also includes a first surface P3 near the display panel 11 and a second surface P4 away from the display panel 11. The first surface P3 is connected to the first side wall T1 by a first inclined surface, and the second surface P4 is connected to the second side wall T2 by a second inclined surface.

[0152] Based on this, along the through direction of the flexible circuit board 13, the edge of the opening of the middle frame 2 is designed with a half-angle to reduce the inclination of the through part 133, reduce the bending radius, and thus reduce the bending stress.

[0153] For example, such as Figure 7 As shown, along the extending direction of the second connecting portion 132, the length O1 of the first inclined surface is greater than or equal to 0.5 mm, and the length O2 of the second inclined surface is greater than or equal to 0.5 mm.

[0154] If the angle between the first inclined plane and the first surface P3 is J1, then 0°<J1≤30°.

[0155] If the angle between the second inclined plane and the second surface P4 is J2, then 0°<J2≤30°.

[0156] Along the direction perpendicular to the first surface P3, the maximum thickness of the middle frame 2 is R, the thickness of the first sidewall T1 is 1 / 2R, and the thickness of the second sidewall T2 is 1 / 2R.

[0157] For example, if the maximum thickness of the middle frame 2 is R, which is typically 0.5mm, then the thickness of the first sidewall T1 and the second sidewall T2 should be uniformly set at 0.25mm to prevent the middle frame 2 from being too thin at the sidewall positions, thus weakening its strength. The lengths O1 and O2 of the first and second inclined surfaces are both set to 1mm. Theoretically, the larger the lengths O1 and O2 of the first and second inclined surfaces, the smaller the included angles J1 and J2, resulting in a more significant improvement in white spots. Finite element simulation shows that when the included angles J1 and J2 are around 20°, the compressive force of the flexible circuit board 13 on the backlight 12 is relatively small, leading to a more significant improvement in white spots.

[0158] The results of finite element simulation and physical verification for the beveled design of the mid-frame are shown in Table 5 below:

[0159] Table 5

[0160]

[0161] Based on the above results, the simulation data trend matches the physical verification results. At the location where the flexible circuit board 13 passes through the middle frame 2, the squeezing force of the flexible circuit board 13 on the backlight 12 is reduced, thus improving the white spot problem without increasing costs. This solution can be achieved through conventional die-casting processes and has no impact on the customer's overall product.

[0162] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display device, characterized in that, include: The display module includes a display panel, a backlight, and a flexible circuit board; the display panel includes opposing light-emitting and non-light-emitting surfaces, and the backlight is disposed on the non-light-emitting surface; the flexible circuit board is electrically connected to the display panel, and the flexible circuit board includes a first connecting portion bent to the side of the backlight away from the display panel; A mid-frame is disposed on the side of the backlight away from the display panel; the mid-frame includes a through first opening, and a first connecting portion extends from the side of the mid-frame near the display panel, through the first opening, to the side of the mid-frame away from the display panel; A heat sink is disposed between the backlight and the first connecting part, and the orthographic projection of the heat sink on the display panel does not overlap with the orthographic projection of the first opening on the display panel.

2. The display device according to claim 1, wherein The flexible circuit board further includes a main body portion bent to the side of the backlight away from the display panel, and the first connecting portion is connected to the main body portion; The orthographic projection of the heat sink on the display panel at least partially overlaps with the orthographic projection of the main body on the display panel, and also partially overlaps with the orthographic projection of the first connecting part on the display panel.

3. The display device according to claim 1, wherein Along a first direction parallel to the non-light-emitting surface, the distance between the heat sink and the first opening is greater than or equal to 0.5 mm; Along a second direction parallel to the non-light-emitting surface, the distance between the heat sink and the first opening is greater than or equal to 0.5 mm, and the second direction intersects the first direction.

4. The display device according to claim 1, wherein The flexible circuit board further includes a main body portion and a second connecting portion that are bent to the side of the backlight away from the display panel, and both the first connecting portion and the second connecting portion are connected to the main body portion; The mid-frame also includes a through second opening, and the second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel; the second connecting portion includes a perforated portion, and the orthographic projection of the perforated portion on the display panel is located within the orthographic projection range of the second opening on the display panel; The edge of the perforated portion is provided with a stress relief groove, which extends from the edge into the perforated portion.

5. The display device according to claim 4, wherein The width direction of the perforated portion is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting portion; Along the width direction of the perforated portion, the perforated portion includes two opposing edges, and both edges of the perforated portion are provided with the stress relief groove.

6. The display device according to claim 5, wherein The stress relief groove includes a semi-circular groove with a radius greater than or equal to 0.1 mm; Along the extending direction of the second connecting part, the opening size of the second opening is A, and the distance between the center of the semi-circular groove and the boundary of the second opening is B, then 0≤B≤A.

7. The display device according to claim 5, wherein The stress relief groove includes a V-shaped groove, and the included angle between the two sides of the V-shaped groove is C, then 0° < C < 180°; The bottom of the V-groove is a semi-circular arc, and the radius of the semi-circular arc is greater than or equal to 0.1 mm; Along the extension direction of the second connecting part, the opening size of the second opening is A, and the distance between the center of the semicircular arc and the boundary of the second opening is D, then 0≤D≤A.

8. The display device according to claim 5, wherein The stress relief groove includes a wavy groove with a continuous arc, and the width of the wavy groove is greater than 0 along the width direction of the perforation portion. Along the extending direction of the second connecting portion, the length of the wavy groove is greater than 0; Along the extending direction of the second connecting part, the opening size of the second opening is A, and the boundary distance between the corrugated groove and the second opening is E, then 0≤E<0.5A; The radius of the arc of the wavy groove is greater than 0; The center-to-center distance between two adjacent circular arcs in the wavy groove is greater than 0.

9. The display device according to claim 5, wherein The stress relief groove includes a serrated groove with continuous serrations, and the width of the serrations is greater than 0 along the width direction of the perforation portion; Along the extending direction of the second connecting portion, the length of the sawtooth is greater than 0; Along the extending direction of the second connecting part, the opening size of the second opening is A, and the distance between the sawtooth and the boundary of the second opening is F, then 0≤F<0.5A; The included angle between the two sides of the saw teeth is greater than 0°; The distance between two adjacent saw teeth in the sawtooth groove is greater than 0.

10. The display device according to claim 1, wherein The flexible circuit board further includes a main body portion and a second connecting portion that are bent to the side of the backlight away from the display panel, and both the first connecting portion and the second connecting portion are connected to the main body portion; The mid-frame also includes a through second opening, and the second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel; the second connecting portion includes a perforated portion, and the orthographic projection of the perforated portion on the display panel is located within the orthographic projection range of the second opening on the display panel; The perforated portion has a through stress relief hole inside.

11. The display device according to claim 10, wherein Along the extending direction of the second connection, the stress relief hole is shaped as an extended strip; The width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting part; along the width direction of the perforation, the width of the stress relief hole is greater than 0; Along the extending direction of the second connection portion, the length of the stress relief hole is greater than 0; Along the extending direction of the second connection, the opening size of the second opening is A, and the boundary distance between the stress relief hole and the second opening is G, then 0≤G<0.5A.

12. The display device of claim 11, wherein, The perforated portion has a plurality of stress relief holes arranged sequentially along the width direction of the perforated portion.

13. The display device of claim 12, wherein, Along the extending direction of the second connection, the stress relief hole includes two opposing ends, and the adjacent ends of two adjacent stress relief holes are staggered.

14. The display device of claim 10, wherein, The perforated portion has a plurality of stress relief holes inside; the width direction of the perforated portion is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting portion; the plurality of stress relief holes are arranged sequentially along the width direction of the perforated portion; The stress relief hole is circular in shape, and the radius of the circle is greater than or equal to 0.1 mm; Along the extending direction of the second connection, the opening size of the second opening is A, and the boundary distance between the stress relief hole and the second opening is H, then 0≤H≤A.

15. The display device of claim 1, wherein, The flexible circuit board further includes a main body portion and a second connecting portion that are bent to the side of the backlight away from the display panel, and both the first connecting portion and the second connecting portion are connected to the main body portion; The mid-frame also includes a through second opening, and the second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel; along the extending direction of the second connecting portion, the second opening includes a first boundary and a second boundary opposite to each other, and the first boundary is closer to the main body portion than the second boundary; The display device further includes a first buffer structure located on the side of the backlight away from the display panel; the orthographic projection of the first buffer structure on the display panel overlaps at least with the orthographic projection of the first boundary on the display panel.

16. The display device according to claim 15, characterized in that, The second connecting portion includes a perforated portion, and the orthographic projection of the perforated portion on the display panel is located within the orthographic projection range of the second opening on the display panel; The width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting portion; along the width direction of the perforation, the width of the first buffer structure is greater than the width of the perforation and less than the width of the second opening; Along the extending direction of the second connecting portion, the first buffer structure includes opposing first and second edges, the first edge being located between the first boundary and the second boundary, and the second edge being located on the side of the first boundary away from the second boundary; Along the extension direction of the second connection portion, the opening size of the second opening is A, and the distance between the first edge and the first boundary is I1. Then I1≥0.5A, and the distance between the second edge and the first boundary is greater than or equal to 0.5mm.

17. The display device of claim 1, wherein The flexible circuit board further includes a main body portion and a second connecting portion that are bent to the side of the backlight away from the display panel, and both the first connecting portion and the second connecting portion are connected to the main body portion; The mid-frame also includes a through second opening, and the second connecting portion extends from the side of the mid-frame near the display panel through the second opening to the side of the mid-frame away from the display panel; along the extending direction of the second connecting portion, the second opening includes a first boundary and a second boundary opposite to each other, and the first boundary is closer to the main body portion than the second boundary; The display device further includes a second buffer structure located on the side of the second connection portion closer to the display panel; the orthographic projection of the second buffer structure on the display panel overlaps at least with the orthographic projection of the first boundary on the display panel.

18. The display device of claim 17, wherein, The second connecting portion includes a perforated portion, and the orthographic projection of the perforated portion on the display panel is located within the orthographic projection range of the second opening on the display panel; The width direction of the perforation is parallel to the non-light-emitting surface and intersects the extension direction of the second connecting portion; along the width direction of the perforation, the width of the second buffer structure is equal to the width of the perforation. Along the extending direction of the second connecting portion, the second buffer structure includes opposing third and fourth edges, the third edge being located between the first boundary and the second boundary, and the fourth edge being located on the side of the first boundary away from the second boundary; Along the extending direction of the second connecting part, the opening size of the second opening is A, the distance between the third edge and the first boundary is I2, then I2≥0.5A, and the distance between the fourth edge and the first boundary is greater than or equal to 0.5mm.

19. The display device of claim 1, wherein, The flexible circuit board further includes a main body portion and a second connecting portion that are bent to the side of the backlight away from the display panel, and both the first connecting portion and the second connecting portion are connected to the main body portion; The mid-frame also includes a through second opening, and the second connecting portion extends from the side of the mid-frame near the display panel, through the second opening, to the side of the mid-frame away from the display panel; Along the extending direction of the second connecting portion, the second opening includes opposing first and second sidewalls, with the first sidewall being closer to the main body than the second sidewall; the middle frame also includes a first surface close to the display panel and a second surface away from the display panel, with the first surface connected to the first sidewall via a first inclined surface, and the second surface connected to the second sidewall via a second inclined surface; the second connecting portion includes a through-hole portion, the orthographic projection of the through-hole portion on the display panel being located within the orthographic projection range of the second opening on the display panel.

20. The display device of claim 19, wherein, Along the extending direction of the second connecting portion, the length of the first inclined surface is greater than or equal to 0.5 mm, and the length of the second inclined surface is greater than or equal to 0.5 mm; If the angle between the first inclined plane and the first surface is J1, then 0°<J1≤30°; If the angle between the second inclined plane and the second surface is J2, then 0°<J2≤30°; Along a direction perpendicular to the first surface, the maximum thickness of the middle frame is R, the thickness of the first sidewall is 1 / 2R, and the thickness of the second sidewall is 1 / 2R.

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