Switch module
By integrating the tactile switch and pressure sensor onto the same substrate, the problem of the tactile switch having a single function is solved, enabling accurate identification and control of multi-mode operation, reducing costs and improving integration.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN NEW DEGREE TECH
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-03
AI Technical Summary
Existing tactile switches have limited functionality and are insufficient to meet the emerging demands for pressure-graded control and multi-mode operation.
By integrating a tactile switch and a pressure sensor on opposite surfaces of the same substrate, the pressure differential signal and conduction signal are acquired through the substrate to recognize multiple operation modes, including light press, double press, long press, pressure gradation, and heavy press.
The module structure has been simplified, production and assembly costs have been reduced, integration has been improved, and space occupation has been reduced by using a shared substrate, enabling accurate identification and control of multiple operating modes.
Smart Images
Figure CN224459771U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of switch technology, and in particular to a switch module. Background Technology
[0002] With the rapid development of smart devices, various electronic products are placing higher demands on the functionality and adaptability of tactile switches. Currently, most tactile switches on the market can only achieve simple circuit switching functions, making it difficult to meet emerging needs such as pressure-level control and multi-mode operation. Utility Model Content
[0003] This application provides a switch module that can solve the technical problem of the single function of traditional tactile switches.
[0004] This application provides a switch module, which includes:
[0005] substrate;
[0006] A tactile switch is mounted on a first surface of the substrate and electrically connected to the substrate, wherein the trigger end of the tactile switch is positioned away from the substrate.
[0007] A pressure sensor is mounted on a second surface of the substrate, the second surface being disposed opposite to the first surface, and the pressure sensor is electrically connected to the substrate;
[0008] When an external force is applied to the pressure sensor, it is transmitted through the substrate to the trigger terminal of the tactile switch. The substrate acquires the differential signal of the pressure sensor and the conduction signal output by the tactile switch.
[0009] In some embodiments, the center point of the pressure sensor, the center point of the trigger end of the tactile switch, and the geometric center of the substrate are located on the same axis, which is perpendicular to the first and second surfaces of the substrate.
[0010] In some embodiments, a first pad group is provided on a first surface of the substrate for connecting the pins of the tactile switch, and a second pad group is provided on a second surface of the substrate for connecting the pressure sensor.
[0011] In some embodiments, the second pad group includes at least four pads, which are respectively connected to the four bridge arm resistors of the pressure sensor to form a Wheatstone bridge circuit, which is used to convert pressure changes into differential voltage signals.
[0012] In some embodiments, the pressure sensor is a piezoresistive ink pressure sensor, a thin-film pressure sensor, a capacitive pressure sensor, or an inductive pressure sensor.
[0013] In some embodiments, the substrate is a flexible circuit board, the pressure sensor is mounted on the second surface of the flexible circuit board using surface mount technology, and the tactile switch is bonded to the first surface of the flexible circuit board.
[0014] In some embodiments, the substrate is a rigid circuit board.
[0015] In some embodiments, a connector is also included. Two substrates are provided, each substrate corresponding to the pressure sensor and the tactile switch. The two substrates are connected to the same side of the connector in a spaced and parallel manner, and the second surface is disposed facing the connector.
[0016] In some embodiments, the spacing between the two substrates is L, satisfying: 10mm≤L≤30mm.
[0017] In some embodiments, the substrate integrates a signal processing circuit, which includes a differential amplifier-to-digital converter. The differential amplifier amplifies the differential signal from the pressure sensor, and the analog-to-digital converter converts the analog signal into a digital signal.
[0018] Based on the above embodiments, by integrating the tactile switch and pressure sensor on opposite surfaces of the same substrate, the switch module can simultaneously acquire pressure differential signals and conduction signals, enabling the recognition of various operation modes such as light press, double press, long press, pressure gradation, and heavy press. The real-time monitoring function of the pressure sensor allows the module to trigger different commands according to the magnitude of the applied force. The collaborative design of the tactile switch and pressure sensor not only simplifies the module structure and reduces production and assembly costs, but also reduces space occupation and improves integration by sharing a substrate. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of a switch module according to an embodiment of this application;
[0021] Figure 2 This is a schematic diagram of another perspective of the structure of a switch module according to an embodiment of this application;
[0022] Figure 3 This is a schematic diagram of another embodiment of the switch module of this application;
[0023] Figure 4 This is a schematic diagram of another embodiment of the switch module of this application from another perspective.
[0024] Explanation of icon numbers:
[0025] 100. Switch module; 10. Substrate; 11. First surface; 12. Second surface; 121. Second pad group; 20. Tactile switch; 30. Pressure sensor; 40. Connector.
[0026] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0028] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0029] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0031] With the rapid development of smart devices, various electronic products are placing higher demands on the functionality and adaptability of tactile switches. Currently, most tactile switches on the market can only achieve simple circuit switching functions, making it difficult to meet emerging needs such as pressure-level control and multi-mode operation.
[0032] To resolve the above issues, please refer to [link / reference]. Figures 1 to 2 This application proposes a switch module 100. In the embodiments of this application, the switch module 100 includes a substrate 10, a tactile switch 20, and a pressure sensor 30.
[0033] The substrate 10 adopts a regular rectangular shape, which is conducive to standardized production and modular integration, and can fit the spatial architecture of most electronic products when laid out inside the equipment. The substrate 10 can be a rigid printed circuit board (PCB), which has mature circuit design and processing technology and can stably support and connect various electronic components within the module; or it can be a flexible circuit board (FPC), which, while meeting the circuit connection requirements, can adapt to complex internal spatial layouts of the equipment due to its bendable characteristics.
[0034] As a crucial component of the module, the tactile switch 20 can be made from various materials. For example, the traditional spring-loaded tactile switch 20 utilizes the elastic deformation of a metal dome spring to achieve circuit switching, offering cost advantages and mature application solutions to meet basic circuit control needs. Waterproof tactile switches 20 are suitable for scenarios requiring a high level of protection, effectively resisting moisture intrusion and ensuring normal operation in humid environments. There are also surface-mount tactile switches 20, characterized by their compact size and ease of automated assembly, enabling miniaturization and high-density integration of the module. The tactile switch 20 is mounted on the first surface 11 of the substrate 10 and reliably electrically connected to the substrate 10 via welding or connectors. Its trigger end is positioned away from the substrate 10 to facilitate the application of external forces. It is understood that a contact object (such as a metal bracket or insulating pad) is provided at the corresponding position of the trigger end, fixed to the internal structure of the device to support the trigger end and ensure a stable force transmission path. The pressure sensor 30 is mounted on the second surface 12 of the substrate 10, which is opposite to the first surface 11 and is also electrically connected to the substrate 10. When an external force is applied to the pressure sensor 30, the force is transmitted through the substrate 10 to the trigger end of the tactile switch 20. The trigger end is displaced due to the support of the object, thereby triggering the switch to conduct. In this process, the cooperative working mechanism of the tactile switch 20 and the pressure sensor 30 can realize multi-mode operation recognition: when the external force lightly presses the pressure sensor 30, the small pressure is transmitted through the substrate 10 to the trigger end of the tactile switch 20, and the trigger end produces a small displacement, causing the switch to conduct momentarily. The substrate 10 recognizes it as a "light press" based on the signal strength output by the pressure sensor 30 and the switch conduction time (e.g., pulse width < 200ms); if such signal combinations occur twice in a short period of time (e.g., within 200ms), it is determined as a "double press"; when the pressure is continuous and the switch conduction time exceeds 1.5 seconds, the substrate 10 determines it as a "long press" based on the signal timing characteristics. The recognition of pressure levels and hard presses relies on the difference in pressure transmission intensity: When a moderate pressure is applied, the force transmitted by the pressure sensor 30 through the substrate 10 increases the displacement of the trigger end, and the switch is turned on. At the same time, the substrate 10 distinguishes different pressure levels based on the change in the signal amplitude output by the pressure sensor 30 (such as the deformation caused by pressure), and triggers different functions accordingly. If the applied pressure causes the trigger end to reach its limit position and the switch is continuously on for more than 300ms, the substrate 10 determines it as a "hard press" based on the combined signal duration and intensity, and activates a higher-order function. Throughout the recognition process, the rigid structure of the substrate 10 ensures a stable force transmission path, while the object that the trigger end contacts (such as a metal bracket) provides feedback on the mechanical characteristics under different pressures through elastic deformation, enabling the substrate 10 to accurately recognize multi-mode operation based on the signal time series and intensity gradient.
[0035] Based on the above embodiments, by integrating the tactile switch 20 and the pressure sensor 30 onto the opposite surfaces of the same substrate 10, the switch module 100 can simultaneously acquire pressure differential signals and conduction signals, enabling the recognition of various operation modes such as light press, double press, long press, pressure gradation, and heavy press. The real-time monitoring function of the pressure sensor 30 allows the module to trigger different commands according to the magnitude of the applied force. The collaborative design of the tactile switch 20 and the pressure sensor 30 not only simplifies the module structure and reduces production and assembly costs, but also reduces space occupation and improves integration by sharing the substrate 10.
[0036] In some embodiments, the center point of the pressure sensor 30, the center point of the trigger end of the tactile switch 20, and the geometric center of the substrate 10 are located on the same axis, which is perpendicular to the first surface 11 and the second surface 12 of the substrate 10. This coaxial layout ensures that when an external force is applied to the pressure sensor 30, the force transmission path is transmitted in a straight line along the axis to the trigger end of the tactile switch 20, avoiding force transmission loss or signal deviation due to offset. By shortening the force transmission path and ensuring the consistency of direction, this design can improve the synchronization and accuracy of the pressure signal and the switch conduction signal, enabling the differential signal and conduction signal acquired by the substrate 10 to more accurately reflect the actual state of the external force, thereby optimizing the module's response accuracy to pressure graded control.
[0037] Please see Figures 1 to 2 In some embodiments, the first surface 11 of the substrate 10 is provided with a first pad group for connecting the pins of the tactile switch 20, and the second surface 12 of the substrate 10 is provided with a second pad group 121 for connecting the pressure sensor 30. The first pad group on the first surface 11, through precise layout design, corresponds one-to-one with the pins of the tactile switch 20. Reflow soldering, wave soldering, and other soldering processes can be used to achieve a stable electrical connection between the tactile switch 20 and the substrate 10, ensuring efficient and accurate transmission of electrical signals when the switch is triggered. The second pad group 121 on the second surface 12 of the substrate 10 is specifically designed for the pressure sensor 30. Its pad spacing, size, and other parameters are adapted to the pin specifications of the pressure sensor 30. While soldering and fixing the pressure sensor 30, a reliable signal transmission channel is established between the sensor and the circuitry of the substrate 10, enabling the differential signal collected by the pressure sensor 30 to be stably transmitted to the substrate 10, laying the foundation for subsequent signal processing and functional implementation.
[0038] Furthermore, the second pad group 121 includes at least four pads, which are respectively connected to the four bridge arm resistors of the pressure sensor 30 to form a Wheatstone bridge circuit. The Wheatstone bridge is used to convert pressure changes into differential voltage signals. This circuit is based on the resistance strain effect. When pressure is applied to the sensor, the bridge arm resistors will change resistance due to deformation, breaking the initial balance of the bridge. This resistance change is converted into a differential voltage signal output from both ends. Compared with single resistance measurement, the Wheatstone bridge circuit can effectively suppress common-mode interference, improve signal stability and accuracy, and provide a reliable basis for the substrate 10 to accurately obtain pressure change information, thereby helping the switch module 100 to achieve more sensitive and accurate pressure sensing and control functions.
[0039] Optionally, the pressure sensor 30 can be selected from various types according to different application scenarios and performance requirements. Piezoresistive ink-type pressure sensors 30 convert pressure changes into resistance changes by printing piezoresistive material on a flexible substrate, offering advantages such as low cost and large-area fabrication, making them suitable for cost-sensitive consumer electronics. Thin-film pressure sensors 30 are manufactured using thin-film technology, enabling high-precision pressure measurement with fast response and good stability, and are commonly used in industrial control, medical equipment, and other fields requiring high measurement accuracy. Capacitive pressure sensors 30, based on the principle of capacitance change, acquire pressure signals by detecting changes in the distance between plates or the dielectric constant under pressure, featuring high sensitivity and low power consumption, and are widely used in portable smart devices. Inductive pressure sensors 30 utilize the principle of electromagnetic induction, converting mechanical displacement caused by pressure into changes in inductance, exhibiting strong anti-interference capabilities and suitable for pressure detection scenarios in harsh environments. In this switch module 100, different types of pressure sensors 30 can work in conjunction with the tactile switch 20 and the substrate 10 to effectively convert pressure signals into processable electrical signals, meeting diverse application needs.
[0040] Please see Figures 1 to 2 In some embodiments, the substrate 10 is a flexible circuit board, and the pressure sensor 30 is mounted on the second surface 12 of the flexible circuit board using surface mount technology. This process enables a reliable connection between the sensor and the circuitry of the substrate 10, ensuring stable transmission of pressure signals. The tactile switch 20 is bonded to the first surface 11 of the flexible circuit board. This connection method ensures flexible response of the trigger end and avoids stress concentration problems that may be caused by rigid connections. Especially when the flexible circuit board undergoes bending deformation, it can effectively protect the connection structure between the switch and the circuit board. By combining the mounting process of the pressure sensor 30 with the bonding process of the tactile switch 20, the flexible circuit board achieves a double-sided component layout while taking into account the mechanical stability and functional reliability of the module, providing an effective solution for pressure sensing and control in complex spatial environments.
[0041] Please see Figures 3 to 4 In some embodiments, a connecting base 40 is also included. Two substrates 10 are provided, each substrate 10 correspondingly equipped with the pressure sensor 30 and the tactile switch 20. The two substrates 10 are connected to the same side of the connecting base 40 in a spaced and parallel manner, with the second surface 12 facing the connecting base 40. When an external force is applied to the connecting base 40 and it slides in a direction parallel to the plane of the substrate 10, the connecting base 40 undergoes elastic deformation or displacement due to the force. This deformation or displacement is mechanically transmitted, causing the two substrates 10 to tilt slightly at an angle or shift in position sequentially according to the direction of the force. Due to the positional difference between the pressure sensor 30 and the tactile switch 20 on the two substrates 10, this shift will cause differences in the magnitude and timing of the pressure sensed by the two pressure sensors 30, and the triggering timing of the tactile switch 20 will also change accordingly. By comparing the differential signal changes of the two pressure sensors 30 and the conduction state sequence of the tactile switch 20, the substrate 10 can accurately analyze parameters such as the sliding direction, distance and speed of the external force on the connector 40, thereby realizing sliding operation control functions such as volume adjustment and interface switching, providing users with a richer interactive experience.
[0042] Furthermore, the spacing between the two substrates 10 is L, satisfying: 10mm ≤ L ≤ 30mm. Specifically, the spacing L between the two substrates 10 is optimized to be between 10mm and 30mm. This spacing range ensures that when an external force is applied to the connector 40, the two substrates 10 can generate a sufficient relative displacement difference for the pressure sensor 30 and the tactile switch 20 to detect, while avoiding excessive distance that would lead to a bulky module or decreased structural stability. When an external force is applied to the connector 40 in a direction parallel to the plane of the substrates 10, the elastic deformation of the connector 40 will cause the two substrates 10 to tilt or displace asynchronously. The spacing of 10mm to 30mm allows this displacement difference to be effectively sensed by the pressure sensor 30 and converted into differentiated signals. Simultaneously, the triggering timing of the tactile switch 20 will also have a recognizable time difference due to the spacing design. By analyzing the timing relationship and amplitude difference of these two sets of differentiated signals, the substrate 10 can accurately calculate the sliding trajectory parameters of the external force, achieving high-precision sliding operation control. This spacing design ensures module sensitivity while maintaining structural compactness and signal resolution reliability, making it suitable for various smart devices that require sliding operation, such as portable controllers and wearable devices.
[0043] In some embodiments, a signal processing circuit is integrated on the substrate 10. This circuit includes a differential amplifier and an analog-to-digital converter (ADC). The differential amplifier amplifies the differential signal from the pressure sensor 30, and the ADC converts the analog signal into a digital signal. The differential amplifier amplifies the differential signal output by the pressure sensor 30, enhancing signal strength and improving anti-interference capabilities. The ADC converts the amplified analog signal into a digital signal, facilitating digital processing on the substrate 10. When an external force is applied, the signal processing circuit on the substrate 10 operates synchronously, converting the differential signal from the pressure sensor 30 into a digital signal sequence. This provides fundamental data for subsequent algorithmic analysis of parameters such as the magnitude and duration of the external force, enabling precise signal processing and functional control.
[0044] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.
[0045] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A switch module, characterized in that include: substrate; A tactile switch is mounted on a first surface of the substrate and electrically connected to the substrate, wherein the trigger end of the tactile switch is positioned away from the substrate. A pressure sensor is mounted on a second surface of the substrate, the second surface being disposed opposite to the first surface, and the pressure sensor is electrically connected to the substrate; When an external force is applied to the pressure sensor, it is transmitted through the substrate to the trigger terminal of the tactile switch. The substrate acquires the differential signal of the pressure sensor and the conduction signal output by the tactile switch.
2. The switch module of claim 1, wherein, The center point of the pressure sensor, the center point of the trigger end of the tactile switch, and the geometric center of the substrate are located on the same axis, which is perpendicular to the first and second surfaces of the substrate.
3. The switch module of claim 1, wherein, The first surface of the substrate is provided with a first pad group for connecting the pins of the tactile switch, and the second surface of the substrate is provided with a second pad group for connecting the pressure sensor.
4. The switch module of claim 3, wherein, The second pad group includes at least four pads, which are respectively connected to the four bridge arm resistors of the pressure sensor to form a Wheatstone bridge circuit. The Wheatstone bridge is used to convert pressure changes into differential voltage signals.
5. The switch module of claim 1, wherein, The pressure sensor is a piezoresistive ink pressure sensor, a thin-film pressure sensor, a capacitive pressure sensor, or an inductive pressure sensor.
6. The switch module of claim 1, wherein, The substrate is a flexible circuit board, the pressure sensor is mounted on the second surface of the flexible circuit board using surface mount technology, and the tactile switch is bonded to the first surface of the flexible circuit board.
7. The switch module of claim 1, wherein, The substrate is a rigid circuit board.
8. A switch module as claimed in any one of claims 1 to 7, characterized in that It also includes a connector, and the substrate is provided in two. Each substrate is provided with the pressure sensor and the tactile switch. The two substrates are connected to the same side of the connector in a spaced and parallel manner, and the second surface is disposed facing the connector.
9. The switch module of claim 8, wherein, The distance between the two substrates is L, which satisfies: 10mm≤L≤30mm.
10. A switch module as claimed in any one of claims 1 to 7, characterised in that, The substrate integrates a signal processing circuit, which includes a differential amplifier and an analog-to-digital converter. The differential amplifier is used to amplify the differential signal of the pressure sensor, and the analog-to-digital converter is used to convert the analog signal into a digital signal.